TWI461696B - Contact film, method for generating the film, probe unit and lcd pannel tester - Google Patents
Contact film, method for generating the film, probe unit and lcd pannel tester Download PDFInfo
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- TWI461696B TWI461696B TW101130095A TW101130095A TWI461696B TW I461696 B TWI461696 B TW I461696B TW 101130095 A TW101130095 A TW 101130095A TW 101130095 A TW101130095 A TW 101130095A TW I461696 B TWI461696 B TW I461696B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
本發明涉及接觸膜、所述接觸膜的製造方法、探針單元及LCD面板檢測裝置，特別是凸點的斷面與填充於通孔中的導體的斷面相同的接觸膜，安裝有所述接觸膜的探針單元，使用所述探針單元的LCD面板檢測裝置以及所述接觸膜的製造方法。The present invention relates to a contact film, a method of manufacturing the contact film, a probe unit, and an LCD panel detecting device, and in particular, a contact film having a cross section of a bump and a cross section of a conductor filled in the through hole, A probe unit that contacts a film, an LCD panel detecting device that uses the probe unit, and a method of manufacturing the contact film.
在設有具有多個端子的電氣部件或電子部件的PCB(Printed Circuit Board)的製造過程的最後步驟中，為了防止不良製品的出庫，檢測電子部件之間、電子部件與PCB之間的電連接及電特性。在檢測步驟中使用與所述電子部件和所述PCB電連接的探針，探針成為將作為檢測對象的被檢測物與測定裝置電連接的介質。In the final step of the manufacturing process of a PCB (Printed Circuit Board) provided with electrical or electronic components having a plurality of terminals, in order to prevent the out of the defective product, electrical connection between the electronic components and between the electronic components and the PCB is detected. And electrical characteristics. In the detecting step, a probe electrically connected to the electronic component and the PCB is used, and the probe is a medium that electrically connects the object to be detected to the measuring device.
探針的形態是根據成為檢測物件的電子部件或PCB的形態而決定，普遍使用凸點(bump)，所述凸點不僅與對於檢測的被檢測物的電接觸的可靠性相關，而且還與圖案的微細化、電極的數量、電極與電極之間的間距(pitch)的微小化相關。The shape of the probe is determined according to the form of the electronic component or PCB that becomes the detection object, and bumps are generally used, which are not only related to the reliability of the electrical contact with the detected object, but also The miniaturization of the pattern, the number of electrodes, and the miniaturization of the pitch between the electrodes and the electrodes are related.
特別是，對於檢測LCD面板的電連接和電特性的探針單元，使用在基礎膜上設有凸點的接觸膜。。In particular, for a probe unit that detects electrical connection and electrical characteristics of an LCD panel, a contact film provided with a bump on the base film is used. .
本發明所要解決的技術課題是提供包括形成於基礎膜的通孔和凸點的接觸膜。A technical problem to be solved by the present invention is to provide a contact film including through holes and bumps formed in a base film.
本發明所要解決的另一技術課題是提供使用所述接觸膜的探針單元。Another technical problem to be solved by the present invention is to provide a probe unit using the contact film.
本發明所要解決的又一技術課題是提供使用所述探針單元的LCD面板檢測用裝置。Another technical problem to be solved by the present invention is to provide an LCD panel detecting device using the probe unit.
本發明所要解決的又一技術課題是提供製造所述接觸膜的接觸膜製造方法。Still another technical problem to be solved by the present invention is to provide a method for producing a contact film for manufacturing the contact film.
根據用於實現所述技術課題的本發明的一實施方式的接觸膜包括基礎膜、導體、凸點和導線。所述基礎膜包含多個通孔。所述導體填充在所述通孔中。所述凸點是在所述基礎膜的一面露出的所述導體。所述導線與所述基礎膜的另一面的所述導體電連接。所述凸點的斷面與填充在通孔中的導體的斷面相同。A contact film according to an embodiment of the present invention for achieving the technical problem includes a base film, a conductor, a bump, and a wire. The base film includes a plurality of through holes. The conductor is filled in the through hole. The bump is the conductor exposed on one side of the base film. The wire is electrically connected to the conductor of the other side of the base film. The cross section of the bump is the same as the cross section of the conductor filled in the through hole.
根據用於實現所述另一技術課題的本發明的一實施方式的探針單元安裝有所述接觸膜。The contact film is attached to the probe unit according to an embodiment of the present invention for realizing the above-described another technical problem.
