TW200612492A - Method and composition to provide a layer with uniform etch characteristics - Google Patents

Method and composition to provide a layer with uniform etch characteristics

Info

Publication number
TW200612492A
TW200612492A TW094127323A TW94127323A TW200612492A TW 200612492 A TW200612492 A TW 200612492A TW 094127323 A TW094127323 A TW 094127323A TW 94127323 A TW94127323 A TW 94127323A TW 200612492 A TW200612492 A TW 200612492A
Authority
TW
Taiwan
Prior art keywords
composition
layer
components
evaporation
rate
Prior art date
Application number
TW094127323A
Other languages
Chinese (zh)
Other versions
TWI291204B (en
Inventor
Frank Y Xu
Nicholas A Stacey
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/919,062 external-priority patent/US7282550B2/en
Priority claimed from US10/919,224 external-priority patent/US7939131B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200612492A publication Critical patent/TW200612492A/en
Application granted granted Critical
Publication of TWI291204B publication Critical patent/TWI291204B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)

Abstract

The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes depositing a polymerizable liquid on the substrate as a composition of a plurality of components. Each of the components has a rate of evaporation associated therewith. The polymerizable composition is then solidified. A relative rate of evaporation associated with a subset of the plurality of components is established to be within a predetermined range. Specifically, the present invention is based upon the discovery that etch non-uniformity in a layer that is formed by solidification of a deposited liquid is a function of the relative rates of evaporation of the components that form the layer. As a result, the composition is formed of a plurality of components, a subset of which has a substantially identical rate of evaporation for an interval of time.
TW94127323A 2004-08-16 2005-08-11 Method and composition to provide a layer with uniform etch characteristics TWI291204B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/919,062 US7282550B2 (en) 2004-08-16 2004-08-16 Composition to provide a layer with uniform etch characteristics
US10/919,224 US7939131B2 (en) 2004-08-16 2004-08-16 Method to provide a layer with uniform etch characteristics

Publications (2)

Publication Number Publication Date
TW200612492A true TW200612492A (en) 2006-04-16
TWI291204B TWI291204B (en) 2007-12-11

Family

ID=35967849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94127323A TWI291204B (en) 2004-08-16 2005-08-11 Method and composition to provide a layer with uniform etch characteristics

Country Status (3)

Country Link
JP (1) JP5020079B2 (en)
TW (1) TWI291204B (en)
WO (1) WO2006023297A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8142850B2 (en) * 2006-04-03 2012-03-27 Molecular Imprints, Inc. Patterning a plurality of fields on a substrate to compensate for differing evaporation times
US8707890B2 (en) * 2006-07-18 2014-04-29 Asml Netherlands B.V. Imprint lithography
US8633693B2 (en) 2007-04-02 2014-01-21 The Regents Of The University Of California Rotating-frame gradient fields for magnetic resonance imaging and nuclear magnetic resonance in low fields
JP4908369B2 (en) * 2007-10-02 2012-04-04 株式会社東芝 Imprint method and imprint system
US20090212012A1 (en) * 2008-02-27 2009-08-27 Molecular Imprints, Inc. Critical dimension control during template formation
NL2003875A (en) 2009-02-04 2010-08-05 Asml Netherlands Bv Imprint lithography method and apparatus.
JP5887871B2 (en) * 2011-11-24 2016-03-16 富士通株式会社 Film forming material and pattern forming method
JP6071255B2 (en) * 2012-06-04 2017-02-01 キヤノン株式会社 Photocured material
US10892167B2 (en) * 2019-03-05 2021-01-12 Canon Kabushiki Kaisha Gas permeable superstrate and methods of using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170192A (en) * 1990-11-29 1992-12-08 Pilkington Visioncare, Inc. Oxygen permeable bifocal contact lenses and their manufacture
US6143433A (en) * 1994-09-14 2000-11-07 Mitsui Chemicals, Inc. Organic electroluminescent device and process for producing the same
US20030124853A1 (en) * 1998-06-25 2003-07-03 Mitsubishi Materials Silicon Corporation Anisotropic etching method and apparatus
EP1395417B1 (en) * 2001-05-29 2006-08-02 Essilor International Compagnie Generale D'optique Method for forming on-site a coated optical article
MY164487A (en) * 2002-07-11 2017-12-29 Molecular Imprints Inc Step and repeat imprint lithography processes

Also Published As

Publication number Publication date
TWI291204B (en) 2007-12-11
JP2008509815A (en) 2008-04-03
WO2006023297A1 (en) 2006-03-02
JP5020079B2 (en) 2012-09-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees