TWI291204B - Method and composition to provide a layer with uniform etch characteristics - Google Patents

Abstract

The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes depositing a polymerizable liquid on the substrate as a composition of a plurality of components. Each of the components has a rate of evaporation associated therewith. The polymerizable composition is then solidified. A relative rate of evaporation associated with a subset of the plurality of components is established to be within a predetermined range. Specifically, the present invention is based upon the discovery that etch non-uniformity in a layer that is formed by solidification of a deposited liquid is a function of the relative rates of evaporation of the components that form the layer. As a result, the composition is formed of a plurality of components, a subset of which has a substantially identical rate of evaporation for an interval of time.

Description

1291204 IX. Description of the invention: [Technical field to which the invention pertains] The field of the present invention is schematically related to the microfabrication of the structure. More particularly, the present invention is directed to forming a method having uniform properties and an imprint material. BACKGROUND OF THE INVENTION Microfabrication involves the fabrication of very small structures, such as those having a micron scale or smaller. One area where microfabrication has a considerable impact is the process of integrated circuits. The semiconductor manufacturing industry is still striving to achieve higher manufacturing yields, while increasing the number of circuits per unit area formed on the substrate. The importance of micro-fabrication is increasing. Microfabrication provides greater process control while allowing the smallest structural dimension of the resulting structure to continue to shrink. Other areas of development using microfabrication include biotechnology, optical technology, and mechanical systems. An example of a microfabrication technique is shown in U.S. Patent No. 5, the entire disclosure of which is incorporated herein by reference. The method includes providing a substrate having a transfer layer. The transfer • layer is covered with a polymerizable fluid composition. The imprinting device is in mechanical contact with the polymerizable fluid. The imprint apparatus includes a structure formed by land and trenches. The polymerizable fluid composition fills the relief structure, and the thickness of the polymerizable flow is overlapped to define the remaining thickness of the land. The polymerizable fluid composition is then placed under curing conditions and polymerized to form a cured polymer layer on the transfer layer which contains a relief structure complementary to the relief structure of the imprint apparatus. The imprinting device is then separated from the cured polymer layer such that a replica of the relief structure of the imprinting device is formed on the cured polymer layer. The transfer layer and the cured polymer layer are placed in a selective etching environment in which the transfer layer is selectively etched with respect to the cured polymer layer to form a relief image on the transfer layer. Therefore, the conventional engraving method can be used to transfer the pattern of the relief structure to the substrate. The white etching method forms a predetermined pattern on a layer which is covered with a suitable mask such as a photoresist 5. The mask is typically deposited on the layer using a patterned mask to form a pattern. The patterned mask is then exposed to an etchant, such as a liquid acid of a dry etching ion or wet etch technique, to remove portions of the layer that are exposed through the patterned mask. The desired characteristic of any etching method is to achieve a uniform residual rate on the surface subjected to etching. In order to achieve this, prior art attempts have been made to control the etch rate during the etching process. For example, U.S. Patent No. 6,132,632 to Haney et al. discloses a device for achieving a uniform etch rate in a reactive ion regenerator. The reactive ion etcher generates a plasma in a vacuum to etch a substrate disposed in the cathode of the reactor tank in the vacuum chamber, wherein the plasma is ejected from the top plate of the reactor tank and is affected by the localized magnetic %. To locally control the etch rate across the cathode, a uniform etch rate profile across the cathode is produced as a result of localizing the magnetic field. A magnet array can be placed between the top plate and the vacuum chamber to create a localized magnetic field. The magnet array includes a plurality of individual magnets and a grid of 20 plates that are fixedly positioned by the individual magnets.

A method and apparatus for ion assisted etching processing in a table processing system is disclosed in U.S. Patent No. 6,344, issued to U.S. Pat. In accordance with aspects of the present invention, a raised edge ring, a groove edge ring, and a FF (RF) M rim ring are disclosed. The present invention operates to improve one of the cross-substrate (wafer) 1291204 #etch rate uniformity. The improvement in the uniformity of the remaining rate provided by the present invention not only improves the manufacturing yield, but is also cost effective and free from the risk of particulate contamination and/or heavy metal contamination.

