JP2009244096A - Sheet-like probe and method for manufacturing of same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-like probe for forming an electrode structure having a front face electrode section with a small diameter, and surely achieving a stable electrical connection state to a circuit device having a to-be-inspected electrode formed with a resist film in a peripheral area, and also provide its method for manufacturing. <P>SOLUTION: In the sheet-like probe, a plurality of the electrode structures comprise: the front face electrode section protruded from a front face of an insulating sheet; and a back face electrode section exposed on a back face, and coupled to the front face electrode section by a short circuit section extended in the thickness direction of the insulating sheet. A plurality of the electrode structures are disposed in the insulating sheet in accordance with a pattern corresponding to the to-be-inspected electrode. The front face electrode section in the electrode structure is formed with metal bumps on a thin plate electrode substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to, for example, a sheet-like probe used for performing electrical inspection of a plurality of integrated circuits formed on a wafer in a wafer state and a method for manufacturing the same.

For example, in an electrical inspection of a circuit device such as a wafer on which a large number of integrated circuits are formed or an electronic component such as a semiconductor element, inspection electrodes arranged according to a pattern corresponding to the pattern of the inspection target electrode of the circuit device under inspection A probe card having the following is used. As such a probe card, one in which inspection electrodes (probes) made of pins or blades are arranged has been used.
However, when the circuit device to be inspected is a wafer on which a large number of integrated circuits are formed, when producing a probe card for inspecting the wafer, it is necessary to arrange a very large number of inspection electrodes. Therefore, the probe card becomes extremely expensive, and when the pitch of the electrodes to be inspected is small, it is difficult to produce the probe card itself. Further, the wafer is generally warped, and the state of the warp varies depending on the product (wafer). Therefore, each of the inspection electrodes of the probe card can be stably and securely applied to many inspection electrodes on the wafer. It is practically difficult to ensure contact.

  For the above reasons, as a probe card for inspecting an integrated circuit formed on a wafer in recent years, an inspection circuit board in which a plurality of inspection electrodes are formed according to a pattern corresponding to the pattern of the electrode to be inspected on one surface; An anisotropic conductive sheet disposed on one surface of the circuit board for inspection, and a plurality of electrode structures that extend through the flexible insulating film disposed in the thickness direction on the anisotropic conductive sheet Have been proposed (see, for example, Patent Document 1).

  A configuration of an example of a sheet-like probe used in such a probe card is shown in FIG. The sheet-like probe 90 has a flexible insulating sheet 91 made of, for example, a resin, and a plurality of electrode structures 95 extending in the thickness direction are formed on the insulating sheet 91 in the pattern of the electrode to be inspected of the circuit device to be inspected. Are arranged in accordance with a pattern corresponding to. Each of the electrode structures 95 includes a protruding surface electrode portion 96 exposed on the surface of the insulating sheet 91 and a plate-like back surface electrode portion 97 exposed on the back surface of the insulating sheet 91. Are integrally connected via a short-circuit portion 98 that extends through in the thickness direction.

Such a sheet-like probe 90 is generally manufactured as follows.
First, as shown in FIG. 22A, a laminate 90A in which a metal layer 92 is formed on one surface of an insulating sheet 91 is prepared, and as shown in FIG. A through hole 98H penetrating in the thickness direction is formed.
Next, as shown in FIG. 22C, a resist film 93 is formed on the metal layer 92 of the insulating sheet 91, and then an electroplating process is performed using the metal layer 92 as a common electrode. A through-hole 98H is filled with a metal deposit to form a short-circuit portion 98 integrally connected to the metal layer 92, and is integrally connected to the short-circuit portion 98 on the surface of the insulating sheet 91. The protruding surface electrode portion 96 is formed.
Thereafter, the resist film 93 is removed from the metal layer 92, and a resist film 94A is formed on the surface of the insulating sheet 91 including the surface electrode portion 96 as shown in FIG. Then, a resist film 94B is formed in accordance with a pattern corresponding to the pattern of the back electrode portion to be formed, and the metal layer 92 is subjected to an etching process, whereby as shown in FIG. The exposed portion is removed to form the back electrode portion 97, thereby forming the electrode structure 95.
Then, the sheet-like probe 90 is obtained by removing the resist film 94A formed on the insulating sheet 91 and the front surface electrode portion 96 and removing the resist film 94B formed on the back surface electrode portion 97.

However, the above sheet-like probe has the following problems.
In the step of forming the short-circuit portion 98 and the surface electrode portion 96 in the method for manufacturing the sheet-like probe described above, since the plating layer by electrolytic plating grows isotropically, as shown in FIG. In 96, the distance w from the peripheral edge of the surface electrode portion 96 to the peripheral edge of the short-circuit portion 98 is equal to the protruding height h of the surface electrode portion 96. Accordingly, the diameter R of the surface electrode portion 96 obtained is considerably larger than twice the protruding height h. Therefore, for example, when performing electrical inspection of a wafer in which a resist film is formed in the peripheral region of the electrode to be inspected, the resist film becomes an obstacle and the electrical connection between the electrode to be inspected and the surface electrode portion 96 is made. It is difficult to achieve reliably.

