AT506622A3 - Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger - Google Patents
Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger Download PDFInfo
- Publication number
- AT506622A3 AT506622A3 ATA357/2009A AT3572009A AT506622A3 AT 506622 A3 AT506622 A3 AT 506622A3 AT 3572009 A AT3572009 A AT 3572009A AT 506622 A3 AT506622 A3 AT 506622A3
- Authority
- AT
- Austria
- Prior art keywords
- wafer
- carrier
- applying
- disconnecting
- membrane
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Die Erfindung betrifft eine Vorrichtung zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger mit- einer parallel zu einer Kontaktfläche des Wafers ausrichtbaren, verformbaren Membran mit einer Kontaktseite zur zumindest teilweisen Kontaktierung der Kontaktfläche,- rückwärtig zu der Kontaktseite angeordneten Verformungsmitteln zur definiert steuerbaren Verformung der Membran und- Haftmitteln zur Anhaftung des Wafers an die Membran sowie Verfahren zum Ablösen und/oder Aufbringen eines Wafers von einem/auf einen Träger mit einer entsprechenden Vorrichtung.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008018536.1A DE102008018536B4 (de) | 2008-04-12 | 2008-04-12 | Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger |
Publications (3)
Publication Number | Publication Date |
---|---|
AT506622A2 AT506622A2 (de) | 2009-10-15 |
AT506622A3 true AT506622A3 (de) | 2012-11-15 |
AT506622B1 AT506622B1 (de) | 2016-01-15 |
Family
ID=41060606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA357/2009A AT506622B1 (de) | 2008-04-12 | 2009-03-05 | Vorrichtung und verfahren zum aufbringen und/oder ablösen eines wafers auf einen/von einem träger |
Country Status (4)
Country | Link |
---|---|
US (1) | US8157615B2 (de) |
JP (1) | JP5421629B2 (de) |
AT (1) | AT506622B1 (de) |
DE (1) | DE102008018536B4 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006026331B4 (de) * | 2006-06-02 | 2019-09-26 | Erich Thallner | Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit |
US8267143B2 (en) * | 2009-04-16 | 2012-09-18 | Suss Microtec Lithography, Gmbh | Apparatus for mechanically debonding temporary bonded semiconductor wafers |
US8950459B2 (en) | 2009-04-16 | 2015-02-10 | Suss Microtec Lithography Gmbh | Debonding temporarily bonded semiconductor wafers |
US8366873B2 (en) * | 2010-04-15 | 2013-02-05 | Suss Microtec Lithography, Gmbh | Debonding equipment and methods for debonding temporary bonded wafers |
US9275029B2 (en) | 2009-12-02 | 2016-03-01 | International Business Machines Corporation | Automated form layout based upon usage patterns |
US9064686B2 (en) | 2010-04-15 | 2015-06-23 | Suss Microtec Lithography, Gmbh | Method and apparatus for temporary bonding of ultra thin wafers |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
KR101570917B1 (ko) | 2011-04-11 | 2015-11-20 | 에베 그룹 에. 탈너 게엠베하 | 가요성의 캐리어 마운트 및 캐리어 기판을 분리하기 위한 장치 및 방법 |
CN103999205B (zh) * | 2011-12-22 | 2017-12-01 | Ev 集团 E·索尔纳有限责任公司 | 柔性的基片支架、用于分离第一基片的装置和方法 |
US9233452B2 (en) * | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
KR102036907B1 (ko) * | 2013-04-17 | 2019-10-28 | 삼성디스플레이 주식회사 | 패턴 마스크 제작을 위한 금속 시트의 고정 장치 |
WO2015046243A1 (ja) * | 2013-09-25 | 2015-04-02 | 芝浦メカトロニクス株式会社 | 吸着ステージ、貼合装置、および貼合基板の製造方法 |
US20170140971A1 (en) * | 2015-11-14 | 2017-05-18 | Nachiket R. Raravikar | Adhesive with tunable adhesion for handling ultra-thin wafer |
DE102019135499B3 (de) * | 2019-12-20 | 2021-04-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Ablöseelement, Ablöseeinheit und Verfahren zum Ablösen einer Halbleiterschicht von einem Substrat |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
CN112053937B (zh) * | 2020-08-05 | 2024-02-20 | 武汉新芯集成电路制造有限公司 | 一种降低破损率的晶圆解键合方法及装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000076899A1 (en) * | 1999-06-11 | 2000-12-21 | Honeywell International Inc. | A vacuum device for peeling off thin sheets |
