JP2016003335A - 熱硬化性エポキシ樹脂組成物、プリプレグおよび積層板 - Google Patents
熱硬化性エポキシ樹脂組成物、プリプレグおよび積層板 Download PDFInfo
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- JP2016003335A JP2016003335A JP2014245841A JP2014245841A JP2016003335A JP 2016003335 A JP2016003335 A JP 2016003335A JP 2014245841 A JP2014245841 A JP 2014245841A JP 2014245841 A JP2014245841 A JP 2014245841A JP 2016003335 A JP2016003335 A JP 2016003335A
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- Prior art keywords
- epoxy resin
- weight
- parts
- resin composition
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 89
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 89
- 239000000203 mixture Substances 0.000 title claims abstract description 55
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 21
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims abstract description 36
- 239000011256 inorganic filler Substances 0.000 claims abstract description 27
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 27
- 229910001593 boehmite Inorganic materials 0.000 claims abstract description 15
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 15
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims abstract description 15
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 13
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003063 flame retardant Substances 0.000 claims abstract description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 31
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 12
- 230000001588 bifunctional effect Effects 0.000 claims description 11
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 8
- 125000003277 amino group Chemical group 0.000 claims description 7
- 239000004843 novolac epoxy resin Substances 0.000 claims description 7
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052794 bromium Inorganic materials 0.000 claims description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000012779 reinforcing material Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 4
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 4
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 4
- RIAHASMJDOMQER-UHFFFAOYSA-N 5-ethyl-2-methyl-1h-imidazole Chemical compound CCC1=CN=C(C)N1 RIAHASMJDOMQER-UHFFFAOYSA-N 0.000 claims description 4
- 229930185605 Bisphenol Natural products 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 4
- 150000003512 tertiary amines Chemical class 0.000 claims description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 235000012211 aluminium silicate Nutrition 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010445 mica Substances 0.000 claims description 3
- 229910052618 mica group Inorganic materials 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 239000010456 wollastonite Substances 0.000 claims description 3
- 229910052882 wollastonite Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- QRFTXHFUNIFHST-UHFFFAOYSA-N 4,5,6,7-tetrabromoisoindole-1,3-dione Chemical compound BrC1=C(Br)C(Br)=C2C(=O)NC(=O)C2=C1Br QRFTXHFUNIFHST-UHFFFAOYSA-N 0.000 claims description 2
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 claims description 2
