TWI541930B - A method for manufacturing an electronic component, a method for manufacturing the same, and a slicing device - Google Patents

A method for manufacturing an electronic component, a method for manufacturing the same, and a slicing device Download PDF

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Publication number
TWI541930B
TWI541930B TW103114447A TW103114447A TWI541930B TW I541930 B TWI541930 B TW I541930B TW 103114447 A TW103114447 A TW 103114447A TW 103114447 A TW103114447 A TW 103114447A TW I541930 B TWI541930 B TW I541930B
Authority
TW
Taiwan
Prior art keywords
resin
electronic component
hole
jig
base
Prior art date
Application number
TW103114447A
Other languages
English (en)
Chinese (zh)
Other versions
TW201515139A (zh
Inventor
Hajime Watanabe
Kanji Ishibashi
Shoichi Kataoka
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201515139A publication Critical patent/TW201515139A/zh
Application granted granted Critical
Publication of TWI541930B publication Critical patent/TWI541930B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW103114447A 2013-06-24 2014-04-22 A method for manufacturing an electronic component, a method for manufacturing the same, and a slicing device TWI541930B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013131847A JP6000902B2 (ja) 2013-06-24 2013-06-24 電子部品用の収容治具、その製造方法及び個片化装置

Publications (2)

Publication Number Publication Date
TW201515139A TW201515139A (zh) 2015-04-16
TWI541930B true TWI541930B (zh) 2016-07-11

Family

ID=52228969

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103114447A TWI541930B (zh) 2013-06-24 2014-04-22 A method for manufacturing an electronic component, a method for manufacturing the same, and a slicing device

Country Status (4)

Country Link
JP (1) JP6000902B2 (ko)
KR (1) KR101642565B1 (ko)
CN (1) CN104241113B (ko)
TW (1) TWI541930B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160375653A1 (en) * 2015-06-26 2016-12-29 Intel Corporation Integrated circuit die transport apparatus and methods
CN105966783B (zh) * 2016-06-30 2018-02-13 镇江环太硅科技有限公司 一种新型的硅片中转盒
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP6640142B2 (ja) * 2017-03-31 2020-02-05 Ｔｏｗａ株式会社 切断装置、半導体パッケージの貼付方法及び電子部品の製造方法
CN107135611B (zh) * 2017-06-01 2023-08-15 中国石油天然气集团有限公司 钻井工具电路板灌封胶装置及使用方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6890894B2 (ja) * 2017-08-21 2021-06-18 株式会社ディスコ 保持冶具の製造方法
JP6861602B2 (ja) * 2017-09-15 2021-04-21 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持機構及び製品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
CN110444506A (zh) * 2019-07-31 2019-11-12 青岛歌尔智能传感器有限公司 一种系统级封装外壳的吸附方法
CN111532586B (zh) * 2020-04-22 2022-09-27 京东方科技集团股份有限公司 一种包装系统及包装判定方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740952A (en) * 1980-08-25 1982-03-06 Fujitsu Ltd Taking-out of semiconductor chip
JPH0613454A (ja) * 1992-06-25 1994-01-21 Seiko Epson Corp 半導体素子保管用トレイおよびその製造方法
JPH06252255A (ja) * 1993-03-01 1994-09-09 Fujitsu Miyagi Electron:Kk チップトレイ
JPH11220015A (ja) * 1998-02-04 1999-08-10 Nec Yamagata Ltd 半導体装置チップ用トレー及び半導体装置チップの保管・運搬方法
KR100331165B1 (ko) * 1999-08-05 2002-04-01 김도열 소자 일괄 제조용 지그 및 이를 이용한 소자 일괄 제조방법
GB2370411B (en) 2000-12-20 2003-08-13 Hanmi Co Ltd Handler system for cutting a semiconductor package device
JP2007214243A (ja) * 2006-02-08 2007-08-23 Renesas Technology Corp 半導体装置の製造方法
JP2008103493A (ja) * 2006-10-18 2008-05-01 Lintec Corp チップのピックアップ方法及びピックアップ装置
JP5215556B2 (ja) * 2006-12-20 2013-06-19 Ｔｏｗａ株式会社 電子部品製造用の個片化装置
JP2009266850A (ja) * 2008-04-22 2009-11-12 Towa Corp 基板の切断方法及び装置
JP2010260914A (ja) * 2009-04-30 2010-11-18 Kuraray Co Ltd 熱可塑性重合体組成物

Also Published As

Publication number Publication date
KR101642565B1 (ko) 2016-07-25
TW201515139A (zh) 2015-04-16
CN104241113B (zh) 2017-04-05
JP6000902B2 (ja) 2016-10-05
KR20150000408A (ko) 2015-01-02
CN104241113A (zh) 2014-12-24
JP2015008170A (ja) 2015-01-15

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