HK1150638A1 - Plated molded article and method for producing the same - Google Patents

Plated molded article and method for producing the same

Info

Publication number
HK1150638A1
HK1150638A1 HK11104569.0A HK11104569A HK1150638A1 HK 1150638 A1 HK1150638 A1 HK 1150638A1 HK 11104569 A HK11104569 A HK 11104569A HK 1150638 A1 HK1150638 A1 HK 1150638A1
Authority
HK
Hong Kong
Prior art keywords
coating layer
molded article
producing
same
catalyst metal
Prior art date
Application number
HK11104569.0A
Other languages
English (en)
Inventor
Hiroki Ashizawa
Takashi Suzuki
Mayumi Nakamura
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Publication of HK1150638A1 publication Critical patent/HK1150638A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
HK11104569.0A 2008-04-30 2011-05-09 Plated molded article and method for producing the same HK1150638A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008119025 2008-04-30
PCT/JP2009/056975 WO2009133751A1 (fr) 2008-04-30 2009-04-03 Article moulé plaqué et procédé de production de cet article

Publications (1)

Publication Number Publication Date
HK1150638A1 true HK1150638A1 (en) 2012-01-06

Family

ID=41254972

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11104569.0A HK1150638A1 (en) 2008-04-30 2011-05-09 Plated molded article and method for producing the same

Country Status (6)

Country Link
JP (1) JP5344191B2 (fr)
KR (1) KR101496501B1 (fr)
CN (1) CN101983257B (fr)
HK (1) HK1150638A1 (fr)
TW (1) TWI438301B (fr)
WO (1) WO2009133751A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012045819A (ja) * 2010-08-26 2012-03-08 Sakaiya:Kk 加飾膜層と金属膜層を備えた樹脂シートの製造方法
CN103370960B (zh) * 2011-01-10 2017-03-08 诺基亚通信公司 动态传输集指示
JP5912365B2 (ja) * 2011-09-22 2016-04-27 アキレス株式会社 高分子材料のめっき物
CN102703884A (zh) * 2012-01-31 2012-10-03 扬州华盟电子有限公司 利用ppy高分子液的无电解电镀方法
US20200040459A1 (en) * 2017-04-04 2020-02-06 Nanyang Technological University Plated object and method of forming the same
KR102458237B1 (ko) * 2018-09-27 2022-10-25 한국전기연구원 도금용 촉매 잉크 및 이를 이용한 무전해 도금 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069942B2 (ja) * 1994-06-14 2000-07-24 アイカ工業株式会社 電気回路基板及びその製造方法
US5846606A (en) * 1995-11-29 1998-12-08 Zipperling Kessler & Co. (Gmbh&Co.) Process for the production of metallized materials
JP2004131906A (ja) 2002-10-09 2004-04-30 Yasutada Miura 前開きマタニティブラジャー
JP2004131806A (ja) * 2002-10-10 2004-04-30 Japan Science & Technology Agency 導電性高分子上への金属粒子の光析出方法
DE102005010162B4 (de) * 2005-03-02 2007-06-14 Ormecon Gmbh Leitfähige Polymere aus Teilchen mit anisotroper Morphologie
JP4853774B2 (ja) * 2006-03-30 2012-01-11 アキレス株式会社 還元性ポリマー微粒子を用いるパターン化された金属膜が形成されためっきフィルムの製造方法
JP4765722B2 (ja) 2006-03-30 2011-09-07 住友金属工業株式会社 高炉立上げ操業方法
JP4853775B2 (ja) * 2006-03-30 2012-01-11 アキレス株式会社 還元性ポリマー微粒子を用いるパターン化された金属膜が形成されためっきフィルムの製造法

Also Published As

Publication number Publication date
JP5344191B2 (ja) 2013-11-20
KR20100134792A (ko) 2010-12-23
TW201000672A (en) 2010-01-01
JPWO2009133751A1 (ja) 2011-09-01
TWI438301B (zh) 2014-05-21
WO2009133751A1 (fr) 2009-11-05
CN101983257B (zh) 2013-05-15
CN101983257A (zh) 2011-03-02
KR101496501B1 (ko) 2015-02-26

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