WO2013129599A1 - 非接触吸着盤 - Google Patents

非接触吸着盤 Download PDF

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Publication number
WO2013129599A1
WO2013129599A1 PCT/JP2013/055491 JP2013055491W WO2013129599A1 WO 2013129599 A1 WO2013129599 A1 WO 2013129599A1 JP 2013055491 W JP2013055491 W JP 2013055491W WO 2013129599 A1 WO2013129599 A1 WO 2013129599A1
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WO
WIPO (PCT)
Prior art keywords
holder
porous pad
sealed space
pad
suction
Prior art date
Application number
PCT/JP2013/055491
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
清隆 藤平
Original Assignee
株式会社タンケンシールセーコウ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社タンケンシールセーコウ filed Critical 株式会社タンケンシールセーコウ
Priority to JP2013542287A priority Critical patent/JP5512052B2/ja
Priority to CN201380010718.2A priority patent/CN104137247B/zh
Priority to KR1020147024329A priority patent/KR101697839B1/ko
Publication of WO2013129599A1 publication Critical patent/WO2013129599A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to a non-contact suction disk, and more particularly, to a non-contact suction disk in which the work surface is lifted by pressurized air and the work is sucked by suction at the same time.
  • a so-called vacuum tweezers is known as an apparatus for handling a workpiece having a very thin thickness such as a semiconductor wafer, a glass substrate for FPD, and the like.
  • the vacuum tweezers handle the workpiece in contact with the workpiece, there are problems such as applying stress to the workpiece.
  • Patent Documents 1 and 2 As a device that handles non-contacted workpieces such as glass substrates for FPDs in a non-contact manner without applying stress or the like, pressurized air is ejected from the pores of the porous plate to float the workpiece, Devices that transport on a plate have been proposed (for example, Patent Documents 1 and 2).
  • Bernoulli chucking using the so-called “Bernoulli principle” has been proposed as a device that can hold a thin work piece in a contactless downward direction.
  • the compressed air from the air compressor is blown along the lower surface while swirling in the recess formed in the lower surface of the chucking.
  • This is a device that generates buoyancy and sucks and holds a thin workpiece such as a semiconductor wafer on the lower surface of chucking in a non-contact manner.
  • the present invention has been made to solve such problems, and provides a non-contact suction disk capable of holding and sucking a thin workpiece at a predetermined position or holding and sucking it downward. Objective.
  • a non-contact suction disk for adsorbing a thin plate-shaped object to be adsorbed in a non-contact state A plate-like porous pad in which a plurality of air holes extending through in the thickness direction are formed in the adsorption fixing region; A first sealed space disposed adjacent to the back surface of the porous pad; A second sealed space isolated from the first sealed space; Communicating means for communicating the second sealed space and the vent hole; A non-contact suction disk is provided.
  • the first sealed space is communicated with the pressurized air source, and the second sealed space is communicated with the suction decompression source, so that the pressurized air is discharged from the pores on the surface of the porous pad. Air can be sucked from the vents on the surface of the porous pad while jetting.
  • the work can be floated on the surface of the porous pad with pressurized air while being held at a predetermined position by suction.
  • a thin workpiece such as a semiconductor wafer is held and adsorbed at a predetermined position on the surface of the porous pad facing upward, or downward on the lower side of the surface of the porous pad facing downward. It can be held and adsorbed without contact. Since the suction pressure (decompression) and the supply pressure (pressurization) can be adjusted independently, the gripping force and the levitation force can be controlled. Therefore, adjustment of the floating gap is also possible.
  • a plate-like holder having a surface laminated on the back side of the porous pad, and a recess that forms the first sealed space with the back side of the porous pad;
  • a base that is laminated on the back side of the holder and forms a second sealed space between the back side of the holder, and
  • the holder has a communication hole that has one end connected to the air hole of the porous pad during the lamination and the other end opened to the back surface of the holder and functions as the communication means.