  In the above, means for reducing the diameter of the surface electrode portion 96 to be obtained are means for reducing the protrusion height h of the surface electrode portion 96, and the diameter of the short-circuit portion 98 (if the cross-sectional shape is not circular, the shortest A means for reducing r, that is, reducing the diameter of the through-hole 98H of the insulating sheet 91 is conceivable. However, the sheet-like probe obtained by the former means is stable with respect to the electrode to be inspected. On the other hand, it is difficult to reliably achieve such an electrical connection, while the latter means makes it difficult to form the short circuit part 98 and the surface electrode part 96 by electrolytic plating.

In order to solve such a problem, in Patent Document 2 and Patent Document 3, a sheet-like probe in which a large number of electrode structures each having a tapered surface electrode portion having a small diameter from the proximal end toward the distal end are arranged. Has been proposed (see Patent Document 2 and Patent Document 3).
However, when such a sheet-like probe is repeatedly used many times, there is a problem that the tip portion of the surface electrode portion in the electrode structure is easily crushed at an early stage.

Japanese Unexamined Patent Publication No. 7-231019 JP 11-326378 A JP 2002-196018 A

  The present invention has been made based on the circumstances as described above, and an object thereof is to form an electrode structure having a surface electrode portion with a small diameter, and a resist film is formed in a peripheral region. Another object of the present invention is to provide a sheet-like probe capable of reliably achieving a stable electrical connection state even for a circuit device having an inspected electrode, and a method for manufacturing the same.

The sheet-like probe of the present invention is formed by connecting a surface electrode portion protruding from the surface of the insulating sheet and a back electrode portion exposed on the back surface to the insulating sheet by a short-circuit portion extending in the thickness direction of the insulating sheet. A plurality of electrode structures are arranged according to a pattern corresponding to the electrode to be inspected,
The surface electrode portion in each of the electrode structures is formed by forming metal bumps on a thin plate-like electrode base layer.

The manufacturing method of the sheet-like probe of the present invention is connected to an insulating sheet by a short-circuit portion in which a surface electrode portion protruding from the surface of the insulating sheet and a back electrode portion exposed on the back surface extend in the thickness direction of the insulating sheet. A plurality of electrode structures are arranged according to a pattern corresponding to the electrode to be inspected, and the surface electrode portion of each of the electrode structures is a sheet in which metal bumps are formed on a thin plate-like electrode base layer A method of manufacturing a probe, comprising:
The insulating sheet, the surface side metal layer formed on the surface thereof, the back side metal layer formed on the back surface of the insulating sheet, and the insulating sheet formed according to the pattern corresponding to the electrode to be inspected. A composite sheet having a plurality of short-circuit portions extending through the thickness direction and connected to each of the front surface side metal layer and the back surface side metal layer,
A resist film having a plurality of pattern holes is formed on the surface-side metal layer in the composite sheet in accordance with a pattern corresponding to the metal bump, and the surface-side metal layer exposed through the pattern holes of the resist film is plated. Forming a plurality of metal bumps, and then etching the surface-side metal layer and the back-side metal layer in the composite sheet to form a metal on the electrode base layer composed of a part of the surface-side metal layer. It has the process of forming the back surface electrode part which consists of a part of back surface side metal layer while forming the several surface electrode part in which a bump is formed.

In the method for manufacturing a sheet-like probe of the present invention, a metal is formed so that a plurality of through holes are formed in an insulating sheet according to a pattern corresponding to an electrode to be inspected, and covers the front and back surfaces of the insulating sheet and the inner wall surface of the through hole. A composite sheet can be manufactured by forming a thin layer and subjecting the metal thin layer to an electrolytic plating treatment.
Further, the metal bumps in the surface electrode portion may have a diameter substantially the same as the diameter of the electrode base layer.
Moreover, the metal bump in the said surface electrode part may have a diameter smaller than the diameter of an electrode base layer.

According to the method for manufacturing a sheet-like probe of the present invention, a resist film having a plurality of pattern holes is formed on the surface-side metal layer of the composite sheet according to a pattern corresponding to the metal bump to be formed. Since the metal bumps are formed by plating the surface-side metal layer exposed through the pattern holes, a surface electrode portion corresponding to the shape of the pattern holes in the resist film can be obtained. By forming a resist film having holes, an electrode structure having a surface electrode portion with a small diameter can be formed.
According to the sheet-like probe obtained by such a manufacturing method, since the surface electrode portion has a small diameter, the electric probe is stable even for a circuit device having an electrode to be inspected in which a resist film is formed in the peripheral region. Connection can be reliably achieved.

Hereinafter, embodiments for carrying out the present invention will be described in detail.
FIG. 1 is an explanatory cross-sectional view showing a configuration of an example of the sheet-like probe of the present invention, and FIG. 2 is an explanatory cross-sectional view showing an enlarged configuration of a main part of the sheet-like probe shown in FIG. .
The sheet-like probe 10 is used, for example, to perform electrical inspection of a plurality of integrated circuits formed on a wafer in a wafer state, and has a flexible insulating sheet 11, and this insulating sheet 11, a plurality of electrode structures 15 made of metal extending in the thickness direction of the insulating sheet 11 are arranged apart from each other according to a pattern corresponding to the pattern of the electrodes to be inspected of the integrated circuit formed on the wafer. Yes.
Each of the electrode structures 15 includes a protruding surface electrode portion 16 protruding from the surface of the insulating sheet 11 and a thin plate-like back electrode portion 17 exposed on the back surface of the insulating sheet 11. The short-circuit portions 18 extending through the thickness direction are integrally connected to each other. Further, the surface electrode portion 16 is configured by integrally forming a metal bump 16B having substantially the same diameter as the electrode base layer 16A on a thin plate-like electrode base layer 16A.