An anti-reflective coating composition having an improved 5 etch rate is disclosed in U.S. Patent No. 6,576, issued to U.S. Pat. Does the composition consist of some kind of acrylic acid? Preparation of κ compounds and co-t materials, such as methacrylic acid glycidol, which is prepared by reacting with non-polycyclic carboxylic acid dyes and non-polycyclic phenolic dyes, all of which are absorbed by light having a wavelength of 193 nm. . In addition to this, there is an etching technique that has improved control over the rate of the reticle of the imprinted material being processed. SUMMARY OF THE INVENTION 3 SUMMARY OF THE INVENTION The present invention comprises a method and composition for forming a layer having uniform remnant characteristics on a substrate. To achieve this, the method includes depositing a polymerizable liquid on the substrate as a constituent of a plurality of components. Each becomes a steaming rate associated therewith. Then the concentratable person's composition is cured. The relative i-forging rate associated with a subset of the plurality of components is established within a predetermined range. In particular, the present invention is based on the discovery that the tactile non-uniformity 20 of a layer formed by solidification of the deposition liquid varies as a function of the relative steaming rate of the components forming the layer. As a result, the composition is formed from a plurality of components, and one of the plurality of components has a similar steaming rate on the babe for a period of time; such a discussion is more fully discussed. BRIEF DESCRIPTION OF THE DRAWINGS 7 1291204 FIG. 1 is a perspective view of a lithography system according to the present invention; FIG. 2 is a view showing the formation of a patterned imprint layer as shown in FIG. 1 according to an embodiment of the present invention. A simplified bottom view of a lithography system; FIG. 3 is a simplified bottom view of an imprinting apparatus separated from the embossed layer of FIG. 5 after being patterned according to the present invention; Figure 2 is a top view of the substrate shown in Figure 2, in which the polymerized fluid droplet pattern is deposited thereon for patterning; Figure 5 is a deposition of the polymerizable imprint material from the prior art. A cross-sectional view of a layer formed on a substrate; 10 FIG. 6 is a cross-sectional view of the layer after receiving the RIE etching process according to the prior art; FIG. 7 is a line diagram showing the inclusion of germanium according to the present invention. The vapor deposition rate of the different components in the polymerizable imprint material; Fig. 8 is a cross-sectional view showing that one release layer and 15 primer layer can be used according to the present invention; and Fig. 9 is a cross-sectional view showing application to One of the relief layers of the flattening mold shown in Figure 8; 10 photo shows a cross-sectional view showing another embodiment according to the present invention, a layer formed on a substrate. 20 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A first embodiment of a lithography system 10 according to one embodiment of the present invention includes a pair of spaced apart bridge supports 12 having a bridge 14 and a A platform support 16 extends therebetween. The bridge 14 and platform support 16 are spaced apart from each other 8 1291204. The face to the bridge is an embossing head 18 which extends from the bridge i4 towards the platform support 16. Set on the platform support member i6 to face the pressure

The print head 18 is a mobile platform 2〇. The mobile platform _ is configured to move relative to the platform support 16 along the X and Y axes and also provides movement along the ice. A light source 22 is coupled to the system 1A to emit an actinic light onto the mobile platform 2A. As shown, the source 22 is coupled to the bridge 14 and includes a power generator 23 coupled to the radiation source 22. Referring to Figures 1 and 2, the stencil 24 having the patterning mold 26 attached thereto is attached to the embossing head 18. The patterned mold 26 includes a plurality of structures defined by a plurality of recesses 28 and projections 30 spaced apart from one another. The convex portion % has a width of 1, and the notch P28 has a visibility %, both of which are measured in a direction transverse to the redundant axis. The plurality of structures define an original pattern that forms the basis for the pattern to be transferred to the substrate 32 placed on the moving platform 20. In order to achieve the project, the imprint head 18 is adapted to move along the z-axis, and the distance between the patterned mold % 15 and the substrate 32 is changed, or combined with the imprint head 18, the mobile platform 20 can be along the Z The shaft moves the stencil 24. In this way, the features on the patterned mold % can be embossed to the fluidity region of the substrate 32, as detailed later. The radiation source 22 is arranged such that the patterned mold 26 is located in the radiation The actinic radiation generated by the light source 22 between the source 22 and the substrate 32 is transmitted via the patterned mold 26. As a result, it is desirable that the patterned mold 26 be made of a material that is substantially transparent to actinic radiation. Examples of materials from which the patterned mold 26 can be fabricated include fused oxygen, quartz enthalpy, organic polymer, siloxane polymer, borosilicate glass, fluorocarbon polymer, metal, and combinations thereof. It is determined by the actinic radiation used. A system example available is available from Ml.