  • the holder includes a plurality of island-shaped protrusions including a flat top portion that comes into contact with the back surface of the porous pad at the position of the back side opening ends of the plurality of vent holes,
  • the communication hole extends through the protrusion,
  • the space between the protrusions is the first sealed space.
  • the base includes a plurality of island-shaped protrusions provided on the surface with flat tops that contact the back surface of the holder during the connection,
  • the space between the protrusions is a pressure reducing flow path, and the other end of the communication hole is in fluid communication with the pressure reducing flow path.
  • the plurality of protrusions have a rectangular cross-sectional shape and are arranged in a grid pattern.
  • the first sealed space is formed as a grid-like flow path for pressurized air. According to such a configuration, the pressurized air can be uniformly ejected from the pores of the porous pad.
  • the decompression grooves are arranged in a lattice pattern. According to such a structure, pressurized air can be uniformly ejected from the vent hole of the porous pad.
  • the other end of the communication hole is in fluid communication with the pressure reducing groove at the intersection of the lattice-shaped pressure reducing grooves. According to such a configuration, it is possible to efficiently perform suction from the communication hole.
  • Laminated on the back side of the porous pad comprising a plate-like holder having a through hole corresponding to the vent of the porous pad, Furthermore, it is laminated on the back side of the holder, and includes a base that forms a second sealed space between the back side of the holder, A recess forming the first sealed space is formed between the holder and the back surface of the porous pad, The air hole of the porous pad is connected to the through hole of the holder and functions as the communication means.
  • a frame member having an annular portion disposed between the holder and the base;
  • the second sealed space is formed by an internal space of the annular portion.
  • a ventilation hole of the porous pad penetrates the island-shaped protrusion.
  • the first sealed space is a space for pressurized air;
  • the second sealed space is a decompression space.
  • the air holes are distributed and arranged over the entire surface of the porous pad, According to such a configuration, the entire surface of the porous pad can be used as an adsorption fixing region.
  • the porous pad is made of porous carbon.
  • a non-contact suction disk capable of holding and sucking a thin workpiece at a predetermined position or holding and sucking it downward.
  • FIG. 4 is a surface obtained by enlarging a part of a cross section taken along line IV-IV in FIG. 3. It is a top view of the holder of the non-contact suction disk of FIG. It is a bottom view of the holder of the non-contact suction disk of FIG. It is a top view of the base of the non-contact suction disk of FIG. It is a bottom view of the modification of the holder of a non-contact suction disk.
  • FIG. 1 It is a bottom view of another modification of the holder of a non-contact suction disk. It is typical sectional drawing for demonstrating the state of the adsorption
  • FIG. 1 is an exploded perspective view of the non-contact suction disk 1 according to the first embodiment of the present invention.
  • the non-contact suction disk 1 of this embodiment is a non-contact suction for sucking a thin plate-like object (work) such as a semiconductor wafer, a glass substrate for FPD, for example, a semiconductor wafer having a thickness of 100 ⁇ m or less in a non-contact state It is a board.
  • the non-contact suction disk 1 is a disk-shaped porous pad 2 having a work suction area on the upper surface, and an approximately holding the porous pad 2 from the lower side (back side).
  • a disk-shaped pad holder 4 and a substantially disk-shaped base 6 connected to the back side of the holder 4 are provided.
  • the porous pad 2 is made of breathable porous carbon.
  • the material of the porous pad 2 is not limited to breathable porous carbon, and other breathable porous materials such as porous SiC / porous alumina can also be used.
  • FIG. 2 is a top view of the porous pad 2
  • FIG. 3 is a bottom view of the porous pad 2.
  • a plurality of suction holes (vent holes) 8 are formed in the porous pad 2. As shown in FIGS. 2 and 3, the suction holes 8 are arranged in a lattice pattern over substantially the entire surface of the porous pad 2, that is, in a state of being arranged on the intersections of the grids. Yes. In the present embodiment, the interval between the suction holes 8 is set to about 25 mm.
  • FIG. 4 is a surface obtained by enlarging a part of the cross section along the line VI-VI in FIG.
