JP2013113849A - コンタクトフィルム、コンタクトフィルムの製造方法、プローブユニット及びｌｃｄパネル検査装置 - Google Patents

コンタクトフィルム、コンタクトフィルムの製造方法、プローブユニット及びｌｃｄパネル検査装置 Download PDF

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Publication number
JP2013113849A
JP2013113849A JP2012257533A JP2012257533A JP2013113849A JP 2013113849 A JP2013113849 A JP 2013113849A JP 2012257533 A JP2012257533 A JP 2012257533A JP 2012257533 A JP2012257533 A JP 2012257533A JP 2013113849 A JP2013113849 A JP 2013113849A
Authority
JP
Japan
Prior art keywords
base film
conductor
via hole
film
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012257533A
Other languages
English (en)
Japanese (ja)
Inventor
Kyu Hang Li
キュウハン リ
Son Mu Chong
ソンム チョン
Jong Han Li
ジョンハン リ
Hwan Sob Kuk
ハワンソォプ ク
Yong Ku Li
ヨンク リ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GigaLane Co Ltd
Original Assignee
GigaLane Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GigaLane Co Ltd filed Critical GigaLane Co Ltd
Publication of JP2013113849A publication Critical patent/JP2013113849A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2012257533A 2011-11-25 2012-11-26 コンタクトフィルム、コンタクトフィルムの製造方法、プローブユニット及びｌｃｄパネル検査装置 Pending JP2013113849A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2011-0124610 2011-11-25
KR20110124610 2011-11-25
KR10-2012-0062777 2012-06-12
KR1020120062777A KR101215375B1 (ko) 2011-11-25 2012-06-12 컨택트 필름, 상기 컨택트 필름의 제조방법, 프로브 유닛 및 ｌｃｄ 패널 검사장치

Publications (1)

Publication Number Publication Date
JP2013113849A true JP2013113849A (ja) 2013-06-10

Family

ID=47908231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012257533A Pending JP2013113849A (ja) 2011-11-25 2012-11-26 コンタクトフィルム、コンタクトフィルムの製造方法、プローブユニット及びｌｃｄパネル検査装置

Country Status (4)

Country Link
JP (1) JP2013113849A (ko)
KR (1) KR101215375B1 (ko)
CN (1) CN103134960B (ko)
TW (1) TWI461696B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101279952B1 (ko) 2013-03-26 2013-07-05 주식회사 기가레인 멀티레이어 컨택트 필름 및 그 제조 방법
KR101279951B1 (ko) * 2013-03-26 2013-07-05 주식회사 기가레인 컨택트 필름 및 그 제조 방법
CN104422800B (zh) * 2013-09-09 2017-11-21 宇德曼斯有限公司 用于测试具有微间距阵列的面板的探针单元
KR101490891B1 (ko) 2013-09-09 2015-02-06 주식회사 기가레인 풀컨택검사와 쇼팅바검사가 가능한 패널 검사용 프로브블럭
KR101617234B1 (ko) * 2014-07-09 2016-05-02 임근환 필름 관통형 범프를 형성한 전자부품의 특성 검사용 프로브
KR101558256B1 (ko) * 2015-05-18 2015-10-12 주식회사 기가레인 고정 가능한 프로브 핀 및 프로브 핀 고정 어셈블리
IT201700100522A1 (it) * 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
KR101835762B1 (ko) * 2017-09-29 2018-03-07 (주)위드멤스 과전류에 따른 합선이 방지되는 컨택트 필름 및 이의 제조 방법

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04174530A (ja) * 1989-11-30 1992-06-22 Hoya Corp 微小探針を有する回路基板およびその製造方法
JPH0758165A (ja) * 1991-12-28 1995-03-03 Hoya Corp 探針付き回路検査素子及びその製造方法
WO1998007216A1 (fr) * 1996-08-08 1998-02-19 Nitto Denko Corporation Film conducteur anisotrope et procede de fabrication
JPH11295344A (ja) * 1998-04-10 1999-10-29 Toppan Printing Co Ltd 半導体検査治具および半導体検査治具の製造方法
JP2002196018A (ja) * 2000-12-25 2002-07-10 Toppan Printing Co Ltd 検査治具及びその製造方法
JP2002343462A (ja) * 2001-05-10 2002-11-29 Fujitsu Ltd 異方導電性シート、その製造方法、接点構造体、電子装置及び動作試験用検査装置
JP2003017160A (ja) * 2001-07-02 2003-01-17 Shinozaki Seisakusho:Kk バンプ付き薄膜シートの製造方法
JP2003124272A (ja) * 2001-10-18 2003-04-25 Jsr Corp シート状コネクターおよびその製造方法並びにプローブ装置
JP2009244096A (ja) * 2008-03-31 2009-10-22 Jsr Corp シート状プローブおよびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100468065C (zh) * 2004-05-19 2009-03-11 Jsr株式会社 片状探针及其制造方法和应用
JP5065674B2 (ja) * 2006-12-28 2012-11-07 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP4584972B2 (ja) * 2007-10-17 2010-11-24 山一電機株式会社 プローブコンタクトの製造方法およびプローブコンタクト
JP2010276541A (ja) * 2009-05-29 2010-12-09 Renesas Electronics Corp 薄膜プローブシートおよびその製造方法、プローブカード、ならびに半導体チップ検査装置
KR20110082331A (ko) * 2010-01-11 2011-07-19 (주)유비프리시젼 필름 프로브

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04174530A (ja) * 1989-11-30 1992-06-22 Hoya Corp 微小探針を有する回路基板およびその製造方法
JPH0758165A (ja) * 1991-12-28 1995-03-03 Hoya Corp 探針付き回路検査素子及びその製造方法
WO1998007216A1 (fr) * 1996-08-08 1998-02-19 Nitto Denko Corporation Film conducteur anisotrope et procede de fabrication
JPH11295344A (ja) * 1998-04-10 1999-10-29 Toppan Printing Co Ltd 半導体検査治具および半導体検査治具の製造方法
JP2002196018A (ja) * 2000-12-25 2002-07-10 Toppan Printing Co Ltd 検査治具及びその製造方法
JP2002343462A (ja) * 2001-05-10 2002-11-29 Fujitsu Ltd 異方導電性シート、その製造方法、接点構造体、電子装置及び動作試験用検査装置
JP2003017160A (ja) * 2001-07-02 2003-01-17 Shinozaki Seisakusho:Kk バンプ付き薄膜シートの製造方法
JP2003124272A (ja) * 2001-10-18 2003-04-25 Jsr Corp シート状コネクターおよびその製造方法並びにプローブ装置
JP2009244096A (ja) * 2008-03-31 2009-10-22 Jsr Corp シート状プローブおよびその製造方法

Also Published As

Publication number Publication date
CN103134960B (zh) 2015-09-23
KR101215375B1 (ko) 2012-12-26
CN103134960A (zh) 2013-06-05
TWI461696B (zh) 2014-11-21
TW201331586A (zh) 2013-08-01

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