WO2008027856A3 - Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same - Google Patents

Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same Download PDF

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Publication number
WO2008027856A3
WO2008027856A3 PCT/US2007/076935 US2007076935W WO2008027856A3 WO 2008027856 A3 WO2008027856 A3 WO 2008027856A3 US 2007076935 W US2007076935 W US 2007076935W WO 2008027856 A3 WO2008027856 A3 WO 2008027856A3
Authority
WO
WIPO (PCT)
Prior art keywords
coating
making
methods
same
whisker growth
Prior art date
Application number
PCT/US2007/076935
Other languages
French (fr)
Other versions
WO2008027856A2 (en
Inventor
Merrill M Jackson
David Humphrey
Original Assignee
Honeywell Int Inc
Merrill M Jackson
David Humphrey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, Merrill M Jackson, David Humphrey filed Critical Honeywell Int Inc
Priority to EP07814479A priority Critical patent/EP2057680A2/en
Publication of WO2008027856A2 publication Critical patent/WO2008027856A2/en
Publication of WO2008027856A3 publication Critical patent/WO2008027856A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

An electrical component includes a conductive substrate (10), a tin layer (12) formed on the substrate, and a multi-phase coating (14) formed on the tin layer to impede tin whisker growth. The multi-phase coating comprises a polymer matrix (15) having pores (20) dispersed therethrough, with the pores constituting at least 30% by volume of the coating. To form the multi-phase coating, the tin plating or finish is covered with a coating comprising a polymer matrix having a second material mixed therein. The second material is subsequently removed from the polymer matrix to produce a coating having pores in the matrix where the second material was disposed before being removed.
PCT/US2007/076935 2006-08-31 2007-08-28 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same WO2008027856A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07814479A EP2057680A2 (en) 2006-08-31 2007-08-28 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/515,116 US20070287023A1 (en) 2006-06-07 2006-08-31 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same
US11/515,116 2006-08-31

Publications (2)

Publication Number Publication Date
WO2008027856A2 WO2008027856A2 (en) 2008-03-06
WO2008027856A3 true WO2008027856A3 (en) 2008-04-17

Family

ID=38984427

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/076935 WO2008027856A2 (en) 2006-08-31 2007-08-28 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same

Country Status (3)

Country Link
US (1) US20070287023A1 (en)
EP (1) EP2057680A2 (en)
WO (1) WO2008027856A2 (en)

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US20070284700A1 (en) * 2006-06-07 2007-12-13 Honeywell International, Inc. Coatings and methods for inhibiting tin whisker growth
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
TWI492303B (en) 2009-03-27 2015-07-11 Applied Nanotech Holdings Inc Buffer layer to enhance photo and/or laser sintering
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
US8907225B1 (en) * 2013-04-11 2014-12-09 The United States Of America As Represented By The Secretary Of The Navy Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures
CN104869754B (en) * 2014-02-25 2018-06-26 财团法人工业技术研究院 Flexible substrate embedded with conducting wire and manufacturing method thereof
CN110402019A (en) * 2019-08-22 2019-11-01 江苏上达电子有限公司 A kind of bending-resistant flexible wiring board and preparation method thereof

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Also Published As

Publication number Publication date
WO2008027856A2 (en) 2008-03-06
US20070287023A1 (en) 2007-12-13
EP2057680A2 (en) 2009-05-13

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