TWI458408B - Substrate manufacturing apparatus and substrate manufacturing method - Google Patents

Substrate manufacturing apparatus and substrate manufacturing method Download PDF

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Publication number
TWI458408B
TWI458408B TW101126823A TW101126823A TWI458408B TW I458408 B TWI458408 B TW I458408B TW 101126823 A TW101126823 A TW 101126823A TW 101126823 A TW101126823 A TW 101126823A TW I458408 B TWI458408 B TW I458408B
Authority
TW
Taiwan
Prior art keywords
substrate
station
coating station
coating
film pattern
Prior art date
Application number
TW101126823A
Other languages
English (en)
Chinese (zh)
Other versions
TW201322853A (zh
Inventor
Yasuhito Nakamori
Keiji Iso
Yuji Okamoto
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW201322853A publication Critical patent/TW201322853A/zh
Application granted granted Critical
Publication of TWI458408B publication Critical patent/TWI458408B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101126823A 2011-07-27 2012-07-25 Substrate manufacturing apparatus and substrate manufacturing method TWI458408B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011164874 2011-07-27
JP2011175170 2011-08-10

Publications (2)

Publication Number Publication Date
TW201322853A TW201322853A (zh) 2013-06-01
TWI458408B true TWI458408B (zh) 2014-10-21

Family

ID=47601007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101126823A TWI458408B (zh) 2011-07-27 2012-07-25 Substrate manufacturing apparatus and substrate manufacturing method

Country Status (5)

Country Link
JP (1) JP5714110B2 (ja)
KR (3) KR20140024953A (ja)
CN (2) CN110099513B (ja)
TW (1) TWI458408B (ja)
WO (1) WO2013015157A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6112898B2 (ja) * 2013-02-20 2017-04-12 住友重機械工業株式会社 基板製造装置
JP6247950B2 (ja) * 2014-02-12 2017-12-13 矢崎総業株式会社 プライマ塗布方法及びプライマ塗布装置
CN105499069B (zh) * 2014-10-10 2019-03-08 住友重机械工业株式会社 膜形成装置及膜形成方法
JP6605876B2 (ja) * 2015-08-11 2019-11-13 東京応化工業株式会社 レジストパターン形成装置およびレジストパターン形成方法
CN105188277B (zh) * 2015-09-21 2017-12-08 迅得机械（东莞）有限公司 一种板件自动翻转插框装置
WO2017057374A1 (ja) * 2015-09-30 2017-04-06 住友金属鉱山株式会社 有機被膜の製造方法、導電性基板の製造方法、有機被膜製造装置
JP6652426B2 (ja) * 2016-03-29 2020-02-26 東レエンジニアリング株式会社 連続塗布装置及び連続塗布方法
JP6723648B2 (ja) * 2016-07-27 2020-07-15 住友重機械工業株式会社 位置検出装置及び位置検出方法
CN106067436A (zh) * 2016-08-01 2016-11-02 江苏宇天港玻新材料有限公司 一种基于同步带传送的基片材料输送装置
KR101954917B1 (ko) * 2018-09-12 2019-03-06 (주)에이피텍 카메라 모듈 제작용 양면 트레이를 이용한 카메라 모듈 양면 디스펜싱 시스템
KR102205125B1 (ko) * 2019-09-17 2021-01-19 연세대학교 산학협력단 베젤리스 표시 장치의 배선 인쇄 장치 및 표시 장치
US11878532B2 (en) 2021-05-11 2024-01-23 Applied Materials, Inc. Inkjet platform for fabrication of optical films and structures

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW411746B (en) * 1998-03-27 2000-11-11 Kansai Paint Co Ltd Resist layer formation method and printed circuit board manufacturing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824230A1 (de) * 1988-07-16 1990-01-25 Spiess Gmbh G Vorrichtung zum transport von werkstuecken
JP2001506804A (ja) * 1996-12-16 2001-05-22 バンティコ アクチエンゲゼルシャフト 基板の塗布のための方法および装置
CN1240567A (zh) * 1996-12-16 2000-01-05 希巴特殊化学控股公司 用于向板涂料的方法和装置
JP2001185833A (ja) * 1999-12-27 2001-07-06 Ibiden Co Ltd 多層プリント配線板の製造方法及び製造装置
JP4386430B2 (ja) * 2004-04-07 2009-12-16 東京エレクトロン株式会社 塗布膜形成装置
JPWO2006011548A1 (ja) * 2004-07-30 2008-05-01 日立化成工業株式会社 感光性フィルム、感光性フィルム積層体及び感光性フィルムロール
ITMI20061960A1 (it) * 2006-10-13 2008-04-14 Cedal Equipment Srl Macchina automatica di allineamento ottico e fissaggio induttivo degli strati di un multistrato a circuito stampato in forma di semilavorato
KR100872565B1 (ko) * 2006-10-25 2008-12-08 삼성전기주식회사 인쇄회로기판 제조방법
EP2073620A1 (de) * 2007-12-18 2009-06-24 Siemens Aktiengesellschaft Substrat-Transportvorrichtung für einen Bestückautomaten
JP5096972B2 (ja) * 2008-03-19 2012-12-12 株式会社ミマキエンジニアリング インクジェットプリンタ、印刷ユニットおよびその印刷方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW411746B (en) * 1998-03-27 2000-11-11 Kansai Paint Co Ltd Resist layer formation method and printed circuit board manufacturing method

Also Published As

Publication number Publication date
KR20160044587A (ko) 2016-04-25
JPWO2013015157A1 (ja) 2015-02-23
KR102061315B1 (ko) 2019-12-31
CN110099513A (zh) 2019-08-06
WO2013015157A1 (ja) 2013-01-31
TW201322853A (zh) 2013-06-01
JP5714110B2 (ja) 2015-05-07
KR20140024953A (ko) 2014-03-03
CN103718661A (zh) 2014-04-09
CN110099513B (zh) 2022-02-18
KR20180033598A (ko) 2018-04-03

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