  • the suction holes 8 are formed so as to extend through the respective porous pads 2 in the thickness direction.
  • the suction hole 8 has a small diameter portion 8a having a diameter of about 0.6 mm on the surface 2a side of the porous pad 2, and a large diameter portion 8b having a diameter of about 4 mm on the back surface 2b side of the porous pad 2, and the small diameter portion 8a and the large diameter.
  • the portion 8b is connected by a tapered portion 8c that tapers toward the surface 2a of the porous pad 2.
  • a connecting hole 10 through which a fastener such as a screw for connecting the porous pad to the pad holder 4 or the like is inserted is formed in the peripheral portion of the porous pad 2.
  • FIG. 5 is a top view of the pad holder 4, and FIG. 6 is a bottom view of the pad holder 4.
  • the pad holder 4 is a substantially disk-shaped member that holds the porous pad 2 from the lower side (back side), and is formed of a metal material such as an aluminum alloy, for example.
  • the pad holder 4 can also be formed of a resin such as CFRP / PEEK.
  • an annular rising portion 12 is formed on the outer periphery of the upper surface of the pad holder 4.
  • the rising portion 12 is configured such that the inner diameter is slightly larger than the outer diameter of the porous pad 2 and the height is slightly lower than the thickness of the porous pad 2.
  • the upper surface 2 a of the porous pad 2 is slightly more than the top surface of the rising portion 12 of the pad holder 4. It will be in the state arranged above.
  • grooves 14 having a rectangular cross section are formed in a lattice shape (a grid pattern), and a portion delimited by the grooves 14 is crossed.
  • the surface is a square island-shaped protrusion 16.
  • the island-shaped protrusions 16 form a grid-like arrangement along with the grooves 14 arranged in a grid pattern (a grid-like pattern).
  • the top surface of each protrusion 14 is flat, and a communication hole 18 that penetrates the pad holder 4 in the thickness direction is formed in the center.
  • the porous pad 2 and the pad holder 4 are bonded and fixed by an adhesive in a state where the porous pad 2 is disposed in the space inside the rising portion 12 of the pad holder 4.
  • the porous pad 2 and the pad holder 4 are further connected and fixed to each other by a fastener such as a bolt.
  • the protruding portion 14 When the porous pad 2 is disposed in the space inside the rising portion 12 of the pad holder 4, the protruding portion 14 has an open end of the large diameter portion 8 b of the suction hole 8 on the back surface 2 b of the porous pad 2. It is comprised so that it may contact
  • a sealed space (first sealed space) is formed by the groove 14 and the porous pad 2 covering the groove 14.
  • the communication hole 18 has substantially the same diameter as the large diameter portion 8 b of the suction hole 8 of the porous pad 2, and the porous pad 2 is in a space inside the rising portion 12 of the pad holder 4 at a predetermined angular position.
  • each suction port 8 formed in the porous pad 2 is arranged in the thickness direction.
  • the sealed space (first sealed space) formed by the groove 14 communicates with the external space of the pad holder 4, and pressurized air is introduced into this sealed space (first sealed space).
  • a pressurized air inlet 20 is formed for this purpose.
  • the pressurized air is formed by the groove 14 and the porous pad 2 from the pressurized air inlet 20.
  • the pressurized air penetrates into the pores of the porous pad 2 constituting the upper surface of the sealed space (first sealed space), passes through the porous pad 2, It will be ejected from the entire surface of the porous pad 2.
  • FIG. 7 is a top view of the base 6.
  • the base 6 is a substantially disk-shaped member connected to the back side of the holder 4 and is formed of a metal material such as an aluminum alloy, for example.
  • the base 6 can also be formed of a resin such as CFRP / PEEK.
  • the base 6 has substantially the same diameter as the pad holder 4, and base grooves 22 having a rectangular cross section are formed in a lattice shape on a flat upper surface. Therefore, when the flat back surface of the pad holder 4 and the upper surface of the base 6 are joined, the lattice-shaped base groove 22 and the back surface of the pad holder 4 that covers the lattice-shaped base groove 22 (second sealed space). Will be formed.