Inc.) Business address 1807-C Braker Lane, Suite 1〇〇, Austin, Texas 78758). The system description of Inplio 100 is available from www.molecularimprints; rnm 〇 5

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Referring to Fig. 2, a fluidity region such as embossed layer 34 is formed on one of the surface %, and a portion of the surface 36 indicates a surface side of the surface of the stencil 24 which is substantially smooth even if it is not flat. In one embodiment of the invention, the flow zone is deposited as a plurality of embossed materials spaced apart from each other to separate droplets from the substrate 32 for subsequent processing. The specific material transferability is polymerized and crosslinked to record the reverse pattern of the original pattern. The plurality of features on the patterned mold 26 are shown as recesses extending in the parallel direction of the projections 3, which provide the wall shape of the castle for the % mold face. The Renshi lion and the convex portion 3G can correspond to substantially any characteristic structure required for forming an integrated circuit, and can be as small as a few tenths of a nanometer. ^Tea Photo 2 and 3, the pattern recorded by the embossed layer 34 is partially produced via mechanical contact with the patterned mold. In order to achieve this, the distance d" allows the embossing layer 34 to be in mechanical contact with the patterned mold, thereby expanding the embossing layer 34 having a continuous formation of the embossed material on the surface %. - The specific shot, the distance "d" is reduced to allow the embossing layer to enter the recess 28 from the small portion 46 and fill the recess 28. "In this embodiment, the small portion 48 of the embossed layer 34 maintains the overlapping projections 3 after the predetermined distance has been reached and is typically the minimum seating distance L, leaving the enamel factory 6 to be thick and private, and the small portion 48 to be thick. Red. The thickness t is the residual thickness. Depending on the application, the thickness "t]"A"t2" can be any desired thickness of 20 1291204. The total volume contained in the droplets 38 can thus be minimized, or the quantitative imprinting material can be prevented from extending beyond the area of the overlapping patterned mold 26 of the surface 36 while achieving the desired thickness (4) 2, in other words via the use of the patterned mold % and surface 36. The capillary attraction of the printed material and the surface adhesion of the imprinted material are achieved to achieve the desired thickness. Referring to Fig. 2, after the predetermined distance rd has been reached, the radiation source generates actinic radiation, and the actinic radiation polymerizes and bonds the embossed material to form a cured imprint layer 134. The composition of the embossed layer 34 is converted from a fluid embossed material into a solidified material. The embossed layer 134 thus provided has a shape on one side that conforms to the shape of the surface 50 of the patterning mold 10, and is more clearly shown in Fig. 5. As a result, the cured imprint layer 134 is formed with the concave portion 52 and the convex portion 54. After the cured imprinting layer 134 is formed, the distance "d" is increased, so that the patterned mold is separated from the cured imprinting layer 134. Typically, such a procedure is repeated several times to pattern different regions of the substrate 32 (not shown), referred to as a step and repeat procedure. An example of a step-and-repeat embossing is disclosed in the published U.S. Patent Application Serial No. 2004/0008334, filed on Jul. 11, 2002, filed on s. Lithography, the case gives the same assignee as the case. There are a number of advantages to this method of patterning. For example, the difference in thickness between the projections 2 〇 54 and the recesses 52 helps the substrate 32 to form a pattern corresponding to the pattern of the cured embossed layer 134. In particular, the difference in thickness between the convex portion 54 and the concave portion 52 is also the same. The difference between the results results in a comparison of the time required for the substrate 32 region of the overlapping recess 52 to be exposed, and the exposure of the substrate overlapping the convex portion to the region takes a longer time. Therefore, for a given_program, the area of the substrate 32 of the convex portion 54 is relatively heavy, and the substrate 32 region of the overlapping recess 52 must be etched earlier. The pattern of the substrate 32 thus formed corresponds to the pattern of the cured imprint layer 134. By appropriate selection of the imprint material and etching chemistry, the relevant dimensions between the different features of the pattern ultimately transferred to the substrate 32 can be controlled to the desired dimensions as desired. In order to achieve this project, it is desirable that for a given residual chemistry, the surname characteristics of the cured imprint layer 134 are substantially uniform 0, 纟. In view of the unique patterning procedure employed, the characteristics of the imprinted material are important. As previously described, the embossing (4) accumulates on the substrate 32 a plurality of discrete and spaced apart droplets. The combined volume of droplet % is embossed (4) and is suitably distributed on the region of the embossed layer 34 to be formed in Table (4). In this way, the total volume of the embossed material of the droplet % defines the distance d" to be obtained, and when the desired distance % is reached, the patterned mold" is defined by the portion of the heavily patterned mold of the substrate 32. The gap is determined by the total volume occupied by the [P material is equal to the total volume of the embossed material of the droplet %. As a result, the embossed layer 34 is unfolded and called a pattern, and the pattern is subsequently: ΰ η gastric radiation cured. Procedure, it is hoped that the imprinting material for the embossing material inside the droplet 38 is quickly and evenly spread on the table (4) = part thickness 'substantially uniform sentence, all residual thick red is substantially uniform. The example of the composition of the forged printing material is composed of the following ingredients Composition: Acrylic isobornyl acrylate acetoxy oxycarbazide (trimethyl sulphate) methyl wei-ethylene glycol acrylate base-2-methyl small stupyl _ propyl ketone 12 25 1291204 composition 2 Isobornyl acrylate propylene methoxymethyl ginseng (trimethyl decyloxy) decane ethylene glycol dicarboxylate 2-hydroxy-2-mercapto-1-phenyl-propan-1-one composition 3 Isobornyl acrylate

