TWI475119B - Cu-Zn-Sn-Ni-P alloy - Google Patents

Cu-Zn-Sn-Ni-P alloy Download PDF

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Publication number
TWI475119B
TWI475119B TW102105823A TW102105823A TWI475119B TW I475119 B TWI475119 B TW I475119B TW 102105823 A TW102105823 A TW 102105823A TW 102105823 A TW102105823 A TW 102105823A TW I475119 B TWI475119 B TW I475119B
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TW
Taiwan
Prior art keywords
less
grain size
rolling
particles
crystal grain
Prior art date
Application number
TW102105823A
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English (en)
Chinese (zh)
Other versions
TW201348467A (zh
Inventor
Naofumi Maeda
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201348467A publication Critical patent/TW201348467A/zh
Application granted granted Critical
Publication of TWI475119B publication Critical patent/TWI475119B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/04Alloys based on copper with zinc as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
TW102105823A 2012-03-30 2013-02-20 Cu-Zn-Sn-Ni-P alloy TWI475119B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012082974A JP5153949B1 (ja) 2012-03-30 2012-03-30 Cu−Zn−Sn−Ni−P系合金

Publications (2)

Publication Number Publication Date
TW201348467A TW201348467A (zh) 2013-12-01
TWI475119B true TWI475119B (zh) 2015-03-01

Family

ID=47890629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102105823A TWI475119B (zh) 2012-03-30 2013-02-20 Cu-Zn-Sn-Ni-P alloy

Country Status (4)

Country Link
JP (1) JP5153949B1 (ja)
KR (1) KR101573163B1 (ja)
TW (1) TWI475119B (ja)
WO (1) WO2013145350A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014115307A1 (ja) 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
JP5452778B1 (ja) * 2013-01-25 2014-03-26 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
KR20160029033A (ko) * 2013-07-10 2016-03-14 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 박판, 전자·전기 기기용 도전 부품 및 단자
CN105283567B (zh) * 2013-07-10 2017-06-09 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金薄板、电子电气设备用导电元件及端子
JP6218325B2 (ja) * 2014-02-27 2017-10-25 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP5879464B1 (ja) * 2014-09-26 2016-03-08 三菱伸銅株式会社 銅合金板及び銅合金板の製造方法
WO2016047175A1 (ja) * 2014-09-26 2016-03-31 三菱伸銅株式会社 銅合金板及び銅合金板の製造方法
JP2016132816A (ja) * 2015-01-21 2016-07-25 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
CN105420544B (zh) * 2015-12-24 2017-11-17 中色奥博特铜铝业有限公司 一种锡黄铜带及其制备方法
JP6645337B2 (ja) * 2016-04-20 2020-02-14 株式会社オートネットワーク技術研究所 接続端子および接続端子対
JP7266540B2 (ja) 2020-01-14 2023-04-28 株式会社オートネットワーク技術研究所 接続端子

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW490496B (en) * 1998-11-16 2002-06-11 Olin Corp Brass alloy, electrical connector, and process for manufacture of copper alloy strip
US20120049130A1 (en) * 2009-05-19 2012-03-01 Dowa Metaltech Co., Ltd. Copper alloy sheet and method for producing same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3243479B2 (ja) * 1991-05-31 2002-01-07 同和鉱業株式会社 熱交換器用銅基合金
JP3807475B2 (ja) * 1998-07-08 2006-08-09 株式会社神戸製鋼所 端子・コネクタ用銅合金板及びその製造方法
JP4166147B2 (ja) 2003-12-03 2008-10-15 株式会社神戸製鋼所 高強度電気電子部品用銅合金板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW490496B (en) * 1998-11-16 2002-06-11 Olin Corp Brass alloy, electrical connector, and process for manufacture of copper alloy strip
US20120049130A1 (en) * 2009-05-19 2012-03-01 Dowa Metaltech Co., Ltd. Copper alloy sheet and method for producing same

Also Published As

Publication number Publication date
JP5153949B1 (ja) 2013-02-27
JP2013213237A (ja) 2013-10-17
KR20140125877A (ko) 2014-10-29
KR101573163B1 (ko) 2015-12-01
TW201348467A (zh) 2013-12-01
WO2013145350A1 (ja) 2013-10-03

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