TWI517208B - Method for manufacturing a substrate for mounting a semiconductor element - Google Patents

Method for manufacturing a substrate for mounting a semiconductor element Download PDF

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Publication number
TWI517208B
TWI517208B TW100130384A TW100130384A TWI517208B TW I517208 B TWI517208 B TW I517208B TW 100130384 A TW100130384 A TW 100130384A TW 100130384 A TW100130384 A TW 100130384A TW I517208 B TWI517208 B TW I517208B
Authority
TW
Taiwan
Prior art keywords
photoresist layer
layer
photoresist
exposed
substrate
Prior art date
Application number
TW100130384A
Other languages
English (en)
Chinese (zh)
Other versions
TW201236051A (en
Inventor
Shigeru Hosomomi
Hiroyuki Arima
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Filing date
Publication date
Application filed filed Critical
Publication of TW201236051A publication Critical patent/TW201236051A/zh
Application granted granted Critical
Publication of TWI517208B publication Critical patent/TWI517208B/zh

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TW100130384A 2010-10-01 2011-08-24 Method for manufacturing a substrate for mounting a semiconductor element TWI517208B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010223374A JP5370330B2 (ja) 2010-10-01 2010-10-01 半導体素子搭載用基板の製造方法

Publications (2)

Publication Number Publication Date
TW201236051A TW201236051A (en) 2012-09-01
TWI517208B true TWI517208B (zh) 2016-01-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW100130384A TWI517208B (zh) 2010-10-01 2011-08-24 Method for manufacturing a substrate for mounting a semiconductor element

Country Status (4)

Country Link
JP (1) JP5370330B2 (ja)
KR (1) KR101671037B1 (ja)
CN (1) CN102446774B (ja)
TW (1) TWI517208B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6099369B2 (ja) * 2012-11-20 2017-03-22 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
JP6099370B2 (ja) * 2012-11-21 2017-03-22 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
JP2015211157A (ja) * 2014-04-28 2015-11-24 三菱電機株式会社 パワー半導体モジュールおよびその製造方法
JP6299004B2 (ja) * 2015-04-30 2018-03-28 Ｓｈマテリアル株式会社 半導体素子搭載用基板及び半導体装置、並びにそれらの製造方法
JP6555927B2 (ja) * 2015-05-18 2019-08-07 大口マテリアル株式会社 半導体素子搭載用リードフレーム及び半導体装置の製造方法
CN109565941B (zh) 2016-08-10 2021-07-20 株式会社村田制作所 陶瓷电子部件
CN108269736B (zh) * 2018-01-25 2020-09-01 深圳市华星光电技术有限公司 通过光阻剥离实现电极层图案化的方法
CN114501801A (zh) * 2020-10-28 2022-05-13 深南电路股份有限公司 一种线路板的加工方法及线路板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4362809A (en) * 1981-03-30 1982-12-07 Hewlett-Packard Company Multilayer photoresist process utilizing an absorbant dye
JPS616830A (ja) * 1984-06-21 1986-01-13 Matsushita Electric Ind Co Ltd パタ−ン形成方法
US5091288A (en) * 1989-10-27 1992-02-25 Rockwell International Corporation Method of forming detector array contact bumps for improved lift off of excess metal
JPH04196152A (ja) * 1990-11-26 1992-07-15 Sumitomo Electric Ind Ltd 半導体装置の製造方法
JPH0715113A (ja) * 1993-06-24 1995-01-17 Hitachi Ltd プリント配線パターン形成方法
JPH0722735A (ja) * 1993-07-05 1995-01-24 Ibiden Co Ltd プリント配線板
JPH081810A (ja) * 1994-06-20 1996-01-09 Koichi Ishida 等方性エッチングにより形成する微小レンズ
ITTO20020793A1 (it) * 2002-09-12 2004-03-13 Olivetti Jet Spa Metodo per ricoprire selettivamente una superficie microlavorata.
JP2007093958A (ja) * 2005-09-28 2007-04-12 Sumitomo Heavy Ind Ltd パターン加工方法

Also Published As

Publication number Publication date
TW201236051A (en) 2012-09-01
KR101671037B1 (ko) 2016-10-31
JP2012079905A (ja) 2012-04-19
CN102446774A (zh) 2012-05-09
CN102446774B (zh) 2016-01-20
KR20120034566A (ko) 2012-04-12
JP5370330B2 (ja) 2013-12-18

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