3_Acryloxypropyl hydrazide (tridecyloxy)methyl decane ethylene glycol diacrylate 2-hydroxy-2-methyl-1-phenyl-propan-1-one composition 4 acrylate Borne ester 15 3-propenyloxypropyl ginseng (trimethyl decyloxy) decane ethylene glycol dicarboxylate 2-hydroxy-2-methyl-1-phenyl-propan-1-one composition 5 acrylic acid Isobornyl ester 20 propylene methoxymethyl hydrazide (tridecyl decyloxy) decyl decane ethylene glycol diacrylate 2 - Technic-2 -Methyl-1 -benyl-propan-1 -酉R1R2 Composition 6 Isobornyl acrylate propylene oxime oxime (trimethyl decyloxy) decane ethylene glycol dicarboxylate 2-hydroxy-2-mercapto-1-phenyl-propan-1-one R] R2 13 25 1291204 Isobornyl acrylate - 3-propenyloxypropyl hydrazine (dimethyl methoxy) methyl decane diethylene glycol glycol g 5 2- mercapto-2-methyl-1 - Stupid base - C-1

RiR2 isobornyl acrylate 3-propenyloxypropyl ginseng (trimethyl decyloxy) decane φ 1 乙二醇 ethylene glycol diacrylate 2-yl-2-methyl-1-phenyl-propan-1 -ketone

Among the RiR2 compositions 1, 2, 3 and 4, the first yttrium-free acrylate, ie, C:isosorbate g, is about 42% of the composition, but it can be present in 15 20-60 The range of %. The ruthenium containing acrylates comprise about 37% of the compositions 1, 2, 3 and 4, but may be present in an amount ranging from 30 to 50%. The second non-stone acrylate, ie, the cross-linking agent, ethylene glycol diacrylate accounts for about 18% of the compositions 1, 2, 3 and φ 4 , but the amount is in the range of 10-40%. . The initiator, 2-chromo-2-methyl-1-phenyl-propanone, is 5% to 5%, and the initiator can respond to 20 UV radiation to aid the composition of the composition 1-4. Union and aggregation. If modified release characteristics are present, in addition to the components of Compositions 1-4, Compositions 5, 6, 7, and 8 each comprise a surfactant, RiR2, in an amount of about 0.5% of the composition. The content of the remaining components of compositions 5, 6, 7 and 8 is proportionally reduced to compensate for the addition of the surfactant. For the purposes of the present invention, the surfactant definition 25 is any molecule having a hydrophobic end. The surfactant may contain gas, for example including a fluorine chain; or the molecular structure of the surfactant may be free of any gas. 14 1291204 An example of a surfactant can be obtained from DuPont under the trade name ZONYL FSO-100, having the general structural formula R!R2, where R1=:F(CF2CF2), where y is 1 to 7 (inclusive) and R2=CH2CH20(CH2CH2〇)xH, where X is from 0 to 15 (inclusive). However, it should be understood that 5 other surfactants may also be included in compositions 5, 6, 7 and 8 in place of F(CF2CF2)yCH2CH20(CH2CH20)xH surfactant or additionally with other surfactants. Additional surfactants may include fluorochemical polymer surfactants available from 3M Company under the tradename FLUORAD FC4432 and/or Florad FC4430. In addition, other ultraviolet photoinitiators can be used to bind or replace 2-yl-2-methyl-1-phenyl-propan-1-one. It is to be understood that non-photoinitiators can also be used, such as thermal initiators. As a result, actinic light shots used to aid cross-linking and polymerization must essentially be hot, such as infrared light. An example of a method of forming a cured imprinting layer 134 includes depositing droplets in pattern 100 to reduce entrained gas as the imprinting material unfolds on surface 3615. In order to achieve this project, the pattern 100 is formed by sequential deposition of a plurality of droplets 101-149 in the order of droplets 1〇1 being first dispensed and droplets 149 being finally dispensed. However, it has been found that the etch characteristics of the cured embossed layer 134 vary as a function of the position of the droplets in the droplet delivery sequence, referred to as a sequential etch difference (SED). 2〇 The SED is judged to be due to the change in the cross-linking and the formation of the cured imprint layer 134 on the region of the cured imprint layer 134. The compositional change of 134 after curing occurs in the fluidized (four) plugging of the riding material. In particular, it has been found that the composition of the embossed material is changed prior to cross-linking of the embossed material polymeric disk. In the printer program, the 15 1291204 key may appear during several intervals. The time between the delivery of the droplet 101 to the patterning contact mold 26 is about 2 shifts. I believe that for the time when the biggest steaming money appears. During this period, the evaporation of the printed material appeared, and the loss of the printed material was proportional to the length of the interval between the deposition of the printed material and the day after the 28th (five). After contacting the mold 26, it is necessary to form a small fine M49 by 5 = two stages _ spacing, and form a continuous layer of bismuth and bismuth on the substrate 32. During this second time interval, typically about qing, additional evaporation of the embossed material occurs. The present invention overcomes the SED by ensuring that a particular polymerizable component is present in a predetermined amount on the cured stamp. In this example, the desired polymerizable component is a composition containing a fluorene-based acrylic acid