JP6213257B2 - シリコーンを含む硬化性組成物およびその硬化物 - Google Patents

シリコーンを含む硬化性組成物およびその硬化物 Download PDF

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Publication number
JP6213257B2
JP6213257B2 JP2014008423A JP2014008423A JP6213257B2 JP 6213257 B2 JP6213257 B2 JP 6213257B2 JP 2014008423 A JP2014008423 A JP 2014008423A JP 2014008423 A JP2014008423 A JP 2014008423A JP 6213257 B2 JP6213257 B2 JP 6213257B2
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group
silicone
general formula
carbon atoms
groups
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Japanese (ja)
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JP2014159561A5 (enExample
JP2014159561A (ja
Inventor
勝宏 秋山
勝宏 秋山
惇也 中辻
惇也 中辻
佑 松野
佑 松野
亘 河合
亘 河合
弘 江口
弘 江口
毅 小川
毅 小川
山中　一広
一広 山中
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Central Glass Co Ltd
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Central Glass Co Ltd
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Priority to JP2014008423A priority Critical patent/JP6213257B2/ja
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority to US14/761,763 priority patent/US9512272B2/en
Priority to PCT/JP2014/051183 priority patent/WO2014115742A1/ja
Priority to CN201480005966.2A priority patent/CN104955900B/zh
Priority to KR1020157022723A priority patent/KR101702474B1/ko
Priority to TW103102780A priority patent/TWI482818B/zh
Publication of JP2014159561A publication Critical patent/JP2014159561A/ja
Publication of JP2014159561A5 publication Critical patent/JP2014159561A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
JP2014008423A 2013-01-25 2014-01-21 シリコーンを含む硬化性組成物およびその硬化物 Active JP6213257B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2014008423A JP6213257B2 (ja) 2013-01-25 2014-01-21 シリコーンを含む硬化性組成物およびその硬化物
PCT/JP2014/051183 WO2014115742A1 (ja) 2013-01-25 2014-01-22 シリコーンを含む硬化性組成物およびその硬化物
CN201480005966.2A CN104955900B (zh) 2013-01-25 2014-01-22 包含聚硅氧烷的固化性组合物及其固化物
KR1020157022723A KR101702474B1 (ko) 2013-01-25 2014-01-22 실리콘을 포함하는 경화성 조성물 및 그 경화물
US14/761,763 US9512272B2 (en) 2013-01-25 2014-01-22 Curable composition containing silicone, and cured product thereof
TW103102780A TWI482818B (zh) 2013-01-25 2014-01-24 A hardening composition containing silicon oxide and a hardened product thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013012062 2013-01-25
JP2013012062 2013-01-25
JP2014008423A JP6213257B2 (ja) 2013-01-25 2014-01-21 シリコーンを含む硬化性組成物およびその硬化物

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JP2014159561A JP2014159561A (ja) 2014-09-04
JP2014159561A5 JP2014159561A5 (enExample) 2015-09-03
JP6213257B2 true JP6213257B2 (ja) 2017-10-18

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US (1) US9512272B2 (enExample)
JP (1) JP6213257B2 (enExample)
KR (1) KR101702474B1 (enExample)
CN (1) CN104955900B (enExample)
TW (1) TWI482818B (enExample)
WO (1) WO2014115742A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016013421A1 (ja) * 2014-07-24 2016-01-28 セントラル硝子株式会社 硬化性シリコーン樹脂組成物およびその硬化物、並びにこれらを用いた光半導体装置
EP3306682A4 (en) * 2015-05-28 2019-03-20 Sumitomo Chemical Company Limited LED DEVICE, LED MODULE AND ULTRAVIOLETTES LIGHT EMITTING DEVICE
ES2865325T3 (es) * 2016-12-16 2021-10-15 Henkel Ag & Co Kgaa Proceso para la preparación de polisiloxanos que tienen grupos funcionales hidroxilo
JP7203196B2 (ja) * 2018-08-17 2023-01-12 ワッカー ケミー アクチエンゲゼルシャフト 架橋性オルガノシロキサン組成物
JP2020143206A (ja) * 2019-03-06 2020-09-10 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物
JP2023127627A (ja) * 2022-03-02 2023-09-14 凸版印刷株式会社 表示装置用基板及び画像表示装置
WO2025033375A1 (ja) * 2023-08-07 2025-02-13 株式会社レゾナック パワー半導体装置用封止用材料、封止材、及びパワー半導体装置
CN117402360B (zh) * 2023-12-15 2024-05-07 荣耀终端有限公司 聚硅氧烷、硬化层组合物、显示模组保护膜、显示模组、显示面板及电子设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3482115B2 (ja) 1997-10-13 2003-12-22 東レ・ダウコーニング・シリコーン株式会社 硬化性シリコーン組成物および電子部品
DE19808117A1 (de) * 1998-02-26 1999-09-09 Wacker Chemie Gmbh RTV-2 Siliconschäume mit niedrigem Druckverformungsrest
JP3595731B2 (ja) * 1999-06-21 2004-12-02 信越化学工業株式会社 半導体装置封止用付加硬化型シリコーン組成物及び半導体装置
JP4646496B2 (ja) * 2003-02-13 2011-03-09 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP5132027B2 (ja) 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP2006063092A (ja) * 2004-07-29 2006-03-09 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物、その硬化方法、光半導体装置および接着促進剤
JP2009062446A (ja) * 2007-09-06 2009-03-26 Momentive Performance Materials Japan Kk 硬化性シリコーン組成物
JP2009215345A (ja) 2008-03-07 2009-09-24 Central Glass Co Ltd 熱硬化性有機無機ハイブリッド透明封止材
JP5323038B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5323037B2 (ja) * 2010-12-14 2013-10-23 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置

Also Published As

Publication number Publication date
CN104955900B (zh) 2017-03-15
WO2014115742A1 (ja) 2014-07-31
JP2014159561A (ja) 2014-09-04
CN104955900A (zh) 2015-09-30
US9512272B2 (en) 2016-12-06
KR20150110710A (ko) 2015-10-02
TWI482818B (zh) 2015-05-01
TW201434985A (zh) 2014-09-16
US20150322211A1 (en) 2015-11-12
KR101702474B1 (ko) 2017-02-03

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