As a material constituting the insulating sheet 11, resin materials such as liquid crystal polymer, polyimide resin, polyester resin, polyaramid resin, polyamide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin For example, a fiber-reinforced resin material such as an epoxy resin or a composite resin material containing an inorganic material such as alumina or poron nitride as a filler can be used.
The insulating sheet 11 preferably has a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less, more preferably 1 × 10 ⁻⁶ to 2 × 10 ⁻⁵ / K, particularly preferably. 1 × 10 ^{−6 to} 6 × 10 ⁻⁶ / K. By using such an insulating sheet 11, it is possible to suppress displacement of the electrode structure 15 due to thermal expansion of the insulating sheet 11.
Moreover, it is preferable that the thickness of the insulating sheet 11 is 10-200 micrometers, More preferably, it is 15-100 micrometers.

As a material constituting the electrode structure 15, a metal material can be suitably used. Specific examples thereof include simple metals such as nickel, cobalt, gold, copper, silver, palladium, rhodium, tungsten, and aluminum, or these. And alloys thereof.
Each of the front electrode portion 16, the back electrode portion 17, and the short-circuit portion 18 in the electrode structure 15 may be formed of the same metal or different metals.
Further, the electrode base layer 16A and the metal bump 16B in the surface electrode portion 16 may be formed of the same metal or different metals, but the surface electrode portion 16 is formed by a manufacturing method described later. In this case, it is preferable to use a metal bump 16B having a lower etching rate (not easily etched) than the material forming the electrode base layer 16A.
Further, when an electrical inspection is performed on an electrode to be inspected having an oxide film formed on the surface, the electrode structure 15 of the sheet-like probe 10 and the electrode to be inspected are brought into contact with each other by the surface electrode portion 16 of the electrode structure 15. It is necessary to destroy the oxide film on the surface of the electrode to be inspected to achieve electrical connection between the electrode structure 15 and the electrode to be inspected. Therefore, it is preferable that the metal bump 16B of the surface electrode portion 16 in the electrode structure 15 has a hardness that can easily break the oxide film. In order to obtain such a surface electrode portion 16, a powder material having high hardness can be contained in the metal constituting the metal bump 16 </ b> B in the surface electrode portion 16.
As such a powder substance, diamond powder, silicon nitride, silicon carbide, ceramics, glass and the like can be used. By containing an appropriate amount of these non-conductive powder substances, the conductivity of the electrode structure 15 can be increased. The oxide film formed on the surface of the electrode to be inspected can be destroyed by the surface electrode portion 16 of the electrode structure 15 without damaging the structure.
In addition, in order to easily destroy the oxide film on the surface of the electrode to be inspected, the shape of the surface electrode portion 16 in the electrode structure 15 is a sharp protrusion, or fine irregularities are formed on the surface of the surface electrode portion 16. Or can be formed.
Moreover, the coating film may be formed in the surface electrode part 16 and the back surface electrode part 17 in the electrode structure 15 as needed. For example, when the electrode to be inspected is made of a solder material, the surface electrode portion 16 is covered with a non-diffusible metal such as silver, palladium, or rhodium from the viewpoint of preventing the solder material from diffusing. A covering film can be formed.

The pitch of the electrode structures 15 is set according to the pitch of the electrodes to be inspected of the wafer to be inspected, and is preferably 40 to 250 μm, for example, and more preferably 40 to 150 μm.
Here, the “pitch of electrode structures” is the shortest distance between the centers of adjacent electrode structures.

In the electrode structure 15, the protruding height of the surface electrode portion 16 from the insulating sheet 11 is preferably 5 to 200 μm. Moreover, the diameter of the surface electrode part 16 is 5-200 micrometers, for example, Preferably it is 10-150 micrometers.
The diameter of the short-circuit portion 18 in the electrode structure 15 is, for example, 5 to 120 μm, preferably 10 to 100 μm.
The diameter of the back electrode portion 17 in the electrode structure 15 is not particularly limited as long as the insulation with the adjacent electrode structure 15 is ensured, but the diameter of the electrode electrically connected to the back electrode portion 17 is 70 to 70. It is preferably 150%.

And in the manufacturing method of this invention, said sheet-like probe 10 is manufactured as follows.
First, the insulating sheet, the surface-side metal layer formed on the surface of the insulating sheet, the back-side metal layer formed on the back surface of the insulating sheet, and formed according to the pattern corresponding to the electrode to be inspected, A composite sheet having a plurality of short-circuit portions each extending through the insulating sheet in the thickness direction and connected to each of the front surface side metal layer and the back surface side metal layer is manufactured.
This composite sheet can be produced, for example, as follows.

