TWI482818B - A hardening composition containing silicon oxide and a hardened product thereof - Google Patents

A hardening composition containing silicon oxide and a hardened product thereof Download PDF

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Publication number
TWI482818B
TWI482818B TW103102780A TW103102780A TWI482818B TW I482818 B TWI482818 B TW I482818B TW 103102780 A TW103102780 A TW 103102780A TW 103102780 A TW103102780 A TW 103102780A TW I482818 B TWI482818 B TW I482818B
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TW
Taiwan
Prior art keywords
group
formula
polyfluorene
decane
represented
Prior art date
Application number
TW103102780A
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English (en)
Chinese (zh)
Other versions
TW201434985A (zh
Inventor
秋山勝宏
松野佑
江口弘
山中一廣
中十惇也
河合亘
小川毅
Original Assignee
中央硝子股份有限公司
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Publication of TW201434985A publication Critical patent/TW201434985A/zh
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Publication of TWI482818B publication Critical patent/TWI482818B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
TW103102780A 2013-01-25 2014-01-24 A hardening composition containing silicon oxide and a hardened product thereof TWI482818B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013012062 2013-01-25
JP2014008423A JP6213257B2 (ja) 2013-01-25 2014-01-21 シリコーンを含む硬化性組成物およびその硬化物

Publications (2)

Publication Number Publication Date
TW201434985A TW201434985A (zh) 2014-09-16
TWI482818B true TWI482818B (zh) 2015-05-01

Family

ID=51227533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103102780A TWI482818B (zh) 2013-01-25 2014-01-24 A hardening composition containing silicon oxide and a hardened product thereof

Country Status (6)

Country Link
US (1) US9512272B2 (enExample)
JP (1) JP6213257B2 (enExample)
KR (1) KR101702474B1 (enExample)
CN (1) CN104955900B (enExample)
TW (1) TWI482818B (enExample)
WO (1) WO2014115742A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016013421A1 (ja) * 2014-07-24 2016-01-28 セントラル硝子株式会社 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置
EP3306682A4 (en) * 2015-05-28 2019-03-20 Sumitomo Chemical Company Limited LED DEVICE, LED MODULE AND ULTRAVIOLETTES LIGHT EMITTING DEVICE
ES2865325T3 (es) * 2016-12-16 2021-10-15 Henkel Ag & Co Kgaa Proceso para la preparación de polisiloxanos que tienen grupos funcionales hidroxilo
JP7203196B2 (ja) * 2018-08-17 2023-01-12 ワッカー ケミー アクチエンゲゼルシャフト 架橋性オルガノシロキサン組成物
JP2020143206A (ja) * 2019-03-06 2020-09-10 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物
JP2023127627A (ja) * 2022-03-02 2023-09-14 凸版印刷株式会社 表示装置用基板及び画像表示装置
WO2025033375A1 (ja) * 2023-08-07 2025-02-13 株式会社レゾナック パワー半導体装置用封止用材料、封止材、及びパワー半導体装置
CN117402360B (zh) * 2023-12-15 2024-05-07 荣耀终端有限公司 聚硅氧烷、硬化层组合物、显示模组保护膜、显示模组、显示面板及电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009062446A (ja) * 2007-09-06 2009-03-26 Momentive Performance Materials Japan Kk 硬化性シリコーン組成物
JP2012129316A (ja) * 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012129315A (ja) * 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3482115B2 (ja) 1997-10-13 2003-12-22 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物および電子部品
DE19808117A1 (de) * 1998-02-26 1999-09-09 Wacker Chemie Gmbh RTV-2 Siliconschäume mit niedrigem Druckverformungsrest
JP3595731B2 (ja) * 1999-06-21 2004-12-02 信越化学工業株式会社 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置
JP4646496B2 (ja) * 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP5132027B2 (ja) 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP2009215345A (ja) 2008-03-07 2009-09-24 Central Glass Co Ltd 熱硬化性有機無機ハイブリッド透明封止材

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2009062446A (ja) * 2007-09-06 2009-03-26 Momentive Performance Materials Japan Kk 硬化性シリコーン組成物
JP2012129316A (ja) * 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012129315A (ja) * 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置

Also Published As

Publication number Publication date
CN104955900B (zh) 2017-03-15
WO2014115742A1 (ja) 2014-07-31
JP2014159561A (ja) 2014-09-04
CN104955900A (zh) 2015-09-30
US9512272B2 (en) 2016-12-06
KR20150110710A (ko) 2015-10-02
TW201434985A (zh) 2014-09-16
US20150322211A1 (en) 2015-11-12
KR101702474B1 (ko) 2017-02-03
JP6213257B2 (ja) 2017-10-18

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