HK1150638A1 - Plated molded article and method for producing the same - Google Patents

Plated molded article and method for producing the same

Info

Publication number
HK1150638A1
HK1150638A1 HK11104569.0A HK11104569A HK1150638A1 HK 1150638 A1 HK1150638 A1 HK 1150638A1 HK 11104569 A HK11104569 A HK 11104569A HK 1150638 A1 HK1150638 A1 HK 1150638A1
Authority
HK
Hong Kong
Prior art keywords
coating layer
molded article
producing
same
catalyst metal
Prior art date
Application number
HK11104569.0A
Inventor
Hiroki Ashizawa
Takashi Suzuki
Mayumi Nakamura
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Publication of HK1150638A1 publication Critical patent/HK1150638A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Abstract

Disclosed are a plated molded article and a method for producing the same. Specifically disclosed is a plate article wherein a coating layer containing conductive polymer particles and a binder is formed on the surface of a molded article, and a metal plating film is formed on the coating layer by electroless plating through adsorption of a catalyst metal. The binder is present in an amount of 0.1-10 parts by mass per 1 part by mass of the conductive polymer particles, and the coating layer has a thickness of 0.5-100 µm. The sizes of the catalyst metal lumps adsorbed on the coating layer are not more than 150 nm, and the amount of the catalyst metal adsorbed on the coating layer per unit area is from 0.1 µg/cm2 to 3.0 µg/cm2.
HK11104569.0A 2008-04-30 2011-05-09 Plated molded article and method for producing the same HK1150638A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008119025 2008-04-30
PCT/JP2009/056975 WO2009133751A1 (en) 2008-04-30 2009-04-03 Plated molded article and method for producing the same

Publications (1)

Publication Number Publication Date
HK1150638A1 true HK1150638A1 (en) 2012-01-06

Family

ID=41254972

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11104569.0A HK1150638A1 (en) 2008-04-30 2011-05-09 Plated molded article and method for producing the same

Country Status (6)

Country Link
JP (1) JP5344191B2 (en)
KR (1) KR101496501B1 (en)
CN (1) CN101983257B (en)
HK (1) HK1150638A1 (en)
TW (1) TWI438301B (en)
WO (1) WO2009133751A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012045819A (en) * 2010-08-26 2012-03-08 Sakaiya:Kk Method for producing resin sheet including decorative film layer and metallic film layer
CN103370960B (en) * 2011-01-10 2017-03-08 诺基亚通信公司 Dynamic transmission set indicates
JP5912365B2 (en) * 2011-09-22 2016-04-27 アキレス株式会社 High polymer material plating
CN102703884A (en) * 2012-01-31 2012-10-03 扬州华盟电子有限公司 Electroless plating method using PPY (Polypyrrole) macromolecule solution
WO2018186804A1 (en) 2017-04-04 2018-10-11 Nanyang Technological University Plated object and method of forming the same
KR102458237B1 (en) * 2018-09-27 2022-10-25 한국전기연구원 Catalyst Ink For Plating And Electroless Plating Pattern Forming Methods Using The Same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069942B2 (en) * 1994-06-14 2000-07-24 アイカ工業株式会社 Electric circuit board and manufacturing method thereof
DE59608706D1 (en) * 1995-11-29 2002-03-21 Zipperling Kessler & Co METHOD FOR PRODUCING METALIZED MATERIALS
JP2004131906A (en) 2002-10-09 2004-04-30 Yasutada Miura Maternity brassiere open in front
JP2004131806A (en) * 2002-10-10 2004-04-30 Japan Science & Technology Agency Method for optical precipitation of metallic particle onto conductive polymer
DE102005010162B4 (en) * 2005-03-02 2007-06-14 Ormecon Gmbh Conductive polymers of particles with anisotropic morphology
JP4853774B2 (en) * 2006-03-30 2012-01-11 アキレス株式会社 Method for producing plated film on which patterned metal film is formed using reducing polymer fine particles
JP4853775B2 (en) * 2006-03-30 2012-01-11 アキレス株式会社 Method for producing plated film with patterned metal film using reducing polymer fine particles
JP4765722B2 (en) 2006-03-30 2011-09-07 住友金属工業株式会社 Blast furnace start-up operation method

Also Published As

Publication number Publication date
WO2009133751A1 (en) 2009-11-05
TW201000672A (en) 2010-01-01
KR20100134792A (en) 2010-12-23
CN101983257B (en) 2013-05-15
KR101496501B1 (en) 2015-02-26
CN101983257A (en) 2011-03-02
JP5344191B2 (en) 2013-11-20
TWI438301B (en) 2014-05-21
JPWO2009133751A1 (en) 2011-09-01

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