JP2014223678A5 - - Google Patents
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- Publication number
- JP2014223678A5 JP2014223678A5 JP2014129244A JP2014129244A JP2014223678A5 JP 2014223678 A5 JP2014223678 A5 JP 2014223678A5 JP 2014129244 A JP2014129244 A JP 2014129244A JP 2014129244 A JP2014129244 A JP 2014129244A JP 2014223678 A5 JP2014223678 A5 JP 2014223678A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal member
- melting point
- low melting
- intermetallic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 438
- 229910052751 metal Inorganic materials 0.000 claims description 438
- 229910000765 intermetallic Inorganic materials 0.000 claims description 71
- 238000005304 joining Methods 0.000 claims description 50
- 229910045601 alloy Inorganic materials 0.000 claims description 49
- 239000000956 alloy Substances 0.000 claims description 49
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 14
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 10
- 229910013643 M-Sn Inorganic materials 0.000 claims description 4
- 229910013672 M—Sn Inorganic materials 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229910017566 Cu-Mn Inorganic materials 0.000 claims 1
- 229910017871 Cu—Mn Inorganic materials 0.000 claims 1
- 238000002844 melting Methods 0.000 description 112
- 230000008018 melting Effects 0.000 description 112
- 239000000463 material Substances 0.000 description 82
- 238000000034 method Methods 0.000 description 46
- 229910000679 solder Inorganic materials 0.000 description 31
- 238000011156 evaluation Methods 0.000 description 23
- 230000035939 shock Effects 0.000 description 21
- 238000012360 testing method Methods 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 17
- 238000005476 soldering Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 14
- 229910052718 tin Inorganic materials 0.000 description 14
- 239000007769 metal material Substances 0.000 description 13
- 150000002739 metals Chemical class 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 230000007547 defect Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910001128 Sn alloy Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- JQUCWIWWWKZNCS-LESHARBVSA-N C(C1=CC=CC=C1)(=O)NC=1SC[C@H]2[C@@](N1)(CO[C@H](C2)C)C=2SC=C(N2)NC(=O)C2=NC=C(C=C2)OC(F)F Chemical compound C(C1=CC=CC=C1)(=O)NC=1SC[C@H]2[C@@](N1)(CO[C@H](C2)C)C=2SC=C(N2)NC(=O)C2=NC=C(C=C2)OC(F)F JQUCWIWWWKZNCS-LESHARBVSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910017034 MnSn Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 description 1
- LFOIDLOIBZFWDO-UHFFFAOYSA-N 2-methoxy-6-[6-methoxy-4-[(3-phenylmethoxyphenyl)methoxy]-1-benzofuran-2-yl]imidazo[2,1-b][1,3,4]thiadiazole Chemical compound N1=C2SC(OC)=NN2C=C1C(OC1=CC(OC)=C2)=CC1=C2OCC(C=1)=CC=CC=1OCC1=CC=CC=C1 LFOIDLOIBZFWDO-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910005887 NiSn Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229940125797 compound 12 Drugs 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- -1 sample number 16 Chemical class 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014129244A JP5907215B2 (ja) | 2010-12-24 | 2014-06-24 | 接合構造および電子装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010287782 | 2010-12-24 | ||
| JP2010287782 | 2010-12-24 | ||
| JP2011159922 | 2011-07-21 | ||
| JP2011159922 | 2011-07-21 | ||
