TWI481637B - 含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物 - Google Patents

含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物 Download PDF

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Publication number
TWI481637B
TWI481637B TW097150834A TW97150834A TWI481637B TW I481637 B TWI481637 B TW I481637B TW 097150834 A TW097150834 A TW 097150834A TW 97150834 A TW97150834 A TW 97150834A TW I481637 B TWI481637 B TW I481637B
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TW
Taiwan
Prior art keywords
epoxy resin
phosphorus
formula
compound represented
weight
Prior art date
Application number
TW097150834A
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English (en)
Chinese (zh)
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TW201024331A (en
Inventor
Tetsuya Nakanishi
Kazuo Ishihara
Original Assignee
Nippon Steel & Sumikin Chem Co
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Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW201024331A publication Critical patent/TW201024331A/zh
Application granted granted Critical
Publication of TWI481637B publication Critical patent/TWI481637B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW097150834A 2007-11-09 2008-12-26 含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物 TWI481637B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292094 2007-11-09
JP2008023014 2008-02-01

Publications (2)

Publication Number Publication Date
TW201024331A TW201024331A (en) 2010-07-01
TWI481637B true TWI481637B (zh) 2015-04-21

Family

ID=40625868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097150834A TWI481637B (zh) 2007-11-09 2008-12-26 含有磷之環氧樹脂及含有磷之環氧樹脂組成物、其製造方法與使用該樹脂及該樹脂組成物之硬化性樹脂組成物及硬化物

Country Status (5)

Country Link
JP (1) JP5632163B2 (ja)
CN (1) CN101883806B (ja)
MY (1) MY157363A (ja)
TW (1) TWI481637B (ja)
WO (1) WO2009060987A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5388518B2 (ja) 2008-09-16 2014-01-15 新日鉄住金化学株式会社 リン含有フェノール化合物およびその製造方法、該化合物を用いた硬化性樹脂組成物および硬化物
JP5686512B2 (ja) * 2009-11-05 2015-03-18 新日鉄住金化学株式会社 リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物
TW201122014A (en) * 2009-12-25 2011-07-01 Nippon Steel Chemical Co Epoxy resin, epoxy resin composition and cured article thereof
JP5544184B2 (ja) * 2010-02-08 2014-07-09 新日鉄住金化学株式会社 リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物
TW201219438A (en) * 2010-08-26 2012-05-16 Nippon Steel Chemical Co providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity
CN102757547B (zh) * 2011-04-27 2016-07-06 新日铁住金化学株式会社 含磷和氮的环氧树脂
JP5947504B2 (ja) * 2011-08-23 2016-07-06 三光株式会社 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法
SG11201408343TA (en) * 2012-06-15 2015-01-29 Nippon Steel & Sumikin Chem Co Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product
CN104356360B (zh) * 2014-11-06 2017-06-30 济南圣泉集团股份有限公司 高Tg无卤阻燃环氧树脂的制备方法
WO2018180267A1 (ja) 2017-03-29 2018-10-04 新日鉄住金化学株式会社 リン含有フェノール化合物、リン含有エポキシ樹脂、その硬化性樹脂組成物又はエポキシ樹脂組成物及びその硬化物
CN107383337A (zh) * 2017-07-31 2017-11-24 镇江利德尔复合材料有限公司 一种无卤素阻燃乙烯基酯树脂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1167417A1 (en) * 1999-01-28 2002-01-02 Takeda Chemical Industries, Ltd. Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof
JP2002249540A (ja) * 2001-02-23 2002-09-06 Toto Kasei Co Ltd リン含有エポキシ樹脂組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126293A (ja) * 1983-12-09 1985-07-05 Sanko Kaihatsu Kagaku Kenkyusho:Kk 環状有機りん化合物及びその製造方法
JPS61236787A (ja) * 1985-04-15 1986-10-22 Sanko Kagaku Kk 環状有機りん化合物及びその製法
JPH0631276B2 (ja) * 1992-09-11 1994-04-27 三光化学株式会社 有機環状りん化合物及びその製造法
JP3642403B2 (ja) * 1999-02-23 2005-04-27 大日本インキ化学工業株式会社 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1167417A1 (en) * 1999-01-28 2002-01-02 Takeda Chemical Industries, Ltd. Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof
JP2002249540A (ja) * 2001-02-23 2002-09-06 Toto Kasei Co Ltd リン含有エポキシ樹脂組成物

Also Published As

Publication number Publication date
MY157363A (en) 2016-05-31
CN101883806B (zh) 2013-08-14
WO2009060987A1 (ja) 2009-05-14
TW201024331A (en) 2010-07-01
JP5632163B2 (ja) 2014-11-26
CN101883806A (zh) 2010-11-10
JPWO2009060987A1 (ja) 2011-03-24

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