As shown in FIG. 3, a plurality of through holes 12 penetrating in the thickness direction of the insulating sheet 11 are formed in the insulating sheet 11 in accordance with a pattern corresponding to the pattern of the electrode to be inspected on the wafer to be inspected.
Here, as a method of forming the through hole 12 in the insulating sheet 11, a laser processing method, an etching processing method, or the like can be used.
The diameter of the through hole 12 formed in the insulating sheet 11 is a diameter that matches the diameter of the short-circuit portion 18 of the electrode structure 15 to be formed.
Next, as shown in FIG. 4, a thin metal layer 13 is formed so as to cover the front and back surfaces of the insulating sheet 11 in which the through holes 12 are formed and the inner wall surfaces of the through holes 12.
Here, as a method of forming the metal thin layer 13 on the insulating sheet 11, a sputtering method or an electroless plating method can be used.
The thickness of the thin metal layer 13 formed on the insulating sheet 11 is, for example, 0.01 to 5 μm, preferably 0.05 to 2 μm.
Then, by subjecting the thin metal layer 13 formed on the surface of the insulating sheet 11 to electrolytic plating, a surface having a required thickness is formed on the front and back surfaces of the insulating sheet 11 as shown in FIG. The side metal layer 14A and the back side metal layer 14B are formed, and a plurality of short-circuit portions connected to the front side metal layer 14A and the back side metal layer 14B in each through hole 12 of the insulating sheet 11 18 is formed, and thus the composite sheet 10A is manufactured.
Here, the thickness of each of the front-side metal layer 14A and the back-side metal layer 14B formed on the front and back surfaces of the insulating sheet 11 is, for example, 1 to 20 μm, preferably 2 to 10 μm.

As shown in FIG. 6, a plurality of pattern holes 19H are formed on the surface of the surface-side metal layer 14A in the composite sheet 10A according to a pattern corresponding to the metal bumps 16B of the surface electrode portion 16 in the electrode structure 15 to be formed. A resist film 19 is formed.
Here, the diameter of the pattern hole 19H of the resist film 19 is a diameter suitable for the metal bump 16B of the surface electrode portion 16 in the electrode structure 15 to be formed.
Moreover, the thickness of the resist film 19 is set according to the protruding height of the surface electrode portion 16 of the electrode structure 15 to be formed.
Next, the portion exposed through the pattern hole 19H of the resist film 19 in the surface-side metal layer 14A is subjected to an electrolytic plating process to deposit metal in the pattern hole 19H of the resist film 19, thereby showing the structure shown in FIG. As described above, the metal bumps 16B are formed on the surface of the surface-side metal layer 14A.
Here, as the material for forming the metal bump 16B, a material having an etching rate lower than that of the material for forming the surface-side metal layer 14A is used. As a specific example, when the material for forming the surface side metal layer 14A is copper, for example, nickel is used as a material for forming the metal bumps 16B.

  Next, the resist film 19 is removed from the surface of the composite sheet 10A, and the exposed surface-side metal layer 14A is subjected to an etching process, whereby the surface of the insulating sheet 11 is exposed to the surface side as shown in FIG. A plurality of surface electrode portions 16 formed by forming metal bumps 16B on the electrode base layer 16A made of a part of the metal layer are formed. Thereafter, the back surface side metal layer 14B is subjected to photolithography and etching to form the back surface electrode portion 17 composed of a part of the back surface side metal layer, and thus the sheet-like probe 10 shown in FIG. 1 is manufactured. .

FIG. 9 is a cross-sectional view for explaining the structure of another example of the sheet-like probe obtained by the manufacturing method of the present invention, and FIG. 10 is an enlarged view of the structure of the main part of the sheet-like probe shown in FIG. FIG.
The sheet-like probe 10 is used, for example, to perform electrical inspection of a plurality of integrated circuits formed on a wafer in a wafer state, and has a flexible insulating sheet 11, and this insulating sheet 11, a plurality of electrode structures 15 made of metal extending in the thickness direction of the insulating sheet 11 are arranged apart from each other according to a pattern corresponding to the pattern of the electrodes to be inspected of the integrated circuit formed on the wafer. Yes.
Each of the electrode structures 15 includes a protruding surface electrode portion 16 protruding from the surface of the insulating sheet 11 and a thin plate-like back electrode portion 17 exposed on the back surface of the insulating sheet 11. The short-circuit portions 18 extending through the thickness direction are integrally connected to each other. Further, the surface electrode portion 16 is configured by integrally forming a metal bump 16B having a diameter smaller than that of the electrode base layer 16A on a thin plate-like electrode base layer 16A.
Here, the diameter of the metal bump 16B is, for example, 5 to 80 μm, preferably 10 to 50 μm, and other specific configurations are the same as those of the sheet-like probe shown in FIG.