根據用於實現所述又一技術課題的本發明一實施方式的LCD面板檢測裝置利用所述探針單元。The probe unit is used in accordance with an LCD panel detecting device according to an embodiment of the present invention for realizing the above-described further technical problem.
根據用於實現所述又一技術課題的本發明的一方面的接觸膜製造方法包括：通孔形成步驟、導體填充步驟和凸點形成步驟。所述通孔形成步驟中，在基礎膜上形成多個通孔。所述導體填充步驟中，在各個所述多個通孔中填充導體。所述凸點形成步驟中，將所述基礎膜蝕刻成一定厚度，從而使填充於所述通孔的導體向所述基礎膜的外部露出一定長度而形成凸點。A contact film manufacturing method according to an aspect of the present invention for achieving the still further technical problem includes a via hole forming step, a conductor filling step, and a bump forming step. In the through hole forming step, a plurality of through holes are formed on the base film. In the conductor filling step, a conductor is filled in each of the plurality of through holes. In the bump forming step, the base film is etched to a certain thickness so that a conductor filled in the through hole is exposed to a certain length to the outside of the base film to form a bump.
根據用於實現所述又一技術課題的本發明的另一方面的接觸膜製造方法包括：形成貫通基礎膜的兩面的多個第一通孔的基礎膜通孔形成步驟；在多個所述第一通孔中填充導體的第一通孔填充步驟；在基礎膜的一面塗布光敏電阻的光敏電阻塗布步驟；形成多個第二通孔的光敏電阻通 孔形成步驟，所述第二通孔與所述第一通孔形態相同且貫通所述光敏電阻而到達所述第一通孔；在所述多個第二通孔中填充導體的第二通孔填充步驟；以及除去所述光敏電阻，從而形成向所述基礎膜的外部露出一定長度的凸點的凸點形成步驟。A contact film manufacturing method according to another aspect of the present invention for achieving the still further technical problem includes: a base film via forming step of forming a plurality of first through holes penetrating both sides of a base film; a first via filling step of filling a conductor in the first via hole; a photoresistor coating step of applying a photoresistor on one side of the base film; and a photoresistor passage forming the plurality of second via holes a hole forming step, the second through hole is in the same shape as the first through hole and penetrates the photoresistor to reach the first through hole; and the second through hole is filled in the plurality of second through holes a hole filling step; and removing the photoresistor to form a bump forming step of exposing a bump of a certain length to the outside of the base film.
根據用於實現所述又一技術課題的本發明的又一方面的接觸膜製造方法包括：光敏電阻塗布步驟、通孔形成步驟、導體填充步驟和凸點形成步驟。所述光敏電阻塗布步驟中，在基礎膜的一面以一定厚度塗布(deposition)光敏電阻。所述通孔形成步驟中，形成同時貫通所述基礎膜和所述光敏電阻的兩面的多個通孔。所述導體填充步驟中，在各個所述多個通孔中填充導體。所述凸點形成步驟中，將形成於所述基礎膜的一面的光敏電阻除去，從而形成向所述基礎膜外部露出一定長度的凸點。A contact film manufacturing method according to still another aspect of the present invention for achieving the still further technical problem includes a photoresistor coating step, a via forming step, a conductor filling step, and a bump forming step. In the photoresistor coating step, a photoresistor is deposited at a certain thickness on one side of the base film. In the via forming step, a plurality of via holes are formed through both the base film and both surfaces of the photoresistor. In the conductor filling step, a conductor is filled in each of the plurality of through holes. In the bump forming step, the photoresistor formed on one surface of the base film is removed to form a bump which is exposed to the outside of the base film by a certain length.
使用根據本發明的接觸膜的情況下，In the case of using the contact film according to the present invention,
1．導線不直接露出在與檢測物件之間的接觸面，基礎膜保護導線免受與檢測物件之間的接觸面的雜質的影響，從而可延長壽命。1. The wire is not directly exposed to the contact surface with the detecting object, and the base film protects the wire from impurities that are in contact with the detecting object, thereby prolonging the life.
2．填充於通孔的導體起到凸點的支撐桿的作用，從而可提高凸點的強度。2. The conductor filled in the through hole functions as a support rod of the bump, so that the strength of the bump can be improved.
3．在基礎膜的兩面分別形成導線和凸點，從而在提高凸點高度方面沒有限制。3. Wires and bumps are formed on both sides of the base film, so that there is no limitation in increasing the height of the bumps.
4．由於不是在導線上形成凸點，所以對於提高導線的厚度沒有限制。4. Since bumps are not formed on the wires, there is no limitation on increasing the thickness of the wires.
