TWI502164B - A measuring device and a film forming device - Google Patents

A measuring device and a film forming device Download PDF

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Publication number
TWI502164B
TWI502164B TW102132518A TW102132518A TWI502164B TW I502164 B TWI502164 B TW I502164B TW 102132518 A TW102132518 A TW 102132518A TW 102132518 A TW102132518 A TW 102132518A TW I502164 B TWI502164 B TW I502164B
Authority
TW
Taiwan
Prior art keywords
signal
optical
substrate
film
measured
Prior art date
Application number
TW102132518A
Other languages
English (en)
Chinese (zh)
Other versions
TW201411090A (zh
Inventor
Kyokuyo Sai
Yohei Hinata
Yoshiyuki Otaki
Yousong Jiang
Original Assignee
Shincron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shincron Co Ltd filed Critical Shincron Co Ltd
Publication of TW201411090A publication Critical patent/TW201411090A/zh
Application granted granted Critical
Publication of TWI502164B publication Critical patent/TWI502164B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8422—Investigating thin films, e.g. matrix isolation method

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Mathematical Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Physical Vapour Deposition (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW102132518A 2012-09-10 2013-09-10 A measuring device and a film forming device TWI502164B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/073097 WO2014038090A1 (fr) 2012-09-10 2012-09-10 Appareil de mesure et appareil de formation de film

Publications (2)

Publication Number Publication Date
TW201411090A TW201411090A (zh) 2014-03-16
TWI502164B true TWI502164B (zh) 2015-10-01

Family

ID=49850420

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102132518A TWI502164B (zh) 2012-09-10 2013-09-10 A measuring device and a film forming device

Country Status (5)

Country Link
JP (1) JP5367196B1 (fr)
CN (1) CN104350380B (fr)
HK (1) HK1202331A1 (fr)
TW (1) TWI502164B (fr)
WO (1) WO2014038090A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767016B (zh) * 2017-06-22 2022-06-11 新加坡商Ａｍｓ傳感器新加坡私人有限公司 微型光譜儀模組

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107179053A (zh) * 2016-03-10 2017-09-19 中国科学院高能物理研究所 导光装置、薄膜的均匀性测试装置和方法
CN105714252B (zh) * 2016-04-28 2018-09-28 中国工程物理研究院激光聚变研究中心 一种光学薄膜沉积扫描控制方法及系统
JP2019144217A (ja) * 2018-02-20 2019-08-29 国立大学法人千葉大学 膜厚測定装置、これを用いた蒸着装置及び膜特性評価装置
CN109811323B (zh) * 2019-01-23 2023-09-08 北京北方华创微电子装备有限公司 一种磁控溅射装置和托盘检测方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002277215A (ja) * 2001-03-14 2002-09-25 Omron Corp 膜厚測定方法およびその方法を用いた膜厚センサ
CN2552943Y (zh) * 2002-04-30 2003-05-28 西安工业学院 光学薄膜厚度在线实时监控仪
JP2006071589A (ja) * 2004-09-06 2006-03-16 Univ Kansai 色測定装置及び光源装置
US20080011229A1 (en) * 2002-03-25 2008-01-17 Ulvac, Inc. Optical film thickness controlling method, optical film thickness controlling apparatus, dielectric multilayer film manufacturing apparatus, and dielectric multilayer film manufactured using the same controlling apparatus or manufacturing apparatus
JP2008180597A (ja) * 2007-01-24 2008-08-07 Sanyo Electric Co Ltd 光検出装置および光学測定ユニット
WO2011001968A1 (fr) * 2009-07-03 2011-01-06 株式会社シンクロン Appareil de mesure d'épaisseur de film optique et appareil de formation de film mince comportant un appareil de mesure d'épaisseur de film optique
JP2012026949A (ja) * 2010-07-27 2012-02-09 Shimadzu Corp ガス濃度測定装置
TW201224430A (en) * 2010-09-17 2012-06-16 Hamamatsu Photonics Kk Reflectivity measuring device, reflectivity measuring method, membrane thickness measuring device, and membrane thickness measuring method