And in the manufacturing method of this invention, said sheet-like probe 10 is manufactured as follows.
First, the composite sheet 10A is manufactured in the same manner as the sheet-like probe shown in FIG. 1 (see FIGS. 3 to 5).
Next, a plurality of pattern holes 19H are formed on the surface of the surface-side metal layer 14A in the composite sheet 10A according to a pattern corresponding to the metal bumps 16B of the surface electrode portion 16 in the electrode structure 15 to be formed, as shown in FIG. A resist film 19 is formed.
Here, the diameter of the pattern hole 19H of the resist film 19 is a diameter suitable for the metal bump 16B of the surface electrode portion 16 in the electrode structure 15 to be formed.
Moreover, the thickness of the resist film 19 is set according to the protruding height of the surface electrode portion 16 of the electrode structure 15 to be formed.
Next, the portion exposed through the pattern hole 19H of the resist film 19 in the surface-side metal layer 14A is subjected to an electrolytic plating process to deposit metal in the pattern hole 19H of the resist film 19, thereby showing the structure shown in FIG. As described above, the metal bumps 16B are formed on the surface of the surface-side metal layer 14A.
In the above, by changing the shape of the pattern hole 19H of the resist film 19, the metal bumps 16B having various shapes such as a columnar shape, a prismatic shape, and a columnar shape having a star shape in cross section can be formed.

  Next, the resist film 19 is removed from the surface of the composite sheet 10A, and then a resist pattern 19A is formed so as to cover the peripheral portions of the metal bumps 16B and the metal bumps 16B in the surface side metal layer 14A as shown in FIG. Then, by etching the exposed surface side metal layer 14A, as shown in FIG. 14, a metal bump is formed on the surface of the insulating sheet 11 on the electrode base layer 16A made of a part of the surface side metal layer. A plurality of surface electrode portions 16 formed by forming 16B are formed. Next, the resist pattern 19A is removed from each surface of the front surface electrode portion 16, and then the back surface side metal layer 14B is subjected to photolithography and etching treatment, whereby the back surface electrode portion 17 made of a part of the back surface side metal layer is formed. Thus, the sheet-like probe 10 shown in FIG. 9 is manufactured.

According to the method for manufacturing the sheet-like probe 10 as described above, the resist film 19 having a plurality of pattern holes 19H is formed on the surface-side metal layer 14A in the composite sheet 10A according to the pattern corresponding to the metal bump 16B to be formed. In addition, the surface side metal layer 14A exposed through the pattern hole 19H of the resist film 19 is plated to form the metal bumps 16B, so that the surface electrode corresponding to the shape of the pattern hole 19H of the resist film 19 is formed. Therefore, the electrode structure 15 having the surface electrode portion 16 having a small diameter can be formed by forming the resist film 19 having the pattern hole 19H having a small diameter.
According to the sheet-like probe 10 obtained by such a manufacturing method, since it has the surface electrode portion 16 having a small diameter, it is stable even for a circuit device having an electrode to be inspected in which a resist film is formed in the peripheral region. Therefore, it is possible to reliably achieve an electrical connection state.

FIG. 15 is a cross-sectional view illustrating an example of a probe card provided with the sheet-like probe of the present invention. FIG. 16 is an explanatory view illustrating the configuration of the main part of the probe card shown in FIG. It is sectional drawing.
The probe card 30 includes an inspection circuit board 31, an anisotropic conductive connector 20 disposed on one surface of the inspection circuit board 31 (upper surface in FIGS. 1 and 2), and the anisotropic conductive connector 20. The sheet-like probe 10 having the configuration shown in FIG.

As shown in FIG. 17, the inspection circuit board 31 includes a disk-shaped first substrate element 32, and a central portion on the surface (the upper surface in FIGS. 15 and 16) of the first substrate element 32. Are arranged in a regular octagonal plate-like second substrate element 35, and the second substrate element 35 is held by a holder 34 fixed to the surface of the first substrate element 32. In addition, a reinforcing member 37 is provided at the center of the back surface of the first substrate element 32.
A plurality of connection electrodes (not shown) are formed in an appropriate pattern at the center of the surface of the first substrate element 32. On the other hand, a lead electrode portion in which a plurality of lead electrodes 33 are arranged along the circumferential direction of the first substrate element 32 as shown in FIG. 33R is formed. The pattern of the lead electrode 33 is a pattern corresponding to the pattern of the input / output terminal of the controller in the wafer inspection apparatus. Each of the lead electrodes 33 is electrically connected to a connection electrode via an internal wiring (not shown).
On the surface of the second substrate element 35 (the upper surface in FIGS. 15 and 16), a plurality of inspection electrodes 36 are in accordance with a pattern corresponding to the pattern of the electrodes to be inspected in the integrated circuit formed on the wafer to be inspected. The arranged inspection electrode part 36R is formed. On the other hand, on the back surface of the second substrate element 35, a plurality of terminal electrodes (not shown) are arranged according to an appropriate pattern, and each of the terminal electrodes is connected to the inspection electrode 36 via an internal wiring (not shown). Electrically connected.
The connection electrode of the first substrate element 32 and the terminal electrode of the second substrate element 35 are electrically connected by appropriate means.

As a substrate material constituting the first substrate element 32 in the circuit board 31 for inspection, conventionally known various materials can be used. Specific examples thereof include glass fiber reinforced epoxy resin and glass fiber reinforced phenol. Examples thereof include composite resin substrate materials such as resin, glass fiber reinforced polyimide resin, and glass fiber reinforced bismaleimide triazine resin.
As a material constituting the second substrate element 35 in the circuit board 31 for inspection, it is preferable to use a material having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less, and more preferably 1 × 10 ⁻⁷ to 1 × 10 ⁻⁵ / K, particularly preferably 1 × 10 ^{−6 to} 6 × 10 ⁻⁶ / K. Specific examples of such substrate materials include inorganic substrate materials made of Pyrex (registered trademark) glass, quartz glass, alumina, beryllia, silicon carbide, aluminum nitride, boron nitride, etc., iron such as 42 alloy, Kovar, and Invar. -The laminated board material etc. which laminated | stacked resin, such as an epoxy resin or a polyimide resin, using the metal plate which consists of nickel alloy steel as a core material are mentioned.

