TWI478296B - 樹脂密封型半導體裝置 - Google Patents

樹脂密封型半導體裝置 Download PDF

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Publication number
TWI478296B
TWI478296B TW099101642A TW99101642A TWI478296B TW I478296 B TWI478296 B TW I478296B TW 099101642 A TW099101642 A TW 099101642A TW 99101642 A TW99101642 A TW 99101642A TW I478296 B TWI478296 B TW I478296B
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Taiwan
Prior art keywords
semiconductor device
semiconductor element
resin
sealing body
microspheres
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TW099101642A
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English (en)
Chinese (zh)
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TW201036118A (en
Inventor
木村紀幸
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精工電子有限公司
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Publication of TW201036118A publication Critical patent/TW201036118A/zh
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Publication of TWI478296B publication Critical patent/TWI478296B/zh

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    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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CN102786028B (zh) * 2012-07-17 2015-05-06 西南交通大学 一种用于大面积摩擦诱导微/纳米加工的多针尖阵列的制作方法
CN102832141A (zh) * 2012-08-18 2012-12-19 孙青秀 一种基于框架的无载体式封装件的制作工艺
TWM506375U (zh) * 2013-07-03 2015-08-01 羅森伯格高頻技術公司 使用介電質塗層引線的晶粒封裝
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