TWI509723B - 載體基板分離系統及方法 - Google Patents

載體基板分離系統及方法 Download PDF

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Publication number
TWI509723B
TWI509723B TW103118180A TW103118180A TWI509723B TW I509723 B TWI509723 B TW I509723B TW 103118180 A TW103118180 A TW 103118180A TW 103118180 A TW103118180 A TW 103118180A TW I509723 B TWI509723 B TW I509723B
Authority
TW
Taiwan
Prior art keywords
substrate
carrier substrate
carrier
manufacturing
platform
Prior art date
Application number
TW103118180A
Other languages
English (en)
Chinese (zh)
Other versions
TW201448092A (zh
Inventor
Ki Bok Kang
Heung Sun Kim
Seung Hoo Lee
Original Assignee
Lg Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51964430&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI509723(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lg Display Co Ltd filed Critical Lg Display Co Ltd
Publication of TW201448092A publication Critical patent/TW201448092A/zh
Application granted granted Critical
Publication of TWI509723B publication Critical patent/TWI509723B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
TW103118180A 2013-05-24 2014-05-23 載體基板分離系統及方法 TWI509723B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130058733A KR102082271B1 (ko) 2013-05-24 2013-05-24 캐리어기판 분리 시스템 및 분리 방법

Publications (2)

Publication Number Publication Date
TW201448092A TW201448092A (zh) 2014-12-16
TWI509723B true TWI509723B (zh) 2015-11-21

Family

ID=51964430

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103118180A TWI509723B (zh) 2013-05-24 2014-05-23 載體基板分離系統及方法

Country Status (4)

Country Link
JP (1) JP5844847B2 (ja)
KR (1) KR102082271B1 (ja)
CN (1) CN104183468B (ja)
TW (1) TWI509723B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102300081B1 (ko) * 2015-04-27 2021-09-08 삼성디스플레이 주식회사 합착 장치 및 이를 이용한 곡면 표시 장치의 제조 방법
CN104900564B (zh) * 2015-05-12 2017-10-17 京东方科技集团股份有限公司 剥离设备
JP6515789B2 (ja) * 2015-11-17 2019-05-22 富士通株式会社 表示装置の分離方法及び分離装置
JP6499109B2 (ja) * 2016-03-29 2019-04-10 日本特殊陶業株式会社 保持装置の分離方法および製造方法
TWM543234U (zh) * 2016-12-23 2017-06-11 Mirle Automation Corp 用於剝離兩基板的裝置
JP6765761B2 (ja) * 2016-12-27 2020-10-07 株式会社ディスコ 静電チャック装置及び静電吸着方法
KR20180124198A (ko) * 2017-05-10 2018-11-21 코닝 인코포레이티드 기판 처리 방법들
KR102572801B1 (ko) * 2018-03-20 2023-08-29 코닝 인코포레이티드 디본딩 서포트 장치 및 이를 이용한 디본딩 방법
KR102560167B1 (ko) * 2018-10-04 2023-07-25 코닝 인코포레이티드 디본딩 서포트 장치 및 이를 이용한 디본딩 방법
CN112478783B (zh) * 2020-12-09 2022-03-29 河北光兴半导体技术有限公司 基板玻璃分离机及分离方法

Citations (2)

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TW200815268A (en) * 2006-09-29 2008-04-01 Shinetsu Eng Co Ltd Work transferring method, electrostatic chuck device, and board joining method
WO2010090147A1 (ja) * 2009-02-06 2010-08-12 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置

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JPH10244545A (ja) * 1997-03-04 1998-09-14 Canon Inc 離型方法及び離型装置
JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
CN1243327A (zh) * 1998-07-27 2000-02-02 佳能株式会社 样品加工装置和方法
KR20000012011A (ko) * 1998-07-27 2000-02-25 미다라이 후지오 시료처리장치 및 시료처리방법
JP4809600B2 (ja) * 2003-10-28 2011-11-09 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR100698054B1 (ko) * 2003-12-02 2007-03-23 엘지.필립스 엘시디 주식회사 액정표시소자의 합착 장치
KR101395821B1 (ko) * 2006-11-29 2014-05-16 엘아이지에이디피 주식회사 기판 합착기
JP4729003B2 (ja) * 2007-06-08 2011-07-20 リンテック株式会社 脆質部材の処理方法
KR100902660B1 (ko) * 2007-11-09 2009-06-15 주식회사 에이디피엔지니어링 입체영상용 디스플레이 패널 합착장치
US7846813B2 (en) * 2008-02-04 2010-12-07 Fairchild Semiconductor Corporation Method and apparatus for bonded substrates
US9063605B2 (en) * 2009-01-09 2015-06-23 Apple Inc. Thin glass processing using a carrier
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JP5374462B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2013052998A (ja) * 2011-09-06 2013-03-21 Asahi Glass Co Ltd 剥離装置、及び電子デバイスの製造方法
JP5422767B1 (ja) * 2013-05-09 2014-02-19 信越エンジニアリング株式会社 貼り合わせ分離方法及び分離装置

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
TW200815268A (en) * 2006-09-29 2008-04-01 Shinetsu Eng Co Ltd Work transferring method, electrostatic chuck device, and board joining method
WO2010090147A1 (ja) * 2009-02-06 2010-08-12 旭硝子株式会社 電子デバイスの製造方法およびこれに用いる剥離装置

Also Published As

Publication number Publication date
CN104183468A (zh) 2014-12-03
TW201448092A (zh) 2014-12-16
CN104183468B (zh) 2018-03-16
KR20140138452A (ko) 2014-12-04
JP2014228871A (ja) 2014-12-08
KR102082271B1 (ko) 2020-04-16
JP5844847B2 (ja) 2016-01-20

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