TWI461252B - A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component - Google Patents
A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component Download PDFInfo
- Publication number
- TWI461252B TWI461252B TW100147807A TW100147807A TWI461252B TW I461252 B TWI461252 B TW I461252B TW 100147807 A TW100147807 A TW 100147807A TW 100147807 A TW100147807 A TW 100147807A TW I461252 B TWI461252 B TW I461252B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- melting point
- metal member
- alloy
- bonding
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000002184 metal Substances 0.000 claims description 517
- 229910052751 metal Inorganic materials 0.000 claims description 517
- 238000002844 melting Methods 0.000 claims description 117
- 230000008018 melting Effects 0.000 claims description 114
- 239000000463 material Substances 0.000 claims description 103
- 229910000765 intermetallic Inorganic materials 0.000 claims description 83
- 229910045601 alloy Inorganic materials 0.000 claims description 68
- 239000000956 alloy Substances 0.000 claims description 68
- 229910017566 Cu-Mn Inorganic materials 0.000 claims description 22
- 229910017871 Cu—Mn Inorganic materials 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 22
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 19
- 238000005304 joining Methods 0.000 claims description 13
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 150000002739 metals Chemical class 0.000 claims description 11
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 229910013643 M-Sn Inorganic materials 0.000 claims description 4
- 229910013672 M—Sn Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052712 strontium Inorganic materials 0.000 claims description 3
- 229910052714 tellurium Inorganic materials 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 29
- 238000011156 evaluation Methods 0.000 description 25
- 238000005476 soldering Methods 0.000 description 22
- 230000035939 shock Effects 0.000 description 20
- 238000012360 testing method Methods 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 238000005259 measurement Methods 0.000 description 13
- 239000007769 metal material Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000010897 surface acoustic wave method Methods 0.000 description 5
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- 238000000113 differential scanning calorimetry Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- JQUCWIWWWKZNCS-LESHARBVSA-N C(C1=CC=CC=C1)(=O)NC=1SC[C@H]2[C@@](N1)(CO[C@H](C2)C)C=2SC=C(N2)NC(=O)C2=NC=C(C=C2)OC(F)F Chemical compound C(C1=CC=CC=C1)(=O)NC=1SC[C@H]2[C@@](N1)(CO[C@H](C2)C)C=2SC=C(N2)NC(=O)C2=NC=C(C=C2)OC(F)F JQUCWIWWWKZNCS-LESHARBVSA-N 0.000 description 2
- 229910017034 MnSn Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 description 1
- LFOIDLOIBZFWDO-UHFFFAOYSA-N 2-methoxy-6-[6-methoxy-4-[(3-phenylmethoxyphenyl)methoxy]-1-benzofuran-2-yl]imidazo[2,1-b][1,3,4]thiadiazole Chemical compound N1=C2SC(OC)=NN2C=C1C(OC1=CC(OC)=C2)=CC1=C2OCC(C=1)=CC=CC=1OCC1=CC=CC=C1 LFOIDLOIBZFWDO-UHFFFAOYSA-N 0.000 description 1
- 229940126062 Compound A Drugs 0.000 description 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 1
- 229910005887 NiSn Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229940125797 compound 12 Drugs 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010287782 | 2010-12-24 | ||
| JP2011159922 | 2011-07-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201233485A TW201233485A (en) | 2012-08-16 |
| TWI461252B true TWI461252B (zh) | 2014-11-21 |
Family
ID=46314012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100147807A TWI461252B (zh) | 2010-12-24 | 2011-12-21 | A bonding method, a bonding structure, an electronic device, an electronic device manufacturing method, and an electronic component |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9209527B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2656955B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP5664664B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101528515B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103167926B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI461252B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012086745A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6011734B2 (ja) * | 2014-01-07 | 2016-10-19 | 株式会社村田製作所 | 構造材接合方法および接合構造 |
| CN106233005B (zh) * | 2014-04-18 | 2018-09-28 | 株式会社村田制作所 | 粘附物的粘附分离方法、金属复合材料 |
| JP6287739B2 (ja) * | 2014-09-30 | 2018-03-07 | 株式会社村田製作所 | ステンドグラスの製造方法 |