S-containing component and a non-%/uninterrupted acryl-containing component, which includes IBOA and a crosslinking agent component EDGA, all of which are acrylates. It is particularly important to understand that the non-uniformity of the surname characteristics of the cured embossed layer 134 is due to the change in the content of the slate. The prior art ruthenium-containing composition in which ruthenium-containing acrylate vapor deposition is faster than the remaining components of the group of 15 components, and is found to cause etching unevenness. It can be seen from Figure 5 and Figure 6. In Fig. 5, the surface topography of the tarpaulin-containing layer 150 formed by the above-described prior art smectite composition is apparently substantially smooth and uniform. After receiving the plasma etching process on the germanium containing layer 150, it appears on the etching layer 154 via the innumerable recessed regions 152, which is non-uniform. This is due to the fact that the associated etch rate from recessed regions 20 152 is faster than the etch rate of raised regions 156. The faster etch rate of the associated recessed regions 152 is derived from the fact that the amount of germanium present is lower than that of the raised regions 156. The inclusion of the lithium layer 150; the ε 含量 content is uneven, resulting in uneven etching of the etch layer 152, which is an undesirable phenomenon. The present invention alleviates (even if unavoidable) the etching unevenness of the ruthenium containing layer. The present invention combines the embossed material composition, wherein the desired component has a predetermined steaming rate at a predetermined time interval to alleviate the surname. All. Although it is possible to provide a composition in which the evaporation rate of the predetermined component is substantially equal for a limited period of time, the judgment is not required. Instead, the polymerizable component of composition 5 1-8 is selected to have a predetermined relative steaming rate at a time interval between deposition and exposure to actinic radiation. The remaining component, i.e., the photoinitiator 2-hydroxy-2-methylphenyl-propan-1-one, based on the respective components, i.e., the composition 1-4, is not considered to be a polymerizable component, but may become a part of the polymer structure. Therefore, the photoinitiator 2-hydroxy-2-methyl-1-phenyl-propan-1-one does not substantially promote the characteristic structure of the resulting imprint layer, thus reducing the evaporation rate to match the acrylate component. The need for evaporation rate. Similarly, the remaining components of the composition 5-8, that is, the photoinitiator 2-yl-2-methyl-1-phenyl-propan-1 - and the surfactant RfCH2CH2 〇 (CH2CH2 〇) xH are not regarded. It is a polymerizable component. Further, it is desirable that the non-polymerizable component of the composition 1-8 be steamed at a slower rate than the evaporation of the acrylic vinegar component. Referring to Figure 7, each curve is shown to verify the relative vaporization rate of the specified components of the 400 microliter liters of the composition, such as the following: ethylene glycol diacrylate (EDGA), propylene methoxymethyl hydrazine ( Trimethyl decyloxy) fluorenyl oxalate (AMBMS), and isobornyl acrylate (IBOA). The 400 picoliter droplets 20 were obtained by depositing 400 microliter droplets having a diameter of about 82 microns by depositing a plurality of droplets of 80 microliters each in a common volume on a common zone. The relative vaporization rate between the components of Composition 1 was shown to be less than 0.1%/second, converted to less than 2% over a 20 second interval, and about 60% over a 60 second interval. The polymerizable components of Compositions 2 and 8 were also found to have similar evaporation rates. As a result, 17 1291204 compositions μ each have a desired characteristic, and the polymerizable component has a solid vapor bond rate' which provides a substantially uniform degree of inhibition on the hail and * volume of Fig. 3. In particular, the cured embossed layer 134 is provided with a lion content not low fiber weight ratio on a designated area of the embossed layer 134. The three-zone content of the solidified riding layer 134 must be no more than 5%. | ^

