TWI438301B - 成形品之鍍敷物及其製造方法 - Google Patents

成形品之鍍敷物及其製造方法 Download PDF

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Publication number
TWI438301B
TWI438301B TW098113500A TW98113500A TWI438301B TW I438301 B TWI438301 B TW I438301B TW 098113500 A TW098113500 A TW 098113500A TW 98113500 A TW98113500 A TW 98113500A TW I438301 B TWI438301 B TW I438301B
Authority
TW
Taiwan
Prior art keywords
coating layer
plating
coating
fine particles
film
Prior art date
Application number
TW098113500A
Other languages
English (en)
Chinese (zh)
Other versions
TW201000672A (en
Inventor
Hiroki Ashizawa
Takashi Suzuki
Mayumi Nakamura
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Publication of TW201000672A publication Critical patent/TW201000672A/zh
Application granted granted Critical
Publication of TWI438301B publication Critical patent/TWI438301B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
TW098113500A 2008-04-30 2009-04-23 成形品之鍍敷物及其製造方法 TWI438301B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008119025 2008-04-30

Publications (2)

Publication Number Publication Date
TW201000672A TW201000672A (en) 2010-01-01
TWI438301B true TWI438301B (zh) 2014-05-21

Family

ID=41254972

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098113500A TWI438301B (zh) 2008-04-30 2009-04-23 成形品之鍍敷物及其製造方法

Country Status (6)

Country Link
JP (1) JP5344191B2 (fr)
KR (1) KR101496501B1 (fr)
CN (1) CN101983257B (fr)
HK (1) HK1150638A1 (fr)
TW (1) TWI438301B (fr)
WO (1) WO2009133751A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012045819A (ja) * 2010-08-26 2012-03-08 Sakaiya:Kk 加飾膜層と金属膜層を備えた樹脂シートの製造方法
US9713126B2 (en) * 2011-01-10 2017-07-18 Nokia Solutions And Networks Oy Dynamic transmission set indication
JP5912365B2 (ja) * 2011-09-22 2016-04-27 アキレス株式会社 高分子材料のめっき物
CN102703884A (zh) * 2012-01-31 2012-10-03 扬州华盟电子有限公司 利用ppy高分子液的无电解电镀方法
WO2018186804A1 (fr) 2017-04-04 2018-10-11 Nanyang Technological University Objet plaqué et son procédé de formation
KR102458237B1 (ko) * 2018-09-27 2022-10-25 한국전기연구원 도금용 촉매 잉크 및 이를 이용한 무전해 도금 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069942B2 (ja) * 1994-06-14 2000-07-24 アイカ工業株式会社 電気回路基板及びその製造方法
JP3208735B2 (ja) * 1995-11-29 2001-09-17 ツィッパーリング ケスラー ウント コー （ゲーエムベーハー ウント コー） 金属化物質の製造方法
JP2004131906A (ja) 2002-10-09 2004-04-30 Yasutada Miura 前開きマタニティブラジャー
JP2004131806A (ja) * 2002-10-10 2004-04-30 Japan Science & Technology Agency 導電性高分子上への金属粒子の光析出方法
DE102005010162B4 (de) * 2005-03-02 2007-06-14 Ormecon Gmbh Leitfähige Polymere aus Teilchen mit anisotroper Morphologie
JP4853774B2 (ja) * 2006-03-30 2012-01-11 アキレス株式会社 還元性ポリマー微粒子を用いるパターン化された金属膜が形成されためっきフィルムの製造方法
JP4853775B2 (ja) * 2006-03-30 2012-01-11 アキレス株式会社 還元性ポリマー微粒子を用いるパターン化された金属膜が形成されためっきフィルムの製造法
JP4765722B2 (ja) 2006-03-30 2011-09-07 住友金属工業株式会社 高炉立上げ操業方法

Also Published As

Publication number Publication date
KR20100134792A (ko) 2010-12-23
KR101496501B1 (ko) 2015-02-26
JPWO2009133751A1 (ja) 2011-09-01
JP5344191B2 (ja) 2013-11-20
CN101983257B (zh) 2013-05-15
TW201000672A (en) 2010-01-01
WO2009133751A1 (fr) 2009-11-05
HK1150638A1 (en) 2012-01-06
CN101983257A (zh) 2011-03-02

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