TWI524823B - 印刷配線板之製造方法及以該印刷配線板製造方法所製得之印刷配線板 - Google Patents

印刷配線板之製造方法及以該印刷配線板製造方法所製得之印刷配線板 Download PDF

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Publication number
TWI524823B
TWI524823B TW100136444A TW100136444A TWI524823B TW I524823 B TWI524823 B TW I524823B TW 100136444 A TW100136444 A TW 100136444A TW 100136444 A TW100136444 A TW 100136444A TW I524823 B TWI524823 B TW I524823B
Authority
TW
Taiwan
Prior art keywords
wiring board
printed wiring
insulating resin
copper
etching
Prior art date
Application number
TW100136444A
Other languages
English (en)
Chinese (zh)
Other versions
TW201223365A (en
Inventor
吉川和廣
Original Assignee
三井金屬礦業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三井金屬礦業股份有限公司 filed Critical 三井金屬礦業股份有限公司
Publication of TW201223365A publication Critical patent/TW201223365A/zh
Application granted granted Critical
Publication of TWI524823B publication Critical patent/TWI524823B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
TW100136444A 2010-10-08 2011-10-07 印刷配線板之製造方法及以該印刷配線板製造方法所製得之印刷配線板 TWI524823B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010229128 2010-10-08

Publications (2)

Publication Number Publication Date
TW201223365A TW201223365A (en) 2012-06-01
TWI524823B true TWI524823B (zh) 2016-03-01

Family

ID=45927833

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100136444A TWI524823B (zh) 2010-10-08 2011-10-07 印刷配線板之製造方法及以該印刷配線板製造方法所製得之印刷配線板

Country Status (5)

Country Link
JP (1) JP5794740B2 (ko)
KR (1) KR101553635B1 (ko)
CN (1) CN103155724B (ko)
TW (1) TWI524823B (ko)
WO (1) WO2012046841A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5470493B1 (ja) * 2013-07-23 2014-04-16 Ｊｘ日鉱日石金属株式会社 樹脂基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
KR20230038643A (ko) * 2020-07-16 2023-03-21 미쓰이금속광업주식회사 동장 적층판 및 프린트 배선판
CN114143982A (zh) * 2022-02-08 2022-03-04 江油星联电子科技有限公司 一种多层印刷电路板的生产制作方法
CN115023058B (zh) * 2022-06-20 2023-04-18 清华大学深圳国际研究生院 一种高精度电路转移至柔性可拉伸基底上的方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2808504B2 (ja) * 1990-09-12 1998-10-08 加古川プラスチックス 株式会社 フィルム状銅蒸着基材
JPH0629647A (ja) * 1992-07-08 1994-02-04 Hitachi Ltd フォトレジストの剥離方法
JP4583939B2 (ja) 2005-01-14 2010-11-17 日東電工株式会社 配線回路基板の製造方法
JP2006287099A (ja) 2005-04-04 2006-10-19 Fujikura Ltd レジスト付きプリント配線板の製造方法
CN101024800A (zh) * 2006-02-21 2007-08-29 联华电子股份有限公司 清洗液以及移除等离子体工艺后的残余物的方法
JPWO2007148666A1 (ja) * 2006-06-20 2009-11-19 日本化薬株式会社 プライマー樹脂層付銅箔及びそれを使用した積層板
JP4923903B2 (ja) * 2006-09-20 2012-04-25 住友金属鉱山株式会社 高耐熱密着力を有する銅被覆ポリイミド基板
WO2009084533A1 (ja) * 2007-12-28 2009-07-09 Mitsui Mining & Smelting Co., Ltd. 樹脂付銅箔および樹脂付銅箔の製造方法

Also Published As

Publication number Publication date
CN103155724A (zh) 2013-06-12
KR20130067302A (ko) 2013-06-21
TW201223365A (en) 2012-06-01
JP5794740B2 (ja) 2015-10-14
WO2012046841A1 (ja) 2012-04-12
KR101553635B1 (ko) 2015-09-16
JPWO2012046841A1 (ja) 2014-02-24
CN103155724B (zh) 2016-01-13

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