JP2005228973A - 溶射部材、電極、およびプラズマ処理装置 - Google Patents
溶射部材、電極、およびプラズマ処理装置 Download PDFInfo
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Abstract
【解決手段】母材31と、母材31の下面に設けられた絶縁性セラミックスからなる溶射被膜33と、母材31と溶射被膜33との間に設けられ、これらの間の結合力を高める金属製の中間層32とを有し、母材31は、導電性材料からなるベース部31aと、下面の一部を含むように設けられた誘電体部31bとを有し、中間層32は、互いに孤立した複数の島状部位32aからなる。
【選択図】図2
Description
図1は、本発明の一実施形態に係る電極を上部電極として適用したRIEプラズマエッチング装置を示す断面図である。このエッチング装置は、気密に構成され、小径の上部1aと大径の下部1bとからなる段つき円筒状をなし、壁部が例えばアルミニウム製のチャンバー(処理容器)1を有している。
上部電極9は、図2にその断面を拡大して示すように、上部電極9は、母材31の表面である下面に金属製の中間層であるボンドコート層32および絶縁セラミックスからなる溶射被膜33がその順で形成されて構成されている。
と表すことができる。
上記上部電極9において、母材31として、Al等の金属からなるベース部31aと、誘電体部31bとを、例えば図7に示すように、これらの間に熱伝導シート35を配置して、ねじ34で締結したものを用いたが、この場合には以下のような問題点がある。
1.ベース部31aを構成する金属の熱膨張係数が誘電体部31bの誘電体に比較して大きく、高温においてこれらの間の機械的誤差が生じやすい。
2.ねじで締結する場合には、破損の危険があるため、ねじに大きなトルクをかけられないため導入ガスのリークが生じやすく、また寸法誤差や取り付け誤差が発生しやすい。シリコーンゴム等の熱伝導性シートを使用して誤差を吸収することができるが、完全には吸収されず、むしろ高温での使用で経時劣化しやすい、ガス吐出孔から到達するプラズマに対する耐性が低い、熱抵抗になりやすいため、誘電体部の熱衝撃破壊を引き起こしやすく、表面温度分布性均一性も低い等の不都合が生じる。
3.ベース部31aと、誘電体部31bとをねじ止めする場合には、両者に隙間が生じるため、溶射面にも隙間が存在し、その部分の耐プラズマ性や異常放電発生が懸念される。
まず、ベース部31a′の前駆体である多孔質セラミックス41にスペーサー42で一定間隔をあけて誘電体部31bを配置する(図9の(a))。この際に、スリーブ38は予め配置しておく(図9では図示せず)。次いで、溶融金属をガス圧等で加圧して多孔質セラミックス41に含浸させる(図9の(b))。溶融金属が多孔質セラミックス41に行き渡った後も溶融金属の加圧を続け、溶融金属を溶融金属が含浸された多孔質セラミックス41′と誘電体部31bとの間に充填させ、接合層43とする(図9の(c))。その後、冷却して含浸金属からなる接合層43でベース部31a′と誘電体部31bとからなる母材31を得る(図9の(d))。
2;支持テーブル(下部電極,第2の電極)
8;シャワーヘッド(処理ガス導入手段)
9;上部電極(第1の電極)
10;ガス吐出孔
17;第1の高周波電源(プラズマ生成手段)
31;母材
31a,31a′;ベース部
31b;誘電体部
32;ボンドコート層(中間層)
32a;島状部位
33;溶射被膜
37;金属ロウ
38;スリーブ
41;多孔質セラミックス
42;スペーサー
43;接合層
W;半導体ウエハ(被処理体)
Claims (14)
- 少なくとも表面の一部が誘電体からなる母材と、前記母材の前記表面に形成された絶縁性セラミックスからなる溶射被膜と、前記母材と前記溶射被膜との間に設けられ、これらの間の結合力を高める金属製の中間層とを有し、前記溶射被膜形成部位が高周波プラズマ雰囲気に曝される溶射部材であって、前記中間層は、互いに孤立した複数の島状部位からなることを特徴とする溶射部材。
- 前記中間層の隣接する島状部位の間隔が、プラズマを生成する高周波電力のスキンデプスより小さいことを特徴とする請求項1に記載の溶射部材。
- 母材と、前記母材の表面に設けられた絶縁性セラミックスからなる溶射被膜と、前記母材と前記溶射被膜との間に設けられ、これらの間の結合力を高める金属製の中間層とを有し、前記母材は、導電性材料からなるベース部と、前記表面の一部を含むように設けられた誘電体部とを有し、前記溶射被膜側に高周波プラズマを形成するための電極であって、前記中間層は、互いに孤立した複数の島状部位からなることを特徴とする電極。
- 前記中間層の隣接する島状部位の間隔が、プラズマを生成する高周波電力のスキンデプスより小さいことを特徴とする請求項3に記載の電極。
- 前記ベース部は金属からなることを特徴とする請求項3または請求項4に記載の電極。
- 前記ベース部は金属−セラミックス複合材料からなることを特徴とする請求項3または請求項4に記載の電極。
- 前記ベース部を構成する金属−セラミックス複合材料は、多孔質セラミックスに金属を含浸させたものであることを特徴とする請求項6に記載の電極。