| JP2014129244A JP5907215B2 (ja) | 2010-12-24 | 2014-06-24 | 接合構造および電子装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012549868A Division JP5664664B2 (ja) | 2010-12-24 | 2011-12-22 | 接合方法、電子装置の製造方法、および電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014223678A JP2014223678A (ja) | 2014-12-04 |
| JP2014223678A5 true JP2014223678A5 (cg-RX-API-DMAC7.html) | 2015-02-05 |
| JP5907215B2 JP5907215B2 (ja) | 2016-04-26 |
Family
ID=46314012
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012549868A Active JP5664664B2 (ja) | 2010-12-24 | 2011-12-22 | 接合方法、電子装置の製造方法、および電子部品 |
| JP2014129244A Active JP5907215B2 (ja) | 2010-12-24 | 2014-06-24 | 接合構造および電子装置 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012549868A Active JP5664664B2 (ja) | 2010-12-24 | 2011-12-22 | 接合方法、電子装置の製造方法、および電子部品 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9209527B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2656955B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP5664664B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101528515B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103167926B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI461252B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2012086745A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6011734B2 (ja) * | 2014-01-07 | 2016-10-19 | 株式会社村田製作所 | 構造材接合方法および接合構造 |
| CN106233005B (zh) * | 2014-04-18 | 2018-09-28 | 株式会社村田制作所 | 粘附物的粘附分离方法、金属复合材料 |
| JP6287739B2 (ja) * | 2014-09-30 | 2018-03-07 | 株式会社村田製作所 | ステンドグラスの製造方法 |
| CN105081500B (zh) * | 2015-09-02 | 2017-02-22 | 哈尔滨工业大学 | 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法 |
| CN107848075B (zh) | 2015-09-15 | 2021-03-19 | 株式会社村田制作所 | 接合用构件、接合用构件的制造方法和接合方法 |
| JP6528852B2 (ja) | 2015-09-28 | 2019-06-12 | 株式会社村田製作所 | ヒートパイプ、放熱部品、ヒートパイプの製造方法 |
| JP6369640B2 (ja) * | 2015-11-05 | 2018-08-08 | 株式会社村田製作所 | 接合用部材、および、接合用部材の製造方法 |
| CN108430690B (zh) | 2016-02-01 | 2021-05-14 | 株式会社村田制作所 | 接合材料、使用该接合材料的接合方法和接合结构 |
| JP6621068B2 (ja) * | 2016-12-08 | 2019-12-18 | パナソニックＩｐマネジメント株式会社 | 実装構造体 |
| JP6355091B1 (ja) * | 2017-03-07 | 2018-07-11 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
| CN109983544A (zh) * | 2017-03-23 | 2019-07-05 | 积水化学工业株式会社 | 导电性粒子、导电材料以及连接结构体 |
| DE102017206932A1 (de) * | 2017-04-25 | 2018-10-25 | Siemens Aktiengesellschaft | Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils |
| JP6998557B2 (ja) * | 2017-09-29 | 2022-01-18 | パナソニックＩｐマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
| CN108098172B (zh) * | 2017-12-01 | 2020-03-27 | 北京工业大学 | 一种实现Cu/Sn/Cu界面可逆连接的方法 |
| KR102574413B1 (ko) * | 2018-12-10 | 2023-09-04 | 삼성전기주식회사 | 코일 전자 부품 |
| US11581239B2 (en) * | 2019-01-18 | 2023-02-14 | Indium Corporation | Lead-free solder paste as thermal interface material |
| KR102148297B1 (ko) * | 2019-03-06 | 2020-08-26 | 성균관대학교산학협력단 | 이종 금속 재료 간의 접합을 위한 천이액상소결접합 방법 |
| CN109822256B (zh) * | 2019-03-15 | 2021-08-06 | 南昌大学 | 一种低熔点In-Sn-Bi合金钎料及制备方法 |
| JP6803107B1 (ja) * | 2019-07-26 | 2020-12-23 | 株式会社日本スペリア社 | プリフォームはんだ及び該プリフォームはんだを用いて形成されたはんだ接合体 |
| WO2021045131A1 (ja) * | 2019-09-02 | 2021-03-11 | 株式会社日本スペリア社 | はんだペースト及びはんだ接合体 |
| CN113275787B (zh) * | 2020-01-31 | 2023-05-30 | 铟泰公司 | 作为热界面材料的无铅焊料膏 |
| JP7412532B2 (ja) * | 2020-03-06 | 2024-01-12 | 三菱電機株式会社 | 薄板状接合部材の製造方法、半導体装置の製造方法、ならびに、電力変換装置の製造方法 |
| JP6799701B1 (ja) * | 2020-03-12 | 2020-12-16 | 有限会社 ナプラ | 金属粒子 |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6371361B1 (en) * | 1996-02-09 | 2002-04-16 | Matsushita Electric Industrial Co., Ltd. | Soldering alloy, cream solder and soldering method |