| CN105081500B (zh) * | 2015-09-02 | 2017-02-22 | 哈尔滨工业大学 | 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法 |
| CN107848075B (zh) | 2015-09-15 | 2021-03-19 | 株式会社村田制作所 | 接合用构件、接合用构件的制造方法和接合方法 |
| JP6528852B2 (ja) | 2015-09-28 | 2019-06-12 | 株式会社村田製作所 | ヒートパイプ、放熱部品、ヒートパイプの製造方法 |
| JP6369640B2 (ja) * | 2015-11-05 | 2018-08-08 | 株式会社村田製作所 | 接合用部材、および、接合用部材の製造方法 |
| CN108430690B (zh) | 2016-02-01 | 2021-05-14 | 株式会社村田制作所 | 接合材料、使用该接合材料的接合方法和接合结构 |
| JP6621068B2 (ja) * | 2016-12-08 | 2019-12-18 | パナソニックＩｐマネジメント株式会社 | 実装構造体 |
| JP6355091B1 (ja) * | 2017-03-07 | 2018-07-11 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
| CN109983544A (zh) * | 2017-03-23 | 2019-07-05 | 积水化学工业株式会社 | 导电性粒子、导电材料以及连接结构体 |
| DE102017206932A1 (de) * | 2017-04-25 | 2018-10-25 | Siemens Aktiengesellschaft | Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils |
| JP6998557B2 (ja) * | 2017-09-29 | 2022-01-18 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
| CN108098172B (zh) * | 2017-12-01 | 2020-03-27 | 北京工业大学 | 一种实现Cu/Sn/Cu界面可逆连接的方法 |
| KR102574413B1 (ko) * | 2018-12-10 | 2023-09-04 | 삼성전기주식회사 | 코일 전자 부품 |
| US11581239B2 (en) * | 2019-01-18 | 2023-02-14 | Indium Corporation | Lead-free solder paste as thermal interface material |
| KR102148297B1 (ko) * | 2019-03-06 | 2020-08-26 | 성균관대학교산학협력단 | 이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법 |
| CN109822256B (zh) * | 2019-03-15 | 2021-08-06 | 南昌大学 | 一种低熔点In-Sn-Bi合金钎料及制备方法 |
| JP6803107B1 (ja) * | 2019-07-26 | 2020-12-23 | 株式会社日本スペリア社 | プリフォームはんだ及び該プリフォームはんだを用いて形成されたはんだ接合体 |
| WO2021045131A1 (ja) * | 2019-09-02 | 2021-03-11 | 株式会社日本スペリア社 | はんだペースト及びはんだ接合体 |
| CN113275787B (zh) * | 2020-01-31 | 2023-05-30 | 铟泰公司 | 作为热界面材料的无铅焊料膏 |
| JP7412532B2 (ja) * | 2020-03-06 | 2024-01-12 | 三菱電機株式会社 | 薄板状接合部材の製造方法、半導体装置の製造方法、ならびに、電力変換装置の製造方法 |
| JP6799701B1 (ja) * | 2020-03-12 | 2020-12-16 | 有限会社 ナプラ | 金属粒子 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI287264B (en) * | 2004-03-29 | 2007-09-21 | Intel Corp | Under bump metallization layer to enable use of high tin content solder bumps |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6371361B1 (en) * | 1996-02-09 | 2002-04-16 | Matsushita Electric Industrial Co., Ltd. | Soldering alloy, cream solder and soldering method |
| US5863493A (en) * | 1996-12-16 | 1999-01-26 | Ford Motor Company | Lead-free solder compositions |
| ES2224609T3 (es) * | 1998-03-26 | 2005-03-01 | Nihon Superior Sha Co., Ltd | Aleacion de soldadura exenta de plomo. |
| JP3414388B2 (ja) * | 2000-06-12 | 2003-06-09 | 株式会社日立製作所 | 電子機器 |
| JP3763520B2 (ja) * | 2000-12-25 | 2006-04-05 | Ｔｄｋ株式会社 | はんだ付け用組成物 |
| US6602777B1 (en) * | 2001-12-28 | 2003-08-05 | National Central University | Method for controlling the formation of intermetallic compounds in solder joints |
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| JP2003332731A (ja) * | 2002-05-09 | 2003-11-21 | Murata Mfg Co Ltd | Ｐｂフリー半田付け物品 |
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2011
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- 2011-12-22 CN CN201180049028.9A patent/CN103167926B/zh active Active
- 2011-12-22 EP EP11851801.8A patent/EP2656955B1/en active Active
- 2011-12-22 KR KR1020137007337A patent/KR101528515B1/ko active Active
- 2011-12-22 WO PCT/JP2011/079781 patent/WO2012086745A1/ja not_active Ceased
- 2011-12-22 JP JP2012549868A patent/JP5664664B2/ja active Active
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2013
- 2013-05-29 US US13/904,072 patent/US9209527B2/en active Active
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2014
- 2014-06-24 JP JP2014129244A patent/JP5907215B2/ja active Active
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- 2015-10-21 US US14/918,648 patent/US9614295B2/en active Active
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| TWI287264B (en) * | 2004-03-29 | 2007-09-21 | Intel Corp | Under bump metallization layer to enable use of high tin content solder bumps |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5907215B2 (ja) | 2016-04-26 |
| CN103167926B (zh) | 2016-03-09 |
| EP2656955A1 (en) | 2013-10-30 |
| US20160043480A1 (en) | 2016-02-11 |
| EP2656955A4 (en) | 2017-07-19 |
| CN103167926A (zh) | 2013-06-19 |
| JP2014223678A (ja) | 2014-12-04 |
| TW201233485A (en) | 2012-08-16 |
| KR20130077873A (ko) | 2013-07-09 |
| JP5664664B2 (ja) | 2015-02-04 |
| EP2656955B1 (en) | 2021-08-04 |
| US20130299236A1 (en) | 2013-11-14 |
| KR101528515B1 (ko) | 2015-06-12 |
| US9209527B2 (en) | 2015-12-08 |
| US9614295B2 (en) | 2017-04-04 |
| JPWO2012086745A1 (ja) | 2014-06-05 |
| WO2012086745A1 (ja) | 2012-06-28 |
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