WO2005005096A1 (en) * | 2003-07-14 | 2005-01-20 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Perforated plate for wafer chuck |
WO2007143566A2 (en) * | 2006-06-02 | 2007-12-13 | Applied Materials, Inc. | Fast substrate loading on polishing head without membrane inflation step |
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US3307869A (en) * | 1965-03-15 | 1967-03-07 | Banbury Mfg Corp | Vacuum lifting pad |
US3627369A (en) * | 1969-10-10 | 1971-12-14 | Charles H Nixon | High-temperature vacuum pickup |
DE69120068T2 (de) * | 1990-05-22 | 1996-11-28 | Glasstech Inc | Vakuumbiegen von erhitzten glasscheiben |
JPH05315434A (ja) * | 1992-05-07 | 1993-11-26 | Nec Yamagata Ltd | 半導体ウェーハ保持具 |
US5607718A (en) * | 1993-03-26 | 1997-03-04 | Kabushiki Kaisha Toshiba | Polishing method and polishing apparatus |
US5674115A (en) * | 1994-07-06 | 1997-10-07 | Sony Corporation | Apparatus for grinding a master disc |
JPH08267357A (ja) * | 1995-03-31 | 1996-10-15 | Nec Corp | 基板の研磨装置及びその研磨方法 |
USRE38854E1 (en) * | 1996-02-27 | 2005-10-25 | Ebara Corporation | Apparatus for and method for polishing workpiece |
TW324835B (en) * | 1996-05-31 | 1998-01-11 | Memc Electronic Materials | Method for mountong semiconductor |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
US6398621B1 (en) * | 1997-05-23 | 2002-06-04 | Applied Materials, Inc. | Carrier head with a substrate sensor |
JP3955659B2 (ja) | 1997-06-12 | 2007-08-08 | リンテック株式会社 | 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置 |
JP4022306B2 (ja) * | 1998-03-03 | 2007-12-19 | 不二越機械工業株式会社 | ウェーハの接着方法及び接着装置 |
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US6652362B2 (en) * | 2000-11-23 | 2003-11-25 | Samsung Electronics Co., Ltd. | Apparatus for polishing a semiconductor wafer and method therefor |
US6769973B2 (en) * | 2001-05-31 | 2004-08-03 | Samsung Electronics Co., Ltd. | Polishing head of chemical mechanical polishing apparatus and polishing method using the same |
DE10140133A1 (de) * | 2001-08-16 | 2003-03-13 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Herstellen einer klebenden Verbindung zwischen einer Halbleiterscheibe und einer Trägerplatte |
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JP4201564B2 (ja) * | 2001-12-03 | 2008-12-24 | 日東電工株式会社 | 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置 |
JP2005150453A (ja) * | 2003-11-17 | 2005-06-09 | Taiyo Yuden Co Ltd | 薄型半導体ウェハーの剥離方法及びその装置並びに薄型半導体ウェハーの製造方法 |
US7549833B2 (en) * | 2006-05-04 | 2009-06-23 | David Tang | Unstacking apparatus and method for placing a sheet of glass from an upright glass stack into a tiltable glass frame |
-
2008
- 2008-04-12 DE DE102008018536.1A patent/DE102008018536B4/de active Active
-
2009
- 2009-03-05 AT ATA357/2009A patent/AT506622B1/de active
- 2009-03-12 US US12/402,542 patent/US8157615B2/en active Active
- 2009-03-23 JP JP2009070508A patent/JP5421629B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000076899A1 (en) * | 1999-06-11 | 2000-12-21 | Honeywell International Inc. | A vacuum device for peeling off thin sheets |
WO2005005096A1 (en) * | 2003-07-14 | 2005-01-20 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Perforated plate for wafer chuck |
WO2007143566A2 (en) * | 2006-06-02 | 2007-12-13 | Applied Materials, Inc. | Fast substrate loading on polishing head without membrane inflation step |
Also Published As
Publication number | Publication date |
---|---|
DE102008018536A1 (de) | 2009-10-15 |
DE102008018536B4 (de) | 2020-08-13 |
JP5421629B2 (ja) | 2014-02-19 |
US20090258583A1 (en) | 2009-10-15 |
US8157615B2 (en) | 2012-04-17 |
AT506622A2 (de) | 2009-10-15 |
AT506622B1 (de) | 2016-01-15 |
JP2009260317A (ja) | 2009-11-05 |
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