(4) The pre-adhesive viscosity (four) degree is in the range of 1 to 20 centipoise ((10) tipoises), preferably less than 5 centipoise. This assists in the deposition using droplet dispensing techniques. In addition, the composition 提供 provides a predetermined frequency to the cured imprint 134 such that the _stress is equal to 15 curries. 15

20 Referring to Figures 2 and 8, it is desirable to provide a smooth surface (even if it is not a flat surface) to the substrate 32 on which the embossed layer 34 is formed. In order to achieve the item, the substrate 32 can include an undercoat layer 96. The undercoat layer 96 is confirmed to be advantageous when the surface % of the base is compared with the characteristic knot formed by the embossed layer 34. The base coat % can also be used to provide a standard interface with the imprinted material. [This reduction requires that the various processing procedures for the imprint material forming the substrate 32 be tailored to the customer's needs. The primer (4) can have The embossed layer 34 is made of the same or different organic imprinting material. The result '% of the base coat is made to have a continuous smooth (four) plague-free surface' which has excellent adhesion to the embossed layer 1 to form the undercoat layer 96 - a material example can be obtained from the trade name Duv _6 Brewer Science, Inc., of Rhode Island, Missouri. The undercoat layer 96 typically provides a thickness for which the lion can provide a predetermined surface ride, and does not use the optical sensing of the substrate 32 to be self-patterned (such as a calibration mark) 18 ! 2912 〇 4 device It is opaque. Referring to Figures 8 and 9, it is found that when the embossed layer 34 is present on the surface 136 of the previously patterned substrate 32, it is preferred to deposit the undercoat layer. To achieve this, the undercoat layer 196 can be deposited as any of the underlying coatings by any of the known deposition methods, including droplet dispensing techniques, spin coating techniques, and the like. In addition, in order to enhance the surface light, boneness of either of the undercoat layers 96 and 196, it is desirable to have the undercoat layer contact the planarizing mold 80 having a substantially smooth (even if not flat) contact surface.

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20 To reduce the chance of the undercoats 96 and 196 adhering to the flattening mold 80 after curing, the flattened lion can be treated with a low surface energy coating 98. The low surface energy coating 98 can be applied using any of the known methods. For example, processing techniques include chemical vapor deposition methods, physical vapor deposition methods, atomic layer deposition methods, or various other techniques, ore methods, and the like. In a similar manner, a low: surface energy coating (not shown) can be applied to the mold 26, as shown in Figure 2. In addition to the aforementioned surfactants and low surface energy coatings, the defeating additive can be used to improve the exit of the imprinted material. Fluorinated addition-like surfactants have associated surface energy systems that are lower than the surface energy of the imprinted material. The i-Finance Method of Pre-Wei Chemical Additives was discussed by the class in "Multi-imprinting of Ultraviolet-based Nanoimprint Lithography: Related Materials Issues", Microelectronics Engineering, 61-62 (2) ). Adding a low surface visit provides a predetermined release property to reduce the embossed material mold 26 after cross-linking and post-polymerization. It should be understood that the surfactant can be combined with or substituted for the composition of the surfactant comprising 8 pure 5 and the first schematic. It should be understood that the effect provided by the present invention is equally suitable for the technique. 19 1291204 The layers of the evaporation technology appear. Exemplary evaporation techniques that can be used to form the cured layer 134 include spin coating techniques, laser assisted direct imprinting, and the like. An example of LADI technology is disclosed by Chou et al. in "Ultra-Fast Direct Imprinting of the Nanostructure of Suizhong", Natural 417, 835-837, June 2002. For example, 5 can be deposited on substrate 32 as layer 234 by using a spin coating technique. Subsequent layer 234 can be patterned using mold 26. The effect of the present invention becomes significant when layer 234 is patterned using step and repeat techniques, during which different regions of layer 234 must be sequentially patterned and subsequently cured. 10 The foregoing specific examples of the invention are for illustrative purposes only. Many changes and modifications may be made without departing from the scope of the invention. For example, the composition ratio of each of the foregoing compositions may vary. Furthermore, although the invention has been discussed in terms of improving the uniformity of the control layer, the invention is equally applicable to other properties of the modified layer, such as adhesion (whether or not 5 is good), stress, uniform thickness Degree, thickness, strength, density, etc. Therefore, the scope of the invention is not limited by the foregoing description, but rather the scope of the accompanying claims and the full scope thereof. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a lithography system according to the present invention; 0 Fig. 2 is a view showing a patterned P layer as shown in Fig. 1 according to an embodiment of the present invention. A simplified bottom view of the lithography system shown in FIG. 3; FIG. 3 is a simplified bottom view of an imprinting apparatus separated from the hydration embossed layer shown in FIG. 4 is a region of the substrate shown in FIG. 2, in which a plan view is formed by patterning a polymerizable 20 1291204 fluid droplet pattern thereon; FIG. 5 is a polymerizable imprint material from the prior art. A cross-sectional view of a layer formed on a substrate; FIG. 6 is a cross-sectional view of the layer after receiving the RIE etching process according to the prior art; FIG. 7 is a line diagram showing Invention, the evaporation rate of different components in the ruthenium-containing imprintable material; FIG. 8 is a cross-sectional view showing that one release layer and one undercoat layer can be used according to the present invention; 10 FIG. 9 is a cross-sectional view , showing the relief layer applied to one of the flattening molds shown in FIG. 8; The first picture shows the cross-section in FIG 10, shows another specific embodiment of the present invention, a layer formed on a substrate. [Major component symbol description] 10...lithography system 26...patterned mold 12...bridge support member 28...recess 14...bridge 30...projection portion 16·.·platform support member 32...substrate 18···imprint head 34···imprint layer 20...moving platform 36...surface 22...radiation source 38...droplet 23...power source is generated as 46...small portion 24...stencil 48...small portion 21 1291204 50...surface 134...cured imprinting layer 52...recessed portion 136...surface 54··convex portion 150...containing litmus layer 80...flattening mold 152...recessed area 96...bottom Coating 154...etching layer 98...low surface energy coating 156...raised area 100...pattern 196...primer layer 101-149...droplet 234...layer 22

