TWI481637B - 含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物 - Google Patents
含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物 Download PDFInfo
- Publication number
- TWI481637B TWI481637B TW097150834A TW97150834A TWI481637B TW I481637 B TWI481637 B TW I481637B TW 097150834 A TW097150834 A TW 097150834A TW 97150834 A TW97150834 A TW 97150834A TW I481637 B TWI481637 B TW I481637B
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- Prior art keywords
- epoxy resin
- phosphorus
- formula
- compound represented
- weight
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007292094 | 2007-11-09 | ||
JP2008023014 | 2008-02-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201024331A TW201024331A (en) | 2010-07-01 |
TWI481637B true TWI481637B (zh) | 2015-04-21 |
Family
ID=40625868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097150834A TWI481637B (zh) | 2007-11-09 | 2008-12-26 | 含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5632163B2 (ja) |
CN (1) | CN101883806B (ja) |
MY (1) | MY157363A (ja) |
TW (1) | TWI481637B (ja) |
WO (1) | WO2009060987A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5388518B2 (ja) | 2008-09-16 | 2014-01-15 | 新日鉄住金化学株式会社 | リン含有フェノール化合物およびその製造方法、該化合物を用いた硬化性樹脂組成物および硬化物 |
JP5686512B2 (ja) * | 2009-11-05 | 2015-03-18 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物 |
TW201122014A (en) * | 2009-12-25 | 2011-07-01 | Nippon Steel Chemical Co | Epoxy resin, epoxy resin composition and cured article thereof |
JP5544184B2 (ja) * | 2010-02-08 | 2014-07-09 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物 |
TW201219438A (en) * | 2010-08-26 | 2012-05-16 | Nippon Steel Chemical Co | providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity |
CN102757547B (zh) * | 2011-04-27 | 2016-07-06 | 新日铁住金化学株式会社 | 含磷和氮的环氧树脂 |
JP5947504B2 (ja) * | 2011-08-23 | 2016-07-06 | 三光株式会社 | 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法 |
WO2013187184A1 (ja) * | 2012-06-15 | 2013-12-19 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂及び該エポキシ樹脂を必須成分とする組成物、硬化物 |
CN104356360B (zh) * | 2014-11-06 | 2017-06-30 | 济南圣泉集团股份有限公司 | 高Tg无卤阻燃环氧树脂的制备方法 |
WO2018180267A1 (ja) | 2017-03-29 | 2018-10-04 | 新日鉄住金化学株式会社 | リン含有フェノール化合物、リン含有エポキシ樹脂、その硬化性樹脂組成物又はエポキシ樹脂組成物及びその硬化物 |
CN107383337A (zh) * | 2017-07-31 | 2017-11-24 | 镇江利德尔复合材料有限公司 | 一种无卤素阻燃乙烯基酯树脂及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1167417A1 (en) * | 1999-01-28 | 2002-01-02 | Takeda Chemical Industries, Ltd. | Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof |
JP2002249540A (ja) * | 2001-02-23 | 2002-09-06 | Toto Kasei Co Ltd | リン含有エポキシ樹脂組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60126293A (ja) * | 1983-12-09 | 1985-07-05 | Sanko Kaihatsu Kagaku Kenkyusho:Kk | 環状有機りん化合物及びその製造方法 |
JPS61236787A (ja) * | 1985-04-15 | 1986-10-22 | Sanko Kagaku Kk | 環状有機りん化合物及びその製法 |
JPH0631276B2 (ja) * | 1992-09-11 | 1994-04-27 | 三光化学株式会社 | 有機環状りん化合物及びその製造法 |
JP3642403B2 (ja) * | 1999-02-23 | 2005-04-27 | 大日本インキ化学工業株式会社 | 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法 |
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2008
- 2008-11-06 JP JP2009540114A patent/JP5632163B2/ja active Active
- 2008-11-06 CN CN2008801152610A patent/CN101883806B/zh active Active
- 2008-11-06 WO PCT/JP2008/070622 patent/WO2009060987A1/ja active Application Filing
- 2008-11-06 MY MYPI2010002027A patent/MY157363A/en unknown
- 2008-12-26 TW TW097150834A patent/TWI481637B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1167417A1 (en) * | 1999-01-28 | 2002-01-02 | Takeda Chemical Industries, Ltd. | Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof |
JP2002249540A (ja) * | 2001-02-23 | 2002-09-06 | Toto Kasei Co Ltd | リン含有エポキシ樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
CN101883806B (zh) | 2013-08-14 |
WO2009060987A1 (ja) | 2009-05-14 |
TW201024331A (en) | 2010-07-01 |
JP5632163B2 (ja) | 2014-11-26 |
JPWO2009060987A1 (ja) | 2011-03-24 |
CN101883806A (zh) | 2010-11-10 |
MY157363A (en) | 2016-05-31 |
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