MY157363A - Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition - Google Patents

Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition

Info

Publication number
MY157363A
MY157363A MYPI2010002027A MYPI20102027A MY157363A MY 157363 A MY157363 A MY 157363A MY PI2010002027 A MYPI2010002027 A MY PI2010002027A MY PI20102027 A MYPI20102027 A MY PI20102027A MY 157363 A MY157363 A MY 157363A
Authority
MY
Malaysia
Prior art keywords
resin composition
resin
phosphorus
general formula
epoxy resin
Prior art date
Application number
MYPI2010002027A
Other languages
English (en)
Inventor
Nakanishi Tetsuya
Ishihara Kazuo
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of MY157363A publication Critical patent/MY157363A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
MYPI2010002027A 2007-11-09 2008-11-06 Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition MY157363A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292094 2007-11-09
JP2008023014 2008-02-01

Publications (1)

Publication Number Publication Date
MY157363A true MY157363A (en) 2016-05-31

Family

ID=40625868

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010002027A MY157363A (en) 2007-11-09 2008-11-06 Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition

Country Status (5)

Country Link
JP (1) JP5632163B2 (ja)
CN (1) CN101883806B (ja)
MY (1) MY157363A (ja)
TW (1) TWI481637B (ja)
WO (1) WO2009060987A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5388518B2 (ja) * 2008-09-16 2014-01-15 新日鉄住金化学株式会社 リン含有フェノール化合物およびその製造方法、該化合物を用いた硬化性樹脂組成物および硬化物
JP5686512B2 (ja) * 2009-11-05 2015-03-18 新日鉄住金化学株式会社 リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物
TW201122014A (en) * 2009-12-25 2011-07-01 Nippon Steel Chemical Co Epoxy resin, epoxy resin composition and cured article thereof
JP5544184B2 (ja) * 2010-02-08 2014-07-09 新日鉄住金化学株式会社 リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物
TW201219438A (en) * 2010-08-26 2012-05-16 Nippon Steel Chemical Co providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity
CN102757547B (zh) * 2011-04-27 2016-07-06 新日铁住金化学株式会社 含磷和氮的环氧树脂
JP5947504B2 (ja) * 2011-08-23 2016-07-06 三光株式会社 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法
SG11201408343TA (en) * 2012-06-15 2015-01-29 Nippon Steel & Sumikin Chem Co Phosphorus-containing epoxy resin, composition containing phosphorus-containing epoxy resin as essential component, and cured product
CN104356360B (zh) * 2014-11-06 2017-06-30 济南圣泉集团股份有限公司 高Tg无卤阻燃环氧树脂的制备方法
WO2018180267A1 (ja) 2017-03-29 2018-10-04 新日鉄住金化学株式会社 リン含有フェノール化合物、リン含有エポキシ樹脂、その硬化性樹脂組成物又はエポキシ樹脂組成物及びその硬化物
CN107383337A (zh) * 2017-07-31 2017-11-24 镇江利德尔复合材料有限公司 一种无卤素阻燃乙烯基酯树脂及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126293A (ja) * 1983-12-09 1985-07-05 Sanko Kaihatsu Kagaku Kenkyusho:Kk 環状有機りん化合物及びその製造方法
JPS61236787A (ja) * 1985-04-15 1986-10-22 Sanko Kagaku Kk 環状有機りん化合物及びその製法
JPH0631276B2 (ja) * 1992-09-11 1994-04-27 三光化学株式会社 有機環状りん化合物及びその製造法
EP1167417A4 (en) * 1999-01-28 2002-11-06 Takeda Chemical Industries Ltd FLAME-RESISTANT VINYL ESTERS, RESINS AND RESIN COMPOSITIONS THEREOF AND CURED PRODUCTS BASED ON THEM
JP3642403B2 (ja) * 1999-02-23 2005-04-27 大日本インキ化学工業株式会社 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法
JP4837175B2 (ja) * 2001-02-23 2011-12-14 新日鐵化学株式会社 リン含有エポキシ樹脂組成物

Also Published As

Publication number Publication date
CN101883806B (zh) 2013-08-14
JPWO2009060987A1 (ja) 2011-03-24
CN101883806A (zh) 2010-11-10
TW201024331A (en) 2010-07-01
JP5632163B2 (ja) 2014-11-26
WO2009060987A1 (ja) 2009-05-14
TWI481637B (zh) 2015-04-21

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