KR101702474B1 - 실리콘을 포함하는 경화성 조성물 및 그 경화물 - Google Patents

실리콘을 포함하는 경화성 조성물 및 그 경화물 Download PDF

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KR101702474B1
KR101702474B1 KR1020157022723A KR20157022723A KR101702474B1 KR 101702474 B1 KR101702474 B1 KR 101702474B1 KR 1020157022723 A KR1020157022723 A KR 1020157022723A KR 20157022723 A KR20157022723 A KR 20157022723A KR 101702474 B1 KR101702474 B1 KR 101702474B1
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South Korea
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silicon
general formula
groups
silicone
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KR20150110710A (ko
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가츠히로 아키야마
유 마츠노
히로시 에구치
가즈히로 야마나카
준야 나카츠지
와타루 가와이
츠요시 오가와
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샌트랄 글래스 컴퍼니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H01L33/56—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
KR1020157022723A 2013-01-25 2014-01-22 실리콘을 포함하는 경화성 조성물 및 그 경화물 Expired - Fee Related KR101702474B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013012062 2013-01-25
JPJP-P-2013-012062 2013-01-25
JP2014008423A JP6213257B2 (ja) 2013-01-25 2014-01-21 シリコーンを含む硬化性組成物およびその硬化物
JPJP-P-2014-008423 2014-01-21
PCT/JP2014/051183 WO2014115742A1 (ja) 2013-01-25 2014-01-22 シリコーンを含む硬化性組成物およびその硬化物

Publications (2)

Publication Number Publication Date
KR20150110710A KR20150110710A (ko) 2015-10-02
KR101702474B1 true KR101702474B1 (ko) 2017-02-03

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KR1020157022723A Expired - Fee Related KR101702474B1 (ko) 2013-01-25 2014-01-22 실리콘을 포함하는 경화성 조성물 및 그 경화물

Country Status (6)

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US (1) US9512272B2 (enExample)
JP (1) JP6213257B2 (enExample)
KR (1) KR101702474B1 (enExample)
CN (1) CN104955900B (enExample)
TW (1) TWI482818B (enExample)
WO (1) WO2014115742A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016013421A1 (ja) * 2014-07-24 2016-01-28 セントラル硝子株式会社 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置
WO2016190207A1 (ja) * 2015-05-28 2016-12-01 住友化学株式会社 Ｌｅｄデバイス、ｌｅｄモジュール及び紫外線発光装置
PL3336129T3 (pl) * 2016-12-16 2021-09-20 Henkel Ag & Co. Kgaa Sposób wytwarzania polisiloksanów funkcjonalizowanych grupami hydroksylowymi
EP3837304B1 (de) * 2018-08-17 2021-11-24 Wacker Chemie AG Vernetzbare organosiloxan-zusammensetzungen
JP2020143206A (ja) * 2019-03-06 2020-09-10 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物
JP2023127627A (ja) * 2022-03-02 2023-09-14 凸版印刷株式会社 表示装置用基板及び画像表示装置
WO2025033375A1 (ja) * 2023-08-07 2025-02-13 株式会社レゾナック パワー半導体装置用封止用材料、封止材、及びパワー半導体装置
CN117402360B (zh) * 2023-12-15 2024-05-07 荣耀终端有限公司 聚硅氧烷、硬化层组合物、显示模组保护膜、显示模组、显示面板及电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001002922A (ja) 1999-06-21 2001-01-09 Shin Etsu Chem Co Ltd 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置
JP2009062446A (ja) 2007-09-06 2009-03-26 Momentive Performance Materials Japan Kk 硬化性シリコーン組成物
JP2012129315A (ja) 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012129316A (ja) 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3482115B2 (ja) 1997-10-13 2003-12-22 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物および電子部品
DE19808117A1 (de) * 1998-02-26 1999-09-09 Wacker Chemie Gmbh RTV-2 Siliconschäume mit niedrigem Druckverformungsrest
JP4646496B2 (ja) * 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP5132027B2 (ja) 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP2009215345A (ja) 2008-03-07 2009-09-24 Central Glass Co Ltd 熱硬化性有機無機ハイブリッド透明封止材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001002922A (ja) 1999-06-21 2001-01-09 Shin Etsu Chem Co Ltd 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置
JP2009062446A (ja) 2007-09-06 2009-03-26 Momentive Performance Materials Japan Kk 硬化性シリコーン組成物
JP2012129315A (ja) 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置
JP2012129316A (ja) 2010-12-14 2012-07-05 Sekisui Chem Co Ltd 光半導体装置用封止剤及びそれを用いた光半導体装置

Also Published As

Publication number Publication date
CN104955900A (zh) 2015-09-30
US9512272B2 (en) 2016-12-06
WO2014115742A1 (ja) 2014-07-31
KR20150110710A (ko) 2015-10-02
JP2014159561A (ja) 2014-09-04
TWI482818B (zh) 2015-05-01
US20150322211A1 (en) 2015-11-12
TW201434985A (zh) 2014-09-16
CN104955900B (zh) 2017-03-15
JP6213257B2 (ja) 2017-10-18

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