  • the base groove 22 is configured such that when the pad holder 4 and the base 6 are joined at a predetermined angular position, the lattice-shaped base groove 22 is aligned with the communication hole 18 formed in the pad holder 4 in the thickness direction. Has been.
  • the suction hole 8 of the porous pad 2 passes through the communication hole 18 of the pad holder 4. , It communicates with the intersection of the lattice-shaped sealed space (second sealed space) formed between the base 6 and the pad holder 4.
  • a vacuum hole 24 that is a through hole for allowing the base groove 22 to communicate with a vacuum source outside the base 6 is formed on the outer periphery of the base 6.
  • the pad holder 4 and the base 6 are connected by a connecting tool such as a screw or a bolt.
  • a groove is formed along the outer periphery of the upper surface of the base 6, and an O-ring is disposed in the groove so that the lattice-shaped base groove 22 of the base 6 is in an airtight state, so that the pad holder 4 and the base 6 Can be linked.
  • the structure which connects the pad holder 4 and the base 6 with an adhesive agent may be sufficient.
  • the pressurized air is supplied from the pressurized air inlet 20 to the groove 14.
  • a sealed space first sealed space formed by the porous pad 2 and vacuum suction is performed from the vacuum hole 24 of the base 6, so that the workpiece is adsorbed on the porous pad 2 in a non-contact manner.
  • the lattice-shaped base groove 22 is formed on the upper surface of the base 6 and the second sealed space is formed by the base groove 22.
  • the upper surface of the base is a flat surface and the back surface of the pad holder is formed.
  • a configuration in which a second sealed space is formed between the pad holder and the base by forming a recess or a groove may be employed.
  • FIG. 8 is a bottom view of a modified pad holder 4 ′ for such a configuration.
  • a thin cylindrical recess 22 ' is formed on the bottom surface of the pad holder 4'.
  • the pad holder 4 ' has a lower surface joined to a disk-shaped base having a flat upper surface, and the pad holder 4' and the base are separated by a flat upper surface of the base and a thin cylindrical recess 22 '.
  • a thin (low height) cylindrical second sealed space is formed.
  • a vacuum hole (not shown) communicating with the recess 22 ′ is formed in the side wall of the pad holder 4 ′.
  • FIG. 9 is a bottom view of another modified pad holder 4 ′′ for such a configuration.
  • the bottom surface of the pad holder 4 ′′ has a grid-like groove. 22 "is formed.
  • This pad holder 4 ′′ also has a disk-shaped base whose lower surface is flat on the upper surface and is joined between the pad holder 4 ′′ and the base by the flat upper surface of the base and the lattice-like grooves 22 ′′.
  • a second sealed space is formed by a groove-like groove.
  • FIG. 10 is a schematic cross-sectional view for explaining the state of the workpiece W being sucked and fixed (non-contact suction) by the non-contact suction plate 1.
  • the workpiece W floated on the surface (suction surface) 8a of the pad by vacuum suction from the vacuum hole 24 of the base 6 which is performed simultaneously with the introduction of the pressurized air passes through the communication hole 18 of the pad holder 4.
  • the suction holes 8 of the porous pad 2 as indicated by an arrow V, and at a position separated by a predetermined distance G from the suction surface 8a where the buoyancy by the pressurized air and the suction force by the vacuum suction are balanced. Will be.
  • the non-contact suction disk 1 By adjusting the buoyancy due to pressurized air (air amount and air pressure) and the suction force due to vacuum suction, the non-contact suction disk 1 is inverted, that is, the suction surface 2a of the porous pad 2 faces downward. In this state, the workpiece W can be sucked and fixed below the suction surface 2a in a non-contact state.
  • FIGS. 11 to 19 are drawings showing each process of workpiece conveyance by the workpiece conveyance device 50 using the non-contact suction disk 1.
  • the workpiece transfer device 50 is a so-called horizontal articulated “material handling” robot.
