TWI478296B - 樹脂密封型半導體裝置 - Google Patents

樹脂密封型半導體裝置 Download PDF

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Publication number
TWI478296B
TWI478296B TW099101642A TW99101642A TWI478296B TW I478296 B TWI478296 B TW I478296B TW 099101642 A TW099101642 A TW 099101642A TW 99101642 A TW99101642 A TW 99101642A TW I478296 B TWI478296 B TW I478296B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
semiconductor element
resin
sealing body
microspheres
Prior art date
Application number
TW099101642A
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English (en)
Chinese (zh)
Other versions
TW201036118A (en
Inventor
木村紀幸
Original Assignee
精工電子有限公司
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Publication date
Application filed by 精工電子有限公司 filed Critical 精工電子有限公司
Publication of TW201036118A publication Critical patent/TW201036118A/zh
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Publication of TWI478296B publication Critical patent/TWI478296B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H10W72/07504—Connecting or disconnecting of bond wires using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW099101642A 2009-02-06 2010-01-21 樹脂密封型半導體裝置 TWI478296B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009026507 2009-02-06
JP2009258415A JP5588150B2 (ja) 2009-02-06 2009-11-11 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
TW201036118A TW201036118A (en) 2010-10-01
TWI478296B true TWI478296B (zh) 2015-03-21

Family

ID=42539745

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099101642A TWI478296B (zh) 2009-02-06 2010-01-21 樹脂密封型半導體裝置

Country Status (5)

Country Link
US (2) US8703532B2 (enExample)
JP (1) JP5588150B2 (enExample)
KR (1) KR101665963B1 (enExample)
CN (1) CN101901788B (enExample)
TW (1) TWI478296B (enExample)

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* Cited by examiner, † Cited by third party
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JP5642473B2 (ja) * 2010-09-22 2014-12-17 セイコーインスツル株式会社 Ｂｇａ半導体パッケージおよびその製造方法
CN102786028B (zh) * 2012-07-17 2015-05-06 西南交通大学 一种用于大面积摩擦诱导微/纳米加工的多针尖阵列的制作方法
CN102832141A (zh) * 2012-08-18 2012-12-19 孙青秀 一种基于框架的无载体式封装件的制作工艺
CN105359263B (zh) * 2013-07-03 2018-07-06 罗森伯格高频技术有限及两合公司 包括具有电介质涂层和金属涂层的配线的无衬底裸片封装体及其制造方法
DE102015212177A1 (de) * 2015-06-30 2017-01-05 Osram Gmbh Schaltungsträger für eine elektronische Schaltung und Verfahren zum Herstellen eines derartigen Schaltungsträgers
CN105489509A (zh) * 2015-12-25 2016-04-13 华天科技（西安）有限公司 应用钢网印刷技术优化点胶工艺的光学传感芯片封装方法
CN110517963A (zh) * 2019-09-05 2019-11-29 合肥矽迈微电子科技有限公司 一种环膜结构注塑工艺
CN113874550B (zh) * 2019-09-13 2024-01-30 株式会社力森诺科 层叠体及其制造方法

Citations (3)

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TW200305264A (en) * 2001-09-28 2003-10-16 Mitsubishi Electric Corp Semiconductor device and method of fabricating the same
WO2005060450A2 (en) * 2003-12-09 2005-07-07 Freescale Semiconductor, Inc. Land grid array packaged device and method of forming same
JP2006066521A (ja) * 2004-08-25 2006-03-09 Fujitsu Ltd 半導体装置及び半導体装置の製造方法

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JP3129169B2 (ja) * 1995-11-08 2001-01-29 富士通株式会社 半導体装置及びその製造方法
KR100332378B1 (ko) * 1999-09-11 2002-04-12 이병구 반도체 패키지의 솔더볼 마운팅 방법
JP3823651B2 (ja) * 2000-01-05 2006-09-20 松下電器産業株式会社 樹脂封止型半導体装置の製造方法
JP2001230270A (ja) * 2000-02-14 2001-08-24 Fujitsu Ltd 半導体装置及びその製造方法
JP3626075B2 (ja) 2000-06-20 2005-03-02 九州日立マクセル株式会社 半導体装置の製造方法
US20020033527A1 (en) * 2000-09-19 2002-03-21 Siliconware Precision Industries Co., Ltd. Semiconductor device and manufacturing process thereof
US7297572B2 (en) * 2001-09-07 2007-11-20 Hynix Semiconductor, Inc. Fabrication method for electronic system modules
CN1477703A (zh) * 2002-08-02 2004-02-25 ǧס������ҵ��ʽ���� 焊球组件及其生产方法，形成焊块的方法
JP2004319577A (ja) * 2003-04-11 2004-11-11 Dainippon Printing Co Ltd 樹脂封止型半導体装置とその製造方法、および積層型樹脂封止型半導体装置
JP2005194393A (ja) * 2004-01-07 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
KR20050079399A (ko) * 2004-02-05 2005-08-10 삼성전자주식회사 이방성도전필름 및 범프와, 이를 갖는 반도체 칩의 실장구조체
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Publication number Priority date Publication date Assignee Title
TW200305264A (en) * 2001-09-28 2003-10-16 Mitsubishi Electric Corp Semiconductor device and method of fabricating the same
WO2005060450A2 (en) * 2003-12-09 2005-07-07 Freescale Semiconductor, Inc. Land grid array packaged device and method of forming same
JP2006066521A (ja) * 2004-08-25 2006-03-09 Fujitsu Ltd 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
CN101901788B (zh) 2014-10-29
CN101901788A (zh) 2010-12-01
TW201036118A (en) 2010-10-01
US20140117544A1 (en) 2014-05-01
US9490224B2 (en) 2016-11-08
KR20100090666A (ko) 2010-08-16
US8703532B2 (en) 2014-04-22
JP2010206162A (ja) 2010-09-16
US20100200982A1 (en) 2010-08-12
KR101665963B1 (ko) 2016-10-24
JP5588150B2 (ja) 2014-09-10

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