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JPH01304345A (ja) * 1988-06-02 1989-12-07 Nkk Corp ガス検知装置
JPH0590371A (ja) * 1991-09-27 1993-04-09 Nec Corp 膜厚測定方法及びその装置
JP2973639B2 (ja) * 1991-09-30 1999-11-08 横河電機株式会社 シ―ト状物体の特性測定装置
JP3534632B2 (ja) * 1998-12-22 2004-06-07 シャープ株式会社 膜厚測定方法
JP2001174404A (ja) * 1999-12-15 2001-06-29 Takahisa Mitsui 光断層像計測装置および計測方法
CN1302916A (zh) * 2000-12-27 2001-07-11 中国科学院上海技术物理研究所 关于红外截止滤光片光学介质膜厚度的监控方法
JP3959469B2 (ja) * 2003-08-07 2007-08-15 独立行政法人産業技術総合研究所 膜の屈折率及び厚さの測定方法、測定プログラム及びコンピュータ読取可能な記録媒体
CN2763776Y (zh) * 2004-12-30 2006-03-08 鸿富锦精密工业（深圳）有限公司 膜厚监控装置
CN100365467C (zh) * 2005-04-08 2008-01-30 中国科学院上海光学精密机械研究所 光学膜厚监控系统
JP4559995B2 (ja) * 2006-03-30 2010-10-13 株式会社東芝 腫瘍検査装置
JP4775798B2 (ja) * 2006-05-18 2011-09-21 独立行政法人科学技術振興機構 複数ガス濃度同時測定装置
CN1877298A (zh) * 2006-07-05 2006-12-13 中国科学院上海光学精密机械研究所 膜层光谱的实时测量装置及其测量方法
JP5314301B2 (ja) * 2008-03-14 2013-10-16 三菱重工業株式会社 ガス濃度計測方法および装置
JP5126909B2 (ja) * 2010-10-08 2013-01-23 株式会社シンクロン 薄膜形成方法及び薄膜形成装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002277215A (ja) * 2001-03-14 2002-09-25 Omron Corp 膜厚測定方法およびその方法を用いた膜厚センサ
US20080011229A1 (en) * 2002-03-25 2008-01-17 Ulvac, Inc. Optical film thickness controlling method, optical film thickness controlling apparatus, dielectric multilayer film manufacturing apparatus, and dielectric multilayer film manufactured using the same controlling apparatus or manufacturing apparatus
CN2552943Y (zh) * 2002-04-30 2003-05-28 西安工业学院 光学薄膜厚度在线实时监控仪
JP2006071589A (ja) * 2004-09-06 2006-03-16 Univ Kansai 色測定装置及び光源装置
JP2008180597A (ja) * 2007-01-24 2008-08-07 Sanyo Electric Co Ltd 光検出装置および光学測定ユニット
WO2011001968A1 (fr) * 2009-07-03 2011-01-06 株式会社シンクロン Appareil de mesure d'épaisseur de film optique et appareil de formation de film mince comportant un appareil de mesure d'épaisseur de film optique
JP2012026949A (ja) * 2010-07-27 2012-02-09 Shimadzu Corp ガス濃度測定装置
TW201224430A (en) * 2010-09-17 2012-06-16 Hamamatsu Photonics Kk Reflectivity measuring device, reflectivity measuring method, membrane thickness measuring device, and membrane thickness measuring method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767016B (zh) * 2017-06-22 2022-06-11 新加坡商Ａｍｓ傳感器新加坡私人有限公司 微型光譜儀模組

Also Published As

Publication number Publication date
HK1202331A1 (en) 2015-09-25
CN104350380A (zh) 2015-02-11
WO2014038090A1 (fr) 2014-03-13
CN104350380B (zh) 2017-03-15
TW201411090A (zh) 2014-03-16
JPWO2014038090A1 (ja) 2016-08-08
JP5367196B1 (ja) 2013-12-11

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