  • the work transfer device 50 includes a column 52, a first arm 56 having a base end rotatably connected to the upper end of the column 52 via a shoulder joint 54, and a elbow joint 58 rotated to the distal end of the first arm 56.
  • a second arm 60 whose base end is freely connected and a hand portion 64 whose base end is rotatably connected to the tip of the second arm 60 via a wrist joint 62 are provided.
  • the non-contact suction disk 1 of the above embodiment is attached to the lower surface of the hand portion 64 with the suction surface 2a facing downward.
  • the workpiece W is sucked and held on the first processing device 66 by the suction device 70 on the first processing device 66.
  • the first and second arms 56 and 60 of the work transporting device 50 are extended in the direction of the first processing device 66 and attached to the hand unit 64. 1 is disposed above the work W held by suction on the first processing device 66 (FIG. 12).
  • the column 52 is contracted, and the non-contact suction disk 1 or the like is lowered to a height position where the workpiece W can be sucked (FIG. 13).
  • pressurized air and vacuum suction to the non-contact suction board 1 are started, the suction operation of the suction device 70 of the first processing device 66 is stopped, and the workpiece W is suction-fixed on the non-contact suction board 1 side ( FIG. 14).
  • the column 52 is contracted, and the non-contact suction plate 1 and the like are lowered to a height position where the suction device 72 of the second processing device 68 can suck the workpiece W sucked and fixed to the non-contact suction plate 1.
  • FIG. 17 the suction operation of the suction device 72 of the second processing device 68 is started, the pressurized air and the vacuum suction to the non-contact suction board 1 are stopped, and the workpiece W is sucked by the suction device 72 of the second processing device 68. Further, the arm is returned to the initial position to complete the transfer operation (FIG. 19).
  • the workpiece W is sucked from the suction holes distributed over the entire suction surface while blowing the pressurized air from the entire suction surface and floating the workpiece, so that a large stress is applied to the workpiece.
  • the workpiece can be sucked and fixed at a predetermined position in a non-contact state without being applied.
  • FIG. 20 is an exploded perspective view from above of the non-contact suction disk 100 according to the second embodiment of the present invention
  • FIG. 21 is an exploded perspective view from below of the non-contact suction disk 100 according to the second embodiment of the present invention.
  • the non-contact suction disk 100 of the present embodiment is a thin plate-like object (work) such as a semiconductor wafer or a glass substrate for FPD, for example, a thickness of 100 ⁇ m, like the non-contact suction disk 1 of the first embodiment.
  • This is a non-contact suction disk for sucking the following semiconductor wafers in a non-contact state.
  • the non-contact suction disk 100 includes a disk-like porous pad 102 having a workpiece suction region on the upper surface, and a lower side (back side) of the porous pad 102.
  • a substantially disc-shaped pad holder 104 that is held from the bottom, and a substantially disc-shaped base 106 disposed on the back side of the pad holder 104.
  • a frame member 108 having an annular portion 108a is disposed between the pad holder 104 and the base 106.
  • the porous pad 102 is formed of breathable porous carbon, like the porous pad 2 of the non-contact suction disk 1.
  • the material of the porous pad 102 is not limited to the breathable porous carbon, and other breathable porous materials such as porous SiC / porous alumina can be used.
  • the porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 have substantially the same outer diameter.
  • the porous pad 102, the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are laminated, fixed by an adhesive, and non-coated.
  • a contact suction disk 100 is formed.
  • the pad holder 104, the base 106, and the frame member 108 are respectively provided with rectangular handle portions 104b, 106b, and 108b having substantially the same contour extending outward from the disk portion or the annular portion.
  • the pad holder 104, the base 106, and the frame member 108 are made of an aluminum alloy metal material, a resin such as CFRP / PEEK, or the like.
  • a plurality of suction holes (vent holes) 109 are formed in the porous pad 102.
  • the suction hole 109 is disposed over substantially the entire surface of the porous pad 102.