  The holder 34 has a regular octagonal opening 34 </ b> K that matches the outer shape of the second substrate element 35, and the second substrate element 35 is accommodated in the opening 34 </ b> K. The outer edge of the holder 34 is circular, and a step 34S is formed on the outer edge of the holder 34 along the circumferential direction.

  As shown in FIG. 19, the anisotropic conductive connector 20 includes a disk-shaped frame plate 21 in which a plurality of openings 22 penetrating in the thickness direction are formed. The opening 22 of the frame plate 21 is formed corresponding to the pattern of the electrode region where the electrodes to be inspected are formed in all the integrated circuits formed on the wafer to be inspected. A plurality of elastic anisotropic conductive films 23 having conductivity in the thickness direction are arranged on the frame plate 21 so as to be supported by the opening edge portions of the frame plate 21 so as to block the one opening 22. .

Each of the elastic anisotropic conductive films 23 is made of an elastic polymer material, and as shown in an enlarged view in FIG. 20, a plurality of connection conductive portions 24 extending in the thickness direction, and the connection conductive portions. 24 has a functional part 26 formed of an insulating part 25 that is formed around each of the connecting conductive parts 24 and insulates each of the connecting conductive parts 24 from each other. The functional part 26 is located in the opening 22 of the frame plate 21. Arranged to do. The conductive portion 24 for connection in the functional portion 26 is arranged according to a pattern corresponding to the pattern of the electrode to be inspected in the electrode area in the integrated circuit formed on the wafer to be inspected.
A supported portion 28 fixedly supported by the opening edge of the frame plate 21 is formed integrally with the functional portion 26 at the periphery of the functional portion 26. Specifically, the supported portion 28 in this example is formed in a bifurcated shape, and is fixedly supported in close contact so as to grip the opening edge of the frame plate 21.
The conductive portion 24 for connection in the functional portion 26 of the elastic anisotropic conductive film 23 contains the conductive particles P exhibiting magnetism densely in an aligned state in the thickness direction. On the other hand, the insulating part 25 contains no or almost no conductive particles P.
Further, in the illustrated example, on both surfaces of the functional portion 26 in the elastic anisotropic conductive film 23, protruding portions 27 protruding from the other surfaces are formed at locations where the connecting conductive portion 24 and its peripheral portion are located. ing.

Although the thickness of the frame board 21 changes with the materials, it is preferable that it is 20-600 micrometers, More preferably, it is 40-400 micrometers.
When this thickness is less than 20 μm, the strength required when using the anisotropically conductive connector 20 is not obtained, the durability tends to be low, and the shape of the frame plate 21 is maintained. A degree of rigidity cannot be obtained, and the handleability of the anisotropic conductive connector 20 is low. On the other hand, when the thickness exceeds 600 μm, the elastic anisotropic conductive film 23 formed in the opening 22 becomes excessively thick, and the conductive property in the connection conductive portion 24 and the adjacent connection use It may be difficult to obtain insulation between the conductive portions 24.
The shape and size in the surface direction of the opening 22 of the frame plate 21 are designed according to the size, pitch, and pattern of the electrodes to be inspected on the wafer to be inspected.

The material constituting the frame plate 21 is not particularly limited as long as the frame plate 21 is not easily deformed and has a rigidity that allows the shape to be stably maintained. For example, a metal material, a ceramic material Various materials such as a resin material can be used. When the frame plate 21 is made of, for example, a metal material, an insulating coating may be formed on the surface of the frame plate 21.
Specific examples of the metal material constituting the frame plate 21 include metals such as iron, copper, nickel, titanium, and aluminum, or alloys or alloy steels in which two or more of these are combined.

Moreover, as a material which comprises the frame board 21, it is preferable to use a thing with a linear thermal expansion coefficient of 3 * 10 < ^-5 > / K or less, More preferably, it is -1 * 10 < ^-7 > -1 * 10 < ^-5 > / K. Particularly preferably, it is 1 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / K.
Specific examples of such a material include Invar type alloys such as Invar, Elinvar type alloys such as Elinvar, alloys such as Super Invar, Kovar, and 42 alloy, or alloy steel.

