JP7401266B2 - 基板載置台、及び、基板処理装置 - Google Patents
基板載置台、及び、基板処理装置 Download PDFInfo
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- JP7401266B2 JP7401266B2 JP2019203311A JP2019203311A JP7401266B2 JP 7401266 B2 JP7401266 B2 JP 7401266B2 JP 2019203311 A JP2019203311 A JP 2019203311A JP 2019203311 A JP2019203311 A JP 2019203311A JP 7401266 B2 JP7401266 B2 JP 7401266B2
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- 239000000758 substrate Substances 0.000 title claims description 163
- 239000010410 layer Substances 0.000 claims description 373
- 229920005989 resin Polymers 0.000 claims description 96
- 239000011347 resin Substances 0.000 claims description 96
- 239000000463 material Substances 0.000 claims description 40
- 239000000919 ceramic Substances 0.000 claims description 23
- 239000011247 coating layer Substances 0.000 claims description 23
- 229920002050 silicone resin Polymers 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000009719 polyimide resin Substances 0.000 claims description 9
- 239000008187 granular material Substances 0.000 claims description 3
- 239000011236 particulate material Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 42
- 230000004048 modification Effects 0.000 description 34
- 238000012986 modification Methods 0.000 description 34
- 239000012790 adhesive layer Substances 0.000 description 29
- 238000010586 diagram Methods 0.000 description 24
- 238000009413 insulation Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000003746 surface roughness Effects 0.000 description 10
- 239000003507 refrigerant Substances 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 3
- 238000007750 plasma spraying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 238000005524 ceramic coating Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C23C4/134—Plasma spraying
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- H01L21/67063—Apparatus for fluid treatment for etching
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Description
Claims (9)
- 基台と、
前記基台の上に配置された静電チャックとを備え、
前記静電チャックは、
前記基台上に配置された積層体と、
前記積層体を覆う第1の被覆層と、
前記第1の被覆層を覆うセラミック製の第2の被覆層とを含み、
前記積層体は、
第1の絶縁層と、
第2の絶縁層と、
前記第1の絶縁層と前記第2の絶縁層との間に配置された電極層であって、前記第1の絶縁層及び前記第2の絶縁層の一方又は双方により覆われる、前記電極層とを含み、
前記基台は、上面及び側面を有する導電性部材と、前記導電性部材の側面を覆う絶縁壁とを含み、
前記第1の絶縁層は、前記導電性部材の上面に渡って配置され、前記絶縁壁まで延在し、
前記第1の被覆層は、前記積層体の側面から外方に延在する延長端部を含み、
前記延長端部は、下面及び傾斜上面を有し、
前記下面は、前記絶縁壁に接しており、
前記傾斜上面は、前記第2の被覆層に接している、
基板支持体。 - 前記傾斜上面は、前記下面に対して45°以下で傾斜している、
請求項1に記載の基板支持体。 - 前記積層体を取り囲む絶縁環をさらに備える、
請求項1に記載の基板支持体。 - 前記基台の上部に配置される追加絶縁層をさらに備え、
前記絶縁環は、前記積層体の側面と前記追加絶縁層に接している、
請求項3に記載の基板支持体。 - 前記第1の絶縁層は、セラミック、またはポリイミド樹脂、シリコーン樹脂、エポキシ樹脂及びアクリル樹脂からなる群から選ばれたいずれかの樹脂である、
請求項1に記載の基板支持体。 - 前記第2の絶縁層は、ポリイミド樹脂、シリコーン樹脂、エポキシ樹脂及びアクリル樹脂からなる群から選ばれたいずれかの樹脂である、
請求項1に記載の基板支持体。 - 基台と、
前記基台の上に配置された静電チャックとを備え、
前記静電チャックは、
前記基台上に配置された積層体と、
前記積層体を覆う第1の被覆層と、
前記第1の被覆層を覆うセラミック製の第2の被覆層とを含み、
前記積層体は、
第1の絶縁層と、
第2の絶縁層と、
前記第1の絶縁層と前記第2の絶縁層との間に配置された電極層であって、前記第1の絶縁層及び前記第2の絶縁層の一方又は双方により覆われる、前記電極層とを含み、
前記第1の被覆層は、基材と該基材中に分散した粒状材料とを含み、
前記粒状材料の少なくとも一部は、前記第2の絶縁層及び前記第2の被覆層に接している、
基板支持体。 - 前記基材は、シリコーン樹脂を含有し、
前記粒状材料は、セラミックを含有する、
請求項7に記載の基板支持体。 - プラズマ処理チャンバと、
前記プラズマ処理チャンバ内に配置された基板支持部であって、
基台と、
前記基台の上に配置された静電チャックとを備え、
前記静電チャックは、
前記基台上に配置された積層体と、
前記積層体を覆う第1の被覆層と、
前記第1の被覆層を覆うセラミック製の第2の被覆層とを含み、
前記積層体は、
第1の絶縁層と、
第2の絶縁層と、
前記第1の絶縁層と前記第2の絶縁層との間に配置された電極層であって、前記第1の絶縁層及び前記第2の絶縁層の一方又は双方により覆われる、前記電極層とを含む、前記基板支持部と、
前記基台に電気的に接続され、3MHz以下の周波数を有する高周波電力を生成するように構成された高周波電源とを備え、
前記基台は、上面及び側面を有する導電性部材と、前記導電性部材の側面を覆う絶縁壁とを含み、
前記第1の絶縁層は、前記導電性部材の上面に渡って配置され、前記絶縁壁まで延在し、
前記第1の被覆層は、前記積層体の側面から外方に延在する延長端部を含み、
前記延長端部は、下面及び傾斜上面を有し、
前記下面は、前記絶縁壁に接しており、
前記傾斜上面は、前記第2の被覆層に接している、
プラズマ処理装置。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000286332A (ja) | 1999-03-31 | 2000-10-13 | Shibaura Mechatronics Corp | ドライエッチング用静電チャック装置及び載置台 |
WO2008053934A1 (fr) | 2006-10-31 | 2008-05-08 | Tomoegawa Co., Ltd. | Mandrin électrostatique |
JP2013502721A (ja) | 2009-08-21 | 2013-01-24 | コミコ株式会社 | 静電チャック及びその製造方法 |
WO2016158110A1 (ja) | 2015-03-31 | 2016-10-06 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP7335732B2 (ja) | 2019-06-27 | 2023-08-30 | 株式会社日本トリム | プリント配線基板 |
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TW541586B (en) * | 2001-05-25 | 2003-07-11 | Tokyo Electron Ltd | Substrate table, production method therefor and plasma treating device |
JP4992389B2 (ja) | 2006-11-06 | 2012-08-08 | 東京エレクトロン株式会社 | 載置装置、プラズマ処理装置及びプラズマ処理方法 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000286332A (ja) | 1999-03-31 | 2000-10-13 | Shibaura Mechatronics Corp | ドライエッチング用静電チャック装置及び載置台 |
WO2008053934A1 (fr) | 2006-10-31 | 2008-05-08 | Tomoegawa Co., Ltd. | Mandrin électrostatique |
JP2013502721A (ja) | 2009-08-21 | 2013-01-24 | コミコ株式会社 | 静電チャック及びその製造方法 |
WO2016158110A1 (ja) | 2015-03-31 | 2016-10-06 | 住友大阪セメント株式会社 | 静電チャック装置 |
JP7335732B2 (ja) | 2019-06-27 | 2023-08-30 | 株式会社日本トリム | プリント配線基板 |
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