  • a positioning hole 110 for connecting the porous pad to the pad holder 4 or the like is formed in the peripheral portion of the porous pad 102.
  • an annular hanging portion 112 is formed on the outer peripheral edge of the lower surface of the porous pad 102.
  • the hanging portion 112 is configured such that the outer diameter is substantially equal to the outer diameter of the disk portion 104 b of the pad holder 104. That is, a disk-shaped recess is formed on the lower surface of the porous pad 102.
  • a sealed space first sealed space
  • a groove 114 having a rectangular cross section is formed in an inner region of the drooping portion 112 on the lower surface of the porous pad 102, and a portion delimited by the groove 114 is an island-like protrusion 116 having a square cross section.
  • the island-shaped protrusions 116 form a grid-like arrangement along with the grooves 114 arranged in a grid pattern (a grid-like pattern).
  • the top surface of each protrusion 114 is flat, and a suction hole 109 penetrating the porous pad 102 in the thickness direction is disposed at the center.
  • a sealed space (first sealed space) formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102. Is a sealed space partitioned by island-shaped protrusions 116.
  • the pad holder 104 has a through hole 118 that penetrates the pad holder 104 in the thickness direction.
  • Each through-hole 118 has substantially the same diameter as the suction hole 109 of the porous pad 102, and when the pad holder 104 is disposed at a predetermined angular position on the porous pad 102, the suction hole 109 of the porous pad 102. Are arranged to line up.
  • the disk portion of the pad holder 104, the annular portion of the frame member 108, and the disk portion of the base 106 have substantially the same outer diameter, the disk portion of the pad holder 104, the annular portion of the frame member 108, and the base portion
  • the height between the disk portion of the pad holder 104 and the disk portion of the base 106 is substantially equal to the thickness of the frame member 108.
  • a sealed space (second sealed space) is formed.
  • a sealed space (second sealed space) between the disk portion of the pad holder 104 and the disk portion of the base 106 communicates with the suction hole 109 of the porous pad 102 through the through hole 118 of the pad holder 104.
  • each suction hole of the porous pad 102 is passed through the through hole 118 of the pad holder 104. Suction is performed from 109, and the work on the porous pad 102 can be adsorbed toward the porous pad 102.
  • suction long holes 120 and 122 and a pressurizing long hole 124 extending in substantially parallel are formed in the handle portion 108b of the frame member 108.
  • the suction long holes 120 and 123 on both sides communicate with the inner space surrounded by the annular portion 108 a of the frame member 108 on the inner end side. Therefore, in the assembled state of the non-contact suction disk 100, the suction long holes 120 and 122 are communicated with the sealed space (second sealed space) between the disk part of the pad holder 104 and the disk part of the base 106.
  • a plurality of reinforcing members 126 are arranged in a sealed space (second sealed space) between the disk part of the pad holder 104 and the disk part of the base 106.
  • the reinforcing member 126 has substantially the same thickness as the frame member 108.
  • the reinforcing member 126 is sandwiched between the lower surface of the disk portion 104a of the pad holder 104 and the upper surface of the disk portion 106a of the base 106 in the assembled state of the non-contact suction disk 100, and the disk portion 104a of the pad holder 104
  • the sealed space (second sealed space) between the base 106 and the disk portion 106a is depressurized, it functions as a reinforcing material that suppresses the collapse of the sealed space (second sealed space) in the thickness direction.
  • the non-contact suction disk 100 of this embodiment includes an upper plate 128 and a lower plate 130.
  • the upper plate 128 and the lower plate 130 have substantially the same rectangular shape as the pad holder 104, the base 106, and the handle portions 104b, 106b, and 108b of the frame member 108, and the handle portion 104b in the assembled state of the non-contact suction disk 100.
  • 106b and 108b are sandwiched from above and below.
  • the upper plate 128 and the lower plate 130 have screw holes 132 and 134 at four corners.