The total thickness of the elastic anisotropic conductive film 23 (thickness in the connecting conductive portion 24 in the illustrated example) is preferably 50 to 3000 μm, more preferably 70 to 2500 μm, and particularly preferably 100 to 2000 μm. If this thickness is 50 μm or more, the elastic anisotropic conductive film 23 having sufficient strength can be obtained reliably. On the other hand, if the thickness is 3000 μm or less, the connecting conductive portion 23 having the required conductive characteristics can be obtained reliably.
As for the protrusion height of the protrusion part 27, it is preferable that the sum total is 10% or more of the thickness in the said protrusion part 27, More preferably, it is 20% or more. By forming the projecting portion 27 having such a projecting height, the connecting conductive portion 24 is sufficiently compressed with a small applied pressure, so that good conductivity can be reliably obtained.
The protrusion height of the protrusion 27 is preferably 100% or less of the shortest width or diameter of the protrusion 27, more preferably 70% or less. By forming the projecting portion 27 having such a projecting height, the projecting portion 27 does not buckle when pressed, and thus the desired conductivity can be reliably obtained.
Further, the thickness of the supported portion 28 (one thickness of the bifurcated portion in the illustrated example) is preferably 5 to 600 μm, more preferably 10 to 500 μm, and particularly preferably 20 to 400 μm.
Further, the supported portion 28 is not necessarily formed in a bifurcated shape, and may be fixed to only one surface of the frame plate 21.

  As the elastic polymer material constituting the elastic anisotropic conductive film 23, a heat-resistant polymer material having a crosslinked structure is preferable. As a curable polymeric substance-forming material that can be used to obtain such a crosslinked polymeric substance, it is preferable to use silicone rubber in terms of moldability and electrical characteristics.

In the formation of the elastic anisotropic conductive film 23, the conductive particles P contained in the connection conductive portion 24 in the elastic anisotropic conductive film 23 are included in the molding material for forming the elastic anisotropic conductive film 23. From the viewpoint that the conductive particles P can be easily moved, it is preferable to use those showing magnetism. Specific examples of such conductive particles P exhibiting magnetism include metal particles exhibiting magnetism such as iron, nickel and cobalt, particles of these alloys, particles containing these metals, or cores of these particles. Particles with the surface of the core particles plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or inorganic substance particles such as non-magnetic metal particles or glass beads, or polymer particles are used as core particles. The surface of the core particle is plated with a conductive magnetic material such as nickel or cobalt, or the core particle is coated with both a conductive magnetic material and a metal having good conductivity. It is done.
Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with a metal having good conductivity such as gold or silver.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, but can be performed by, for example, electroless plating.

In the case of using the conductive particles P in which the surface of the core particles is coated with a conductive metal, from the viewpoint of obtaining good conductivity, the coverage of the conductive metal on the particle surface (surface area of the core particles). The ratio of the covering area of the conductive metal with respect to is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
The coating amount of the conductive metal is preferably 2.5 to 50% by weight of the core particles, more preferably 3 to 45% by weight, still more preferably 3.5 to 40% by weight, and particularly preferably 5%. ~ 30% by weight.

Moreover, it is preferable that the particle diameter of the electroconductive particle P is 1-500 micrometers, More preferably, it is 2-400 micrometers, More preferably, it is 5-300 micrometers, Most preferably, it is 10-150 micrometers.
Moreover, it is preferable that the particle diameter distribution (Dw / Dn) of the electroconductive particle P is 1-10, More preferably, it is 1-7, More preferably, it is 1-5, Most preferably, it is 1-4.
By using the conductive particles P that satisfy such conditions, the obtained elastic anisotropic conductive film 23 can be easily deformed under pressure, and the connecting conductive portion 24 in the elastic anisotropic conductive film 23 is obtained. In this case, sufficient electrical contact can be obtained between the conductive particles P.
Further, the shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or agglomerated particles 2 can be easily dispersed in the polymer substance-forming material. It is preferable that it is a lump with secondary particles.

  The content ratio of the conductive particles P in the connecting conductive portion 24 of the functional portion 26 is preferably 10 to 60%, preferably 15 to 50% in terms of volume fraction. When this ratio is less than 10%, the connection conductive portion 24 having a sufficiently small electric resistance value may not be obtained. On the other hand, if this ratio exceeds 60%, the obtained connecting conductive portion 24 is likely to be fragile, and the elasticity necessary for the connecting conductive portion 24 may not be obtained.

  Such an anisotropic conductive connector 20 can be manufactured, for example, by a method described in JP-A-2002-334732.

On the back surface of the insulating sheet 11 in the sheet-like probe 10, a circular ring-shaped holding member 40 is disposed along the peripheral edge of the insulating sheet 31, and the insulating sheet 31 is held by the holding member 40. Yes.
The sheet-like probe 10 is arranged such that the back electrode portion 17 in each of the electrode structures 15 is in contact with the connecting conductive portion 24 in the elastic anisotropic conductive film 23 of the anisotropic conductive connector 20, and the holding member 40 is The inspection circuit board 31 is engaged with and fixed to the step 34S of the holder 34.

  According to such a probe card, since the sheet-like probe having the surface electrode portion 16 having a small diameter is provided, stable electric power can be obtained even for a circuit device having an electrode to be inspected in which a resist film is formed in the peripheral region. Connection can be reliably achieved.

