TWI461696B - 接觸膜及其製造方法以及探針單元和ｌｃｄ面板檢測裝置 - Google Patents

接觸膜及其製造方法以及探針單元和ｌｃｄ面板檢測裝置 Download PDF

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Publication number
TWI461696B
TWI461696B TW101130095A TW101130095A TWI461696B TW I461696 B TWI461696 B TW I461696B TW 101130095 A TW101130095 A TW 101130095A TW 101130095 A TW101130095 A TW 101130095A TW I461696 B TWI461696 B TW I461696B
Authority
TW
Taiwan
Prior art keywords
film
base film
conductor
bump
hole
Prior art date
Application number
TW101130095A
Other languages
English (en)
Chinese (zh)
Other versions
TW201331586A (zh
Inventor
Kyu-Han Lee
Sung-Moo Chun
Jong-Han Lee
Hwang-Sub Koo
Yong-Goo Lee
Original Assignee
Gigalane Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gigalane Co Ltd filed Critical Gigalane Co Ltd
Publication of TW201331586A publication Critical patent/TW201331586A/zh
Application granted granted Critical
Publication of TWI461696B publication Critical patent/TWI461696B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW101130095A 2011-11-25 2012-08-20 接觸膜及其製造方法以及探針單元和ｌｃｄ面板檢測裝置 TWI461696B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20110124610 2011-11-25
KR1020120062777A KR101215375B1 (ko) 2011-11-25 2012-06-12 컨택트 필름, 상기 컨택트 필름의 제조방법, 프로브 유닛 및 ｌｃｄ 패널 검사장치

Publications (2)

Publication Number Publication Date
TW201331586A TW201331586A (zh) 2013-08-01
TWI461696B true TWI461696B (zh) 2014-11-21

Family

ID=47908231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130095A TWI461696B (zh) 2011-11-25 2012-08-20 接觸膜及其製造方法以及探針單元和ｌｃｄ面板檢測裝置

Country Status (4)

Country Link
JP (1) JP2013113849A (ko)
KR (1) KR101215375B1 (ko)
CN (1) CN103134960B (ko)
TW (1) TWI461696B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572864B (zh) * 2015-05-18 2017-03-01 Gigalane Co Ltd 可固定之探針及探針固定組件

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101279951B1 (ko) * 2013-03-26 2013-07-05 주식회사 기가레인 컨택트 필름 및 그 제조 방법
KR101279952B1 (ko) 2013-03-26 2013-07-05 주식회사 기가레인 멀티레이어 컨택트 필름 및 그 제조 방법
CN104422800B (zh) * 2013-09-09 2017-11-21 宇德曼斯有限公司 用于测试具有微间距阵列的面板的探针单元
KR101490891B1 (ko) 2013-09-09 2015-02-06 주식회사 기가레인 풀컨택검사와 쇼팅바검사가 가능한 패널 검사용 프로브블럭
KR101617234B1 (ko) * 2014-07-09 2016-05-02 임근환 필름 관통형 범프를 형성한 전자부품의 특성 검사용 프로브
IT201700100522A1 (it) * 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
KR101835762B1 (ko) * 2017-09-29 2018-03-07 (주)위드멤스 과전류에 따른 합선이 방지되는 컨택트 필름 및 이의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1233350A (zh) * 1996-08-08 1999-10-27 日东电工株式会社 各向异性导电膜及其制造方法
JPH11295344A (ja) * 1998-04-10 1999-10-29 Toppan Printing Co Ltd 半導体検査治具および半導体検査治具の製造方法
TW200834087A (en) * 2006-12-28 2008-08-16 Renesas Tech Corp Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
JP2009244096A (ja) * 2008-03-31 2009-10-22 Jsr Corp シート状プローブおよびその製造方法
TW201109672A (en) * 2009-05-29 2011-03-16 Renesas Electronics Corp Thin-film probe sheet and method of manufacturing the same, probe card, and semiconductor chip inspection apparatus
KR20110082331A (ko) * 2010-01-11 2011-07-19 (주)유비프리시젼 필름 프로브

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US5160779A (en) * 1989-11-30 1992-11-03 Hoya Corporation Microprobe provided circuit substrate and method for producing the same
JP3198135B2 (ja) * 1991-12-28 2001-08-13 ホーヤ株式会社 回路検査素子における探針付き絶縁性有機樹脂膜の製造方法、絶縁性有機樹脂膜および探針付き回路検査素子
JP4556327B2 (ja) * 2000-12-25 2010-10-06 凸版印刷株式会社 検査治具の製造方法
JP3616031B2 (ja) * 2001-05-10 2005-02-02 富士通株式会社 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置
JP2003017160A (ja) * 2001-07-02 2003-01-17 Shinozaki Seisakusho:Kk バンプ付き薄膜シートの製造方法
JP2003124272A (ja) * 2001-10-18 2003-04-25 Jsr Corp シート状コネクターおよびその製造方法並びにプローブ装置
WO2005111632A1 (ja) * 2004-05-19 2005-11-24 Jsr Corporation シート状プローブおよびその製造方法並びにその応用
JP4584972B2 (ja) * 2007-10-17 2010-11-24 山一電機株式会社 プローブコンタクトの製造方法およびプローブコンタクト

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1233350A (zh) * 1996-08-08 1999-10-27 日东电工株式会社 各向异性导电膜及其制造方法
JPH11295344A (ja) * 1998-04-10 1999-10-29 Toppan Printing Co Ltd 半導体検査治具および半導体検査治具の製造方法
TW200834087A (en) * 2006-12-28 2008-08-16 Renesas Tech Corp Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
JP2009244096A (ja) * 2008-03-31 2009-10-22 Jsr Corp シート状プローブおよびその製造方法
TW201109672A (en) * 2009-05-29 2011-03-16 Renesas Electronics Corp Thin-film probe sheet and method of manufacturing the same, probe card, and semiconductor chip inspection apparatus
KR20110082331A (ko) * 2010-01-11 2011-07-19 (주)유비프리시젼 필름 프로브

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572864B (zh) * 2015-05-18 2017-03-01 Gigalane Co Ltd 可固定之探針及探針固定組件
TWI600908B (zh) * 2015-05-18 2017-10-01 宇德曼斯有限公司 可固定之探針

Also Published As

Publication number Publication date
CN103134960A (zh) 2013-06-05
KR101215375B1 (ko) 2012-12-26
TW201331586A (zh) 2013-08-01
CN103134960B (zh) 2015-09-23
JP2013113849A (ja) 2013-06-10

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