TWI440124B - A placing device, a plasma processing device, and a plasma processing method - Google Patents

A placing device, a plasma processing device, and a plasma processing method Download PDF

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Publication number
TWI440124B
TWI440124B TW096141619A TW96141619A TWI440124B TW I440124 B TWI440124 B TW I440124B TW 096141619 A TW096141619 A TW 096141619A TW 96141619 A TW96141619 A TW 96141619A TW I440124 B TWI440124 B TW I440124B
Authority
TW
Taiwan
Prior art keywords
layer
plasma
electrostatic chuck
mounting device
carrier
Prior art date
Application number
TW096141619A
Other languages
English (en)
Chinese (zh)
Other versions
TW200837874A (en
Inventor
伊藤弘治
加藤健一
上田雄大
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW200837874A publication Critical patent/TW200837874A/zh
Application granted granted Critical
Publication of TWI440124B publication Critical patent/TWI440124B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts

Landscapes

  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Coating By Spraying Or Casting (AREA)
TW096141619A 2006-11-06 2007-11-05 A placing device, a plasma processing device, and a plasma processing method TWI440124B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006300923A JP4992389B2 (ja) 2006-11-06 2006-11-06 載置装置、プラズマ処理装置及びプラズマ処理方法

Publications (2)

Publication Number Publication Date
TW200837874A TW200837874A (en) 2008-09-16
TWI440124B true TWI440124B (zh) 2014-06-01

Family

ID=39405226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096141619A TWI440124B (zh) 2006-11-06 2007-11-05 A placing device, a plasma processing device, and a plasma processing method

Country Status (4)

Country Link
JP (1) JP4992389B2 (https=)
KR (1) KR100964040B1 (https=)
CN (1) CN100543960C (https=)
TW (1) TWI440124B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8734664B2 (en) 2008-07-23 2014-05-27 Applied Materials, Inc. Method of differential counter electrode tuning in an RF plasma reactor
US20100018648A1 (en) * 2008-07-23 2010-01-28 Applied Marterials, Inc. Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
US8206829B2 (en) * 2008-11-10 2012-06-26 Applied Materials, Inc. Plasma resistant coatings for plasma chamber components
JP5390846B2 (ja) 2008-12-09 2014-01-15 東京エレクトロン株式会社 プラズマエッチング装置及びプラズマクリーニング方法
JP5642531B2 (ja) * 2010-12-22 2014-12-17 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2012204644A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
JP6014408B2 (ja) * 2012-08-07 2016-10-25 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
JP6071514B2 (ja) * 2012-12-12 2017-02-01 東京エレクトロン株式会社 静電チャックの改質方法及びプラズマ処理装置
KR101385950B1 (ko) * 2013-09-16 2014-04-16 주식회사 펨빅스 정전척 및 정전척 제조 방법
KR101598465B1 (ko) 2014-09-30 2016-03-02 세메스 주식회사 기판 처리 장치 및 방법
TWI593473B (zh) * 2015-10-28 2017-08-01 漢辰科技股份有限公司 清潔靜電吸盤的方法
KR101842124B1 (ko) 2016-05-27 2018-03-27 세메스 주식회사 지지 유닛, 기판 처리 장치 및 기판 처리 방법
JP6854600B2 (ja) * 2016-07-15 2021-04-07 東京エレクトロン株式会社 プラズマエッチング方法、プラズマエッチング装置、および基板載置台
CN108281342B (zh) * 2017-01-05 2020-01-21 东京毅力科创株式会社 等离子体处理装置
JP7038497B2 (ja) * 2017-07-07 2022-03-18 東京エレクトロン株式会社 静電チャックの製造方法
JP7224096B2 (ja) * 2017-07-13 2023-02-17 東京エレクトロン株式会社 プラズマ処理装置用部品の溶射方法及びプラズマ処理装置用部品
JP6768946B2 (ja) * 2017-10-17 2020-10-14 株式会社アルバック 被処理体の処理装置
JP2019151879A (ja) * 2018-03-01 2019-09-12 株式会社アルバック 成膜装置
CN111383986B (zh) * 2018-12-27 2024-11-29 东京毅力科创株式会社 基板载置台及基板处理装置
JP7401266B2 (ja) 2018-12-27 2023-12-19 東京エレクトロン株式会社 基板載置台、及び、基板処理装置
KR102370471B1 (ko) * 2019-02-08 2022-03-03 주식회사 히타치하이테크 플라스마 처리 장치
CN113454761B (zh) 2019-03-01 2024-11-08 日本发条株式会社 载物台以及载物台的制造方法
JP7204564B2 (ja) * 2019-03-29 2023-01-16 東京エレクトロン株式会社 プラズマ処理装置
CN112553592B (zh) * 2019-09-25 2023-03-31 中微半导体设备(上海)股份有限公司 一种利用ald工艺对静电吸盘进行处理的方法
CN114308907B (zh) * 2022-02-23 2023-11-28 深圳市震华等离子体智造有限公司 一种用于精密分析仪器的等离子清洗装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4104386B2 (ja) * 2002-06-24 2008-06-18 太平洋セメント株式会社 静電チャックの製造方法
JP2005012144A (ja) * 2003-06-23 2005-01-13 Kyocera Corp 静電チャック
JP2005072286A (ja) * 2003-08-25 2005-03-17 Kyocera Corp 静電チャック
JP2006019626A (ja) * 2004-07-05 2006-01-19 Tokyo Electron Ltd プラズマ処理装置及びその洗浄方法
JP4642528B2 (ja) * 2005-03-31 2011-03-02 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法

Also Published As

Publication number Publication date
JP4992389B2 (ja) 2012-08-08
JP2008117982A (ja) 2008-05-22
KR100964040B1 (ko) 2010-06-16
CN100543960C (zh) 2009-09-23
KR20080041116A (ko) 2008-05-09
CN101179045A (zh) 2008-05-14
TW200837874A (en) 2008-09-16

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