TWI529805B - 半導體基板的製造方法 - Google Patents
半導體基板的製造方法 Download PDFInfo
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- TWI529805B TWI529805B TW098132321A TW98132321A TWI529805B TW I529805 B TWI529805 B TW I529805B TW 098132321 A TW098132321 A TW 098132321A TW 98132321 A TW98132321 A TW 98132321A TW I529805 B TWI529805 B TW I529805B
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- QXTCFDCJXWLNAP-UHFFFAOYSA-N sulfidonitrogen(.) Chemical compound S=[N] QXTCFDCJXWLNAP-UHFFFAOYSA-N 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008251335 | 2008-09-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201030850A TW201030850A (en) | 2010-08-16 |
| TWI529805B true TWI529805B (zh) | 2016-04-11 |
Family
ID=42057899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098132321A TWI529805B (zh) | 2008-09-29 | 2009-09-24 | 半導體基板的製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8383491B2 (enExample) |
| JP (1) | JP5666794B2 (enExample) |
| KR (1) | KR101576815B1 (enExample) |
| SG (1) | SG160302A1 (enExample) |
| TW (1) | TWI529805B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5142831B2 (ja) * | 2007-06-14 | 2013-02-13 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| US20120021588A1 (en) * | 2010-07-23 | 2012-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing soi substrate and semiconductor device |
| JP5902917B2 (ja) * | 2010-11-12 | 2016-04-13 | 株式会社半導体エネルギー研究所 | 半導体基板の作製方法 |
| US8842358B2 (en) | 2012-08-01 | 2014-09-23 | Gentex Corporation | Apparatus, method, and process with laser induced channel edge |
| AT515945B1 (de) * | 2014-09-05 | 2016-01-15 | Piezocryst Advanced Sensorics | Sensorelement |
| US11127601B2 (en) * | 2019-05-21 | 2021-09-21 | Applied Materials, Inc. | Phosphorus fugitive emission control |
| CN112599470B (zh) * | 2020-12-08 | 2024-10-29 | 上海新昇半导体科技有限公司 | 一种绝缘体上硅结构及其方法 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE259098T1 (de) | 1990-08-03 | 2004-02-15 | Canon Kk | Verfahren zur herstellung eines soi-substrats |
| US5750000A (en) | 1990-08-03 | 1998-05-12 | Canon Kabushiki Kaisha | Semiconductor member, and process for preparing same and semiconductor device formed by use of same |
| CA2069038C (en) | 1991-05-22 | 1997-08-12 | Kiyofumi Sakaguchi | Method for preparing semiconductor member |
| CN1132223C (zh) | 1995-10-06 | 2003-12-24 | 佳能株式会社 | 半导体衬底及其制造方法 |
| SG65697A1 (en) | 1996-11-15 | 1999-06-22 | Canon Kk | Process for producing semiconductor article |
| US6054363A (en) | 1996-11-15 | 2000-04-25 | Canon Kabushiki Kaisha | Method of manufacturing semiconductor article |
| JP3324469B2 (ja) * | 1997-09-26 | 2002-09-17 | 信越半導体株式会社 | Ｓｏｉウエーハの製造方法ならびにこの方法で製造されるｓｏｉウエーハ |
| JPH11163363A (ja) | 1997-11-22 | 1999-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JPH11307472A (ja) | 1998-04-23 | 1999-11-05 | Shin Etsu Handotai Co Ltd | 水素イオン剥離法によってｓｏｉウエーハを製造する方法およびこの方法で製造されたｓｏｉウエーハ |
| JP4379927B2 (ja) * | 1998-05-27 | 2009-12-09 | 信越半導体株式会社 | Ｓｏｉウエーハの製造方法およびｓｏｉウエーハ |
| JP2000012864A (ja) | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| US20020089016A1 (en) | 1998-07-10 | 2002-07-11 | Jean-Pierre Joly | Thin layer semi-conductor structure comprising a heat distribution layer |