- DHAHRLDIUIPTCJ-UHFFFAOYSA-K aluminium metaphosphate Chemical compound [Al+3].[O-]P(=O)=O.[O-]P(=O)=O.[O-]P(=O)=O DHAHRLDIUIPTCJ-UHFFFAOYSA-K 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical compound OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004305 biphenyl Substances 0.000 claims description 2
- 235000010290 biphenyl Nutrition 0.000 claims description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical group CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical group [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 2
- FJBIAMSKRDWSMM-UHFFFAOYSA-N triazine hydrobromide Chemical compound Br.N1=NN=CC=C1 FJBIAMSKRDWSMM-UHFFFAOYSA-N 0.000 claims description 2
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical group CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- HDXGUOZQUVDYMC-UHFFFAOYSA-N 6h-benzo[c][2,1]benzoxaphosphinine Chemical compound C1=CC=C2OPC3=CC=CC=C3C2=C1 HDXGUOZQUVDYMC-UHFFFAOYSA-N 0.000 claims 1
- BULOCEWDRJUMEL-UHFFFAOYSA-N benzene formaldehyde Chemical compound C=O.C1=CC=CC=C1.C=O BULOCEWDRJUMEL-UHFFFAOYSA-N 0.000 claims 1
- NBLIMNPDWOWGSH-UHFFFAOYSA-N benzene-1,4-diol 6H-benzo[c][2,1]benzoxaphosphinine Chemical compound Oc1ccc(O)cc1.O1Pc2ccccc2-c2ccccc12 NBLIMNPDWOWGSH-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000009477 glass transition Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005553 drilling Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- 230000002411 adverse Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- WXAIEIRYBSKHDP-UHFFFAOYSA-N 4-phenyl-n-(4-phenylphenyl)-n-[4-[4-(4-phenyl-n-(4-phenylphenyl)anilino)phenyl]phenyl]aniline Chemical compound C1=CC=CC=C1C1=CC=C(N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)C=2C=CC=CC=2)C=2C=CC(=CC=2)C=2C=CC=CC=2)C=C1 WXAIEIRYBSKHDP-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- -1 moisture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
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- 239000000356 contaminant Substances 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
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- 239000012760 heat stabilizer Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
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- 239000000314 lubricant Substances 0.000 description 1
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- 238000000691 measurement method Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/60—Amines together with other curing agents with amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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Abstract
【解決手段】エポキシ樹脂100重量部に対し、芳香族ジアミン1〜10重量部、ジシアンジアミド0.5〜2.2重量部、ベーマイト又は/及び硫酸バリウムを含有する無機フィラー30〜200重量部及び硬化促進剤0.05〜1.0重量部からなるエポキシ樹脂組成物、及び該エポキシ樹脂組成物を用いてなるプリプレグ、プリント配線基板。
【選択図】なし
Description
好ましくは、前記有機ホスフィン硬化促進剤はトリブチルホスフィン又は/及びトリフェニルホスフィンである。
本発明のもう一つの目的は少なくとも一枚の前記プリプレグを含む積層板を提供することにある。
(1)本発明の前記熱硬化性エポキシ樹脂組成物はCTI>600Vであり、且つ低吸水性、優れた粘着性及び機械的加工特性を有し、PCBの過酷な環境での適応能力を著しく改善できる。
本発明の熱硬化性エポキシ樹脂組成物を用いて銅張積層板を製造し、そのガラス転移温度、CTI、難燃性、耐ディップソルダリング時間及び孔開け加工等の性能を測定し、下記実施例と比較例のように更に説明する。
(A)エポキシ樹脂:
A1:臭化ビスフェノールA型エポキシ樹脂(DER530A80、エポキシ当量430g/eq、米国DOW化学社製)、
A2:リン含有エポキシ樹脂(YEP−250、エポキシ当量325g/eq、広山化学工業公司製)、
A3:ビスフェノールA型ノボラックエポキシ樹脂(EPR627、エポキシ当量210g/eq、米国Momentive化学社製)。
B1:4,4’−ジアミンジフェニルスルホン
B2:4,4’−ジアミンジフェニルエーテル
B3:4,4’−メチレンビス(2−メチル−6−エチルアニリン)
B4:3,3'−ジクロロ−4,4'−ジアミノジフェニルメタン
