AT521797A3 - Fixierungssystem, Auflageplatte und Herstellungsverfahren - Google Patents

Fixierungssystem, Auflageplatte und Herstellungsverfahren Download PDF

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Publication number
AT521797A3
AT521797A3 ATA50910/2019A AT509102019A AT521797A3 AT 521797 A3 AT521797 A3 AT 521797A3 AT 509102019 A AT509102019 A AT 509102019A AT 521797 A3 AT521797 A3 AT 521797A3
Authority
AT
Austria
Prior art keywords
handling device
holding
holding plate
platen
manufacturing process
Prior art date
Application number
ATA50910/2019A
Other languages
English (en)
Other versions
AT521797A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT521797A2 publication Critical patent/AT521797A2/de
Publication of AT521797A3 publication Critical patent/AT521797A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Robotics (AREA)

Abstract

Offenbart ist ein Befestigungssystem (10) zur Befestigung eines flexiblen Substrats (16), mit einer Handhabungsvorrichtung (12) und einer von der Handhabungsvorrichtung (12) getrennten Halteplatte (14). Die Handhabungsvorrichtung (12) weist eine Lagerfläche (18) mit Vakuumöffnungen (20) auf. Die Halteplatte (14) weist eine Haltefläche (26) zum Halten des Substrats (16) und eine Verbindungsfläche (24) in Kontakt mit der Lagerfläche (18) der Handhabungsvorrichtung (12) auf. Die Halteplatte (14) weist Durchgangsöffnungen (28) auf, die sich von der Haltefläche (26) zur Verbindungsfläche (24) erstrecken, wobei mindestens eine der Durchgangsöffnungen (28) mit einer der Vakuumöffnungen (20) der Handhabungsvorrichtung (12) in Strömungsverbindung steht. Darüber hinaus sind eine Halteplatte (14) für ein Befestigungssystem (10) und ein Verfahren zur Herstellung einer Halteplatte (14) offenbart.
ATA50910/2019A 2018-10-23 2019-10-22 Fixierungssystem, Auflageplatte und Herstellungsverfahren AT521797A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2021859A NL2021859B1 (en) 2018-10-23 2018-10-23 Fixation system, support plate and method for production thereof

Publications (2)

Publication Number Publication Date
AT521797A2 AT521797A2 (de) 2020-05-15
AT521797A3 true AT521797A3 (de) 2021-11-15

Family

ID=65199549

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50910/2019A AT521797A3 (de) 2018-10-23 2019-10-22 Fixierungssystem, Auflageplatte und Herstellungsverfahren

Country Status (8)

Country Link
US (1) US20200122302A1 (de)
JP (1) JP2020077868A (de)
KR (1) KR20200047379A (de)
CN (1) CN111092041A (de)
AT (1) AT521797A3 (de)
DE (1) DE102019128479A1 (de)
NL (1) NL2021859B1 (de)
TW (1) TW202029400A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022083111A1 (zh) * 2020-10-19 2022-04-28 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
CN112117230B (zh) * 2020-10-19 2025-01-24 北京航空航天大学杭州创新研究院 高密度图案化加工的衬底-掩模板原位保持装置
CN114613721B (zh) * 2022-05-10 2022-07-26 上海隐冠半导体技术有限公司 一种运动台及运动装置
EP4489064A1 (de) * 2023-07-03 2025-01-08 Unity Semiconductor Substratdimensionsadapter

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068541A (ja) * 1999-08-26 2001-03-16 Tatsumo Kk 処理基板トレイ
US20040104326A1 (en) * 2002-08-02 2004-06-03 Walter Demel Device for fixing thin and flexible substrates
JP2007103609A (ja) * 2005-10-03 2007-04-19 Mejiro Precision:Kk 投影露光装置
WO2013129599A1 (ja) * 2012-02-28 2013-09-06 株式会社タンケンシールセーコウ 非接触吸着盤
US20180093918A1 (en) * 2015-05-18 2018-04-05 Schott Ag Sensitized, photo-sensitive glass and its production

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001068541A (ja) * 1999-08-26 2001-03-16 Tatsumo Kk 処理基板トレイ
US20040104326A1 (en) * 2002-08-02 2004-06-03 Walter Demel Device for fixing thin and flexible substrates
JP2007103609A (ja) * 2005-10-03 2007-04-19 Mejiro Precision:Kk 投影露光装置
WO2013129599A1 (ja) * 2012-02-28 2013-09-06 株式会社タンケンシールセーコウ 非接触吸着盤
US20180093918A1 (en) * 2015-05-18 2018-04-05 Schott Ag Sensitized, photo-sensitive glass and its production

Also Published As

Publication number Publication date
DE102019128479A1 (de) 2020-04-23
US20200122302A1 (en) 2020-04-23
KR20200047379A (ko) 2020-05-07
AT521797A2 (de) 2020-05-15
CN111092041A (zh) 2020-05-01
JP2020077868A (ja) 2020-05-21
TW202029400A (zh) 2020-08-01
NL2021859B1 (en) 2020-05-13

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Effective date: 20220515