為了充分理解本發明和本發明的動作上的優點以及通 過實施本發明而實現的目的，需要參照用於說明本發明的示例性實施方式的附圖以及附圖中記載的內容。In order to fully understand the advantages and advantages of the present invention and the present invention For the purpose of implementing the present invention, it is necessary to refer to the drawings and the accompanying drawings for illustrating the exemplary embodiments of the present invention.
以下參照附圖說明本發明的較佳實施方式，從而進一步詳細說明本發明。各附圖中的相同附圖標記表示相同部件。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in further detail with reference to the accompanying drawings. The same reference numerals in the various drawings denote the same parts.
圖1是根據本發明的接觸膜製造方法的一實施方式。1 is an embodiment of a method of manufacturing a contact film in accordance with the present invention.
參照圖1，根據本發明的接觸膜的製造方法100包括：通孔形成步驟(b)，在基礎膜110(a)上形成多個通孔111；導體填充步驟(c)，在各個多個通孔(111)中填充導體112；以及凸點形成步驟(d)，將基礎膜110蝕刻(向箭頭方向)成一定厚度，從而使填充在所述通孔111中的導體112向基礎膜110的外部露出一定長度而形成凸點。Referring to Fig. 1, a method 100 of manufacturing a contact film according to the present invention includes a via forming step (b), forming a plurality of via holes 111 on the base film 110(a), and a conductor filling step (c) in each of a plurality of Filling the conductor 112 in the through hole (111); and bump forming step (d), etching the base film 110 (in the direction of the arrow) to a thickness such that the conductor 112 filled in the through hole 111 faces the base film 110 The outside is exposed to a certain length to form a bump.
圖2是根據本發明的接觸膜製造方法的另一實施方式。2 is another embodiment of a method of manufacturing a contact film in accordance with the present invention.
參照圖2，根據本發明的接觸膜的製造方法200包括：基礎膜通孔形成步驟(b)，形成貫通基礎膜110(a)的兩面的多個第一通孔111；第一通孔填充步驟(c)，在多個第一通孔111中填充導體112；光敏電阻塗布步驟(d)，在基礎膜110的一面塗布光敏電阻120；光敏電阻通孔形成步驟(e)，形成多個第二通孔111，所述第二通孔111與第一通孔111形態相同且貫通光敏電阻120而達到第一通孔；第二通孔填充步驟(f)，在多個第二通孔111中填充導體113；以及凸點形成步驟(g)，蝕刻光敏電阻120，從而形成向基礎膜110的外部露出一定長度的凸點。Referring to FIG. 2, a method 200 for manufacturing a contact film according to the present invention includes a base film via forming step (b), forming a plurality of first via holes 111 penetrating both sides of the base film 110(a); filling the first via holes Step (c), filling a plurality of first through holes 111 with a conductor 112; a photoresistor coating step (d), coating a photoresistor 120 on one side of the base film 110; and forming a plurality of photoresist via holes forming step (e) to form a plurality of The second through hole 111 has the same shape as the first through hole 111 and penetrates the photoresistor 120 to reach the first through hole; the second through hole fills the step (f) in the plurality of second through holes The filler 113 is filled in 111; and the bump forming step (g) etches the photoresistor 120 to form a bump which is exposed to the outside of the base film 110 by a certain length.
在這裡，第一通孔和第二通孔的形態相同且互相整齊排列。即，由圖2的e、f、g可以確認，不僅形態相同而且相接的面即斷面也一致。Here, the first through hole and the second through hole have the same shape and are aligned with each other. That is, it can be confirmed from e, f, and g of Fig. 2 that not only the shapes but also the faces that meet each other are identical.
填充第一通孔的導體112和填充第二通孔的導體113可以是相同材質的導體，也可以使用具有導電性的不同材質的導體。The conductor 112 filling the first through hole and the conductor 113 filling the second through hole may be conductors of the same material, and conductors of different materials having conductivity may be used.
圖3是根據本發明的接觸膜製造方法的又一實施方式。3 is still another embodiment of a method of manufacturing a contact film in accordance with the present invention.
