TWI509723B - 載體基板分離系統及方法 - Google Patents
載體基板分離系統及方法 Download PDFInfo
- Publication number
- TWI509723B TWI509723B TW103118180A TW103118180A TWI509723B TW I509723 B TWI509723 B TW I509723B TW 103118180 A TW103118180 A TW 103118180A TW 103118180 A TW103118180 A TW 103118180A TW I509723 B TWI509723 B TW I509723B
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- 239000000758 substrate Substances 0.000 title claims description 929
- 238000000034 method Methods 0.000 title claims description 98
- 238000004519 manufacturing process Methods 0.000 claims description 195
- 238000000926 separation method Methods 0.000 claims description 137
- 238000001179 sorption measurement Methods 0.000 claims description 67
- 230000003068 static effect Effects 0.000 claims description 10
- 238000012546 transfer Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 112
- 230000008569 process Effects 0.000 description 70
- 238000010438 heat treatment Methods 0.000 description 56
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130058733A KR102082271B1 (ko) | 2013-05-24 | 2013-05-24 | 캐리어기판 분리 시스템 및 분리 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201448092A TW201448092A (zh) | 2014-12-16 |
TWI509723B true TWI509723B (zh) | 2015-11-21 |
Family
ID=51964430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103118180A TWI509723B (zh) | 2013-05-24 | 2014-05-23 | 載體基板分離系統及方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5844847B2 (ja) |
KR (1) | KR102082271B1 (ja) |
CN (1) | CN104183468B (ja) |
TW (1) | TWI509723B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102300081B1 (ko) * | 2015-04-27 | 2021-09-08 | 삼성디스플레이 주식회사 | 합착 장치 및 이를 이용한 곡면 표시 장치의 제조 방법 |
CN104900564B (zh) * | 2015-05-12 | 2017-10-17 | 京东方科技集团股份有限公司 | 剥离设备 |
JP6515789B2 (ja) * | 2015-11-17 | 2019-05-22 | 富士通株式会社 | 表示装置の分離方法及び分離装置 |
JP6499109B2 (ja) * | 2016-03-29 | 2019-04-10 | 日本特殊陶業株式会社 | 保持装置の分離方法および製造方法 |
TWM543234U (zh) * | 2016-12-23 | 2017-06-11 | Mirle Automation Corp | 用於剝離兩基板的裝置 |
JP6765761B2 (ja) * | 2016-12-27 | 2020-10-07 | 株式会社ディスコ | 静電チャック装置及び静電吸着方法 |
KR20180124198A (ko) * | 2017-05-10 | 2018-11-21 | 코닝 인코포레이티드 | 기판 처리 방법들 |
KR102572801B1 (ko) * | 2018-03-20 | 2023-08-29 | 코닝 인코포레이티드 | 디본딩 서포트 장치 및 이를 이용한 디본딩 방법 |
KR102560167B1 (ko) * | 2018-10-04 | 2023-07-25 | 코닝 인코포레이티드 | 디본딩 서포트 장치 및 이를 이용한 디본딩 방법 |
CN112478783B (zh) * | 2020-12-09 | 2022-03-29 | 河北光兴半导体技术有限公司 | 基板玻璃分离机及分离方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200815268A (en) * | 2006-09-29 | 2008-04-01 | Shinetsu Eng Co Ltd | Work transferring method, electrostatic chuck device, and board joining method |
WO2010090147A1 (ja) * | 2009-02-06 | 2010-08-12 | 旭硝子株式会社 | 電子デバイスの製造方法およびこれに用いる剥離装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10244545A (ja) * | 1997-03-04 | 1998-09-14 | Canon Inc | 離型方法及び離型装置 |
JPH115064A (ja) * | 1997-06-16 | 1999-01-12 | Canon Inc | 試料の分離装置及びその方法並びに基板の製造方法 |
CN1243327A (zh) * | 1998-07-27 | 2000-02-02 | 佳能株式会社 | 样品加工装置和方法 |
KR20000012011A (ko) * | 1998-07-27 | 2000-02-25 | 미다라이 후지오 | 시료처리장치 및 시료처리방법 |
JP4809600B2 (ja) * | 2003-10-28 | 2011-11-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR100698054B1 (ko) * | 2003-12-02 | 2007-03-23 | 엘지.필립스 엘시디 주식회사 | 액정표시소자의 합착 장치 |
KR101395821B1 (ko) * | 2006-11-29 | 2014-05-16 | 엘아이지에이디피 주식회사 | 기판 합착기 |
JP4729003B2 (ja) * | 2007-06-08 | 2011-07-20 | リンテック株式会社 | 脆質部材の処理方法 |
KR100902660B1 (ko) * | 2007-11-09 | 2009-06-15 | 주식회사 에이디피엔지니어링 | 입체영상용 디스플레이 패널 합착장치 |
US7846813B2 (en) * | 2008-02-04 | 2010-12-07 | Fairchild Semiconductor Corporation | Method and apparatus for bonded substrates |
US9063605B2 (en) * | 2009-01-09 | 2015-06-23 | Apple Inc. | Thin glass processing using a carrier |
US8852391B2 (en) * | 2010-06-21 | 2014-10-07 | Brewer Science Inc. | Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate |
JP5374462B2 (ja) * | 2010-08-23 | 2013-12-25 | 東京エレクトロン株式会社 | 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP2013052998A (ja) * | 2011-09-06 | 2013-03-21 | Asahi Glass Co Ltd | 剥離装置、及び電子デバイスの製造方法 |
JP5422767B1 (ja) * | 2013-05-09 | 2014-02-19 | 信越エンジニアリング株式会社 | 貼り合わせ分離方法及び分離装置 |
-
2013
- 2013-05-24 KR KR1020130058733A patent/KR102082271B1/ko active IP Right Grant
-
2014
- 2014-05-23 TW TW103118180A patent/TWI509723B/zh active
- 2014-05-23 JP JP2014107216A patent/JP5844847B2/ja active Active
- 2014-05-26 CN CN201410225354.6A patent/CN104183468B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200815268A (en) * | 2006-09-29 | 2008-04-01 | Shinetsu Eng Co Ltd | Work transferring method, electrostatic chuck device, and board joining method |
WO2010090147A1 (ja) * | 2009-02-06 | 2010-08-12 | 旭硝子株式会社 | 電子デバイスの製造方法およびこれに用いる剥離装置 |
Also Published As
Publication number | Publication date |
---|---|
CN104183468A (zh) | 2014-12-03 |
TW201448092A (zh) | 2014-12-16 |
CN104183468B (zh) | 2018-03-16 |
KR20140138452A (ko) | 2014-12-04 |
JP2014228871A (ja) | 2014-12-08 |
KR102082271B1 (ko) | 2020-04-16 |
JP5844847B2 (ja) | 2016-01-20 |
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