It is sectional drawing for description which shows the structure in an example of the sheet-like probe of this invention. It is sectional drawing for description which expands and shows the structure of the principal part of the sheet-like probe shown in FIG. It is sectional drawing for description which shows the insulating sheet in which the through-hole was formed. It is sectional drawing for description which shows the state in which the metal thin layer was formed in the insulating sheet. It is sectional drawing for description which shows the structure of a composite sheet. It is sectional drawing for description which shows the state by which the resist film was formed on the surface side metal layer in a composite sheet. It is sectional drawing for description which shows the state by which the metal bump was formed in the pattern hole of a resist film. It is sectional drawing for description which shows the state in which the surface electrode part was formed. It is sectional drawing for description which shows the structure in the other example of the sheet-like probe of this invention. It is sectional drawing for description which expands and shows the structure of the principal part of the sheet-like probe shown in FIG. It is sectional drawing for description which shows the state by which the resist film was formed on the surface side metal layer in a composite sheet. It is sectional drawing for description which shows the state by which the metal bump was formed in the pattern hole of a resist film. It is sectional drawing for description which shows the state in which the resist pattern was formed so that the peripheral part of the metal bump and the metal bump in a surface side metal layer might be covered. It is sectional drawing for description which shows the state in which the surface electrode part was formed. It is sectional drawing for description which shows the structure of the probe card provided with the sheet-like probe of this invention. It is sectional drawing for description which shows the structure of the principal part of the probe card shown in FIG. FIG. 16 is a plan view of a circuit board requiring inspection in the probe card shown in FIG. 15. It is explanatory drawing which expands and shows the lead electrode part in a circuit board for a test | inspection. It is a top view which shows the anisotropically conductive connector in the probe card shown in FIG. It is sectional drawing for description which expands and shows the principal part in the anisotropically conductive connector shown in FIG. It is sectional drawing for description which shows the structure in an example of the conventional sheet-like probe. It is sectional drawing for description which shows the manufacturing process of the conventional sheet-like probe. It is sectional drawing for description which expands and shows the sheet-like probe shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet-like probe 10A Composite sheet 11 Insulating sheet 12 Through-hole 13 Metal thin layer 14A Surface side metal layer 14B Back surface side metal layer 15 Electrode structure 16 Surface electrode part 16A Electrode base layer 16B Metal bump 17 Back surface electrode part 18 Short-circuit part DESCRIPTION OF SYMBOLS 19 Resist film 19A Resist pattern 19H Pattern hole 20 Anisotropic conductive connector 21 Frame board 22 Opening 23, 23A Elastic anisotropic conductive film 24 Connection conductive part 25 Insulation part 26 Function part 27 Projection part 28 Supported part 30 Probe card 31 Circuit board for inspection 32 First substrate element 33 Lead electrode 33R Lead electrode portion 34 Holder 34K Opening 34S Step portion 35 Second substrate element 36 Inspection electrode 36R Inspection electrode portion 37 Reinforcing member 40 Holding member 90 Sheet-like probe 90A Laminated body 91 Insulating sheet 91A Insulating film material 92 Metal Layer 93 Resist films 94A and 94B Resist film 95 Electrode structure 96 Front surface electrode portion 97 Back surface electrode portion 98 Short-circuit portion 98H Through-hole

Claims (5)

A plurality of electrode structures in which a surface electrode portion protruding from the surface of the insulating sheet and a back surface electrode portion exposed on the back surface are connected to the insulating sheet by a short-circuit portion extending in the thickness direction of the insulating sheet. Arranged according to the pattern corresponding to the inspection electrode,
The surface electrode portion in each of the electrode structures is formed by forming a metal bump on a thin plate electrode base layer. A plurality of electrode structures in which a surface electrode portion protruding from the surface of the insulating sheet and a back surface electrode portion exposed on the back surface are connected to the insulating sheet by a short-circuit portion extending in the thickness direction of the insulating sheet. A method for producing a sheet-like probe that is arranged according to a pattern corresponding to an inspection electrode, and in which the surface electrode portion in each of the electrode structures has a metal bump formed on a thin plate-like electrode base layer,
The insulating sheet, the surface side metal layer formed on the surface thereof, the back side metal layer formed on the back surface of the insulating sheet, and the insulating sheet formed according to the pattern corresponding to the electrode to be inspected. A composite sheet having a plurality of short-circuit portions extending through the thickness direction and connected to each of the front surface side metal layer and the back surface side metal layer,
A resist film having a plurality of pattern holes is formed on the surface-side metal layer in the composite sheet in accordance with a pattern corresponding to the metal bump, and the surface-side metal layer exposed through the pattern holes of the resist film is plated. Forming a plurality of metal bumps, and then etching the surface-side metal layer and the back-side metal layer in the composite sheet to form a metal on the electrode base layer composed of a part of the surface-side metal layer. A method for manufacturing a sheet-like probe, comprising: forming a plurality of front surface electrode portions formed with bumps and forming a back surface electrode portion made of a part of a back surface side metal layer.   A plurality of through holes are formed in the insulating sheet according to a pattern corresponding to the electrode to be inspected, and a thin metal layer is formed so as to cover the front surface, the back surface of the insulating sheet, and the inner wall surface of the through hole. The method according to claim 2, wherein the composite sheet is manufactured by performing an electrolytic plating process.   4. The method for manufacturing a sheet-like probe according to claim 2, wherein the metal bumps in the surface electrode portion have a diameter substantially the same as the diameter of the electrode base layer.   The method for manufacturing a sheet-like probe according to claim 2 or 3, wherein the metal bump in the surface electrode portion has a diameter smaller than that of the electrode base layer.

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