MY157363A - Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition - Google Patents
Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin compositionInfo
- Publication number
- MY157363A MY157363A MYPI2010002027A MYPI20102027A MY157363A MY 157363 A MY157363 A MY 157363A MY PI2010002027 A MYPI2010002027 A MY PI2010002027A MY PI20102027 A MYPI20102027 A MY PI20102027A MY 157363 A MY157363 A MY 157363A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- resin
- phosphorus
- general formula
- epoxy resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007292094 | 2007-11-09 | ||
JP2008023014 | 2008-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY157363A true MY157363A (en) | 2016-05-31 |
Family
ID=40625868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2010002027A MY157363A (en) | 2007-11-09 | 2008-11-06 | Phosphorus containing epoxy resin and phosphorus containing eppxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and resin composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5632163B2 (ja) |
CN (1) | CN101883806B (ja) |
MY (1) | MY157363A (ja) |
TW (1) | TWI481637B (ja) |
WO (1) | WO2009060987A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5388518B2 (ja) * | 2008-09-16 | 2014-01-15 | 新日鉄住金化学株式会社 | リン含有フェノール化合物およびその製造方法、該化合物を用いた硬化性樹脂組成物および硬化物 |
JP5686512B2 (ja) * | 2009-11-05 | 2015-03-18 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物 |
TW201122014A (en) * | 2009-12-25 | 2011-07-01 | Nippon Steel Chemical Co | Epoxy resin, epoxy resin composition and cured article thereof |
JP5544184B2 (ja) * | 2010-02-08 | 2014-07-09 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物 |
TW201219438A (en) * | 2010-08-26 | 2012-05-16 | Nippon Steel Chemical Co | providing an epoxy resin cured article capable of giving excellent high thermal decomposition stability, high heat tolerance, low thermal expansibility, flame retardancy, and low hygroscopicity |
CN102757547B (zh) * | 2011-04-27 | 2016-07-06 | 新日铁住金化学株式会社 | 含磷和氮的环氧树脂 |
JP5947504B2 (ja) * | 2011-08-23 | 2016-07-06 | 三光株式会社 | 高融点難燃剤結晶の製造方法、該難燃剤含有エポキシ樹脂組成物の製造方法、該組成物を用いたプリプレグ及び難燃性積層板の製造方法 |
CN104379626B (zh) * | 2012-06-15 | 2019-03-22 | 日铁化学材料株式会社 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
CN104356360B (zh) * | 2014-11-06 | 2017-06-30 | 济南圣泉集团股份有限公司 | 高Tg无卤阻燃环氧树脂的制备方法 |
CN110520433B (zh) | 2017-03-29 | 2023-12-05 | 日铁化学材料株式会社 | 含磷酚化合物、含磷环氧树脂、其固化性树脂组合物或环氧树脂组合物及其固化物 |
CN107383337A (zh) * | 2017-07-31 | 2017-11-24 | 镇江利德尔复合材料有限公司 | 一种无卤素阻燃乙烯基酯树脂及其制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60126293A (ja) * | 1983-12-09 | 1985-07-05 | Sanko Kaihatsu Kagaku Kenkyusho:Kk | 環状有機りん化合物及びその製造方法 |
JPS61236787A (ja) * | 1985-04-15 | 1986-10-22 | Sanko Kagaku Kk | 環状有機りん化合物及びその製法 |
JPH0631276B2 (ja) * | 1992-09-11 | 1994-04-27 | 三光化学株式会社 | 有機環状りん化合物及びその製造法 |
WO2000044805A1 (fr) * | 1999-01-28 | 2000-08-03 | Takeda Chemical Industries, Ltd. | Vinylesters retardateurs de flamme, resines et compositions de resines contenant lesdits vinylesters, et produits durcis obtenus a partir de ceux-ci |
JP3642403B2 (ja) * | 1999-02-23 | 2005-04-27 | 大日本インキ化学工業株式会社 | 難燃性エポキシ樹脂組成物及び難燃性エポキシ樹脂の製造方法 |
JP4837175B2 (ja) * | 2001-02-23 | 2011-12-14 | 新日鐵化学株式会社 | リン含有エポキシ樹脂組成物 |
-
2008
- 2008-11-06 WO PCT/JP2008/070622 patent/WO2009060987A1/ja active Application Filing
- 2008-11-06 MY MYPI2010002027A patent/MY157363A/en unknown
- 2008-11-06 JP JP2009540114A patent/JP5632163B2/ja active Active
- 2008-11-06 CN CN2008801152610A patent/CN101883806B/zh active Active
- 2008-12-26 TW TW097150834A patent/TWI481637B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPWO2009060987A1 (ja) | 2011-03-24 |
CN101883806A (zh) | 2010-11-10 |
JP5632163B2 (ja) | 2014-11-26 |
TW201024331A (en) | 2010-07-01 |
WO2009060987A1 (ja) | 2009-05-14 |
TWI481637B (zh) | 2015-04-21 |
CN101883806B (zh) | 2013-08-14 |
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