| US5863493A (en) * | 1996-12-16 | 1999-01-26 | Ford Motor Company | Lead-free solder compositions |
| ES2224609T3 (es) * | 1998-03-26 | 2005-03-01 | Nihon Superior Sha Co., Ltd | Aleacion de soldadura exenta de plomo. |
| JP3414388B2 (ja) * | 2000-06-12 | 2003-06-09 | 株式会社日立製作所 | 電子機器 |
| JP3763520B2 (ja) * | 2000-12-25 | 2006-04-05 | Ｔｄｋ株式会社 | はんだ付け用組成物 |
| US6602777B1 (en) * | 2001-12-28 | 2003-08-05 | National Central University | Method for controlling the formation of intermetallic compounds in solder joints |
| JP2003211289A (ja) * | 2002-01-21 | 2003-07-29 | Fujitsu Ltd | 導電性接合材料、それを用いた接合方法及び電子機器 |
| JP2003332731A (ja) * | 2002-05-09 | 2003-11-21 | Murata Mfg Co Ltd | Ｐｂフリー半田付け物品 |
| JP4071049B2 (ja) * | 2002-06-18 | 2008-04-02 | 松下電器産業株式会社 | 鉛フリー半田ペースト |
| JP4271684B2 (ja) * | 2003-10-24 | 2009-06-03 | 日鉱金属株式会社 | ニッケル合金スパッタリングターゲット及びニッケル合金薄膜 |
| US7064446B2 (en) * | 2004-03-29 | 2006-06-20 | Intel Corporation | Under bump metallization layer to enable use of high tin content solder bumps |
| JP2005288458A (ja) * | 2004-03-31 | 2005-10-20 | Toshiba Corp | 接合体、半導体装置、接合方法、及び半導体装置の製造方法 |
| WO2006075459A1 (ja) * | 2005-01-11 | 2006-07-20 | Murata Manufacturing Co., Ltd | はんだペースト、及び電子装置 |
| JP4344707B2 (ja) * | 2005-02-24 | 2009-10-14 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
| JP4501818B2 (ja) * | 2005-09-02 | 2010-07-14 | 日立電線株式会社 | 銅合金材およびその製造方法 |
| CN101479073B (zh) * | 2006-04-26 | 2013-09-18 | 千住金属工业株式会社 | 焊膏 |
| WO2008026335A1 (fr) | 2006-09-01 | 2008-03-06 | Murata Manufacturing Co., Ltd. | Dispositif de pièce électronique ainsi que son procédé de fabrication et ensemble de pièce électronique ainsi que son procédé de fabrication |
| EP2157605B1 (en) | 2007-06-04 | 2016-07-13 | Murata Manufacturing Co. Ltd. | Electronic part apparatus and process for manufacturing the same |
| KR101406174B1 (ko) * | 2007-06-18 | 2014-06-12 | 엠케이전자 주식회사 | 주석, 은 및 비스무스를 함유하는 무연솔더 |
| WO2009051181A1 (ja) * | 2007-10-19 | 2009-04-23 | Nihon Superior Sha Co., Ltd. | 無鉛はんだ合金 |
| EP2221390B1 (en) * | 2007-11-01 | 2014-06-18 | The Furukawa Electric Co., Ltd. | Method for producing a copper alloy sheet excellent in strength, bending workability and stress relaxation resistance |
| JP5169354B2 (ja) * | 2008-03-18 | 2013-03-27 | 富士通株式会社 | 接合材料及びそれを用いた接合方法 |
| JP5584909B2 (ja) * | 2008-11-28 | 2014-09-10 | 株式会社弘輝 | 接続構造体 |
| KR101276147B1 (ko) * | 2009-09-03 | 2013-06-18 | 가부시키가이샤 무라타 세이사쿠쇼 | 솔더 페이스트, 그것을 사용한 접합 방법, 및 접합 구조 |
| EP2641689B1 (en) * | 2010-11-19 | 2016-06-29 | Murata Manufacturing Co., Ltd. | Electroconductive material, method of connection with same, and connected structure |
-
2011
- 2011-12-21 TW TW100147807A patent/TWI461252B/zh active
- 2011-12-22 CN CN201180049028.9A patent/CN103167926B/zh active Active
- 2011-12-22 EP EP11851801.8A patent/EP2656955B1/en active Active
- 2011-12-22 KR KR1020137007337A patent/KR101528515B1/ko active Active
- 2011-12-22 WO PCT/JP2011/079781 patent/WO2012086745A1/ja not_active Ceased
- 2011-12-22 JP JP2012549868A patent/JP5664664B2/ja active Active
-
2013
- 2013-05-29 US US13/904,072 patent/US9209527B2/en active Active
-
2014
- 2014-06-24 JP JP2014129244A patent/JP5907215B2/ja active Active
-
2015
- 2015-10-21 US US14/918,648 patent/US9614295B2/en active Active
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