  • these screw holes correspond to the corresponding screw holes formed at the four corners of the handle portions 104b, 106b, 108b of the pad holder 104, the base 106, and the frame member 108, 136, 138, 140, the handle portions 104b, 106b, and 108b in a stacked state are attached to the upper plate 128 by inserting screws (not shown) through these screw holes 132, 136, 138, 140, and 134, respectively.
  • the lower plate 130 are sandwiched.
  • the lower plate 130 is formed with two suction openings 142 and 144 penetrating in the thickness direction and a pressure opening 146.
  • the suction openings 142 and 144 formed on the side are formed in the handle portion 108b of the frame member 108 through the suction passages 148 and 150 that penetrate the handle portion 106b of the base 106 in the assembled state of the non-contact suction disk 100.
  • the suction elongated holes 120 and 122 communicate with each other, and further communicate with a sealed space (second sealed space) between the disk portion of the pad holder 104 and the disk portion of the base 106.
  • the pressurization opening 146 is a pressurization long hole formed in the handle portion 108b of the frame member 108 via the pressurization passage 152 penetrating the handle portion 106b of the base 106 in the assembled state of the non-contact suction board 100. It communicates with the outer side portion of 124.
  • the inner side (annular portion side) portion of the pressurizing elongated hole 124 is disposed via a pressurizing passage 154 that penetrates the handle portion 104b of the pad holder 104 and is disposed above in the assembled state of the non-contact suction disk 100. In this way, it communicates with a sealed space (first sealed space) formed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102.
  • the pressurized air is sealed between the upper surface of the pad holder 104 and the lower surface of the porous pad 102 (first space). Into the sealed space) and ejected from the surface through the pores of the porous pad 102.
  • the work can be sucked and fixed under the suction surface in a non-contact state.
  • the disk portion 104a of the pad holder 104, the annular portion 108a of the frame member 108, and the disk portion 106a of the base 106 are aligned with the positioning holes 110 of the porous pad 102 in the assembled state of the non-contact suction disk 100.
  • a plurality of positioning holes 156, 158, and 160 are respectively formed.
  • the porous pad 102, the disk part 104a of the pad holder 104, the annular part 108a of the frame member 108 so that the positioning holes 110, 156, 158, 160 are aligned
  • the disk portion 106a of the base 106 is laminated, and pins (not shown) are inserted into the aligned positioning holes 110, 156, 158, 160, and the porous pad 102, the pad holder 104, the frame member 108, and the base 106 are positioned relative to each other. Then, these are bonded and fixed.
  • the pin has a length that protrudes upward from the surface of the porous pad 102, and is not removed after the assembly of the non-contact suction disk 100, and the workpiece adsorbed on the surface of the porous pad 102 is the porous pad 102 It serves as a stopper that prevents sliding off the surface.
  • the non-contact suction disk of the first embodiment has a configuration in which the suction holes 8 are provided in a lattice shape in the disk-shaped porous pad 2, but as shown in FIG. 22, the disk-shaped porous pad You may use the porous pad which has arrange
  • a plurality of suction holes 8 ′′ may be arranged in a rectangular porous pad 2 ′′ in a lattice shape or in an annular shape. In this case, a rectangular pad holder 4 ′′ or the like is used.
  • the positions of the suction holes (vent holes) of the porous pad, the communication holes of the pad holder, and the like are appropriately changed corresponding to the positions of the suction holes of the porous pad.
  • the first sealed space is a pressurized space and the second sealed space is a decompressed space.
  • the pressurized portion and the decompressed portion are replaced, and the first sealed space is the decompressed space
  • the second sealed space may be a pressurized space.
  • the base groove 22 having a rectangular cross section is formed in a lattice shape on the flat upper surface of the base 6, and the base groove 22 becomes the second sealed space. That is, an island-shaped protrusion similar to the island-shaped protrusion 16 on the upper surface of the pad holder 4 is formed between the lattice-shaped base grooves 22.
  • the entire upper surface of the base 6 ′ may be a recess so that the second sealed space 22 ′ is not divided into island-shaped protrusions.