參照圖3，根據本發明的接觸膜的製造方法300包括：光敏電阻塗布步驟(b)，在基礎膜110(a)的一面塗布光敏電阻120；通孔形成步驟(c)，形成同時貫通基礎膜110和光敏電阻120的兩面的多個通孔111；導體填充步驟(d)，在各個多個通孔111中填充導體112；以及凸點形成步驟(e)，將形成於基礎膜111的一面的光敏電阻120(箭頭方向)除去，從而形成向基礎膜110的外部露出一定距離的凸點。Referring to FIG. 3, a method 300 for manufacturing a contact film according to the present invention includes a photoresistor coating step (b) of coating a photoresistor 120 on one side of a base film 110(a), and a via forming step (c) to form a simultaneous through-base. a plurality of through holes 111 on both sides of the film 110 and the photoresistor 120; a conductor filling step (d) filling the conductors 112 in each of the plurality of through holes 111; and a bump forming step (e) to be formed on the base film 111 The one side photoresistor 120 (in the direction of the arrow) is removed to form a bump which is exposed to the outside of the base film 110 by a certain distance.
在通孔形成步驟(c)中，可以先將光敏電阻120進行顯影，從而在光敏電阻120中形成通孔後，將基礎膜110進行蝕刻，從而在基礎膜110形成通孔，該通孔的斷面與形成於光敏電阻120的通孔的斷面相同。In the via forming step (c), the photoresistor 120 may be first developed to form a via hole in the photoresistor 120, and then the base film 110 is etched to form a via hole in the base film 110. The cross section is the same as the cross section of the through hole formed in the photoresistor 120.
當然，如果有使光敏電阻120和基礎膜110同時形成通孔的方法，則也可以使用那種方法。Of course, if there is a method in which the photoresistor 120 and the base film 110 are simultaneously formed with through holes, that method can also be used.
圖1中圖示的製造方法100是將基礎膜110本身進行蝕刻而製造接觸膜的方法，圖2和圖3中圖示的製造方法200、300是在基礎膜110上塗布光敏電阻120後，使光敏電阻120顯影而製造接觸膜的方法。The manufacturing method 100 illustrated in FIG. 1 is a method of manufacturing a contact film by etching the base film 110 itself, and the manufacturing methods 200, 300 illustrated in FIGS. 2 and 3 are after coating the photoresistor 120 on the base film 110. A method of producing a contact film by developing the photoresistor 120.
圖4是根據本發明的接觸膜的剖視圖。Figure 4 is a cross-sectional view of a contact film in accordance with the present invention.
參照圖4中圖示的接觸膜400，可知還可以包括導線130，所述導線130形成於根據圖1至圖3製造的基礎膜110的下部面且與填充於多個通孔中的導體112電連接。Referring to the contact film 400 illustrated in FIG. 4, it is also possible to further include a wire 130 formed on a lower surface of the base film 110 manufactured according to FIGS. 1 to 3 and a conductor 112 filled in the plurality of through holes. Electrical connection.
基礎膜110較佳為高分子聚合物撓性膜，所述高分子聚合物是聚對苯二甲酸乙二醇酯(PET)、液晶聚合物(LCP)、聚醯亞胺(PI)等高分子聚合物。The base film 110 is preferably a high molecular polymer flexible film, and the high molecular weight polymer is polyethylene terephthalate (PET), liquid crystal polymer (LCP), and polyimine (PI). Molecular polymer.
圖5是根據本發明的一實施方式的接觸膜的立體圖。Figure 5 is a perspective view of a contact film in accordance with an embodiment of the present invention.
圖6是根據本發明的另一實施方式的接觸膜的立體圖。Figure 6 is a perspective view of a contact film in accordance with another embodiment of the present invention.
參照圖5和圖6，可知在接觸膜的上部面形成有凸點，在下部面形成有導線130，通孔的形態可以形成四邊形(圖5)或圓形(圖6)等多種形態。Referring to Fig. 5 and Fig. 6, it is understood that a bump is formed on the upper surface of the contact film, and a wire 130 is formed on the lower surface. The shape of the through hole can be various forms such as a quadrangle (Fig. 5) or a circular shape (Fig. 6).
在所述說明中，混用通孔111、凸點和導體112，導體112意味著填充於通孔111中的物質的成分，凸點意味著填充於通孔111的導體112中向基礎膜110的外部露出的部分。In the above description, the via hole 111, the bump, and the conductor 112 are mixed, and the conductor 112 means a component of a substance filled in the through hole 111, and the bump means that it is filled in the conductor 112 of the through hole 111 toward the base film 110. The exposed part of the exterior.
上述說明和附圖中，說明了凸點與填充於膜中的導體的斷面的面積相同，但是也可以使向膜的外部突出的凸點的斷面形成為大於或小於填充於膜的導體的斷面。製造成這樣的形態可經過多種過程來實現。例如，使用圖1所示的方法的情況下，形成膜的通孔時，蝕刻成形成凸點區域的部分與單純填充導體的部分的通孔的斷面不同而實現。使用圖2和圖3所示的方法的情況下，使形成於光敏電阻的通孔的大小與形成於膜的通孔的大小不同而實現。In the above description and the drawings, it is explained that the bump has the same area as the cross section of the conductor filled in the film, but the cross section of the bump protruding to the outside of the film may be formed to be larger or smaller than the conductor filled in the film. Section. Fabrication into such a form can be accomplished through a variety of processes. For example, in the case of using the method shown in FIG. 1, when a via hole of a film is formed, it is realized by etching a portion in which a bump region is formed and a cross section of a via hole in a portion where the conductor is simply filled. In the case of using the method shown in FIGS. 2 and 3, the size of the through hole formed in the photoresistor is made different from the size of the through hole formed in the film.
110‧‧‧基礎膜110‧‧‧Basic film
111‧‧‧通孔111‧‧‧through hole
112‧‧‧導體112‧‧‧Conductor
113‧‧‧導體113‧‧‧Conductor
120‧‧‧光敏電阻120‧‧‧Photoresist
130‧‧‧導線130‧‧‧Wire
圖1是根據本發明的接觸膜製造方法的一實施方式。1 is an embodiment of a method of manufacturing a contact film in accordance with the present invention.
圖2是根據本發明的接觸膜製造方法的另一實施方式。2 is another embodiment of a method of manufacturing a contact film in accordance with the present invention.
圖3是根據本發明的接觸膜製造方法的又一實施方式。3 is still another embodiment of a method of manufacturing a contact film in accordance with the present invention.
圖4是根據本發明的接觸膜的剖視圖。Figure 4 is a cross-sectional view of a contact film in accordance with the present invention.
圖5是根據本發明的一實施方式的接觸膜的立體圖。Figure 5 is a perspective view of a contact film in accordance with an embodiment of the present invention.
圖6是根據本發明的另一實施方式的接觸膜的立體圖。Figure 6 is a perspective view of a contact film in accordance with another embodiment of the present invention.
110‧‧‧基礎膜110‧‧‧Basic film
112‧‧‧導體112‧‧‧Conductor
130‧‧‧導線130‧‧‧Wire
400‧‧‧接觸膜400‧‧‧Contact film
Claims (5)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20110124610 | 2011-11-25 | ||
| KR1020120062777A KR101215375B1 (en) | 2011-11-25 | 2012-06-12 | Contact film, method for generating the film, probe unit and lcd pannel tester |
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| Publication Number | Publication Date |
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| TW201331586A TW201331586A (en) | 2013-08-01 |
| TWI461696B true TWI461696B (en) | 2014-11-21 |
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| JP (1) | JP2013113849A (en) |
| KR (1) | KR101215375B1 (en) |
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| TW (1) | TWI461696B (en) |
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| TWI572864B (en) * | 2015-05-18 | 2017-03-01 | Gigalane Co Ltd | A probe pin and assembly for fixing the probe pin |
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| KR101279952B1 (en) | 2013-03-26 | 2013-07-05 | 주식회사 기가레인 | Apparatus for multilayer contact film and method for manufacturing the same |
| KR101279951B1 (en) * | 2013-03-26 | 2013-07-05 | 주식회사 기가레인 | Apparatus for contact film and method for manufacturing the same |
| KR101490891B1 (en) | 2013-09-09 | 2015-02-06 | 주식회사 기가레인 | Probe block available full contact test and shorting bar test for testing panel |
| CN104422800B (en) * | 2013-09-09 | 2017-11-21 | 宇德曼斯有限公司 | For testing the probe unit of the panel with micro- pitch arrays |
| KR101617234B1 (en) * | 2014-07-09 | 2016-05-02 | 임근환 | Through-Film Via Bump Probe for testing electronic components |
| IT201700100522A1 (en) * | 2017-09-07 | 2019-03-07 | Technoprobe Spa | Interface element for an electronic device test device and its manufacturing method |
| KR101835762B1 (en) * | 2017-09-29 | 2018-03-07 | (주)위드멤스 | Contact film preventing short circuit due to overcurrent and method for manufacturing the same |
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Also Published As
| Publication number | Publication date |
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| CN103134960B (en) | 2015-09-23 |
| KR101215375B1 (en) | 2012-12-26 |
| JP2013113849A (en) | 2013-06-10 |
| CN103134960A (en) | 2013-06-05 |
| TW201331586A (en) | 2013-08-01 |
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