TWI527747B - 非接觸吸著盤 - Google Patents

非接觸吸著盤 Download PDF

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Publication number
TWI527747B
TWI527747B TW102107177A TW102107177A TWI527747B TW I527747 B TWI527747 B TW I527747B TW 102107177 A TW102107177 A TW 102107177A TW 102107177 A TW102107177 A TW 102107177A TW I527747 B TWI527747 B TW I527747B
Authority
TW
Taiwan
Prior art keywords
porous
pad
contact
hole
sealed space
Prior art date
Application number
TW102107177A
Other languages
English (en)
Chinese (zh)
Other versions
TW201343514A (zh
Inventor
藤平清隆
Original Assignee
炭研軸封精工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 炭研軸封精工股份有限公司 filed Critical 炭研軸封精工股份有限公司
Publication of TW201343514A publication Critical patent/TW201343514A/zh
Application granted granted Critical
Publication of TWI527747B publication Critical patent/TWI527747B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW102107177A 2012-02-28 2013-02-27 非接觸吸著盤 TWI527747B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012041171 2012-02-28

Publications (2)

Publication Number Publication Date
TW201343514A TW201343514A (zh) 2013-11-01
TWI527747B true TWI527747B (zh) 2016-04-01

Family

ID=49082790

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107177A TWI527747B (zh) 2012-02-28 2013-02-27 非接觸吸著盤

Country Status (5)

Country Link
JP (1) JP5512052B2 (ko)
KR (1) KR101697839B1 (ko)
CN (1) CN104137247B (ko)
TW (1) TWI527747B (ko)
WO (1) WO2013129599A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101627913B1 (ko) * 2014-05-26 2016-06-07 세메스 주식회사 반도체 패키지들을 지지하기 위한 테이블 조립체
CN104096980B (zh) * 2014-06-26 2016-01-20 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台
JP6949455B2 (ja) 2014-12-24 2021-10-13 株式会社タンケンシールセーコウ 非接触搬送装置、および非接触吸着盤
JP6803177B2 (ja) * 2016-08-29 2020-12-23 株式会社日本製鋼所 レーザ照射装置
CN106444298B (zh) * 2016-11-22 2018-01-30 江苏影速光电技术有限公司 一种dmd结构单轴固定光路直写曝光机
CN106444299B (zh) * 2016-11-22 2017-12-12 江苏影速光电技术有限公司 一种dmd结构多轴可移动光路直写曝光机
CN106325007B (zh) * 2016-11-22 2017-11-17 江苏影速光电技术有限公司 一种多扫描驱动轴可移动多棱镜光路直写设备
KR101749997B1 (ko) * 2017-01-17 2017-06-22 주식회사 21세기 Mlcc 적층용 상부금형
JP6898797B2 (ja) * 2017-07-10 2021-07-07 日本特殊陶業株式会社 真空吸着装置
JP6983578B2 (ja) 2017-08-25 2021-12-17 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
JP7110005B2 (ja) * 2018-06-20 2022-08-01 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
JP7260984B2 (ja) * 2018-09-21 2023-04-19 日本特殊陶業株式会社 基板保持部材
NL2021859B1 (en) * 2018-10-23 2020-05-13 Suss Microtec Lithography Gmbh Fixation system, support plate and method for production thereof
CN111482712A (zh) * 2020-04-27 2020-08-04 沈阳仪表科学研究院有限公司 精密切割设备用辅助系统
KR102624060B1 (ko) 2021-09-29 2024-01-12 고려대학교 세종산학협력단 진공 분위기 유지 피식각체 이송 장치 및 진공 분위기 유지 피식각체 이송 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750336A (ja) * 1993-08-04 1995-02-21 Hitachi Ltd 差動排気型真空吸着治具
JP4553376B2 (ja) * 2005-07-19 2010-09-29 東京エレクトロン株式会社 浮上式基板搬送処理装置及び浮上式基板搬送処理方法
JP4814050B2 (ja) 2006-10-31 2011-11-09 株式会社妙徳 浮上搬送ユニット
JP5145524B2 (ja) * 2007-10-25 2013-02-20 株式会社ブイ・テクノロジー 露光装置
JP2011084352A (ja) 2009-10-14 2011-04-28 Myotoku Ltd ワーク浮上装置
KR101099555B1 (ko) * 2010-01-12 2011-12-28 세메스 주식회사 기판 처리 장치

Also Published As

Publication number Publication date
KR101697839B1 (ko) 2017-01-18
TW201343514A (zh) 2013-11-01
WO2013129599A1 (ja) 2013-09-06
CN104137247B (zh) 2016-09-07
JPWO2013129599A1 (ja) 2015-07-30
KR20140129070A (ko) 2014-11-06
CN104137247A (zh) 2014-11-05
JP5512052B2 (ja) 2014-06-04

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