  • Non-contact suction board 2 Porous pad 4: Pad holder 6: Base 8: Suction hole (vent hole) 10: Connecting hole 12: Rising part 14: Groove 16: Protruding part 18: Communication hole 20: Pressurized air inlet 22: Base groove 24: Vacuum hole

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
PCT/JP2013/055491 2012-02-28 2013-02-28 非接触吸着盤 WO2013129599A1 (ja)

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CN104096980A (zh) * 2014-06-26 2014-10-15 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台
JP2019016735A (ja) * 2017-07-10 2019-01-31 日本特殊陶業株式会社 真空吸着装置
JP2019219508A (ja) * 2018-06-20 2019-12-26 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
JP2020047872A (ja) * 2018-09-21 2020-03-26 日本特殊陶業株式会社 基板保持部材
NL2021859B1 (en) * 2018-10-23 2020-05-13 Suss Microtec Lithography Gmbh Fixation system, support plate and method for production thereof

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KR101627913B1 (ko) * 2014-05-26 2016-06-07 세메스 주식회사 반도체 패키지들을 지지하기 위한 테이블 조립체
JP6949455B2 (ja) 2014-12-24 2021-10-13 株式会社タンケンシールセーコウ 非接触搬送装置、および非接触吸着盤
JP6803177B2 (ja) * 2016-08-29 2020-12-23 株式会社日本製鋼所 レーザ照射装置
CN106444298B (zh) * 2016-11-22 2018-01-30 江苏影速光电技术有限公司 一种dmd结构单轴固定光路直写曝光机
CN106444299B (zh) * 2016-11-22 2017-12-12 江苏影速光电技术有限公司 一种dmd结构多轴可移动光路直写曝光机
CN106325007B (zh) * 2016-11-22 2017-11-17 江苏影速光电技术有限公司 一种多扫描驱动轴可移动多棱镜光路直写设备
KR101749997B1 (ko) * 2017-01-17 2017-06-22 주식회사 21세기 Mlcc 적층용 상부금형
JP6983578B2 (ja) 2017-08-25 2021-12-17 株式会社日本製鋼所 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法
CN111482712A (zh) * 2020-04-27 2020-08-04 沈阳仪表科学研究院有限公司 精密切割设备用辅助系统
KR102624060B1 (ko) 2021-09-29 2024-01-12 고려대학교 세종산학협력단 진공 분위기 유지 피식각체 이송 장치 및 진공 분위기 유지 피식각체 이송 방법

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JP2007027495A (ja) * 2005-07-19 2007-02-01 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2009104029A (ja) * 2007-10-25 2009-05-14 V Technology Co Ltd 露光装置
JP2011146705A (ja) * 2010-01-12 2011-07-28 Semes Co Ltd 基板処理装置

Cited By (8)

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Publication number Priority date Publication date Assignee Title
CN104096980A (zh) * 2014-06-26 2014-10-15 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台
JP2019016735A (ja) * 2017-07-10 2019-01-31 日本特殊陶業株式会社 真空吸着装置
JP2019219508A (ja) * 2018-06-20 2019-12-26 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
JP7110005B2 (ja) 2018-06-20 2022-08-01 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
JP2020047872A (ja) * 2018-09-21 2020-03-26 日本特殊陶業株式会社 基板保持部材
JP7260984B2 (ja) 2018-09-21 2023-04-19 日本特殊陶業株式会社 基板保持部材
NL2021859B1 (en) * 2018-10-23 2020-05-13 Suss Microtec Lithography Gmbh Fixation system, support plate and method for production thereof
AT521797A3 (de) * 2018-10-23 2021-11-15 Suss Microtec Lithography Gmbh Fixierungssystem, Auflageplatte und Herstellungsverfahren

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TWI527747B (zh) 2016-04-01
TW201343514A (zh) 2013-11-01
CN104137247B (zh) 2016-09-07
JPWO2013129599A1 (ja) 2015-07-30
KR20140129070A (ko) 2014-11-06
CN104137247A (zh) 2014-11-05
JP5512052B2 (ja) 2014-06-04

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