- 前記ベース部と前記誘電体部とは金属ロウで接合されていることを特徴とする請求項6または請求項7に記載の電極。
- 前記ベース部と前記誘電体部とは、前記ベース部に含浸させた金属をそれらの間に充填させることにより接合されていることを特徴とする請求項7に記載の電極。
- 前記母材、前記中間層、および前記溶射被膜を貫通する複数のガス吐出孔を有し、前記ガス吐出孔の周囲に誘電体からなるスリーブが設けられていることを特徴とする請求項3から請求項9のいずれか1項に記載の電極。
- 被処理体が収容され、減圧下に保持されるチャンバーと、
前記チャンバー内に相対向するように設けられた第1および第2の電極と、
減圧下に保持されたチャンバー内に処理ガスを導入する処理ガス導入手段と、
前記第1および第2の電極間に高周波電界を形成して前記処理ガスのプラズマを生成するプラズマ生成手段と
を具備し、このプラズマにより被処理基板に所定のプラズマ処理を施すプラズマ処理装置であって、
前記第1および第2の電極の少なくとも一方が、母材と、前記母材の表面に設けられた絶縁性セラミックスからなる溶射被膜と、前記母材と前記溶射被膜との間に設けられ、これらの間の結合力を高める金属製の中間層とを有し、前記母材は、導電性材料からなるベース部と、前記表面の一部を含むように設けられた誘電体部とを有し、前記中間層は、互いに孤立した複数の島状部位からなることを特徴とするプラズマ処理装置。 - 前記第1の電極および第2の電極は上下に対向し、それぞれ上部電極および下部電極として機能し、前記第2の電極に被処理体が載置され、前記プラズマ生成手段は前記第2の電極に高周波電力を印加する高周波電源を有し、前記第1の電極が、母材と、前記母材の表面に設けられた絶縁性セラミックスからなる溶射被膜と、前記母材と前記溶射被膜との間に設けられ、これらの間の結合力を高める金属製の中間層とを有し、前記母材は、導電性材料からなるベース部と、前記表面の一部を含むように設けられた誘電体部とを有し、前記中間層は、互いに孤立した複数の島状部位からなることを特徴とする請求項11に記載のプラズマ処理装置。
- 前記処理ガス導入手段は多数の孔からガスを吐出するシャワーヘッドを有し、前記第1の電極は、前記シャワーヘッドの下面のシャワー板として機能し、多数のガス吐出孔が形成されていることを特徴とする請求項12に記載のプラズマ処理装置。
- 前記中間層の隣接する島状部位の間隔が、プラズマを生成する高周波電力のスキンデプスより小さいことを特徴とする請求項11から請求項13のいずれか1項に記載のプラズマ処理装置。
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US11/055,058 US7331307B2 (en) | 2004-02-13 | 2005-02-11 | Thermally sprayed member, electrode and plasma processing apparatus using the electrode |
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Cited By (18)
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JP2007194507A (ja) * | 2006-01-20 | 2007-08-02 | Tokyo Electron Ltd | プラズマ発生用の電極及びプラズマ処理装置 |
KR100754363B1 (ko) | 2005-12-29 | 2007-08-31 | 코리아세미텍 주식회사 | 웨이퍼 에칭용 전극 |
KR100754364B1 (ko) | 2005-12-29 | 2007-08-31 | 코리아세미텍 주식회사 | 웨이퍼 에칭용 전극 |
KR100754362B1 (ko) | 2005-12-29 | 2007-08-31 | 코리아세미텍 주식회사 | 웨이퍼 에칭용 전극 |
JP2008042115A (ja) * | 2006-08-10 | 2008-02-21 | Tokyo Electron Ltd | プラズマ処理装置用の載置台及びプラズマ処理装置 |
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JP2012069867A (ja) * | 2010-09-27 | 2012-04-05 | Tokyo Electron Ltd | 電極及びプラズマ処理装置 |
US8888951B2 (en) | 2009-03-06 | 2014-11-18 | Tokyo Electron Limited | Plasma processing apparatus and electrode for same |
JP2014222660A (ja) * | 2014-06-16 | 2014-11-27 | 東京エレクトロン株式会社 | プラズマ処理装置 |
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