| JP2000077287A (ja) * | 1998-08-26 | 2000-03-14 | Nissin Electric Co Ltd | 結晶薄膜基板の製造方法 |
| JP4476390B2 (ja) | 1998-09-04 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2000124092A (ja) | 1998-10-16 | 2000-04-28 | Shin Etsu Handotai Co Ltd | 水素イオン注入剥離法によってｓｏｉウエーハを製造する方法およびこの方法で製造されたｓｏｉウエーハ |
| JP4379943B2 (ja) * | 1999-04-07 | 2009-12-09 | 株式会社デンソー | 半導体基板の製造方法および半導体基板製造装置 |
| AU6905000A (en) | 1999-08-10 | 2001-03-05 | Silicon Genesis Corporation | A cleaving process to fabricate multilayered substrates using low implantation doses |
| EP1251608B1 (en) | 2000-08-22 | 2006-10-04 | Mitsui Chemicals, Inc. | Method for manufacturing semiconductor laser device |
| US6566278B1 (en) | 2000-08-24 | 2003-05-20 | Applied Materials Inc. | Method for densification of CVD carbon-doped silicon oxide films through UV irradiation |
| JP4507395B2 (ja) | 2000-11-30 | 2010-07-21 | セイコーエプソン株式会社 | 電気光学装置用素子基板の製造方法 |
| US6583440B2 (en) | 2000-11-30 | 2003-06-24 | Seiko Epson Corporation | Soi substrate, element substrate, semiconductor device, electro-optical apparatus, electronic equipment, method of manufacturing the soi substrate, method of manufacturing the element substrate, and method of manufacturing the electro-optical apparatus |
| EP1662549B1 (en) * | 2003-09-01 | 2015-07-29 | SUMCO Corporation | Method for manufacturing bonded wafer |
| JP5110772B2 (ja) | 2004-02-03 | 2012-12-26 | 株式会社半導体エネルギー研究所 | 半導体薄膜層を有する基板の製造方法 |
| JP2005251912A (ja) * | 2004-03-03 | 2005-09-15 | Seiko Epson Corp | 複合半導体基板の製造方法、複合半導体基板、電気光学装置および電子機器 |
| JP4730581B2 (ja) | 2004-06-17 | 2011-07-20 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
| CN100458871C (zh) | 2004-09-14 | 2009-02-04 | 东芝松下显示技术有限公司 | 显示器、阵列基板以及显示器制造方法 |
| JP4977999B2 (ja) * | 2005-11-21 | 2012-07-18 | 株式会社Ｓｕｍｃｏ | 貼合せ基板の製造方法及びその方法で製造された貼合せ基板 |
| US7579654B2 (en) * | 2006-05-31 | 2009-08-25 | Corning Incorporated | Semiconductor on insulator structure made using radiation annealing |
| US7608521B2 (en) | 2006-05-31 | 2009-10-27 | Corning Incorporated | Producing SOI structure using high-purity ion shower |
| US7811900B2 (en) | 2006-09-08 | 2010-10-12 | Silicon Genesis Corporation | Method and structure for fabricating solar cells using a thick layer transfer process |
| JP5463017B2 (ja) * | 2007-09-21 | 2014-04-09 | 株式会社半導体エネルギー研究所 | 基板の作製方法 |
| JP5411438B2 (ja) * | 2008-03-18 | 2014-02-12 | 信越化学工業株式会社 | Ｓｏｉ基板の製造方法 |
| US8003483B2 (en) | 2008-03-18 | 2011-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate |
-
2009
- 2009-09-17 SG SG200906194-6A patent/SG160302A1/en unknown
- 2009-09-23 US US12/564,961 patent/US8383491B2/en not_active Expired - Fee Related
- 2009-09-24 TW TW098132321A patent/TWI529805B/zh not_active IP Right Cessation
- 2009-09-25 JP JP2009220730A patent/JP5666794B2/ja not_active Expired - Fee Related
- 2009-09-29 KR KR1020090092181A patent/KR101576815B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010103515A (ja) | 2010-05-06 |
| US8383491B2 (en) | 2013-02-26 |
| US20100081253A1 (en) | 2010-04-01 |
| KR20100036209A (ko) | 2010-04-07 |
| SG160302A1 (en) | 2010-04-29 |
| KR101576815B1 (ko) | 2015-12-11 |
| TW201030850A (en) | 2010-08-16 |
| JP5666794B2 (ja) | 2015-02-12 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |