TW200911886A - Silicon-containing compound, curable composition and cured product - Google Patents

Silicon-containing compound, curable composition and cured product Download PDF

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TW200911886A
TW200911886A TW097114897A TW97114897A TW200911886A TW 200911886 A TW200911886 A TW 200911886A TW 097114897 A TW097114897 A TW 097114897A TW 97114897 A TW97114897 A TW 97114897A TW 200911886 A TW200911886 A TW 200911886A
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compound
group
parts
epoxy
curable composition
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TW097114897A
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Chinese (zh)
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TWI425028B (en
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Takashi Sueyoshi
Kenji Hara
Seiichi Saito
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Adeka Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3254Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Abstract

Disclosed is a silicon-containing compound represented by the general formula (0) below. Also disclosed is a curable composition containing 0.01-20 parts by mass of an epoxy curable compound per 100 parts by mass of the silicon-containing compound. This curable composition enables to obtain a cured product having excellent heat resistance and flexibility. (In the general formula (0), R<a>-R<g> each represents a C1-12 saturated aliphatic hydrocarbon group or a C1-12 aromatic hydrocarbon group; Y represents a C2-4 alkylene group; Z represents a group represented by one of the formulae (2)-(6) shown above; K represents a number of 2-7; T represents a number of 1-7; P represents a number of 0-3; and M and N represent numbers satisfying the following relation: N:M = 1:1-1:100, with the total of all M's and all N's being not less than 15, which make the mass average molecular weight of the compound to be 3,000-1,000,000. In the formulae (2)-(6), X<a>-X<c> each represents a C1-8 alkanediyl group, a -COO- group or a single bond; R<h>-R<j> each represents a hydrogen atom or a methyl group; and r represents 0 or 1.)

Description

200911886 九、發明說明: 【發明所屬之技術領域】 本發月係關;^帛具有特定結構之新顆的含有石夕之化合 物、含有該化合物而形成之硬化性組合物、及使該硬化性 、且“勿硬化而成之硬化物。該含有矽之化合物係具有導入 有環氧基之環石夕氧院結構的高分子化合物,藉由使用環氧 硬化性化合物並使之硬化,可形成可用作密封材料、高電 壓絕緣材料等之硬化物。 Γ\ 【先前技術】 對於將有機原材料及無機原材料組合而成之複合材料, j進仃各種研究’在卫業上’亦利用使無機填充 U機同分子複合之方法、或以有機高分子對金屬表面 加二修飾之塗佈的方法等。對於該等有機/無機複合材料 而石,由於構成該等複合材料之原材料具有微米級以上之 ^、’故_可將—部分物性提高至預想值以上,但其他 f數或物性僅表現出根據有機原材料及無機原材料各 之性能或物性之加成規則所預料的值。 動t β方面,近年來’對以τ有機/無機複合材料之研究 “ ’’’、·行:有機原材料及無機原材料各原材料範疇 大小為奈米級,進而以分子水平 威兵/且°而成之有機/無機複合材料。業者期望此類材料 材料 兼-各原材科之特性,而且兼具各原 身〜”,進而具有加成規則無法預料的與各原材料自 身元全不同之新功能性。 I308〇6.d〇c 200911886 此種有機/無機複合材料中,存在—方之原材料及另一 方之原材料以分子水平經由共價鍵而鍵結之化學鍵結型、 二= 二原材料作為基質並使另—方之原材料細微地 中並複合化的混合型。至於合成該等有機/ 取疑二 使用之無機原材料的方法,係使用溶 ^ ” ’所谓該溶膠-凝膠法’係指藉由前驅物分子之200911886 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a new compound containing a specific structure, a compound containing Shi Xi, a curable composition containing the compound, and the curability And a hardened material which is not hardened. The compound containing ruthenium has a polymer compound having a ring-forming structure of an epoxy group, and can be formed by curing and curing the epoxy curable compound. It can be used as a hardened material for sealing materials, high-voltage insulation materials, etc. Γ\ [Prior Art] For composite materials that combine organic raw materials and inorganic raw materials, various researches on 'in the health industry' are also used to make inorganic a method of filling a U-machine with a molecular compound, or a method of coating a metal surface with a second modification of an organic polymer, etc. For the organic/inorganic composite materials, the raw materials constituting the composite material have a micron or higher ^, 'so _ can be - part of the physical properties increased above the expected value, but other f-number or physical properties only show that according to organic raw materials and inorganic raw materials The value expected by the addition rule of energy or physical properties. In recent years, 'the study of organic/inorganic composite materials for τ', ''', and the raw material categories of organic raw materials and inorganic raw materials are nanometers. An organic/inorganic composite that is formed at a molecular level and at a molecular level. The industry expects that such materials and materials - the characteristics of each raw material section, and both of the original body ~", and thus have the new functionality that is unpredictable by the addition rules and the raw materials themselves. I308〇6.d〇 c 200911886 In this organic/inorganic composite material, there is a chemical bond type in which the raw material of the other side and the other raw material are bonded at a molecular level via a covalent bond, and the raw material of the second=two raw materials serves as a substrate and the raw materials of the other side are fine. a mixed type in the ground and composited. As for the method of synthesizing the organic raw materials used in the organic/suspicious two, the use of the solvent "the so-called sol-gel method" means the precursor molecule

水解=其後所進行之聚縮合反應,而在低溫下獲得交聯之 =機=化物的反應。由該溶膠_凝膠法所獲得之無機原材 ’有在短期間内膠化等保存穩定性差之問題。 料利文獻!中,藉由下述方法來#試改良保存穩定 1者眼於烧基三燒氧基石夕院之由烧基鏈長所致的縮合速 、::差!,在甲基三甲氧基石夕炫之聚縮合後,添加聚縮合 、、-較杈之長鏈烷基三烷氧基矽烷,對聚矽氧烷中之矽醇 基進行封端;進而,使用銘觸媒進行甲基三甲氧基石夕烧之 聚縮合反應’在達到特定分子量時添加乙醯丙酮,在反應 2進行配位基交換。然而,該等方法對保存穩定性之改 口'充刀又,由溶膠-凝膠法所獲得之無機原材料存 在可撓性之問題。 相對於此,作為化學鍵結型之有機/無機複合材料,提 出有含有特定的含有⑦之聚合物的硬化性組合物。例如, 於專利文獻1中揭示有如下含有矽之硬化性組合物:含有 八有乂聯結構且具有烯基及炔基的含有矽之聚合物(A)、 具有父聯結構且具有矽烷基的含有矽之聚合物(B)、及鉑 系觸媒(D) ’且操作性及硬化性優異,所獲得之硬化物之 130806.doc 200911886 耐熱性亦優異。然而,該含有矽之硬化性組合物有如下問 題:硬化特性未必充分,無法在低溫下、在短時間内獲得 具有充分之性能的硬化物。 又,專利文獻2中揭示有如下導入有環氧基之環氧聚矽 氧樹脂組合物:其係藉由聚有機氫化矽氧烷與含有烯基之 環氧化合物的加成反應而獲得,機械強度、耐濕性、财熱 性及作業性良好’ 但此處所揭示者並不提供具有充分之: 熱性及可撓性之硬化物。Hydrolysis = a polycondensation reaction carried out thereafter, and a cross-linking = machine = compound reaction is obtained at a low temperature. The inorganic raw material obtained by the sol-gel method has a problem of poor storage stability such as gelation in a short period of time. Profitable literature! In the following method, the test method is used to improve the stability of storage. The condensation rate caused by the length of the base of the burnt base of the burnt base of the three bases is:: Poor! After polycondensation of methyltrimethoxy sulphate, a polycondensation, a long-chain alkyltrialkoxide of hydrazine is added to block the sterol group in the polyoxyalkylene; The catalyst is subjected to a polycondensation reaction of methyltrimethoxy-zetanic sintering. 'Acetone acetone is added when a specific molecular weight is reached, and a ligand exchange is carried out in the reaction 2. However, these methods have a problem of flexibility in the preservation of the stability of the inorganic material obtained by the sol-gel method. On the other hand, as the chemical bonding type organic/inorganic composite material, a curable composition containing a specific polymer containing 7 is proposed. For example, Patent Document 1 discloses a curable composition containing cerium: a cerium-containing polymer (A) having an octa-linked structure and having an alkenyl group and an alkynyl group, having a parent-linked structure and having a fluorenyl group. The ruthenium-containing polymer (B) and the platinum-based catalyst (D)' are excellent in workability and hardenability, and the obtained cured product is also excellent in heat resistance 130806.doc 200911886. However, the curable composition containing bismuth has a problem that the hardening property is not necessarily sufficient, and a cured product having sufficient performance cannot be obtained at a low temperature in a short time. Further, Patent Document 2 discloses an epoxy polyoxyxene resin composition into which an epoxy group is introduced, which is obtained by an addition reaction of a polyorganohydrogen hydride and an epoxy group containing an alkenyl group, and a mechanical Strength, moisture resistance, heat recovery, and workability are good. However, those disclosed herein do not provide a cured product having sufficient heat and flexibility.

[非專利文獻丨]日本化學會雜誌,N〇 9, 57ι (η%) [專利文獻U日本專利特開2005_325174號公報 [專利文獻2]日本專利特開平5_287〇77號公報 【發明内容】 I發明所欲解決之問題] 本發明之目的在於提供— 可於㈣s ★ π #斤獲传之硬化物的耐熱性及 了撓丨生優異之硬化性組合物。 [解決問題之技術手段] 本發明者等人為解決上述 於環砍氧燒結構中導人有環氧^行研究,結果發現, 上述課題,從而完成本發明/、3切之化合物可解決 亦即,本發明提供—種 化合物: ^式(0)表示之含有矽之 [化1] 130806.doc 200911886[Non-Patent Document 丨] Japanese Journal of Chemical Society, N〇9, 57 ι (η%) [Patent Document U Japanese Patent Laid-Open Publication No. 2005-325174 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei No. Hei. DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The object of the present invention is to provide a curable composition which is excellent in heat resistance and scratch resistance which can be obtained by (4) s ★ π #斤. [Means for Solving the Problems] The inventors of the present invention have found that the above-mentioned problems can be solved by the above-mentioned problems in order to solve the above-mentioned problems in the structure of the above-mentioned ring-cut oxygen-fired structure, that is, the compound of the present invention can be solved. The present invention provides a compound: ^ is represented by the formula (0) containing hydrazine [Chemical 1] 130806.doc 200911886

J具係石反原子數為1〜12之 飽和脂肪族煙基、戋可以飴4 &amp; ^ 飽和脂肪族煙基取代的碳原子數 為6心之芳香族烴基;Y為碳原子數2〜4之㈣基,z為以 下述式(2)〜(6)中任一者所表示之基,κ為2〜7之數]為 1〜7之數,以T為重複數之聚合部分與以κ_τ為重複數之聚 合部分既可為嵌段狀亦可為隨機狀;ρ為〇〜3之數;μ&amp;Ν (式中’ Ra〜Rg既可相同亦可J is a saturated aliphatic nicotine having a reverse atomic number of 1 to 12, 戋 can be 饴 4 &amp; ^ a saturated aliphatic nicotine substituted with 6 carbon atoms of an aromatic hydrocarbon group; Y is a carbon atom number 2~ (4) base, z is a group represented by any one of the following formulas (2) to (6), κ is a number of 2 to 7] is a number of 1 to 7, and a polymerization portion of T is a repeating number The polymerization portion with κ_τ as a repeating number may be either block-shaped or random; ρ is the number of 〇~3; μ&amp;Ν (wherein Ra~Rg may be the same or

為N: M=1 :丨〜丨:100、且所有Μ與所有ν之合計值為15以 上之數,且係使以通式(〇)表示之含有矽之化合物的質量平 均分子量為3000〜100萬之數;又,以Μ為重複數之聚合部 刀/、以Ν為重複數之聚合部分既可為嵌段狀亦可為隨機 狀)。 [化2]N: M = 1: 丨 ~ 丨: 100, and the total value of all Μ and all ν is 15 or more, and the mass average molecular weight of the compound containing ruthenium represented by the general formula (〇) is 3000~ In addition, the polymer portion of the repeating number is /, and the polymerized portion having the repeat number of Ν is either a block shape or a random shape. [Chemical 2]

CH-}^-X—CH「CH-CH2 ⑵—CHfCHf^ ^—d_'CH2 ⑶CH-}^-X—CH“CH-CH2 (2)—CHfCHf^ ^—d_'CH2 (3)

⑹ (式中’ Xa〜X。表示亞甲基可以氧原子及/或酯鍵取代的碳原 子數為1〜8之烷二基、-COO-或單鍵;Rh〜Rj表示氫原子或 甲基;r表示〇或1)。 又’本發明提供一種硬化性組合物,其中,相對於1 00 質夏份之上述含有矽之化合物,含有0.01〜20質量份之環 I30806.doc 200911886 氧硬化性化合物。 又’本發明提供一種硬化性組合物,其中,相對於1〇〇 質量份之上述含有矽之化合物,含有〇 〇1〜3〇質量份之環 氧硬化性化合物及1〜50質量份之環氧化合物。 又,本發明提供一種使上述硬化性組合物硬化而形成之 硬化物。 [發明之效果] 根據本發明,可提供一種新穎的含有矽之化合物,該含 有石夕之化合物若與環氧硬化性化合物—併使用,則成為硬 化性優異之硬化性組合物,可形成耐熱性及可撓性優異之 硬化物。 【實施方式】 首先,對以上述通式(0)表示之本發明的含有矽之化合 物加以說明。 σ 述I式(0)令,作為以Ra〜Rg表示之碳原子數為1〜12之 飽和脂肪族烴基,可丨叛. J列舉.甲基、乙基、丙基、異丙基、 丁基、第二丁基、第二 _ , ^ 第—丁基、異丁基 '戊基、異戊基、第 二戊基、己基3 « •己基、3_己基、環己基、1-甲基環己 基、庚基、2-庚其、0 —好 Α %庚基、異庚基、第三庚基、正辛 基、異辛基、第 Α丄 一辛基、2·乙基己基、壬基、異壬基、癸 基、十二烷基等。 Λ 又,以Ra〜Rg表- 數為6〜12之料/之可錢和脂㈣煙基取代的碳原子 基的整體之碳原:基’係亦包括取代基即飽和脂肪族烴 、 為6〜12者。作為取代基即飽和脂肪族 130806.doc -10- 200911886 、土例如,可採用上述所例示之飽和脂肪族煙基中可滿 足上述碳原子數者。因此,作為以尺3〜以表示之可由飽和 脂肪族烴基取代的碳原子數為6〜12之芳香族烴基,可列 舉.苯基、萘基、2-子基苯基、3_甲基苯基、扣甲基苯 基、3-異丙基苯基、4_異丙基苯基、4_丁基苯基、4旦丁 基苯基、4-第三丁基苯基、4_己基苯基、4·環己基苯基、 2」3 一甲基本基、2,4·二甲基苯基、2,5~二甲基苯基、2,6- r =基'基、3,4-二?基苯基、3,5_二尹基苯基、環己基 本土、聯苯基、2,4,5-三甲基苯基等。(6) (wherein Xa to X represent an alkylene group having 1 to 8 carbon atoms substituted by an oxygen atom and/or an ester bond, -COO- or a single bond; and Rh to Rj represent a hydrogen atom or a group Base; r means 〇 or 1). Further, the present invention provides a curable composition containing 0.01 to 20 parts by mass of the ring I30806.doc 200911886 oxygen-curable compound with respect to the above-mentioned compound containing hydrazine in 100 parts of summer. Further, the present invention provides a curable composition comprising, in an amount of from 1 to 3 parts by mass, based on 1 part by mass of the epoxy-containing compound, and from 1 to 50 parts by mass, per 1 part by mass of the compound containing ruthenium. Oxygen compound. Further, the present invention provides a cured product obtained by curing the curable composition. [Effects of the Invention] According to the present invention, it is possible to provide a novel cerium-containing compound which, when used together with an epoxy-curable compound, is a curable composition excellent in curability and can be formed into a heat-resistant composition. A cured product excellent in properties and flexibility. [Embodiment] First, the compound containing ruthenium of the present invention represented by the above formula (0) will be described. σ I (0), as a saturated aliphatic hydrocarbon group having 1 to 12 carbon atoms represented by Ra to Rg, can be rebelled. J. Methyl, ethyl, propyl, isopropyl, butyl Base, second butyl, second _, ^ butyl, isobutyl 'pentyl, isopentyl, second pentyl, hexyl 3 « • hexyl, 3-hexyl, cyclohexyl, 1-methyl Cyclohexyl, heptyl, 2-heptyl, 0-good Α% heptyl, isoheptyl, third heptyl, n-octyl, isooctyl, decyl-octyl, 2-ethylhexyl, anthracene Base, isodecyl, decyl, dodecyl and the like. Λ In addition, the Ra to Rg table - number 6 to 12 of the material / the money and the fat (iv) the ketone-substituted carbon atom group of the whole carbon source: the base 'also includes the substituent, that is, saturated aliphatic hydrocarbon, 6 to 12 people. As the substituent, i.e., saturated aliphatic 130806.doc-10-200911886, for example, the above-exemplified saturated aliphatic group can satisfy the above-mentioned number of carbon atoms. Therefore, examples of the aromatic hydrocarbon group having 6 to 12 carbon atoms which may be substituted by a saturated aliphatic hydrocarbon group, which are represented by the ruler 3 to phenyl group, a naphthyl group, a 2-phenylphenyl group, and a 3-methylbenzene group are mentioned. Base, methyl phenyl, 3-isopropylphenyl, 4-isopropylphenyl, 4-butylphenyl, 4-butylphenyl, 4-tert-butylphenyl, 4-hexyl Phenyl, 4·cyclohexylphenyl, 2”3-monomethyl, 2,4·dimethylphenyl, 2,5-dimethylphenyl, 2,6-r=yl’, 3, 4-two? Phenylphenyl, 3,5-di-n-phenyl, cyclohexyl, biphenyl, 2,4,5-trimethylphenyl, and the like.

又’作為以Y表示之碳原子數為2〜4之伸烷基,可列舉 -CH2CH2- ^ -CH2CH2CH2- &gt; -CH ΓΗ PH 、-CH2CH(CH3)•等。2CH2CH仰2_、.CH(CH3)CH2_ 二通:(°)中之z為以上述式⑺〜(6)中任-者所表示之 基的基。上述式(2)、⑷、(5)中之m亞甲基 可由氧原子及/或醋鍵取代的碳原 或單鍵。作為該貌二 之基、 p 列如可列舉-CH2-、 -ch2ch2- . -ch2ch2ch2- , -CH2CH2CH,CH 、CH 、 ^H2CH2- , -CH(CH3)CH2- -2 (ch3)_,作為亞?基由氧原 由_取代者、亞甲基由氧及 :者:基 舉下述[化3]所示者。 取代者,例如可列 [化3] Γ—丨 ro—rr〇 r。―rr。〜 ~r°~rr η ttiFurther, the alkylene group having 2 to 4 carbon atoms represented by Y may, for example, be -CH2CH2-^-CH2CH2CH2-&gt; -CH ΓΗ PH or -CH2CH(CH3). 2CH2CH, 2_, .CH(CH3)CH2_, two-pass: (z) is a group having a group represented by any one of the above formulas (7) to (6). The m-methylene group in the above formulas (2), (4), and (5) may be a carbon atom or a single bond which may be substituted by an oxygen atom and/or a vinegar bond. As the basis of the second aspect, the p column can be exemplified by -CH2-, -ch2ch2-. -ch2ch2ch2-, -CH2CH2CH, CH, CH, ^H2CH2-, -CH(CH3)CH2--2(ch3)_, as Asian? The group consists of an oxygen source, a _substituent, a methylene group, and an oxygen group. The compound is represented by the following [Chemical Formula 3]. Substitutes, for example, can be listed as [化3] Γ-丨 ro-rr〇 r. ―rr. ~ ~r°~rr η tti

T0(¾ f—〇—C—c—〇— L1 Η: H 130806.doc 200911886 、述ι式(ο)表示之本發明的含有矽之化合物的較好 形態為以下述通式⑴表示之含有石夕之化合物。以下述通式 ⑴表示之含切之化合物,係以上述通式⑻表示之含有 石夕之化合物中T=K者。利用通常之合成方法所獲得者,係 以下述通式⑴表示之含切之化合物,或複數種以上述通 式()表丁之3有石夕之化合物的混合㉗,其係將以下述通式 ⑴表示之含有♦之化合物作為主成分者。例如,即便使用 户Β此之以(R SlH0)K表示之環聚碎氧院作為導入環聚石夕 氧炫環之化合物時’上述通式(〇)之K-T為大於】之數的化 合物之生成量亦極少。其原因在於,非環狀之聚石夕氧燒經 由Y而與環聚矽氧院的2個以上…鍵結而成的化合物之 生成在能量方面非常不利。 [化4]T0 (3⁄4 f - 〇 - C - c - 〇 - L1 Η: H 130806.doc 200911886, the preferred form of the ruthenium-containing compound of the present invention represented by the ι formula (ο) is a compound represented by the following formula (1) The compound containing the compound represented by the following general formula (1), which is represented by the above formula (8), is T=K in the compound containing the compound of the earth. The compound obtained by the usual synthesis method has the following formula. (1) A compound containing a cut compound or a compound of the above formula (3) having a compound of the formula (1), which is a compound containing ♦ represented by the following formula (1) as a main component. Even if the user has used the compound represented by (R SlH0)K as the compound introduced into the cyclodoxime ring, the compound of the formula "KT of the above formula (〇) is greater than] The reason for this is that the formation of a compound in which a non-cyclic polysulfide is bonded to two or more of the cyclodoxy oxime via Y is extremely disadvantageous in terms of energy.

(式中’ 〜心可相同亦可不@,係碳原子數為之飽 和脂肪族烴基、或可由飽和脂肪族烴基取代的碳原子數為 6〜12之芳香族烴基,Y為碳原子數為2〜4之伸烷基’ z為與 上述通式(0)相同之基,k為2〜7之數’ p為卜4之數。爪及^ 為η:㈣:!〜i :⑽且^以之數,且係使以通式⑴表 示之含有矽之化合物的質量平均分子量為3〇〇〇〜1〇〇萬之 130806.doc -12- 200911886 數。又,以m為重複數之聚合部分與以η為重複數之聚合部 分既可為嵌段狀亦可為隨機狀)。 作為上述通式(0)或通式(1)中之Ζ,最好的是下述結構, 其原因在於,製造含有矽之化合物時之操作性、含有矽之 化合物及後述硬化性組合物之保存穩定性、以及硬化物之 熱性、電氣特性、硬化性及力學特性良好。 [化5](wherein 'the heart can be the same or not @, is a saturated aliphatic hydrocarbon group having a carbon number, or an aromatic hydrocarbon group having 6 to 12 carbon atoms which can be substituted by a saturated aliphatic hydrocarbon group, and Y is a carbon atom number of 2 The alkyl group '4' is the same group as the above formula (0), k is the number of 2 to 7 'p is the number of b. The claw and ^ are η: (4): !~i : (10) and ^ The number of the compounds containing ruthenium represented by the general formula (1) is 130 806. doc -12 to 2009 11 886, and the number of repeats is m. The portion and the polymerized portion having a repeating number of η may be either block-shaped or random. As the oxime in the above formula (0) or formula (1), the following structure is preferred because of the workability in the production of a compound containing ruthenium, the compound containing ruthenium, and the sclerosing composition described later. The storage stability and the heat, electrical properties, hardenability and mechanical properties of the cured product are good. [Chemical 5]

-CHrCH;-CHrCH;

-CHrCHrCHr〇—CH2-CH-CH2 本發明之含有矽之化合物中,Ra〜Rg中,若增大飽和脂 肪,煙基之比例,則所獲得之硬化物之可挽性提高,若增 大芳香族烴基之比例,則所獲得之硬化物之耐孰性及硬度 提高。飽和脂肪族烴基與芳香族煙基之比例可根據硬化物 所e需求广物性而任意設定。本發明之含有石夕之化合物中, 為可由飽和脂肪族烴基取代的碳原子數為M2之芳 ^基的含有石夕之化合物’由於可容易地控制飽和脂肪 煙基與芳香族煙基之比例,故㈣。 f夕之化合物的以Ra〜Rg表示之基中,碳原 的=2之館和脂肪族煙基與可由飽和脂肪族烴基取代 的石反原子數為6〜12之芳香旄徊苴t 者:後 、工基的較好比例(數)為,前 者後者為1〇〇:卜1:2,更好的是2〇: 為碳原子數為1〜12之飽和&amp; 。又,作 原因在於耐U ^ 煙基’較好的是甲基,其 原子數為了由飽和脂肪族烴基取代的碳 為12之方香族煙基,較好的是苯基,其原因在於 130806.doc -13· 200911886 耐熱性良好。 上述通式(1)中之k為2〜7 多,無法獲得所得硬化物所 上可谷易地獲取原料、且官 是k為3。 。若可大於7,則官能基數過 需之可撓性。k為2〜5者在工業 能基數適當,故較好,最好的 &gt;本,明之含切之化合物的f量平均分子量為侧〜⑽ j。若質量平均分子量小於3咖,則所獲得之硬化物之耐 熱性不充分,若質量平均分子量大於1〇〇萬則黏度會變 大,而妨礙操作。質量平均分子量較好的是5_〜50萬, 更好的是1萬〜10萬。 本發明之含有矽之化合物視其製造方法而不同,並無特 別限制’可應用眾所周知之反應來製造。以下製造方法係 將本發明的含有⑪之化合物中以上述通式⑴表示者作為代 表而進行說明。 含有矽之化合物例如可由如下方式而獲得:將具有不飽 和鍵之環狀聚矽氧烷化合物(al)作為前驅物,使其與環狀 聚夕氧烧化合物(a2)反應而獲得聚石夕氧烷_間體(a3),使 導入z基之%氧化合物(a4)與該聚矽氧烷中間體(a3)反應而 獲得;或者使導入Z基之環氧化合物(a4)與環狀聚矽氧烷 化合物(a2)反應而獲得含有環氧基之環狀聚矽氧烷化合物 (a5),再使具有不飽和鍵之非環狀聚矽氧烷化合物與 亥3有%氧基之環狀聚石夕氧院化合物(a5)反應而獲得。考 慮到製k上之作業性,較好的是前者之經由聚矽氧烷中間 體(a3)的方法。 130806.doc 14 200911886 上述具有不飽和鍵之非環狀聚矽氧烷化合物(al)可藉由 如下方式而獲得··使1種或2種以上之二官能矽烷化合物利 用水解進行縮合反應後,當P為1時與單官能單矽烷化合物 反應,當p為3時與三官能單矽烷化合物反應,當卩為4時與 四g旎單矽烷化合物反應’進而與具有不飽和基之單宫能 矽烷化合物反應而獲得。當p為2時,可於縮合反應之後與 具有不飽和基之單官能矽烷化合物反應而獲得。作為該等 矽烷化合物之官能基,代表性者為烷氧基、鹵基或羥基。 f % 八有不飽和鍵之非環狀聚矽氧烷化合物(a丨)與環狀聚矽氧 烷化合物(a2)係藉由(al)之不飽和鍵結碳與(&amp;2)之si H基的 反應而鍵結。 作為上述具有不飽和鍵之非環狀聚矽氧烷化合物的 製ie中所使用之上述二官能石夕院化合物之例,可列舉:二 甲基二甲氧基矽烷、二曱基二乙氧基矽烷、二苯基二甲氧 基矽烷、二苯基二乙氧基矽烷、甲基笨基二甲氧基矽烷、 Q 甲基笨基一乙氧基矽烷等二烷氧基單矽烷化合物;將該等 一烷氧基單矽烷化合物之i個或2個烷氧基取代為選自由 齓、氣、溴及碘所組成之群中的函素原子或羥基之單矽烷 化合物;由2個卩上之該等單石夕烧化合物縮合而成之二矽 氧烧化合物及低聚矽氧烷化合物。 作為上述單官能單矽烷化合物,例如可列舉:三曱基乙 氧基石夕烧、三甲基甲氧基石夕院、三苯基乙氧基石夕烧、三苯 基甲氧基石夕院、甲基二苯基乙氧基錢、二甲基苯基乙氧 基石夕院等單烧氧基石夕院化合物;將該等單燒氧基石夕院化合 130806.doc -15- 200911886 /臭及硬所組成之群中的 物之烷氧基取代為選自由氟、氯、 鹵素原子或羥基之單矽烷化合物。 乍為上述一 g旎單矽烷化合物,例如可列舉:三乙 :基钱、三甲氧基甲基石夕院,三乙氧基苯基石夕:、三; 氧基苯基矽烷等二烷氧基矽烷化合物;將該等三烷氧基矽 烷化合物之i〜3個烷氧基取代為選自由就、氣、演及二斤 組成之群中的齒素原子或羥基之單矽烷化合物。-CHrCHrCHr〇—CH2-CH-CH2 In the compound containing ruthenium of the present invention, when Ra to Rg is increased, the ratio of the saturated fat and the base of smoke is increased, and the obtainability of the cured product is improved. The ratio of the hydrocarbon group is increased, and the hardenability and hardness of the obtained cured product are improved. The ratio of the saturated aliphatic hydrocarbon group to the aromatic tobacco group can be arbitrarily set in accordance with the wide physical properties of the cured product. In the compound containing the compound of the present invention, the compound containing the compound of the aryl group having a carbon number of M2 substituted by a saturated aliphatic hydrocarbon group can easily control the ratio of the saturated fatty smoky group to the aromatic smoky group. Therefore, (four). In the group represented by Ra to Rg, the compound of the carbon source and the aliphatic nicotine group and the aromatic atomic group having a counter atomic number of 6 to 12 which may be substituted by a saturated aliphatic hydrocarbon group are as follows: The preferred ratio (number) of the latter and the working base is that the former is 1 〇〇: 卜 1:2, and more preferably 2 〇: is a saturated atomic number of 1 to 12 carbon atoms. Further, the reason is that the U ^ smoky group is preferably a methyl group, and the number of atoms is a sulphur group of 12, preferably a phenyl group, for the carbon substituted by a saturated aliphatic hydrocarbon group, which is preferably 130806. .doc -13· 200911886 Good heat resistance. In the above formula (1), k is from 2 to 7 and the obtained cured product is not easily obtained, and the k is 3. . If it is more than 7, the number of functional groups is excessively flexible. If the k is 2 to 5, the industrial energy base is appropriate, so it is preferable, and the best &gt; the present invention has a f-average molecular weight of the side ~ (10) j. If the mass average molecular weight is less than 3, the heat resistance of the obtained cured product is insufficient, and if the mass average molecular weight is more than 1,000,000, the viscosity becomes large and the operation is hindered. The mass average molecular weight is preferably from 5 to 500,000, more preferably from 10,000 to 100,000. The ruthenium-containing compound of the present invention is not particularly limited as long as it is produced by a known reaction. The following production method is described by using the compound represented by the above formula (1) in the compound containing 11 of the present invention. The compound containing ruthenium can be obtained, for example, by using a cyclic polyoxy siloxane compound (al) having an unsaturated bond as a precursor, and reacting it with a cyclic polyoxo-oxygen compound (a2) to obtain a polylithic eve. The oxane-interstitial (a3) is obtained by reacting a % oxygen compound (a4) introduced into the z group with the polyoxyalkylene intermediate (a3); or an epoxy compound (a4) introduced into the Z group and a ring The polyoxy siloxane compound (a2) is reacted to obtain an epoxy group-containing cyclic polyoxy siloxane compound (a5), and the acyclic polyoxy siloxane compound having an unsaturated bond and the methoxy group have a % oxy group. It is obtained by reacting a cyclic polysulfide compound (a5). In view of the workability in the production of k, it is preferred that the former is via the polyoxane intermediate (a3). 130806.doc 14 200911886 The above-mentioned acyclic polyoxy siloxane compound (al) having an unsaturated bond can be obtained by subjecting one or two or more difunctional decane compounds to hydrolysis reaction by hydrolysis. When P is 1, it reacts with a monofunctional monodecane compound, reacts with a trifunctional monodecane compound when p is 3, and reacts with tetraglycan monodecane compound when 卩 is 4, and further with a single palace having an unsaturated group. Obtained by reacting a decane compound. When p is 2, it can be obtained by reacting with a monofunctional decane compound having an unsaturated group after the condensation reaction. The functional group of the decane compound is typically an alkoxy group, a halogen group or a hydroxyl group. f % octa-unsaturated bond of acyclic polyoxy siloxane compound (a 丨) and cyclic poly siloxane compound (a2) by (al) unsaturated bonding carbon and (& 2) The Si H group reacts and bonds. Examples of the above-mentioned difunctional Shixia compound used in the preparation of the above-mentioned acyclic polysiloxane compound having an unsaturated bond include dimethyldimethoxydecane and dimercaptodiethoxylate. a dialkoxy monodecane compound such as decane, diphenyldimethoxydecane, diphenyldiethoxydecane, methylphenyldimethoxydecane or Q methylphenyl ethoxy decane; Substituting one or two alkoxy groups of the monoalkoxymonodecane compounds with a monodecane compound selected from a group consisting of a ruthenium, a gas, a bromine and an iodine, or a hydroxyl group; A dioxo-oxygen compound and an oligomeric siloxane compound obtained by condensing the monolithic compound. Examples of the monofunctional monodecane compound include tridecylethoxy zephyr, trimethylmethoxy zeshi, triphenylethoxy zephyr, triphenylmethoxy zexi, and methyl. Diphenylethoxy alcohol, dimethyl phenyl ethoxy shixiyuan and other single-burning oxygen stone compound compound; these single-burning oxygen stone Xiyuan compound 130806.doc -15- 200911886 / odor and hard composition The alkoxy group of the substance in the group is substituted with a monodecane compound selected from fluorine, chlorine, a halogen atom or a hydroxyl group. The above-mentioned mono-p-monodecane compound may, for example, be a tri-alkoxy group such as triethyl group: tribasic acid, trimethoxymethyl ishixiyuan, triethoxyphenyl phosphatase, or tris; oxyphenyl decane. a decane compound; i to 3 alkoxy groups of the trialkoxy decane compound are substituted with a monodecane compound selected from the group consisting of a dentate atom or a hydroxyl group in a group consisting of gas, gas, and jin.

ϋ 作為上述四g能單矽烷化合物,例如可列舉·四乙氧美 石夕炫、四甲氧基錢等四烧氧基錢化合物·將該等四燒 氧基石夕炫化合物之卜4個院氧基取代為選自由氟、氯、= 及碘所組成之群中的_素原子或羥基之單矽烷化合物。 作為上述具有不飽和基之單官能矽烷化合物可列舉: 二甲基乙烯基氣石夕院、=甲基乙稀基甲氧基石夕院、二甲基 乙稀基乙氧基錢、二苯基乙烯基氣㈣、二苯基乙料 ^氧基錢、二苯基乙烯基甲氧基㈣、甲基苯基乙稀基 虱矽烷、甲基苯基乙氧基矽烷、甲基苯基曱氧基矽烷等。 作為上述環狀聚石夕氧烧化合物㈤),可列舉:U3,5_三甲 基環三石夕氧院、1,3,5,7·四甲基環四砍氧烧、^从^五 曱基環五矽氧烷、以,5,7,9,11·六甲基環六矽氧烷、 1,3,5,7,9,U,134 f 基環七石夕氧烧、 甲基環八矽氧烷、H5-三乙基環三矽氧烷、四己 基環四矽氧烷、^,以义五乙基環五矽氧烷、 1,3,5,7,9,U_六乙基環六矽氧烷、以义三苯基環三矽氧 烧、1,3,5,7_四苯基環四石夕氧院、…仏五苯基環五石夕 130806.doc •16· 200911886 氧烷、l,3,5,7,9,ll-六苯基環六矽氧烷等。 作為導入z基之上述環氧化合物(a4),例如可列舉:具 有與上述聚矽氧烷甲間體〇3)或上述環狀聚矽氧烷(a2)中 ^環狀聚梦氧燒結構中的Si_H基反應之不飽和鍵結基的環 氧化合物,具體例可列舉以下所示之化合物。 [化6]ϋ As the above-mentioned tetra-g-enable monodecane compound, for example, four kinds of alkoxy compound such as tetraethoxy sulphate, tetramethoxy ketone, etc. The oxy group is substituted with a mono-decane compound selected from a group consisting of fluorine, chlorine, =, and iodine. Examples of the monofunctional decane compound having an unsaturated group include dimethyl vinyl garnet, methoxymethyl methoxy sylvestre, dimethylethylene ethoxy ketone, and diphenyl. Vinyl gas (tetra), diphenyl ethoxide, oxyphenol, diphenylvinyl methoxy (tetra), methyl phenyl ethane decane, methyl phenyl ethoxy decane, methyl phenyl oxime Base decane and the like. Examples of the above-mentioned cyclic polyoxo-oxygen compound (5)) include U3,5-trimethylcyclotrifluoride, 1,3,5,7·tetramethylcyclotetracalyx, and ^5. Indole ring pentaoxane, 5,7,9,11·hexamethylcyclohexaoxane, 1,3,5,7,9,U,134 f base ring seven-stone oxy-oxygen, A Base octadecane, H5-triethylcyclotrioxane, tetrahexylcyclotetraoxane, ^, pentaethylcyclopentaoxane, 1,3,5,7,9,U _ hexaethylcyclohexaoxane, triphenyl sulfonium trioxane, 1,3,5,7-tetraphenyl ring four stone oxime, ... 仏 pentaphenyl ring five stone eve 130806. Doc •16· 200911886 Oxytomane, l,3,5,7,9,ll-hexaphenylcyclohexaoxane, etc. Examples of the epoxy compound (a4) to which the z group is introduced include, for example, a polyoxyalkylene intermeric oxime 3) or a cyclic polyoxyalkylene (a2) Specific examples of the epoxy compound of the Si—H group-based unsaturated bond group in the middle of the compound include the compounds shown below. [Chemical 6]

CflpCH-^^—CH-CH2 CHfCH—^ CHfCH-CHr〇-fi-^° CH.^CHr〇_.cCflpCH-^^—CH-CH2 CHfCH—^ CHfCH-CHr〇-fi-^° CH.^CHr〇_.c

CHfCH-CH-CH2 CHpCH-CHrO-CH^CHV CHPCH-C-〇-CH-Ah2 CHPC-?-〇--cHrCH-NCH (7 K7 CHpCH-C-〇—CH;CHfCH-CH-CH2 CHpCH-CHrO-CH^CHV CHPCH-C-〇-CH-Ah2 CHPC-?-〇--cHrCH-NCH (7 K7 CHpCH-C-〇-CH;

CHpCH-^y CHfCH-CHj-O-C-^J^y' CHpCH-C-O-CHjCHpCH-^y CHfCH-CHj-O-C-^J^y' CHpCH-C-O-CHj

CHpC—C-O-CH; 〇 CH, CHfC-CH「〇1~&lt;^7 0CHpC—C-O-CH; 〇 CH, CHfC-CH “〇1~&lt;^7 0

;0 用以獲得含有矽之化合物的前驅物即具有不飽和鍵之非 環狀聚麥氧減合物(al)的利用水解所進行之縮合反應, 可藉由所謂之溶膠·凝膠反應來進行。二官能錢化:物 之水解·縮合反應可藉由如下方式而進行:烧氧基或函基 藉由水進行水解而生成矽醇基(Si_〇H基),該所生成之矽 醇基彼此、料基與以基、或料基與i基進行縮合。 為使該水解反應迅速進&lt;于,較好的是加入適量之水,亦可 加入觸媒。又,該縮合反應亦藉由空氣十之水分、或水以 外之溶劑中所含的微量水而進行。該反應中亦可使用落 130806.doc 17- 200911886 齊J '备劑並無特別限定,亘體而士,彳丨 甲醇、乙醇、不 疋〃體而5 ’例如可列舉:水,或 甲A乙A酮丙辱、異丙醇、正丁醇、異丁醇、丙,、 T悉6»暴酮、二π亞岭 友, 〜烷、四虱呋喃等親水性 溶劑可使用!種或混合使用2種以上。有機冷削,該專 列上述觸媒,可使用酸或驗,具體而言,例如可 ^、磷酸、硫酸等無機酸類 :;二異丙醋等有機酸類;氫氧化鈉、氫氧= 風專無機驗類;三甲胺、三乙胺、單乙醇胺、二 =胺等胺化合物(有機驗H 酉日專欽化合物類•曰^^ _ ,月桂馱二丁基錫、辛基錫酸等錫化合物 類;三氟化硼等硼备 ; 硼化合物類,三乙醯丙酮鋁等鋁化合物 類,鐵、始、盆、鋅等金屬之氯化物,以及該等金屬之環 从鹽及辛酸鹽等金屬羧酸鹽類等,該等觸媒可使用1種 或併用2種以上。yΛ体 又由2種以上之二官能矽烷化合物進行 水解'缩合反應時,亦可分別單獨進行某種程度之水解後 將兩者混合而進一步進行水解縮合反應亦可將該等所有 二官能矽烷化合物混合而一起進行水解·縮合反應。 如上所述Α驅物即具有不飽和鍵之非環狀聚矽氧烷化 物(1)可藉由如下方式而獲得:進行上述水解縮合反應 之後,當P為1時進一步與單官能單矽烷化合物反應,當p 為3時進一步與三官能單矽烷化合物反應,當1)為4時進一 步與四官能單矽烷化合物反應,繼而與具有不飽和基之單 吕倉b矽烷化合物反應而獲得;當p為2時,可與具有不飽和 基之單官能矽烧化合物反應而獲得。 130806.doc •18- 200911886 /驅物即具有不飽和鍵之非環狀聚⑪氧烧化合物⑻與 環狀聚妙氧院化合物(a2)的反應中,可使用利_氣化^ 應之方法。例&amp; ’聚矽氧烷中間體⑽可藉由如下方式而 獲得:混合非環狀聚⑦氧烧化合物(al)與環狀聚秒氧炫化 合物⑻)’添加任意量之矽氫化反應觸媒後進行加熱。 又’導人z基之環氧化合物(a4)與環狀聚發氧烧結構中之 S卜Η基的反應,亦同樣可使用矽氫化反應。 作為上述石夕氫化反應觸媒,例如可列舉:含有選自由 鉑、纪及姥所組成之群中的一種以上金屬之取所周知之觸 媒。例如,作為始系觸媒,可列舉始敌基乙稀基甲基錯 〃乙烯基四曱基二矽氧烷錯合物、鉑-環乙烯基 土石夕减錯合物、始·辛基搭錯合物等㈣觸媒。作為 纪系觸媒及錢系觸媒,例如可列舉:在該姑系觸媒甲代替 叙而含有同為鉑系今屬 、’屬的飽或錢之化合物。該等矽氫化反 應觸媒既可使用—種,亦 ^ ^ 丌了併用兩種以上。尤其是就硬化 性之觀點而言,輕杯沾曰 的疋3有鉑者,具體而言,較好的是 鉑-羧基乙烯基甲基錯合物。又,— —(一本基膦)乳化姥(I)等 3有上述翻系金屬的戶斤古田 。月之Wilkinson觸媒,亦包含在上述 石夕氫化反應觸媒中。該算 θ = 飞4矽虱化反應觸媒之使用量較好的 疋反應物總量之5質詈% w 丁 β 置/。以下,更好的是0.0001〜1.0質量 % 0 ' 本發明之含有矽之化人版 此 化σ物除如下所述可用作硬化性組合 物之主成分以外,亦可盥 兀了與其他馬分子化合物或高分子組合 物’此合而用於樹脂、铟獻 塑膠改質劑等用途中。 130806.doc •19- 200911886 再者’雖然在本發明之合 ,,s , 之3有矽之化合物的範圍之外,佝 上述通式⑼或⑴中之非 仁 鎮、紹、鱗、鈦、錯、給乳坑鍵中,可導入蝴、 载、鋅、鈮'鈕、錫、蹄等 以外之元素。作為其方法,如1 巧寻矽 、万在’例如可列舉如下方法: 給該等其他元素之衍生物而、。 ’、 進仃水解-縮合反應,於石夕氧 烷鏈中組入矽以外之元素。 虱 又亦可存在將上述含有妙之 化合物的一部分或全部氫屌孑取 乳原子取代為氘及/或氟者。 其次,對本發明之硬化性組合物加以說明。 本發明之硬化性組合物俜 ^ 糸3有上述含有矽之化合物及環 乳硬化性化合物而形成者。 取有本發明之硬化性組合物中备 僅含有上述含有;5夕之化合物作 奶作马含有裱氧基之成分時,璟 氧硬化性化合物之含量較好的是,相對於⑽質量份之含 有石夕之化合物為0.01〜20質量份。又,當含有含有石夕之化 合物及後述環氧化合物作為含有環氧基之成分時,環氧硬 化性化合物之含量較妊的θ 权好的疋,相對於兩者之總質量100質 量份為0.01〜20質量份。若環氧硬化性化合物之含量少於 0.01質里伤’則可能無法充分地硬化,若環氧硬化性化合 物之使用量超過20質量份,則可能會影響所獲得之硬化物 之耐熱性。 上述環氧硬化性化合物可為眾所周知之通常的環氧硬化 劑,可較好地使用藉由熱'能量線等之作用而使環氧樹脂 硬化者。作為環氧硬化性化合物,可使用紛系硬化劑、胺 系硬化劑、醯胺系硬化劑、醯亞胺系硬化劑、味唑錯合物 系硬化劑、酸針系硬化劑、有機鑌鹽系硬化劑、茂金屬系 130806.doc -20- 200911886 硬化劑、芳茂鐵系硬化劑等,亦可使用市售之環氧硬化劑 或陽離子聚合起始劑。 該等之中,較好的是胺系硬化劑、有機鏽㈣硬化劑, 其原因在於,與上述含有矽之化合物之相容性良好。 作為上述胺系硬化劑’可列舉:二伸乙基三胺、三伸乙 基四胺、四伸乙基五胺、二乙基胺基丙基胺、N-胺:乙基 旅唤、間苯二胺、聚(氧丙稀)二胺、p,p,-二胺基二苯基f 烷、P,P-—胺基二苯基砜、ρ,ρι_二胺基二苯醚、苯胺_ BF3、對甲苯胺·BF3、鄰甲苯胺_BF3、二甲基苯胺、 N甲基苯胺-BF3、N-乙基苯胺_Β]ρ3、N,N,_二甲基苯胺· BF3、N,N’-:乙基苯胺·叫、乙胺_叫、正丁胺_bf广哌 咬-bf3、二苯基胺.BF3、鄰二甲基胺基甲基苯 一(一甲基胺基甲基)苯酚、三乙醇胺-硼酸鹽等。 作為上述有機鑌鹽系硬化劑,可列舉重氮鑌鹽、鱗鹽、 銃I等’ β亥等既可為利用熱進行陽離子聚合而硬化者亦 可為㈣光等能量線照射而硬化者。一般而言,前者係使 用脂肪族鑌鹽,後者係使用芳香族鐯鹽。有機鑌鹽系硬化 =此以幸乂 ν之使用量獲得良好之硬化,因此主要在利用能 量線^進行硬化時較有用,作為本發明中所使用者,較 好的疋芳香無鐄鹽、芳香族疏鹽,其原因在於與含有石夕之 化合物的相容性較好。 —作為上述芳香族鐄鹽,可列舉:4·異丙氧基冬甲基二 :基錤四(五貺苯基)硼酸鹽、4_異丙氧基甲基二苯基錤 /、氟Θ酸鹽、4_異丙氧基_4’_甲基二苯基鎖六氣銻酸鹽、 I30806.doc 200911886 (曱苯基異丙苯基)鎭六氟磷酸鹽、(甲苯基異丙苯基)銚六 氟銻酸鹽、(曱苯基異丙苯基)錤四(五氟苯基)硼酸鹽、雙 (第三丁基苯基)錤六氟磷酸鹽、雙(第三丁基苯基)鎭六氟 銻酸鹽、雙(第三丁基苯基)鎭四(五氟苯基)硼酸鹽等。 作為上述芳香族锍鹽,可列舉4,4’-雙[二(4-庚氧基苯基) 銃基苯基]硫醚雙六氟銻酸鹽、4,4’-雙[二(4-庚氧基苯基)銃 基苯基]硫醚雙六氟磷酸鹽、4-(4-苯曱醯基-苯硫基)苯基-二-(4-氟苯基)銃六氟磷酸鹽、4,4'-雙[雙((β-羥基乙氧基)苯 基)鎳基]苯硫醚雙六氟磷酸鹽、4,4'-雙[雙((β-羥基乙氧基) 苯基)锍基]苯硫醚雙六氟銻酸鹽、4,4'-雙[雙(氟苯基)锍基] 苯硫醚雙六氟磷酸鹽、4,4'-雙[雙(氟苯基)鈒基]苯硫醚雙 六氟銻酸鹽、4,4’-雙(二苯基銕基)苯硫醚雙六氟磷酸鹽、 4,4’-雙(二苯基鈒基)苯硫醚雙六氟銻酸鹽、4-(4-苯甲醯基 苯硫基)苯基-二-(4-(β-羥基乙氧基)苯基)锍六氟磷酸鹽、4-(4-苯曱醯基苯硫基)苯基-二-(4-(β-羥基乙氧基)苯基)銕六 氟銻酸鹽、4-(4-苯曱醯基苯硫基)苯基-二-(4-氟苯基)锍六 氟磷酸鹽、4-(4-苯甲醯基苯硫基)苯基-二-(4-氟苯基)锍六 氟銻酸鹽、4-(4-苯甲醯基苯硫基)苯基-二苯基銃六氟磷酸 鹽、4-(4-苯曱醯基苯硫基)苯基-二苯基锍六氟銻酸鹽、4-(苯硫基)苯基-二-(4-(β-羥基乙氧基)苯基)鎳六氟磷酸鹽、 4-(苯硫基)苯基-二-(4-(β-|^基乙氧基)苯基)疏六氟録酸 鹽、4-(苯硫基)苯基•二-(4-氟苯基)锍六氟磷酸鹽、4-(苯硫 基)苯基-二-(4-氟苯基)銃六氟銻酸鹽、4-(苯硫基)苯基-二 苯基锍六氟磷酸鹽、4-(苯硫基)苯基-二苯基銃六氟銻酸 130806.doc -22- 200911886 鹽、4-(2-氯-4-苯甲醯基苯硫基)苯基雙(4-氟苯基)錡六氟 磷酸鹽、4-(2-氯-4-苯甲醯基苯硫基)苯基雙(4-氟苯基)疏 六氟銻酸鹽、4-(2-氣-4-苯曱醯基苯硫基)苯基二苯基鎮六 氟磷酸鹽、4-(2-氣-4-苯曱醯基苯硫基)苯基二苯基锍六氟 銻酸鹽、4-(2-氣-4-苯甲醯基苯硫基)苯基雙(4·羥基苯基) 銕六氟磷酸鹽、4-(2-氯-4-苯曱醯基苯硫基)苯基雙(4_經基 苯基)鈒六氟銻酸鹽、三苯基鋏六氟磷酸鹽、三苯基鎮六 氟銻酸鹽、4-乙醯氧基苯基二曱基銃六氟磷酸鹽、4_乙醯 氧基本基一甲基鎮六氟録酸鹽、4 -甲氧基緩基氧基苯基二 甲基疏六氟磷酸鹽、4-曱氧基羧基氧基苯基二曱基銃六氟 銻酸鹽、4-乙氧基羧基氧基苯基二甲基锍六氟磷酸鹽、仁 乙氧基羧基氧基苯基二曱基鎳六氟銻酸鹽等。 又,作為上述醯胺系硬化劑,可列舉:聚醯胺樹脂、二 丙’丙稀醯胺錯合物、二氰基二酿胺等。作為上述酸針系 硬化劑,可列舉:鄰苯二曱酸酐、偏苯三甲酸酐、二苯甲 酮四甲酸針、順丁烯二酸針、六氫鄰苯二甲酸軒、甲基耐 地酸肝、戊二酸肝、均苯四甲酸酐、料基-雙(3·丁烷_ I,2-二羧酸)酐、四溴鄰苯二子酸酐等。 接^對在本發明之硬化性組合物中作為任意成分而調 配之環氧化合物加以說明。 一本發明之硬化性組合物中’若使用環氧化合物,則可提 =硬化性組合物硬化所得的硬化物之機械強度。當用於 :述目的時,該環氧化合物之含量相對於 有矽之化合物較好的是卜“ 々之3 負置伤。更好的使用量為5〜25 130806.doc -23- 200911886 份’進而更好的是10〜20質量份。又,使用環氧化合 日、,上述環氧硬化性化合物之含量相對於100質量份之 上述3有矽之化合物較好的是0.01〜30質量份。 上述環氧化合物係分子中具有1個或2個以上之環氧基的 化合物,且為單體性、二聚物性 '低聚物性或聚合物性之 化合物。X ’該等環氧化合物之環氧基可作為末端基而存 在,亦可作為側基而存在。作為上述環氧化合物,可列 舉:2,2-雙(3,4_環氧環己基)丙@、3,4_環I環己基甲基 (^-環氧)環己院幾酸醋、2·(3,4_環氧)環己基_5山螺⑽土· 環氧)環己基-間二嚼院、雙[(3,4_環氧環己基)甲基]己二酸 酯、6-(3,4-環氧環己烧幾基氧基)己酸(3,4_環氧環己基)甲 醋等脂環式環氧化合物;雙盼Α之:縮水甘㈣、雙紛F之 -縮水甘油醚、雙紛S之二縮水甘油趟此類雙紛型環氧樹 脂;苯盼㈣清漆環氧樹脂、甲齡㈣清漆環氧樹月旨、窥 基苯甲酸㈣清漆環氧樹脂此類㈣清漆型環氧樹脂;四 經基苯基甲烧之縮水甘油趟、四經基二苯甲_之縮水甘油 轉、環氧化聚乙稀盼此類多官能型環氧樹脂等芳香族環氧 樹脂;脂肪族多元醇之聚縮水甘油醚;脂肪族多元醇之環 氧院加成物之聚縮水甘油越;脂肪族多元醇與脂肪族多元 羧酸之聚醋多元醇之聚縮水甘油醚;脂肪族多元羧酸之聚 縮水甘油醋·,脂肪族多元醇與脂肪族多元羧酸之聚酿多羧 酸之聚縮水甘油酿;由丙稀酸縮水甘油酷或甲基丙稀縮水 甘油酸醋之乙烯基聚合所獲得之二聚物、低聚物、聚合 物;由丙烯酸縮水甘油酿或甲基丙烯酸縮水甘油醋與其他 130806.doc -24- 200911886 乙烯基單體之乙稀基聚合所獲得之 化植物油,·環氧化植物油之自旨交 物,%氧 等。 乂換體,%乳化聚丁二烯 :為上述環氧化合物’分子量為ι〇〇〜ι〇〇〇者顯著提高所 獲侍之硬化物之機械強度, 是Μ,又,環氧當量較好的 其次,對本發明之硬化性 a札 之今j g &amp; 5物中作為任意成分而調配 金屬氧化物微粉末加以說明。 該金屬氧化物微粉末,例如,可用於改善硬化後之各物 :生或作為填充劑而使用所需量。當用 屬Γ物微粉末之含量相對於_質量份之上述含有= 化。物較好的是】〜!〇〇〇質量份。更好之 量份,進而更好的是10〜100質量份。 里”、’ 5〜500質 作為上述金屬氧化物微粉 料。且I* T M m 如可列舉礦物等無機材 科”體可列舉:膠體二氧化石夕、二氧㈣ 化石夕凝膠等二氧化石夕類;氧化紹、氧 \ 一乳 氧化物;雲母、蒙脫土、# 欽等金屬 /石 石夕溱土類、絹啦卉 古 石、縫石、長石粉、經石'厄帖浦二石-嶺 臘石等礦物類等,又,亦可為 “石、葉 加以改㈣。料之巾㈣的是二氧切類。對^ 就耐熱性之觀點而言’上述金屬 好的是1〇〇_以下,更好的是5〇陣以下。 粒讀 本發明之含有石夕之硬化性組合物中,可 性賦予劑作為任意成分。 ,% _耐候 作為耐候性賦予劑,可❹_ I30806.doc •25· 200911886 定劑、紫外線吸收劑、I系抗氧化劑、硫系抗氧化劑、填 系抗氧化劑等眾所周知之通常所使用者。例如,光穩定劑 可列舉受阻胺類,紫外線吸收劑可列舉2_經基二苯甲嗣 類、2-(2-經基苯基)苯并三嗤類、2_(2_經基苯基二芳 基-1’3’5·二嗪類、苯甲酸酯類、氰基丙烯酸酯類,酚系抗 氧化劑可列舉三乙二醇·雙[M3·第三丁基·5·甲基领基 苯基)丙酸醋]、二丁基經基甲苯(ΒΗΤ)、26_二-第三丁基_ 對甲盼⑽PC)等,硫系抗氧化劑可列舉二院硫基二丙酸醋 類、β-院基疏基丙酸醋類,鱗系抗氧化劑可列舉有機㈣ 酸酯類。 使用上述耐候性賦予劑時,就耐熱性、電氣特性、硬化 性、力學特性、保存穩定性、操作性之觀點而言,在本發 明之硬化性組合物中其含量較好的是〇〇〇〇1〜5〇質量%,更 好的是0.001〜10質量%。 本發明之硬化性組合物中,可於不損及本發明之目標性 能之範圍内調配其他眾所周知之各種樹脂、填充劑、添加 劑等。作為可任意調配之各種樹脂之例,可列舉聚醯亞胺 樹脂、聚乙二醇或聚丙二醇等聚_樹脂、聚胺基甲酸醋樹 脂、環氧樹脂、盼樹脂、聚醋樹脂、三聚氰胺樹脂、聚醯 胺樹脂、聚苯硫_脂等,作為可任意調配之添加劑之 例,可列舉抗靜電劑、光敏劑、酸增殖劑等。為了不損及 本發明之目標性能’該等任意成分(其中將上述環氧化合 物及上述金屬氧化物微粉末除外)之調配量,相對於⑽質 量份之含有石夕之化合物’較好的是合計量為10質量份以 130806.doc -26 - 200911886 下。 本發明之硬化性組合物在室溫(25〇c)下具有 '^野之流動 性’因而操作性優異。關於流動性,在不含金屬氧化物微 粉末之狀態下於室溫(2 5。(:)下用E型黏度計測定之黏度較好 的是50Pa.S以下,更好的是10Pa.s以下。 藉由選擇上述環氧硬化性化合物,本發明之硬化性組合 4勿的硬化種類可選擇熱硬化、光硬化、或利用光及熱兩: 之硬化。進行熱硬化時之硬化溫度較好的是6〇〜2㈧。◦,更 () 好的是80〜15〇C。硬化時間較好的是0.1〜H)小時,更好的 是1〜6小時。進行光硬化時,可使用之活性能量線有紫外 線、電子射線、X射線、放射線、高頻波等,紫外線在經 濟方面最好。紫外線之光源有紫外線雷射、水銀燈、高壓 水銀燈、氤氣燈'鈉燈、驗金屬燈等。此處所使用之紫外 線源較好的是高壓水銀燈。照射能量之最佳條件視所塗佈 之膜厚而不同,通常在100〜10000 mJ/cm2之範圍内。又, i) 在光硬化之後進行熱硬化時,通常可於60〜15〇t之範圍内 加熱。 於如上所述之條件下使本發明之硬化性組合物硬化而成 之硬化物,成為透明性、耐龜裂性、耐熱性、_溶劑性、 /鹼f生而才候性、耐污染性、阻燃性、耐濕性、阻氣性、 可撓14 #長率或強度、電氣絕緣性、低介電常數性等力 學:性、光學特性、電氣特性等優異之材料。 3有本發明之含有矽之化合物而形成的硬化性組合物, 穩疋I·生石更化性等優異,進而其硬化物之耐龜裂性、财熱 130806.doc •27- 200911886 性、耐溶劑性、耐驗性、耐候性 各物性優異。本發明之硬化心予特性、電氣特性等 货β之硬化性組合物 材料領域之顯示材 &quot;;電氣/電子 料、㈣ 材料/半導料之密封材 «•電n緣材料、以絕緣/ ^ 注/密封;. 傲丨万水/防濕為目的之灌 /在封料、塑勝零件之試製母模、塗佈材料、層間絕 緣膜、絕緣用封裝、熱收 、 封劑/保護材料m其^0衣'顯不裝置用密 …… 纖保護材料、光學透鏡、a condensation reaction by hydrolysis to obtain a precursor of a compound containing ruthenium, that is, a non-cyclic polymethicone (al) having an unsaturated bond, which can be obtained by a so-called sol-gel reaction get on. The difunctionalization: the hydrolysis/condensation reaction of the substance can be carried out by: activating the oxy group or the functional group by water to form a sterol group (Si_〇H group), and the resulting sterol group The condensation of each other, the base and the base, or the base with the i group. In order to allow the hydrolysis reaction to proceed rapidly, it is preferred to add an appropriate amount of water, and a catalyst may be added. Further, the condensation reaction is also carried out by the moisture of the air or the trace amount of water contained in the solvent other than water. In the reaction, it is also possible to use 130806.doc 17-200911886. The preparation of the preparation is not particularly limited, and the steroids, methanol, ethanol, and steroids are 5', for example, water, or A Hydrophilic solvents such as acetaminophen, isopropanol, n-butanol, isobutanol, c, T, 6, ketone, di- π arylene, ~ alkane, tetrahydrofuran can be used! Two or more types are used in combination or in combination. Organic cold cutting, the special catalyst above, can use acid or test, specifically, for example, inorganic acids such as phosphoric acid, sulfuric acid, etc.; organic acids such as diisopropyl vinegar; sodium hydroxide, hydrogen and oxygen = wind-specific inorganic Tests; amine compounds such as trimethylamine, triethylamine, monoethanolamine, bis-amine (organic test H 酉日 special compound • 曰 ^ ^ _, tin laurin, dibutyl tin, octyl stannic acid and other tin compounds; Boron such as boron fluoride; boron compounds, aluminum compounds such as aluminum triacetate, metal chlorides such as iron, primary, pot, zinc, etc., and metal carboxylates such as salts and octanoates For the above-mentioned catalysts, one type or two or more types may be used in combination. When the y-body is hydrolyzed by two or more kinds of difunctional decane compounds, the condensation reaction may be carried out separately after a certain degree of hydrolysis. Further, the hydrolysis and condensation reaction may be further carried out by mixing and mixing all of the difunctional decane compounds together. The above-mentioned hydrazine-driven substance, that is, an acyclic polysiloxane compound having an unsaturated bond (1) may be used. Obtained by: After the above hydrolysis and condensation reaction, when P is 1, it is further reacted with a monofunctional monodecane compound, and when p is 3, it is further reacted with a trifunctional monodecane compound, and when 1) is 4, it is further reacted with a tetrafunctional monodecane compound. It is then obtained by reacting with a monobromo bromide compound having an unsaturated group; when p is 2, it can be obtained by reacting with a monofunctional terpene compound having an unsaturated group. 130806.doc •18- 200911886 /In the reaction of a non-cyclic polyoxyl compound (8) having an unsaturated bond with a cyclic polyoxo compound (a2), a method of using a gasification method can be used. . The example &amp; 'polyoxyalkylene intermediate (10) can be obtained by mixing a non-cyclic poly 7 oxy-fired compound (al) with a cyclic polyoxo oxo compound (8)) 'adding any amount of hydrazine hydrogenation reaction The medium is heated. Further, the reaction of the z-group epoxy compound (a4) with the S-buzone group in the cyclic polyoxy-oxygen structure can also be carried out by using a hydrogenation reaction. The above-mentioned catalyst for the hydrogenation reaction of the invention is, for example, a known catalyst containing one or more metals selected from the group consisting of platinum, ruthenium and iridium. For example, as a starting catalyst, an initial thioglycidylmethyl fluorenyl vinyl tetradecyldioxane complex, a platinum-cyclovinyl fluorene complex, and an initial octyl group may be mentioned. Complex compound, etc. (4) Catalyst. Examples of the catalyst and the money-based catalyst include, for example, a compound of the genus or the genus of the genus Platinum. These hydrogenated reaction catalysts may be used in combination of two or more types. In particular, from the viewpoint of hardenability, the light cup is contaminated with ruthenium 3 having a platinum, and specifically, a platinum-carboxyvinylmethyl complex is preferred. Further, - (a base phosphine) emulsified ruthenium (I), etc. 3 has the above-mentioned tumbling metal of the household jin Gutian. The month's Wilkinson catalyst is also included in the above-mentioned Shixi hydrogenation catalyst. The calculation θ = the amount of the total amount of the ruthenium reactant used in the fly 矽虱 矽虱 reaction catalyst is 5 mass % w · β set /. In the following, it is more preferably 0.0001 to 1.0% by mass. 0 ' In addition to the main component of the curable composition, the sigma-containing product of the present invention can be used as a main component of the curable composition as described below. Molecular compounds or polymer compositions are used in applications such as resins and indium plastic modifiers. 130806.doc •19- 200911886 Furthermore, although in the scope of the present invention, s, s, and scorpion compounds, in the above formula (9) or (1), non-renzhen, Shao, scale, titanium, In the wrong, the nipple key can be introduced into elements other than butterflies, carriers, zinc, 铌' buttons, tin, hooves, and the like. As a method thereof, for example, the following methods can be cited: a derivative of these other elements. Into the hydrolysis-condensation reaction, an element other than ruthenium is incorporated in the oxalate chain. Further, some or all of the hydrolyzed milk atoms of the above-mentioned compound may be substituted with hydrazine and/or fluorine. Next, the curable composition of the present invention will be described. The curable composition 俜 ^ 糸 3 of the present invention is formed by the above-mentioned compound containing ruthenium and a cyclogenic compound. When the curable composition of the present invention contains only the above-mentioned compound; the compound of the cerebral ceramide is used as a component containing a methoxy group in the milk, the content of the oxime-curable compound is preferably (10) by mass. The compound containing Shi Xi is 0.01 to 20 parts by mass. In addition, when the compound containing the compound and the epoxy compound described later is contained as the epoxy group-containing component, the content of the epoxy curable compound is better than the θ weight of the pregnancy, and is 100 parts by mass based on the total mass of the two. 0.01 to 20 parts by mass. If the content of the epoxy-curable compound is less than 0.01%, the film may not be sufficiently cured. If the amount of the epoxy-curable compound is more than 20 parts by mass, the heat resistance of the obtained cured product may be affected. The epoxy curable compound may be a conventionally known epoxy hardener, and those which cure the epoxy resin by the action of a heat 'energy line or the like can be preferably used. As the epoxy curable compound, a viscous curing agent, an amine curing agent, a guanamine curing agent, a quinone imide curing agent, a simazole complex curing agent, an acid needle curing agent, and an organic cerium salt can be used. A hardener or a metallocene system 130806.doc -20- 200911886 A hardener, an aromatic iron-based hardener, or the like, or a commercially available epoxy hardener or a cationic polymerization initiator. Among these, an amine-based curing agent and an organic rust (tetra) curing agent are preferred because of good compatibility with the above-mentioned compound containing cerium. Examples of the above-mentioned amine-based curing agent include di-extension ethyltriamine, tri-extension ethyltetramine, tetra-extended ethylpentamine, diethylaminopropylamine, and N-amine: ethyl brigade, and Phenylenediamine, poly(oxypropylene)diamine, p,p,-diaminodiphenylfane, P,P--aminodiphenyl sulfone, ρ,ρι-diaminodiphenyl ether, Aniline _ BF3, p-toluidine BF3, o-toluidine _BF3, dimethyl aniline, N methyl aniline - BF3, N-ethyl aniline Β Β ρ 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 N,N'-:ethylaniline·called, ethylamine _ called, n-butylamine _bf guangpei-bf3, diphenylamine. BF3, o-dimethylaminomethylbenzene-monomethylamine Methyl) phenol, triethanolamine-borate, and the like. Examples of the organic onium salt-based curing agent include a diazonium salt, a scale salt, and a ruthenium I, etc., which may be cured by cationic polymerization by heat or by energy rays such as (4) light. In general, the former uses an aliphatic sulfonium salt and the latter uses an aromatic sulfonium salt. Organic bismuth salt type hardening = This is good hardening by the use amount of 乂 乂 ν, so it is mainly useful when hardening by energy line ^, as a user of the present invention, a good 疋 aromatic 鐄 鐄 salt, aroma The reason for the salt-disintegration is that the compatibility with the compound containing Shi Xi is better. —The above-mentioned aromatic onium salt may, for example, be 4·isopropoxymethylenemethylbis(indenyltetrakis(phenyl)phenyl)borate, 4—isopropoxymethyldiphenylphosphonium/fluorene fluorene Acid salt, 4_isopropoxy _4'-methyldiphenyl hexafluoroantimonate, I30806.doc 200911886 (nonylphenyl cumyl) sulfonium hexafluorophosphate, (tolyl cumene) Hexafluoroantimonate, (p-phenylpyridyl)phosphonium tetrakis(pentafluorophenyl)borate, bis(t-butylphenyl)phosphonium hexafluorophosphate, bis(t-butyl Phenyl) indole hexafluoroantimonate, bis(t-butylphenyl)phosphonium tetrakis(pentafluorophenyl)borate, and the like. Examples of the above aromatic onium salt include 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl]thioether bishexafluoroantimonate, and 4,4'-bis[di(4). -heptyloxyphenyl)nonylphenyl]thioether bishexafluorophosphate, 4-(4-phenylmercapto-phenylthio)phenyl-di-(4-fluorophenyl)phosphonium hexafluorophosphate Salt, 4,4'-bis[bis((β-hydroxyethoxy)phenyl)nickenyl]phenyl sulfide dihexafluorophosphate, 4,4'-bis[bis((β-hydroxyethoxy) Phenyl) indenyl] phenyl sulfide dihexafluoroantimonate, 4,4'-bis[bis(fluorophenyl)indenyl] phenyl sulfide dihexafluorophosphate, 4,4'-double [double (fluorophenyl) fluorenyl] phenyl sulfide dihexafluoroantimonate, 4,4'-bis(diphenylfluorenyl) phenyl sulfide dihexafluorophosphate, 4,4'-bis(diphenyl Thiophene) phenyl sulfide dihexafluoroantimonate, 4-(4-benzylidenephenylthio)phenyl-di-(4-(β-hydroxyethoxy)phenyl)phosphonium hexafluorophosphate , 4-(4-phenylmercaptophenylthio)phenyl-bis-(4-(β-hydroxyethoxy)phenyl)phosphonium hexafluoroantimonate, 4-(4-phenylmercaptobenzene Thio)phenyl-bis-(4-fluorophenyl)phosphonium hexafluorophosphate, 4-(4-benzylidenephenylthio)benzene -bis-(4-fluorophenyl)phosphonium hexafluoroantimonate, 4-(4-benzylidenephenylthio)phenyl-diphenylphosphonium hexafluorophosphate, 4-(4-benzoquinone Phenylthio)phenyl-diphenylphosphonium hexafluoroantimonate, 4-(phenylthio)phenyl-di-(4-(β-hydroxyethoxy)phenyl)nickel hexafluorophosphate, 4-(phenylthio)phenyl-bis-(4-(β-yl)ethoxy)phenyl) hexafluoroate, 4-(phenylthio)phenyl•di-(4- Fluorophenyl)phosphonium hexafluorophosphate, 4-(phenylthio)phenyl-di-(4-fluorophenyl)phosphonium hexafluoroantimonate, 4-(phenylthio)phenyl-diphenylanthracene Hexafluorophosphate, 4-(phenylthio)phenyl-diphenylphosphonium hexafluoroantimonate 130806.doc -22- 200911886 Salt, 4-(2-chloro-4-benzomethylphenylthio)benzene Bis(4-fluorophenyl)phosphonium hexafluorophosphate, 4-(2-chloro-4-benzomethylphenylthio)phenyl bis(4-fluorophenyl) hexafluoroantimonate, 4 -(2-Ga-4-phenylmercaptophenylthio)phenyldiphenyl hexafluorophosphate, 4-(2- gas-4-phenylmercaptophenylthio)phenyldiphenylanthracene Hexafluoroantimonate, 4-(2- gas-4-benzylidenephenylthio)phenylbis(4.hydroxyphenyl)phosphonium hexafluorophosphate, 4-(2- Chloro-4-phenylmercaptophenylthio)phenylbis(4-diphenyl)phosphonium hexafluoroantimonate, triphenylsulfonium hexafluorophosphate, triphenyl hexafluoroantimonate, 4 - ethoxylated phenyl diindenyl hexafluorophosphate, 4 - ethoxylated benzyl monomethyl hexafluoroate, 4-methoxy methoxy phenyl dimethyl hexafluoro Phosphate, 4-decyloxycarboxyloxyphenyldifluorenyl hexafluoroantimonate, 4-ethoxycarboxyoxyphenyldimethylphosphonium hexafluorophosphate, ethoxylated ethoxyoxybenzene Base bisinyl nickel hexafluoroantimonate. Further, examples of the guanamine-based curing agent include a polyamine resin, a dipropyl acrylamide complex, and a dicyandiamide. Examples of the acid needle-based curing agent include phthalic anhydride, trimellitic anhydride, benzophenone tetracarboxylic acid needle, maleic acid needle, hexahydrophthalic acid, and methyl acid-resistant acid. Liver, glutaric acid liver, pyromellitic anhydride, base-bis(3·butane_I,2-dicarboxylic acid) anhydride, tetrabromo-o-phenyl diacid anhydride, and the like. An epoxy compound to be blended as an optional component in the curable composition of the present invention will be described. In the curable composition of the present invention, if an epoxy compound is used, the mechanical strength of the cured product obtained by curing the curable composition can be improved. When used for: the purpose of the description, the content of the epoxy compound is better than that of the compound having a ruthenium. The ruthenium is negatively damaged. The better use amount is 5 to 25 130806.doc -23- 200911886 Further, it is more preferably 10 to 20 parts by mass. Further, the epoxidation day is used, and the content of the epoxy-curable compound is preferably 0.01 to 30 parts by mass based on 100 parts by mass of the above-mentioned compound having 3 oxime. The epoxy compound is a compound having one or two or more epoxy groups in the molecule, and is a monomeric or dimeric oligomeric or polymeric compound. X 'the ring of these epoxy compounds The oxy group may be present as a terminal group or may be present as a side group. Examples of the epoxy compound include 2,2-bis(3,4-epoxycyclohexyl)propane@, 3,4-ring I. Cyclohexylmethyl (^-epoxy) cyclohexanyl acid vinegar, 2·(3,4_epoxy)cyclohexyl_5 mountain snail (10) soil·epoxy)cyclohexyl-intermediate chewing, double[( 3,4_epoxycyclohexyl)methyl]adipate, 6-(3,4-epoxycyclohexaoxy)hexanoic acid (3,4-epoxycyclohexyl) methyl vinegar Ring epoxy compound Double hopes: shrinking water (four), double F-glycidyl ether, double s bis glycerol hydrazine bis double epoxy resin; benzene hope (four) varnish epoxy resin, age (four) varnish epoxy Shuyue, succinyl benzoic acid (four) varnish epoxy resin (4) varnish-type epoxy resin; tetraphenyl-based phenyl carbaryl glycidin, tetra-based benzophenone _ glycidol, epoxidized polyethylene An aromatic epoxy resin such as a polyfunctional epoxy resin; a polyglycidyl ether of an aliphatic polyol; a polyglycidol of an epoxy polyether of an aliphatic polyol; an aliphatic polyol and a fat a polyglycidyl ether of a polyvalent carboxylic acid of a polyvalent carboxylic acid; a polyglycidyl vinegar of an aliphatic polycarboxylic acid; a polyglycidol of an aromatic polyhydric alcohol and an aromatic polycarboxylic acid; Dimers, oligomers, polymers obtained by vinyl polymerization of glycidol or methyl propylene glycol vinegar; glycidol acrylate or glycidyl methacrylate and other 130806.doc -24- 200911886 Ethylene monomer polymerization of vinyl monomers Acquired vegetable oil, epoxidized vegetable oil from the object, % oxygen, etc. 乂Vapor, % emulsified polybutadiene: the above-mentioned epoxy compound 'molecular weight is ι〇〇~ι〇〇〇 significantly improved The mechanical strength of the hardened material to be obtained is Μ, and the epoxy equivalent is preferred, and the metal oxide fine powder is prepared as an optional component in the jg &amp; 5 of the present invention. The metal oxide fine powder can be used, for example, to improve the amount of each material after hardening: raw or used as a filler. When the content of the fine powder of the genus is used, the content of the fine powder relative to _ parts by mass is It is better that ~ ~ 〇〇〇 mass parts. A better amount, and more preferably 10 to 100 parts by mass. In the case of the above-mentioned metal oxide micropowder, I*TM m can be exemplified by an inorganic material such as a mineral, such as a colloidal silica dioxide or a dioxane (tetra) fossil gel. Shixi class; oxidation, oxygen, a milk oxide; mica, montmorillonite, #钦, and other metals / stone stone 溱 溱 soil, 绢啦卉 ancient stone, seam stone, feldspar powder, warp stone 'Eupupo II Minerals such as stone-ridge stone, etc., can also be changed to "stones and leaves (4). The towel of the material (4) is a dioxane type. For the viewpoint of heat resistance, the above metal is good. 〇〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Doc •25· 200911886 A well-known general user such as a fixative, a UV absorber, an I-based antioxidant, a sulfur-based antioxidant, and a filled antioxidant. For example, a light stabilizer may be a hindered amine, and a UV absorber may be mentioned. 2_Phenyldibenzoguanidine, 2-(2-pyridylphenyl)benzo Terpenoids, 2_(2_p-phenylphenyldiaryl-1'3'5.diazines, benzoates, cyanoacrylates, phenolic antioxidants, triethylene glycol·double [M3 ·Third butyl·5·methyl collar phenyl)propionic acid vinegar], dibutyl permethyl toluene (ΒΗΤ), 26-di-t-butyl group, p-methyl (10) PC, etc., sulfur-based antioxidants Examples of the second-grade thiodipropionic acid vinegar and the β-homo-based thioglycolic acid vinegar, and the scaly antioxidants include organic (tetra) acid esters. When the weather resistance imparting agent is used, heat resistance and electrical properties are obtained. The content of the curable composition of the present invention is preferably from 1 to 5 % by mass, more preferably from 0.001 to 10, from the viewpoints of hardenability, mechanical properties, storage stability, and workability. In the curable composition of the present invention, various well-known various resins, fillers, additives, and the like can be blended in the range which does not impair the target performance of the present invention. Examples of various resins which can be arbitrarily formulated include Poly-resin, polyethylene glycol or polypropylene glycol, etc., poly-resin, polyurethane resin, epoxy tree An antistatic agent, a photosensitizer, an acid proliferator, etc. may be mentioned as an example of an additive which can be arbitrarily formulated, such as a resin, a polyester resin, a melamine resin, a polyamide resin, or a polyphenylene sulfide. The target performance of the present invention is such that the compounding amount of the optional components (excluding the epoxy compound and the metal oxide fine powder described above) is preferably 10 in terms of (10) parts by mass of the compound containing the compound of the stone. The mass fraction is 130806.doc -26 - 200911886. The curable composition of the present invention has excellent fluidity at room temperature (25 ° C) and is excellent in handleability. In the state of the micropowder at room temperature (25. The viscosity measured by the E-type viscometer under (:) is preferably 50 Pa·s or less, more preferably 10 Pa·s or less. By selecting the above epoxy curable compound, the hardening type of the curable composition 4 of the present invention can be selected from the group consisting of heat curing, light curing, and curing using both light and heat. The hardening temperature at the time of heat hardening is preferably 6 〇 2 (8). Hey, more () Good is 80~15〇C. The hardening time is preferably 0.1 to H) hours, more preferably 1 to 6 hours. When performing photohardening, the active energy lines that can be used include ultraviolet rays, electron rays, X-rays, radiation, high-frequency waves, etc., and ultraviolet rays are the best in the economy. Ultraviolet light sources include ultraviolet lasers, mercury lamps, high-pressure mercury lamps, xenon lamps, sodium lamps, and metal lamps. The ultraviolet source used herein is preferably a high pressure mercury lamp. The optimum conditions for the irradiation energy vary depending on the film thickness to be applied, and are usually in the range of 100 to 10,000 mJ/cm2. Further, i) When the glass is thermally cured after photohardening, it is usually heated in the range of 60 to 15 Torr. The cured product obtained by curing the curable composition of the present invention under the conditions described above is transparent, crack resistant, heat resistant, solvent-soluble, alkali-based, and weather-resistant. , flame retardancy, moisture resistance, gas barrier properties, flexible 14 #长率 or strength, electrical insulation, low dielectric constant and other mechanical properties: properties, optical properties, electrical properties and other excellent materials. (3) The curable composition formed by the compound containing ruthenium of the present invention is excellent in stability, stability, and the like, and further has the crack resistance of the cured product, and the heat resistance is 130806.doc •27-200911886 Solvent, testability, and weather resistance are excellent in physical properties. The display material of the hardening composition material of the present invention, such as the characteristics of the hardening of the material, the electric property, etc.; the electrical/electronic material, (4) the sealing material of the material/semiconductor, the electric material, the insulation material/ ^Note/sealing;. Aowei Wanshui/moisture-proof irrigation/producing master molds for sealing materials, plastic parts, coating materials, interlayer insulation film, insulation package, heat collection, sealant/protective material m its ^0 clothing 'display device is not dense... fiber protection material, optical lens,

^備用接著劑、高耐熱性接著劑、高散熱性材料、高 ί ,、,、咎封材料、太陽電池/燃料 Φ ^ @b 丁才电池用構件、電池用固態 :解質:絕緣包覆材料、影印機用感光鼓、氣體分離膜 又亦可應用於土木/建材領域之混凝土保護材料、 :砌、土壤注入劑、密封劑、蓄冷蓄熱材料、玻璃鍍膜 荨,進而於醫療用材料領域中,亦可應用於試管、密封材 料、塗佈材料、滅菌處理裝置用密封材料、隱形眼鏡、富 氧臈等。 [實施例] 以下’藉由實施例等進一步說明本發明,但本發明並不 因該等實施例而受到m,只要無特別說明,則實施 例中之「份」或「%」係以質量為基準者。 [合成例1 ] 將100伤之二氣二甲基矽烷滴加於i 〇〇份之離子交換水、 50份之甲苯及450份之48%氫氧化鈉水溶液的混合物中, 使之於1〇5。(:下聚合5小時。用500份之離子交換水對所獲 得之反應溶液進行水洗,其後使該甲笨溶液脫水加入2〇 130806.doc -28- 200911886 份之吡啶,於其中進一步加入10份之二曱基乙烯基氣矽 烷,於70C下攪拌30分鐘。然後,以1〇〇份之離子交換水 進行水洗之後,於1 50°C下減壓餾去溶劑。繼而以100份之 乙腈進行清洗,其後於70°C下減壓餾去溶劑,獲得具有不 飽和鍵之非環狀聚矽氧烷化合物(&amp;卜〇)。下述條件下之 GPC分析之結果為非環狀聚;g夕氧烧化合物(&amp;卜〇)之分子量 為Mw=20,000。再者,以下GPC均係在該條件下進行。 (GPC之測定條件)^Replacement Adhesive, High Heat Resistant Adhesive, High Heat Dissipating Material, High ,,,, Sealing Material, Solar Cell/Fuel Φ ^ @b Ding Battery Component, Battery Solid: Desolvation: Insulation Coating Photosensitive drums and gas separation membranes for materials and photocopiers can also be applied to concrete protection materials in civil engineering/building materials, masonry, soil injection, sealant, cold storage and heat storage materials, glass coating enamel, and further in the field of medical materials. It can also be applied to test tubes, sealing materials, coating materials, sealing materials for sterilization treatment devices, contact lenses, oxygen-rich enamel, and the like. [Examples] The present invention will be further described by the following examples, but the present invention is not limited by the examples, and the "parts" or "%" in the examples are by mass unless otherwise specified. As the benchmark. [Synthesis Example 1] 100 parts of dioxane dimethyl decane was added dropwise to a mixture of i part of ion-exchanged water, 50 parts of toluene and 450 parts of 48% aqueous sodium hydroxide solution, and allowed to make 1 〇 5. (: Polymerization for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the deuterated solution was dehydrated and added to 2〇130806.doc -28-200911886 parts of pyridine, and further added thereto 10 The dimethyl hydrazine was stirred at 70 C for 30 minutes. Then, after washing with 1 part of ion-exchanged water, the solvent was distilled off under reduced pressure at 150 ° C. Then 100 parts of acetonitrile was added. After washing, the solvent was distilled off under reduced pressure at 70 ° C to obtain an acyclic polyoxane compound having an unsaturated bond. The result of GPC analysis under the following conditions was acyclic. The molecular weight of the polyglycolic compound (&amp; dim) is Mw = 20,000. Further, the following GPC is carried out under these conditions. (Measurement conditions of GPC)

官柱.TOSOH股份有限公司製造之TSK GEL MULTIp〇RE HXL Μ,7.8 mmx300 mm 展開溶劑:四氫呋喃 [合成例2] 將100份之合成例1中所獲得之非環狀聚石夕氧院⑷_〇)溶 解於200份之甲苯中,加入〇〇〇3份之鉑觸媒及1〇份之作 為環狀聚矽氧烷化合物的四甲基環四矽氧烷,使 之於105。。下反應2小時。於贼下減壓餾去溶劑之後以 1〇〇份之乙腈it行清洗。其後於贼下減壓顧去溶劑,獲 得聚石夕氧烧中間體㈣)。Gpc之分析結果為聚石夕氧烧中 間體(a3-0)之分子量為Mw=22,〇〇()。 [實施例1 ]含有矽之化合物(A_〇)之製造 將100伤之合成例2中所獲得之聚石夕氧烧中間體⑷_〇)溶 解於200伤之甲本中,加人19份之作為導人z之環氧化合物 的3_乙稀基-7-氧雜雙環[M,〇]庚烧,於105〇C下授拌2小 時。於听下減壓餾去溶劑之後以⑽份之乙腈進行清 130806.doc •29· 200911886 洗’其後於70 C下減壓餾去溶劑,獲得含有矽之化合物 (A-0)。GPC之分析結果為含有矽之化合物(A_〇)之分子量 為Mw=30,000,利用依據JIS規格K7236之電位差滴定法所 求出之環氧當量(每單位數量之環氧基之分子量)為3〇〇〇 g/mmol。再者,以下之環氧當量均係利用該方法測定。 [合成例3 ] 混合90份之二氯二曱基矽烷與9份之二氯二苯基矽烷, 滴加於100份之離子交換水、5〇份之甲苯及45〇份之48%氫 氧化鈉水溶液的混合物中,使之於丨〇5 〇c下聚合5小時。以 500份之離子交換水對所獲得之反應溶液進行水洗,然後 使該甲苯溶液脫水,加入2〇份之吡啶,於其中進一步加入 10份之二甲基乙烯基氣矽烷,於7〇。〇下攪拌3〇分鐘。然 後,以1〇〇份之離子交換水進行水洗之後,於15(rc下減壓 餾去溶劑。繼而以100份之乙腈進行清洗,其後於7〇乞下 減壓餾去溶劑,獲得具有不飽和鍵之非環狀聚矽氧烷化合 物(al-Ι)。非環狀聚石夕氧烧(ai_i)之分子量為mw=2〇,〇〇〇。 [合成例4] 將100份之合成例3中所獲得之非環狀聚矽氧烷卜^^容 解於200份之甲苯中,加入〇.〇〇3份之鉑觸媒、及ι〇份之作 為環狀聚矽氧烷化合物的1,3,5,7-四甲基環四石夕氧烧,使 之於l〇5°C下反應2小時。於70。(:下減壓餾去溶劑之後以 1〇〇份之乙腈進行清洗。然後,於70〇c下減壓餾去溶劑, 獲得聚矽氧烷令間體(a3·!)。GPC之分析結果為聚矽氧烷 中間體(a3-l)之分子量為Mw=22,000。 130806.doc -30- 200911886 [實施例2]含有矽之化合物(A-!)之製造 將1〇0份之合成例4中所獲得之聚矽氧烷中間體^^^容 解於200份之甲苯中,加入19份之作為導入z之環氧化合物 的3-乙烯基-7-氧雜雙環[4,^]庚烷,於1〇5它下攪拌二小 時。於70°C下減壓餾去溶劑之後以1〇〇份之乙腈進行清 洗,其後於70°C下減壓餾去溶劑,獲得含有矽之化合物 (A-1)。GPC之分析結果為含有矽之化合物(八-丨)之分子量 為Mw=30,000,環氧當量(每單位數量之環氧基之分子量) 為 3000 g/mmol 〇 [實施例3]含有石夕之化合物(a-2)之製造 將100份之合成例4中所獲得之聚矽氧烷中間體(^-”溶 解於200份之曱苯中,加入19份之作為導入z之環氧化合物 的烯丙基縮水甘油醚,於105t下攪拌2小時。於7〇。〇下減 壓餾去溶劑之後以100份之乙腈進行清洗,其後於7〇它下 減壓餾去溶劑,獲得含有矽之化合物(A_2)。Gpc之分析結 果為含有矽之化合物(A-2)之分子量為Mw==30,000,環氧當 量(每單位數量之環氧基之分子量)為3〇〇〇 g/mm〇1。 [合成例5 ] 混合90份之二氣二甲基矽烷與9份之二氯二苯基矽烷, /商加於100份之離子交換水、5〇份之曱苯及45〇份之氣 氧化鈉水溶液的混合物中,使之於! 〇5。〇下聚合5小時。用 500份之離子交換水對所獲得之反應溶液進行水洗,其後 使该曱苯溶液脫水,加入2〇份之吡啶及〇 5份之苯基三氣 矽烷,於室溫下攪拌3〇分鐘,接著於7〇它下攪拌3〇分鐘。 130806.doc •31 - 200911886 於其中加入15份之二甲基乙烯基氣矽烷,於室溫下攪拌3〇 分鐘’接著於70°C下攪拌30分鐘。然後,以1〇〇份之離子 交換水進行水洗之後’於15〇°c下減壓餾去溶劑。繼而以 100份之乙腈進行清洗’其後於7(rc下減壓餾去溶劑,獲 得具有不飽和鍵之非環狀聚矽氧烷化合物(al_2) ^ GPC之 分析結果為非環狀聚矽氧烷(a^2)之分子量為Mw= 33,〇〇〇 。 [合成例6 ]TSU GEL MULTIp〇RE HXL® manufactured by TOSOH Co., Ltd., 7.8 mm×300 mm Development solvent: tetrahydrofuran [Synthesis Example 2] 100 parts of the non-cyclic polysulfide (4) obtained in Synthesis Example 1 〇) was dissolved in 200 parts of toluene, and 3 parts of platinum catalyst and 1 part of tetramethylcyclotetraoxane as a cyclic polyoxyalkylene compound were added to make 105. . The reaction was carried out for 2 hours. After distilling off the solvent under reduced pressure under thieves, it was washed with 1 part acetonitrile. Thereafter, the solvent was decompressed under a thief to obtain an intermediate (4) of polysulfide gas. The analysis result of Gpc is that the molecular weight of the polysulfide-oxygen intermediate (a3-0) is Mw=22, 〇〇(). [Example 1] Production of a compound containing ruthenium (A_〇) The poly-stone-oxygenated intermediate (4)_〇 obtained in Synthesis Example 2 of 100 wounds was dissolved in 200 wounds, and added 19 The 3-ethylamino-7-oxabicyclo[M, oxime] was burned as an epoxy compound of z. The mixture was stirred at 105 ° C for 2 hours. After the solvent was distilled off under reduced pressure, the solvent was purified by (10) portions of acetonitrile. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; As a result of GPC analysis, the molecular weight of the compound containing ruthenium (A_〇) was Mw=30,000, and the epoxy equivalent (molecular weight per unit number of epoxy groups) determined by potentiometric titration according to JIS specification K7236 was 3 〇〇〇g/mmol. Further, the following epoxy equivalents were measured by this method. [Synthesis Example 3] 90 parts of dichlorodioxanane and 9 parts of dichlorodiphenyl decane were mixed and added dropwise to 100 parts of ion-exchanged water, 5 parts of toluene, and 45 parts of 48% of oxidized hydroxide. In a mixture of aqueous sodium solutions, the mixture was polymerized at 丨〇5 〇c for 5 hours. The obtained reaction solution was washed with water in an amount of 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, and 2 parts of pyridine was added thereto, and 10 parts of dimethylvinyl gas decane was further added thereto at 7 Torr. Stir under the arm for 3 minutes. Then, after washing with 1 part of ion-exchanged water, the solvent was distilled off under reduced pressure at 15 (rc), followed by washing with 100 parts of acetonitrile, and then the solvent was evaporated under reduced pressure at 7 Torr to obtain An acyclic polyoxyalkylene compound (al-Ι) having an unsaturated bond. The molecular weight of the acyclic polyoxo (i_i) is mw=2〇, 〇〇〇. [Synthesis Example 4] 100 parts The acyclic polyfluorene oxide obtained in Synthesis Example 3 was dissolved in 200 parts of toluene, and 3 parts of platinum catalyst and ι were used as the cyclic polyoxyalkylene. The compound was calcined with 1,3,5,7-tetramethylcyclotetrazepine, and allowed to react at 1 〇 5 ° C for 2 hours at 70 ° (after distillation of the solvent under reduced pressure for 1 part) The acetonitrile is washed, and then the solvent is distilled off under reduced pressure at 70 ° C to obtain a polyoxane intercalation (a3·!). The analysis result of GPC is the molecular weight of the polyoxyalkylene intermediate (a3-l). Mw = 22,000. 130806.doc -30- 200911886 [Example 2] Production of a compound containing ruthenium (A-!) 1 〇 0 part of the polyoxy siloxane intermediate obtained in Synthesis Example 4 ^^^ Compatible in 200 parts of toluene, add 19 parts 3-vinyl-7-oxabicyclo[4,^]heptane which was introduced as an epoxy compound of z, and stirred under a pressure of 1 Torr for 2 hours. The solvent was distilled off under reduced pressure at 70 ° C. After washing with acetonitrile, the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound (A-1) containing ruthenium. The result of analysis by GPC was that the molecular weight of the compound containing ruthenium (octa-ruthenium) was Mw. = 30,000, epoxy equivalent (molecular weight per unit number of epoxy groups) is 3000 g / mmol 〇 [Example 3] Production of Compound (a-2) containing Shi Xi will be obtained in 100 parts of Synthesis Example 4. The polyoxyalkylene intermediate (^-" was dissolved in 200 parts of toluene, and 19 parts of allyl glycidyl ether as an epoxy compound introduced into z was added, and the mixture was stirred at 105 t for 2 hours. After distilling off the solvent under reduced pressure, the solvent was washed with 100 parts of acetonitrile, and then the solvent was evaporated under reduced pressure to give a compound (A2) containing hydrazine. The analysis result of Gpc was a compound containing hydrazine (A- 2) The molecular weight is Mw == 30,000, and the epoxy equivalent (molecular weight per unit number of epoxy groups) is 3 〇〇〇g/mm 〇 1. [Synthesis Example 5] Mixing 90 parts of dimethyl dimethyl decane with 9 parts of dichlorodiphenyl decane, and adding it to a mixture of 100 parts of ion-exchanged water, 5 parts of benzene and 45 parts of sodium oxyhydroxide使5. The polymerization was carried out for 5 hours. The obtained reaction solution was washed with 500 parts of ion-exchanged water, and then the toluene solution was dehydrated, and 2 parts of pyridine and 5 parts of ruthenium were added. Phenyl trioxane was stirred at room temperature for 3 minutes and then stirred at 7 Torr for 3 minutes. 130806.doc • 31 - 200911886 15 parts of dimethylvinyl gas decane was added thereto, and stirred at room temperature for 3 minutes' followed by stirring at 70 ° C for 30 minutes. Then, after washing with 1 part of ion-exchanged water, the solvent was distilled off under reduced pressure at 15 °C. Then, it was washed with 100 parts of acetonitrile. Then, the solvent was distilled off under reduced pressure at 7 rc to obtain an acyclic polysiloxane compound (al_2) having an unsaturated bond. The analysis result of GPC was acyclic polyfluorene. The molecular weight of the oxane (a^2) is Mw = 33, 〇〇〇. [Synthesis Example 6]

將100份之合成例5中所獲得之作為前驅物的非環狀聚矽 氧烷化合物(al-2)溶解於200份之甲苯中,加入〇〇〇3份之 鉑觸媒及10份之1,3,5,7-四甲基環四矽氧烷,使之於1〇5。〇 下反應2小時。於7(rc下減壓餾去溶劑之後以ι〇〇份之乙腈 進行清洗後,於70t下減壓餾去溶劑,獲得聚矽氧烷中間 體(a3-2)。GPC之分析結果為聚梦氧貌中間體“3_2)之分子 量為 Mw=36,000。 [實施例4]含有矽之化合物(A_3)之製造 將100份之合成例6中所獲得之聚石夕氧烧中間體㈤_2)溶 解於份之U巾,加人19份之_基縮水甘㈣,於 ㈣下授拌2小時。於7{rc下減壓館去溶劑之後以麵 之乙腈進行清洗,於7Gt下減壓射溶劑,獲得含有石夕之 化合物叫GPC之分析結果為含有石夕之化合物關之 二 =,。。’環氧當量(每單位數量之環氧基之分 子 Ϊ )為 2000 g/mrn〇i。 [合成例7] 130806.doc •32- 200911886100 parts of the acyclic polyoxy siloxane compound (al-2) obtained as a precursor in Synthesis Example 5 was dissolved in 200 parts of toluene, and 3 parts of platinum catalyst and 10 parts of ruthenium were added. 1,3,5,7-tetramethylcyclotetraoxane, which is made at 1〇5. The reaction was carried out for 2 hours. After the solvent was distilled off under reduced pressure at rc (yield: EtOAc), EtOAc (EtOAc) The molecular weight of the dream oxygenated intermediate "3_2" was Mw = 36,000. [Example 4] Production of a compound containing ruthenium (A-3) 100 parts of the polysulfide intermediate (5)_2) obtained in Synthesis Example 6 was dissolved. In the U towel, add 19 parts of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The analysis result of the compound containing Shi Xi is called GPC, and the compound containing Shi Xi is the second =, ''Ethylene equivalent (the molecular weight per unit number of epoxy groups) is 2000 g/mrn〇i. Synthesis Example 7] 130806.doc •32- 200911886

混合90份之二氣二曱基矽烷與$份之二氯二苯基矽烷, 滴加於1〇〇份之離子交換水、5〇份之甲苯及45〇份之48。/〇氫 氧化納水溶液的混合物中,使之於1 〇5。匸下聚合5小時。用 5〇〇份之離子交換水對所獲得之反應溶液進行水洗,其後 使δ亥甲苯溶液脫水,加入2〇份之吡啶及〇 5份之四氯矽 烷,於室溫下攪拌30分鐘,繼而於几七下攪拌3〇分鐘。於 其中加入15份之二甲基乙烯基氣矽烷,於室溫下攪拌3〇分 鐘,繼而於70 C下攪拌30分鐘。然後,以】〇〇份之離子交 換水進行水洗之後,於150t:T減壓餾去溶劑。繼而以1〇〇 份之乙腈進行清洗,其後於7(rc下減壓餾去溶劑獲得具 有不飽和鍵之非環狀聚矽氧烷化合物(al_3)。Gpc之分析 結果為非環狀聚珍氧烧(al _3)之分子量為Mw=4〇,_。 [合成例8] 將100份之合成例7中所獲得之作為前驅物的非環狀聚石夕 氧烷化合物(al-3)溶解於200份之甲苯中,加入〇〇〇3份之 始觸媒及IGA之1,3,5,7_四甲基環四0氧烧,使之於1〇5。〇 下反應2小時。於70 C下減壓餾去溶劑之後以丨〇〇份之乙腈 進行清洗後,於7Gt下減壓㈣溶劑,獲得聚㈣以間 體(a3 3) GPC之刀析結果為聚石夕氧烧中間體⑷_3)之分子 量為 Mw=44,000。 [只施例5]含有石夕之化合物(八_4)之製造 將⑽份之合成例8中所獲得之聚石夕氧烧中間體(aw)溶 解於份之甲苯中,加人19份之稀丙基縮水甘油越,於 下㈣2小時。於7(rc下減_去溶劑之後以_份 130806.doc -33- 200911886 之乙腈進行清洗,於70°C下減壓餾去溶劑,獲得含有矽之 化合物(A-4)。GPC之分析結果為含有矽之化合物(A-4)之 分子量為Mw=44,000,環氧當量(每單位數量之環氧基之分 子量)為 1000 g/mmol。 [實施例6]硬化性組合物No. 1之製造 將99.9份之上述實施例1中所獲得的含有矽之化合物(A-0)、及0.1份之4,4’-雙[二(4-庚氧基苯基)銃基苯基]硫醚雙 六氟銻酸鹽加以混合,獲得硬化性組合物No. 1。 [實施例7]硬化性組合物No. 2之製造 將90份之上述實施例1中所獲得的含有矽之化合物(A- 0) 、及 10份之JEFFAMIN D-2000(HUNTSMAN公司製造, 二胺系硬化劑)加以混合,獲得硬化性組合物No. 2。 [實施例8]硬化性組合物No. 3之製造 將99.9份之上述實施例2中所獲得的含有矽之化合物(A- 1) 、及0.1份之4,4’-雙[二(4-庚氧基苯基)銕基苯基]硫醚雙 六氟銻酸鹽加以混合,獲得硬化性組合物No. 3。 [實施例9]硬化性組合物No. 4之製造 將99.9份之上述實施例2中所獲得的含有矽之化合物(A-1)、及0.1份之4-異丙氧基-4'-甲基二苯基鎭四(五氟苯基)硼 酸鹽加以混合,獲得硬化性組合物N 〇. 4。 [實施例10]硬化性組合物No. 5之製造 將99.9份之上述實施例4中所獲得的含有矽之化合物(A-3)、及0.1份之4,4-雙[二(4-庚氧基苯基)锍基苯基]硫醚雙六 氟銻酸鹽加以混合,獲得硬化性組合物No. 5。 130806.doc -34- 200911886 [實施例11 ]硬化性組合物No. 6之製造 將99.9份之上述實施例3中所獲得的含有矽之化合物(A-4)、及0.1份之4,4’-雙[二(4-庚氧基苯基)锍基苯基]硫醚雙 六氟録酸鹽加以混合,獲得硬化性組合物No. 6。 [實施例12]硬化性組合物No. 7之製造 將99.9份之上述實施例2中所獲得的含有矽之化合物(A-1)、0.1份之4,4’-雙[二(4-庚氧基苯基)銕基苯基]硫醚雙六 氟銻酸鹽、及5份之二氧化矽填充料(FB-7SDC ;電氣化學 工業製造)加以混合,獲得硬化性組合物No. 5。 [實施例13]硬化性組合物No. 8之製造 將84份之上述實施例2中所獲得的含有矽之化合物(A-1)、0.1份之4,4’-雙[二(4-庚氧基苯基)銃基苯基]硫醚雙六 氟銻酸鹽、及15份之2,2-雙(3,4-環氧環己基)丙烷加以混 合,獲得硬化性組合物N 〇. 8。 [實施例14]硬化性組合物No. 9之製造 將90份之上述實施例2中所獲得的含有矽之化合物(A-1)、及 10 份之 JEFFAMIN D-2000(HUNTSMAN公司製造’ 二胺系硬化劑)加以混合,獲得硬化性組合物No. 9。 [實施例15]硬化性組合物No. 10之製造 將85份之上述實施例2中所獲得的含有矽之化合物(A-1)、10 份之 JEFFAMIN D-2000(HUNTSMAN公司製造,二 胺系硬化劑)、及5份之二氧化矽填充料(FB-7SDC ;電氣化 學工業製造)加以混合,獲得硬化性組合物No. 1 0。 [實施例16]硬化性組合物No. 11之製造 130806.doc -35- 200911886 將90份之上述實施例2中所獲得的含有矽之化合物(A-1)、及 10 份之 ADEKA Hardener EH-220(ADEKA製造,混 合系環氧硬化劑)加以混合,獲得硬化性組合物No. 11。 [比較例1 ]硬化性組合物比較用1之製造 將99.9份之KF-102C信越化學製造,以側位(pendant)型鍵 結有3,4-環氧環己基之聚甲基矽氧烷;環氧當量為3600 g/mmol)、及0.1份之4,4’-雙[二(4-庚氧基苯基)錡基苯基]硫 醚雙六氟銻酸鹽加以混合,獲得硬化性組合物比較用1。 [比較例2 ]硬化性組合物比較用2之製造 將99.9份之X-22-169B(信越化學製造,末端為3,4-環氧 環己烷之聚二曱基矽氧烷;環氧當量為1700 g/mmol)、及 0.1份之4,4’-雙[二(4-庚氧基苯基)銕基苯基]硫醚雙六氟銻 酸鹽加以混合,獲得硬化性組合物比較用2。 [比較例3]硬化性組合物比較用3之製造 將90份之KF-101(信越化學製造,以側位型鍵結有縮水 甘油基之聚二甲基石夕氧烧;環氧當量為350 g/mmol)、及 10份之 ADEKA Hardener EH-220(ADEKA製造,混合系環 氧硬化劑)加以混合,獲得硬化性組合物比較用3。 [比較例4]硬化性組合物比較用4之製造 將99.0份之1,3,5,7-四曱基-1,3,5,7-四(3,4-環氧環己基乙 基)環四矽氧烷、及1份之4,4'-雙[二(4-庚氧基苯基)銕基苯 基]硫醚雙六氟銻酸鹽加以混合,獲得硬化性組合物比較 用4。 [實施例17〜27、比較例5〜8] 130806.doc -36- 200911886 於銘板上將上述實施例6〜16中所獲得之硬化性組合物 No. 1〜11及比較例丨〜4中所獲得之硬化性組合物比較用1〜4 为別製成膜厚約為丨mm之膜,於表丨、2之條件下進行硬 化,獲得硬化物1〜丨丨、硬化物比較丨〜4。又,表i中之硬化 條件表示,使用高壓水銀燈在上段之條件下進行光硬化之 後’在下段之條件下進行加熱處理。 以如下方式對該等硬化物進行硬化狀態之評價、耐熱性 試驗及1 80度彎曲試驗。 硬化狀態係根據特定硬化時間後硬化膜有無黏著感來判 斷,將具有流動性之狀態評價為χ,並無流動性但有黏著 感者視其程度而評價為△〜Q ’無黏著感時㈣為◎。 耐熱性試驗中,測定空氣環境下之TG/DTA之5質量%減 少溫度。 於180度彎曲試驗中,對在鋁板上製作膜厚約為丨之 膜而獲得之硬化膜觀察彎曲18〇度時的膜之狀態。將彎折 1 80度時膜並無龜裂及剝離之樣品評價為〇,將彎折度 時產生龜裂而彎折90度時未產生龜裂及剝離之樣品評價為 △,將彎折90度時產生龜裂之樣品評價為χ。 將結果示於表卜2中。又,表w記載的是使用有機鑌 鹽系硬化劑作為環氧硬化性化合物的硬化性組合物之硬化 物,表2中記載的是使用胺系硬化劑或混合系硬化劑作為 環乳硬化性化合物的硬化性組合物之硬化物。 130806.doc -37- 20091188690 parts of dioxedonyl decane and 0.2 parts of dichlorodiphenyl decane were mixed and added dropwise to 1 part of ion-exchanged water, 5 parts of toluene and 45 parts of 48 parts. /〇 Hydrogen Oxidation of a mixture of aqueous sodium solutions to 1 〇5. The underarm was polymerized for 5 hours. The obtained reaction solution was washed with 5 parts of ion-exchanged water, and then the ?-Hexyl toluene solution was dehydrated, 2 parts of pyridine and 5 parts of tetrachloromethane were added, and the mixture was stirred at room temperature for 30 minutes. Then stir for 3 minutes at a few seven. 15 parts of dimethylvinyl decane was added thereto, stirred at room temperature for 3 Torr, and then stirred at 70 C for 30 minutes. Then, after washing with water of ion exchange water, the solvent was distilled off under reduced pressure at 150t:T. Then, it was washed with 1 part of acetonitrile, and then the solvent was distilled off under reduced pressure at 7 (rc) to obtain an acyclic polyoxane compound (al_3) having an unsaturated bond. The analysis result of Gpc was acyclic polyphosphate. The molecular weight of the oxygen-fired (al _3) is Mw = 4 〇, _ [Synthesis Example 8] 100 parts of the acyclic polyoxosiloxane compound (al-3) obtained as a precursor in Synthesis Example 7 Dissolved in 200 parts of toluene, adding 3 parts of the starting catalyst and IGA of 1,3,5,7-tetramethylcyclotetraoxane, and making it at 1〇5. After distilling off the solvent under reduced pressure at 70 C, the mixture was washed with acetonitrile, and then decompressed (4) solvent at 7 Gt to obtain a poly(tetra)-isomer (a3 3) GPC. The molecular weight of the burned intermediate (4)_3) was Mw = 44,000. [Example 5] Manufacture of a compound containing shixi (eight _4) (10) parts of the polyoxanthine intermediate (aw) obtained in Synthesis Example 8 was dissolved in toluene, and 19 parts were added. The lower the propyl glycidol, the lower (four) 2 hours. After 7 (r s under _ desolvation), the residue was washed with acetonitrile of 130806.doc -33 - 200911886, and the solvent was distilled off under reduced pressure at 70 ° C to obtain a compound (A-4) containing ruthenium. Analysis of GPC As a result, the molecular weight of the compound (A-4) containing ruthenium was Mw = 44,000, and the epoxy equivalent (molecular weight per unit number of epoxy groups) was 1000 g/mmol. [Example 6] Sturability composition No. 1 99.9 parts of the ruthenium-containing compound (A-0) obtained in the above Example 1 and 0.1 part of 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl] were produced. The thioether bishexafluoroantimonate was mixed to obtain a curable composition No. 1. [Example 7] Production of the curable composition No. 2 90 parts of the compound containing ruthenium obtained in the above Example 1 was obtained. (A- 0) and 10 parts of JEFFAMIN D-2000 (manufactured by HUNTSMAN, a diamine-based curing agent) were mixed to obtain a curable composition No. 2. [Example 8] Curing composition No. 3 99.9 parts of the ruthenium-containing compound (A-1) obtained in the above Example 2, and 0.1 part of 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl]sulfate were produced. Ether double The hexafluoroantimonate was mixed to obtain a curable composition No. 3. [Example 9] Production of the curable composition No. 4 99.9 parts of the compound containing ruthenium obtained in the above Example 2 (A- 1), and 0.1 part of 4-isopropoxy-4'-methyldiphenylphosphonium tetrakis(pentafluorophenyl)borate are mixed to obtain a curable composition N 〇. 4. [Example 10] Production of Curable Composition No. 5 99.9 parts of the ruthenium-containing compound (A-3) obtained in the above Example 4, and 0.1 part of 4,4-bis[bis(4-heptyloxyphenyl) The mercaptophenyl]thioether bishexafluoroantimonate was mixed to obtain a curable composition No. 5. 130806.doc -34- 200911886 [Example 11] The curable composition No. 6 was manufactured in a ratio of 99.9 parts. The ruthenium-containing compound (A-4) obtained in the above Example 3, and 0.1 part of 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl] sulfide dihexafluorocarbon The acid salt was mixed to obtain a curable composition No. 6. [Example 12] Production of the curable composition No. 7 99.9 parts of the compound containing ruthenium (A-1) obtained in the above Example 2 was obtained. , 0.1 parts of 4, 4'-double [two (4- The oxyphenyl)nonylphenyl]thioether bishexafluoroantimonate and 5 parts of a cerium oxide filler (FB-7SDC; manufactured by Electric Chemical Industry Co., Ltd.) were mixed to obtain a curable composition No. 5. [Example 13] Production of curable composition No. 8 84 parts of the compound (A-1) containing ruthenium obtained in the above Example 2, and 0.1 part of 4,4'-bis[di(4-) Heptyloxyphenyl)nonylphenyl]thioether bishexafluoroantimonate and 15 parts of 2,2-bis(3,4-epoxycyclohexyl)propane are mixed to obtain a hardenable composition N 〇 . 8. [Example 14] Production of curable composition No. 9 90 parts of the compound (A-1) containing ruthenium obtained in the above Example 2, and 10 parts of JEFFAMIN D-2000 (manufactured by HUNTSMAN Co., Ltd.) The amine hardener) was mixed to obtain a curable composition No. 9. [Example 15] Production of curable composition No. 10 85 parts of the compound (A-1) containing ruthenium obtained in the above Example 2, and 10 parts of JEFFAMIN D-2000 (manufactured by HUNTSMAN, diamine) A hardening agent) and 5 parts of a cerium oxide filler (FB-7SDC; manufactured by Electric Chemical Industry Co., Ltd.) were mixed to obtain a curable composition No. 10. [Example 16] Production of Curable Composition No. 11 130806.doc -35- 200911886 90 parts of the ruthenium-containing compound (A-1) obtained in the above Example 2, and 10 parts of ADEKA Hardener EH -220 (manufactured by ADEKA, mixed epoxy curing agent) was mixed to obtain a curable composition No. 11. [Comparative Example 1] Comparison of curable composition 1 manufactured by using 99.9 parts of KF-102C Shin-Etsu Chemical, 3,4-epoxycyclohexyl polymethyloxirane bonded in a pendant type ; an epoxy equivalent of 3600 g/mmol), and 0.1 part of 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl] thioether hexafluoroantimonate mixed to obtain hardening The composition was compared with 1. [Comparative Example 2] The curable composition was compared with the production of 2, 99.9 parts of X-22-169B (manufactured by Shin-Etsu Chemical Co., Ltd., 3,4-epoxycyclohexane-terminated polydioxanoxane; epoxy Equivalent to 1700 g/mmol) and 0.1 part of 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl] thioether hexafluoroantimonate are mixed to obtain a curable composition Compare with 2. [Comparative Example 3] Comparison of the curable composition with the production of 3, 90 parts of KF-101 (manufactured by Shin-Etsu Chemical Co., Ltd., a polyglycol-based oxygenated group having a glycidyl group bonded to the lateral position; 350 g/mmol) and 10 parts of ADEKA Hardener EH-220 (manufactured by Adeka, mixed epoxy curing agent) were mixed to obtain a comparative composition 3 for a curable composition. [Comparative Example 4] Comparison of the curable composition with the production of 4, 99.0 parts of 1,3,5,7-tetradecyl-1,3,5,7-tetrakis(3,4-epoxycyclohexylethyl) a cyclotetraoxane and 1 part of 4,4'-bis[bis(4-heptyloxyphenyl)nonylphenyl] thioether hexafluoroantimonate are mixed to obtain a sclerosing composition. Use 4. [Examples 17 to 27, Comparative Examples 5 to 8] 130806.doc -36- 200911886 The curable compositions Nos. 1 to 11 and Comparative Examples 丨 to 4 obtained in the above Examples 6 to 16 were placed on the nameplate. The obtained curable composition was prepared by using a film having a film thickness of about 丨mm from 1 to 4, and hardening under the conditions of Table 2 and 2 to obtain a cured product 1 to 丨丨, and a cured product 丨 4 . Further, the hardening conditions in Table i indicate that the heat treatment was carried out under the conditions of the lower stage after the photohardening was carried out under the conditions of the upper stage using a high pressure mercury lamp. The cured product was evaluated for the hardened state, the heat resistance test, and the 180 degree bending test in the following manner. The hardening state is judged based on whether or not the cured film has a feeling of adhesion after a specific curing time, and the state of fluidity is evaluated as χ, and there is no fluidity but the degree of adhesion is evaluated as Δ~Q 'no adhesion feeling (4) It is ◎. In the heat resistance test, the temperature was measured by measuring 5% by mass of TG/DTA in an air atmosphere. In the 180-degree bending test, the state of the film when the film was bent at 18 degrees was observed on a cured film obtained by forming a film having a film thickness of about 丨 on an aluminum plate. The sample with no crack and peeling when the film was bent at 180 ° was evaluated as 〇, and the sample which was cracked at the time of bending and bent at 90 degrees was evaluated as △, and the bending was 90. The sample with cracks at the time was evaluated as χ. The results are shown in Table 2. Further, in Table w, an organic sulfonium-based curing agent is used as a cured product of a curable composition of an epoxy curable compound, and in Table 2, an amine-based curing agent or a mixed curing agent is used as a ring-curing property. A cured product of a curable composition of a compound. 130806.doc -37- 200911886

【II 180度f曲試驗 〇 〇 〇 〇 〇 〇 〇 〇 1 X 5質量%減少溫度(°C) 〇 寸 Ο 寸 Ο m ΓΛ 1 &lt;Ν m 硬化狀態 ◎ ◎ ◎ ◎ ◎ ◎ ◎ &lt; X ◎ 硬化條件 365 nm j 1000 mJ 150°C,30分鐘 365 nm » 1000 mJ 150°C,30分鐘 i 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 365 nm,1000 mJ 150°C,30分鐘 備註 1 1 1 1 1 使用金屬氧化物微粉末(&lt;ό) 使用環氧化合物(,7) 1 1 1 環氧硬化性化合物 锍鹽(M) 疏鹽 錤鹽(*5) 銃鹽 銕鹽 錡鹽 疏鹽 ! 疏鹽 齡 鏟鹽 含有矽之化合物 (A-0) (A-l) (A-l) 1 (A-3) (A-4) (Α-1) (A-1) 比較化合物1(M) 丨比較化合物2(·2) 比較化合物3(#3) 硬化性組合物 No.l (實施例6) No.3 (實施例8) 寸裏 No.5 (實施例10) No.6 (實施例11) No. 7 (實施例12) No.8 (實施例13) ί比較用1 (比較例1) 比較用2 (比較例2) 比較用4 (比較例4) I硬化物 CN m 寸 iri 卜 比較1 比較2 比較3 實施例17 實施例^ _1 實施例19 實施例20 實施例21 實施例22 實施例23 比較例5 比較例6 比較例7 域¢(^10¾¾ ti4t)^-(NCNF 额遨單cfi41H)s繁硪枓M蝴B-4-砩赫肊呼寸(f (Isl 要侩额垵ww^^txul^^iK^ISIrw-lc^fMf^^^^^f^^-toMl^-^H^ ^^^0蛘(硪〇 硪rofi^fi-寸ds-r'v^-ffr-s-z.ve二(Γ (^^^f®-M^w^tofi®ifi-气 e_wx-&lt; 喇鹖*^紫 #&gt;)CQ69l-CNlfN-x (ζ* 130806.doc •38- 200911886 tCN&lt;】 § 〇 〇 〇 〇 X 士、 φΐ 麵ί m § 〇 m g ΓΛ 〇 ΓΛ 硬化狀態 ◎ ◎ ◎ ◎ ◎ 硬化條件 150°C,3小時 150°C,3小時 150°C,3小時 150°C,3小時 150°C,3小時 備註 t 1 使用金屬氧化物粉末 1 1 環氧硬化性化合物 胺系硬化劑 胺系硬化劑 胺系硬化劑 混合系硬化劑 混合系硬化劑 含有矽之化合物 (A-0) (A-1) (A-1) (A-1) 比較化合物1 硬化性組合物 CN军 4 ^ No.9 (實施例14) 1 No.10 | (實施例15) No. 11 (實施例16) 比較用3 (比較例3) :硬化物 00 〇 比較4 1 實施例24 實施例25 實施例26 實施例27 比較例8 j 1 ^-^^-^^♦^wy^^^s-R-l-^-i^ti^^^r^^V^Hav-s-HHSSPJBHV^Hav-* 130806.doc -39 200911886 由表1可確認,作為本發明之硬化性組合物的硬化性組 合物No. 1、No. 3〜8與硬化性組合物比較用1、2相比,顯 示良好之硬化狀態。又可確認,使作為本發明之硬化性組 合物的硬化性組合物No. 1,No. 3〜8硬化而獲得之作為本 發明之硬化物的硬化物1〜7,與硬化物比較3相比耐熱性良 好,與硬化物比較3相比可撓性亦良好。由此可知,藉由 本發明之含有矽之化合物之特徵即於環矽氧烷環中導入環[II 180 degree f-curve test 〇〇〇〇〇〇〇〇 1 X 5 mass% reduction temperature (°C) 〇 inch Ο inch Ο m ΓΛ 1 &lt; Ν m hardened state ◎ ◎ ◎ ◎ ◎ ◎ ◎ &lt; X ◎ Hardening conditions 365 nm j 1000 mJ 150 ° C, 30 minutes 365 nm » 1000 mJ 150 ° C, 30 minutes i 365 nm, 1000 mJ 150 ° C, 30 minutes 365 nm, 1000 mJ 150 ° C, 30 minutes 365 nm , 1000 mJ 150 ° C, 30 minutes 365 nm, 1000 mJ 150 ° C, 30 minutes 365 nm, 1000 mJ 150 ° C, 30 minutes 365 nm, 1000 mJ 150 ° C, 30 minutes 365 nm, 1000 mJ 150 ° C , 30 minutes 365 nm, 1000 mJ 150 ° C, 30 minutes Remarks 1 1 1 1 1 Use metal oxide fine powder (&lt;ό) Use epoxy compound (,7) 1 1 1 Epoxy hardening compound strontium salt ( M) Salt-salt salt (*5) Salt, salt, salt, salt and salt! Salt-salt salt compound containing bismuth (A-0) (Al) (Al) 1 (A-3) (A-4) (Α-1) (A-1) Comparative Compound 1 (M) 丨Comparative Compound 2 (·2) Comparative Compound 3 (#3) Curable Composition No. 1 (Example 6) No. 3 (Example 8 ) inch No. 5 (Example 10) No. 6 (Example 11) No. 7 (Example 12) No. 8 ( Example 13) ί Comparison 1 (Comparative Example 1) Comparison 2 (Comparative Example 2) Comparison 4 (Comparative Example 4) I hardened material CN m inch iri Comparison 1 Comparison 2 Comparison 3 Example 17 Example ^ _1 Example 19 Example 20 Example 21 Example 22 Example 23 Comparative Example 5 Comparative Example 6 Comparative Example 7 Domain ¢(^103⁄43⁄4 ti4t)^-(NCNF 遨 遨 c cfi41H) s 硪枓 M Butterfly B-4-砩赫肊呼寸 (f (Isl wants to 侩ww^^txul^^iK^ISIrw-lc^fMf^^^^^f^^-toMl^-^H^ ^^^0蛘(硪〇硪Rofi^fi-inch ds-r'v^-ffr-sz.ve two (Γ (^^^f®-M^w^tofi®ifi-gas e_wx-&lt;鹖**紫#&gt;) CQ69l -CNlfN-x (ζ* 130806.doc •38- 200911886 tCN&lt;] § 〇〇〇〇X 士, φΐ surface ί m § 〇mg ΓΛ 硬化 Hardened state ◎ ◎ ◎ ◎ ◎ Hardening condition 150 ° C, 3 hours 150 ° C, 3 hours 150 ° C, 3 hours 150 ° C, 3 hours 150 ° C, 3 hours remarks t 1 use metal oxide powder 1 1 epoxy hardening compound amine hardener amine hardener amine hardening Agent mixed hardener mixed hardener containing antimony compound (A-0) (A-1) (A-1) (A-1) Comparative compound 1 Sturability Compound CN Jun 4 ^ No. 9 (Example 14) 1 No. 10 | (Example 15) No. 11 (Example 16) Comparative 3 (Comparative Example 3): Hardened material 00 〇 Comparison 4 1 Example 24 Example 25 Example 26 Example 27 Comparative Example 8 j 1 ^-^^-^^♦^wy^^^sRl-^-i^ti^^^r^^V^Hav-s-HHSSPJBHV^Hav -* 130806.doc -39 200911886 It can be confirmed from Table 1 that the curable composition No. 1 and No. 3 to 8 which are curable compositions of the present invention are displayed in comparison with the curable composition by 1, 2 Good hardening state. In addition, the cured products 1 to 7 which are obtained as the cured product of the present invention obtained by curing the curable composition No. 1, No. 3 to 8 which are the curable composition of the present invention, are compared with the cured product. It has better specific heat resistance and is also more flexible than the cured product. From this, it is understood that the ruthenium-containing compound of the present invention is characterized in that a ring is introduced into the cyclodecane ring.

氧基可^咼硬化性組合物之硬化性、以及硬化物之财熱 性及可撓性。 又,由硬化物1與硬化物2之比較可確認,藉由對含有矽 之化口物之R、R導入芳香族基,所獲得之硬化物之耐熱 生會進一步提尚。又,由硬化物2與硬化物6之比較可確 %藉由使帛金屬氧化物微粉末,亦可進一步賦予耐熱 性。 由表2可確認,僅藉由熱硬化而使本發明之硬化性电人 物硬化所獲得之硬化物8〜Η,與硬化物比較4相比,㈣ 性及可撓性良好。由此可知,藉由本發明之含有矽之化合 物之特徵即於環石夕g° 及可挽性會提高I中“環氧基,硬化物之耐熱性 之二:硬化物8與硬化物9之比較可確認,藉由對含有石夕 之化合物之Re、Rf^ ^ 性合進一牛接▲方曰族基,所獲得之硬化物之耐熱 厶久由硬化物19與硬化物iq之比較可確 二藉由使用金屬氧化物微粉末,,可進—步賦予耐熱 130806.docThe oxy group can be cured by the hardenability of the curable composition, and the heat and flexibility of the cured product. Further, from the comparison between the cured product 1 and the cured product 2, it was confirmed that the heat resistance of the obtained cured product was further improved by introducing an aromatic group into R and R of the chemical substance containing ruthenium. Further, by comparing the cured product 2 with the cured product 6, it is possible to further impart heat resistance by making the base metal oxide fine powder. From Table 2, it was confirmed that the cured product 8 to Η obtained by curing only the curable electric human body of the present invention by thermal curing is superior to the cured product 4 in terms of (four) properties and flexibility. From this, it is understood that the compound containing ruthenium according to the present invention is characterized in that it has an increase in the heat resistance of the epoxy group and the hardened material in the case of the ring-like compound and the pullability of the compound: the cured product 8 and the cured product 9 It can be confirmed that the heat resistance of the cured product obtained by the combination of the Re and Rf^^ of the compound containing the compound of Shishi is improved by the comparison between the cured product 19 and the hardened material iq. 2. By using metal oxide fine powder, it can be further imparted with heat resistance 130806.doc

Claims (1)

200911886 十、申請專利範圍: 1 · 一種含有矽之化合物,其係以下述通式(0)所表示 [化 1] ^200911886 X. Patent application scope: 1 · A compound containing ruthenium, which is represented by the following general formula (0) [Chemical 1] ^ 之飽和脂肪族烴基、或可以飽和脂肪族烴基取代之碳原 子數為6〜12之芳香族煙基;γ為碳原子數為2〜4之伸炫 基’ Z為以下述式(2)〜(6)中之任一者所表示之美. [化2] ? 〇 〇 ~fCHrCH-)rXi-CHrCH-CH2 (2) —CHfCHr^-cil-CH,⑶a saturated aliphatic hydrocarbon group or an aromatic smoky group having 6 to 12 carbon atoms which may be substituted with a saturated aliphatic hydrocarbon group; γ is a condensing group having a carbon number of 2 to 4, and Z is represented by the following formula (2)~ (6) The beauty expressed by any of them. [Chemical 2] ? 〇〇~fCHrCH-)rXi-CHrCH-CH2 (2) —CHfCHr^-cil-CH, (3) (式中,Xa~Xe表示亞甲基可以氧原子及/或酯鍵取代的碳 原子數為1〜8之烷二基、-COO-或單鍵;Rh〜“表示氮原 子或曱基;r表示0或1); K為2〜7之數’ T為1〜7之數,以T為重複數之聚合部分與 以K-T為重複數之聚合部分既可為嵌段狀亦可為隨機 狀;P為0〜3之數;Μ及N為N : M=1 : 1〜1 : 1〇〇、且所有 Μ與所有N之合計值為15以上之數,且係使以通式表 示之含有矽之化合物的質量平均分子量為3000〜1〇〇萬之 數;又,以Μ為重複數之聚合部分與以Ν為重複數之聚 130806.doc 200911886 合部分既可為嵌段狀亦可為隨機狀)。 2. 一種含有矽之化合物,其係以下述通式(1)所表示者. [化3] _”nH. -Si+R* ) 4-p (式中,Ra〜Rg既可相同亦可不同,其係碳原子數為1〜I? 之飽和脂肪族烴基、或可以飽和脂肪族烴基取代的碳原 子數為6〜丨2之芳香族烴基;Y為碳原子數為2〜4之=烷 基,Ζ為與上述通式(0)相同之基,]&lt;為2〜7之 疋 P 1 〜4 3. 4. 之數;m及 η為 n : m=l : η : 1〇〇、且 m+n^i5之數, 係使以通式(1)表示之含有矽之化合物的質量平均八j 為3_〜100萬之數;又,以m為重複數之聚合部分刀座子量 為重複數之$合部分既可為嵌段狀亦可為隨機狀):、n 如請求項1或2之含有矽之化合物’其中…及“為。、 和脂肪族烴基取代的碳原子數為6〜12之芳香族炉^ U飽 -種硬化性組合物’其係相對於1〇〇質量份之如 至3中任一項之含有矽之化合物、 明永項1 3有0.01〜2〇質晋々、 環氧硬化性化合物者。 只里1¾之 5. 一種硬化性組合物,其係相對於1〇〇 只里切之士口含主+、 至3中任一項之含有石夕之化合物、含有ο.ομοΛ 1 環氧硬化性化合物及1〜50質ΙΑ夕e 貝里份之 貝里伤之環氧化合物者。 6·如請求項4或5之硬化性組合物, &quot;進一步含有1〜1000質 130806.doc 200911886 量份之金屬氧化物微粉末。 7. 一種硬化物,其係使如請求項4至6中任一項之硬化性組 合物硬化而成者。 f \ 130806.doc 200911886 七、指定代表圖·· (一) 本案指定代表圖為:(無) (二) 本代表圖之元件符號簡單說明: 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式:(wherein, Xa to Xe represents an alkylene group having 1 to 8 carbon atoms which may be substituted by an oxygen atom and/or an ester bond, -COO- or a single bond; and Rh~" means a nitrogen atom or a fluorenyl group; r represents 0 or 1); K is a number of 2 to 7 'T is a number from 1 to 7, and the polymerized portion having a repeating number of T and the polymerized portion having a repeating number of KT may be either block-shaped or random. P; P is 0~3; Μ and N are N: M=1: 1~1: 1〇〇, and the total value of all Μ and all N is 15 or more, and is expressed by the formula The mass average molecular weight of the compound containing ruthenium is 3000 to 1 million; in addition, the polymerization portion with Μ as the repeat number and the Ν 重复 repeat number of 130806.doc 200911886 may be blocky or It may be random.) 2. A compound containing ruthenium which is represented by the following formula (1). [Chemical 3] _"nH. -Si+R*) 4-p (wherein, Ra~ Rg may be the same or different, and is a saturated aliphatic hydrocarbon group having a carbon number of 1 to I? or an aromatic hydrocarbon group having 6 to 2 carbon atoms which may be substituted with a saturated aliphatic hydrocarbon group; Y is a carbon number 2 to 4 = alkyl Ζ is the same group as the above formula (0),] &lt; is a number of 〜P 1 ~4 3. 4. of 2 to 7; m and η are n: m=l : η : 1〇〇, and The number of m+n^i5 is such that the mass average VIII of the compound containing hydrazine represented by the general formula (1) is from 3 to 1,000,000; The merging portion of the repeating number may be either block-shaped or random:), n The compound containing the hydrazine of claim 1 or 2, wherein ... and "and", and the aliphatic hydrocarbon group are substituted by a carbon atom 6 to 12 of the aromatic furnace ^ U saturating - the kind of hardening composition - which is 0.01 to 2 tantalum with respect to 1 part by mass of the compound containing yttrium according to any one of 3, Ming Yong item 1 3 Jinci, epoxy hardening compound. Only 5⁄4 of 5. A sclerosing composition, which is related to 1 〇〇 之 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士 士a compound, an epoxy compound containing ο.ομοΛ 1 epoxy hardening compound and 1 to 50 ΙΑ e 贝 贝 贝 贝 。 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 如 如 如 如 如 如 如 如A metal oxide fine powder containing 1 to 1000 masses of 130806.doc 200911886 parts. 7. A cured product obtained by hardening the curable composition according to any one of claims 4 to 6. f \ 130806 .doc 200911886 VII. Designation of Representative Representatives (1) The representative representative of the case is: (none) (2) A brief description of the symbol of the representative figure: 8. If there is a chemical formula in this case, please reveal the best indication of the characteristics of the invention. Chemical formula: —⑵ 一CHj-CHf -CH-CHj —CHfCH-xM^y—(2) A CHj-CHf -CH-CHj —CHfCH-xM^y -α° ⑹ 130806.doc-α° (6) 130806.doc
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CN103936999B (en) 2016-08-17
JP2008266485A (en) 2008-11-06
TWI425028B (en) 2014-02-01
WO2008133228A1 (en) 2008-11-06
KR101526862B1 (en) 2015-06-08
KR20090129990A (en) 2009-12-17
CN103936999A (en) 2014-07-23
CN101616962A (en) 2009-12-30

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