B5:ジエチルトルエンジアミン
(C)ジシアンジアミド
(D)硬化促進剤:(2−E−4MI)。
E1:ベーマイト
E2:硫酸バリウム
E3:水酸化アルミニウムE4、アルミナ
(F)溶剤:N,N−ジメチルホルムアミド
ガラス転移温度(Tg)
示差走査熱量法(DSC)に基づき、IPC−TM−650 2.4.25により規定されたDSC方法により測定する。
GB/T 4207−84により規定された方法により測定して、三枚の板を取って測定する。
寸法が100X100mmである両面に銅箔を有する板材を288℃まで加熱したはんだ槽に浸入し、浸入から板材の層間剥離が発生するまでの時間を算出した。
IPC TM−650により規定された方法によって測定した。
厚みが1.6mmである板を二枚積層して、0.3mmのドリルでドリル速度を110krpm、落速を33mm/sとして孔を開け、連続的に5000個の孔を開け、1000個の孔を開ける毎に、ドリル刃先の摩損状況を観察し、摩損程度によって孔開け加工性の良否を決める。
寸法100X100mmの銅箔をエッチングにより除去した板材を用いて、先ず105℃で30min乾燥させ、室温まで冷却した後、重量を量り、重量をw1として、更に2atmの圧力鍋に入れて60min蒸煮し、取り出して板面における水を拭き取り、更に重量を量ってw2とし、吸水率を(w2−w1)/w1で算出する。
UL 94により規定された方法によって測定する。
Claims (10)
- 熱硬化性エポキシ樹脂組成物であって、
重量部でエポキシ樹脂100重量部、芳香族ジアミン1〜10重量部、ジシアンジアミド0.5〜2.2重量部、ベーマイト又は/及び硫酸バリウムを含有する無機フィラー30〜200重量部、硬化促進剤0.05〜1.0重量部を含むことを特徴とする熱硬化性エポキシ樹脂組成物。 - 前記エポキシ樹脂は二官能性エポキシ樹脂又は/及び多官能性エポキシ樹脂であり、
好ましくは、前記二官能性エポキシ樹脂はビスフェノールA型、ビスフェノールF型又はビスフェノールS型構造を含有するエポキシ樹脂の中のいずれか1種又は少なくとも2種の混合物であることを特徴とする請求項1に記載のエポキシ樹脂組成物。 - 前記二官能性エポキシ樹脂のエポキシ当量は300〜520g/eqであり、前記二官能性エポキシ樹脂は好ましくはビスフェノールA型エポキシ樹脂、臭化ビスフェノールA型エポキシ樹脂、二官能性イソシアネートと臭素含有ビスフェノールA型エポキシ樹脂との縮合物、二官能性イソシアネートと臭素を含有していないビスフェノールA型エポキシ樹脂との縮合物、9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレンヒドロキノンとビスフェノールA型エポキシ樹脂との縮合物又は9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレンナフトキノンとビスフェノールA型エポキシ樹脂との縮合物から選ばれるいずれか1種又は少なくとも2種の混合物であり、
好ましくは、前記多官能性エポキシ樹脂は分子中に2つ以上のエポキシ基を有し且つ芳香環構造を持つエポキシ樹脂であり、好ましくはフェノール型ノボラックエポキシ樹脂、o−クレゾール型ノボラックエポキシ樹脂、ビスフェノールA型ノボラックエポキシ樹脂、パラフェノールベンゼンホルムアルデヒドと、フェノールと、o−クレゾールとを酸性触媒で反応させて生成するフェノール樹脂が更にエピクロロヒドリンと反応して生成するノボラックエポキシ樹脂、ビスフェノールAを酸性触媒で反応させて生成するフェノール樹脂が更にエピクロロヒドリンと反応して生成するノボラックエポキシ樹脂、ジシクロペンタジエンエポキシ樹脂、ビフェニルエポキシ樹脂、9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキサイドとノボラックエポキシ樹脂の縮合物又はテトラフェノールエタンとエピクロロヒドリンの縮合物から選ばれるいずれか1種又は少なくとも2種の混合物であることを特徴とする請求項2に記載のエポキシ樹脂組成物。 - ベーマイト又は/及び硫酸バリウムは無機フィラーの全重量の85〜100%を占め、
好ましくは、無機フィラーにベーマイトと硫酸バリウムを含有する場合は、硫酸バリウムが無機フィラー全体に占める重量比率は50%以下であり、
好ましくは、前記無機フィラーは更に水酸化アルミニウム、水酸化マグネシウム、シリカ、ガラスパウダー、カオリン、タルカムパウダー、雲母パウダー、アルミナ、酸化亜鉛、酸化マグネシウム、窒化ホウ素、窒化アルミニウム、炭酸カルシウム又は珪灰石の中のいずれか1種又は少なくとも2種の混合物を含有し、
好ましくは、前記無機フィラーの平均粒子径は0.3〜20μmであり、
好ましくは、ベーマイト又は/及び硫酸バリウムを含有する無機フィラーの含有量は35〜100重量部、好ましくは40〜60重量部であることを特徴とする請求項1〜4のいずれか1項に記載のエポキシ樹脂組成物。 - 前記硬化促進剤はイミダゾール系硬化促進剤、有機ホスフィン硬化促進剤又は第三級アミン硬化促進剤の中のいずれか1種又は少なくとも2種の混合物であり、
好ましくは、前記イミダゾール系硬化促進剤は2−メチルイミダゾール、2−メチル−4−エチルイミダゾール、2−ウンデシルイミダゾール、2−フェニルイミダゾール又は1−シアノエチル−2−エチル−4−メチルイミダゾールの中のいずれか1種又は少なくとも2種の混合物であり、
好ましくは、前記第三級アミン硬化促進剤はベンジルジメチルアミンであり、
好ましくは、前記有機ホスフィン硬化促進剤はトリブチルホスフィン又は/及びトリフェニルホスフィンであることを特徴とする請求項1〜5のいずれか1項に記載のエポキシ樹脂組成物。 - 前記エポキシ樹脂組成物は更に分散剤を含み、
好ましくは、前記分散剤はアミノシランカップリング剤又は/及びエポキシシランカップリング剤であり、
好ましくは、前記分散剤の添加量は無機フィラー重量の0.5〜2%であることを特徴とする請求項1〜6のいずれか1項に記載のエポキシ樹脂組成物。 - 前記エポキシ樹脂組成物は更に非反応型難燃剤を含み、
好ましくは、前記非反応型難燃剤はデカブロモジフェニルエタン、エチル−ビス(テトラブロモフタルイミド)、臭化トリアジン、ホスホニトリル、メタリン酸アルミニウム、リン含有フェノール又はメラミンシアヌレートの中のいずれか1種又は少なくとも2種の混合物であり、
好ましくは、前記非反応型難燃剤の含有量は1〜10重量部であることを特徴とする請求項1〜7のいずれか1項に記載のエポキシ樹脂組成物。 - 強化材及び含浸乾燥後、それに付着した請求項1〜8のいずれか1項に記載の熱硬化性エポキシ樹脂組成物を含むことを特徴とするプリプレグ。
- 少なくとも一枚の請求項9に記載のプリプレグを含むことを特徴とする積層板。
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TWI535777B (zh) | 2016-06-01 |
KR20150143234A (ko) | 2015-12-23 |
KR101811914B1 (ko) | 2017-12-22 |
CN105237949A (zh) | 2016-01-13 |
JP5923590B2 (ja) | 2016-05-24 |
CN105237949B (zh) | 2017-11-03 |
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