Claims (1)

Patent application No. 94127323, the scope of application for patent application is not included in the Han Dynasty / ^ / / Japanese weaving more m y, patent application scope: __ a layer formed by a flowable area associated with a substrate on the substrate The method comprises: forming the flowable region as a composition having a plurality of polymerizable components, each component having an associated evaporation rate; and a plurality of polymerizable components within a predetermined range The relative vapor deposition rate associated with a subset cures the flowable region over a period of time. The method of claim 1, wherein the predetermined range is less than 0.1% per second. The method of claim 1, wherein the time interval is tied to the range before curing and is in the range of 0 seconds to 20 seconds. The method of claim 1, wherein the curing further comprises contacting the flowable zone liquid with a stencil surface for a time interval before the flowable zone contacts the surface. The method of claim 1, wherein the depositing further comprises dispensing the flowable region onto the surface of the substrate to form a plurality of droplets. The method of claim 1, wherein the depositing further comprises spin coating the polymerizable material on the substrate. A composition for forming a layer having uniform etching characteristics, comprising: a plurality of polymerizable components including a ruthenium-containing polymerizable component and a ruthenium-free polymerizable component; and an initiator component to assist the majority of the polymerizable component The phase transition between the fluidized phase and the solidified phase, one of the plurality of polymerizable components 1291204 has a predetermined relative evaporation rate. 8. The composition of claim 7, wherein the subgroup comprises all of the plurality of polymerizable components. 10 9. The composition of claim 7, wherein the predetermined relative vaporization rate is less than 0.1% per second. 10. The composition of claim 7, wherein the subset of the plurality of polymerizable components has the predetermined relative vaporization rate during a predetermined time interval. 11. The composition of claim 10, wherein the predetermined time interval is 0 to 20 seconds. 12. The composition of claim 7, wherein the cerium-containing polymerizable component comprises acryloxymethyl (trimethyl sulfoxide) sulfhydryl sulphate and the bismuth-free Polymerization to include isobornyl acrylate. 13. The composition of claim 7, wherein the ruthenium-containing polymerizable component comprises acryloxymethyl ginseng (trimethyl decyloxy) decane, and the ruthenium-free polymerizable polymer comprises acrylic acid Isoflavone ester. 14. The composition of claim 7, wherein the cerium-containing polymerizable component comprises 3-propenyloxypropyl hydrazone (trimethyl decyloxy) methyl decane, and the bismuth-free Polymerization to include isobornyl acrylate. 20. The composition of claim 7, wherein the ruthenium-containing polymerizable component comprises 3-propenyloxypropyl ginseng (trimethyldecyloxy) decane, and the ruthenium-free polymerizable The inclusion comprises isobornyl acrylate. 2