CN110402019A - A kind of bending-resistant flexible wiring board and preparation method thereof - Google Patents
A kind of bending-resistant flexible wiring board and preparation method thereof Download PDFInfo
- Publication number
- CN110402019A CN110402019A CN201910778039.9A CN201910778039A CN110402019A CN 110402019 A CN110402019 A CN 110402019A CN 201910778039 A CN201910778039 A CN 201910778039A CN 110402019 A CN110402019 A CN 110402019A
- Authority
- CN
- China
- Prior art keywords
- solder resist
- conductive pattern
- bending
- layer
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present invention discloses a kind of bending-resistant flexible wiring board, including insulating substrate, and the insulating substrate is equipped with conductor layer, and it further includes electroplating tin alloy layer, the first solder resist and the second solder resist that being rushed on insulating substrate using mold, which has sprocket hole,；The conductor layer forms conductive pattern after etching, electroplating tin alloy layer is equipped at connection terminal in the conductive pattern, part in conductive pattern in addition to connection terminal is coated with the first solder resist, is coated with the second solder resist at the first solder resist coating and in adjacent conductive pattern at connection terminal.The present invention prints solder resist before tin plating, it can prevent the heat treatment when printing solder resist from copper being caused to be diffused into tin layers and form brittle tin-copper alloy, using production method of the invention, available resistant to bending, the higher flexible print circuit board of reliability.
Description
Technical field
The present invention relates to a kind of bending-resistant flexible wiring boards and preparation method thereof, belong to electronic component technology field.
Background technique
In recent years, with the development of electronic industry, lightening to electronic equipment, short and smallization demand is increasingly enhanced, to line
The densification on road requires also higher and higher.In addition, have on flexible, insulating properties plastic film in polyester, polyimides etc.,
The flexible print circuit board production method that conductive pattern is formed using printed wire plate technique, is widely used.
The production of flexible print circuit board, it is as shown in Figure 1 and Figure 2, membranaceous absolutely using the plastics with flexible and insulation performance
Sticker 4 is coated on insulating substrate 1 by edge substrate 1, is laminated copper foil by sticker 4 and is formed conductor layer；Or pass through sputtering
Method and galvanoplastic form copper foil conductor layer in insulated base material layer, combine insulated base material layer with copper foil conductor layer；Alternatively, In
It is coated with liquid polyimides on copper foil, after solvent seasoning, is combined insulated base material layer and copper foil by being heat-treated.Then make
Sprocket hole 2 is rushed on insulating substrate with mold, the coating photoresist in conductor layer, through overexposure, development, etching forms line map
Case 3 applies the excellent solder resist 5 of flexibility by printing process, to cover in addition to connection terminal to protect conductive pattern 3
Conductive pattern 3 except (such as interior pin and outer pin) part, then sets up separately in the connecting end sub-portion of conductive pattern 3 and sets plating
For tin alloy layers to connect with semiconductor and to prevent from corroding, original adoption tin-lead alloy electroplated layer etc. improves electrical connectivity, but
Since lead will cause environmental pollution, tin-lead alloy coating is replaced using tin-bismuth alloy electroplating coating.
It is found in use, when the marginal portion 5a of solder resist 5 is removed, electrotinning-bismuth alloy layer is being peeled off in this state
Region can be precipitated, so that tin-bismuth alloy electroplating layer is covered on the region of peeling, as shown in Figure 1 and Figure 2, at the edge of solder resist 5
On the 5a of part, the precipitation exception 6a of tin-bismuth alloy electroplating coating is generated.It is impacted when directly or indirectly applying to precipitation exception 6a
When, there is a problem of outer pin fall off to be formed short circuit or other pins between it is short-circuit.In particular, being refined recently as route
Progress, the short-circuit risks of connection terminal are also increasing.
When the flexible print circuit board of production COF winding at present, as shown in Figure 3, Figure 4, have flexible plastics thin
The single side of the insulating substrate 1 of film dress forms the conductor layers such as copper, the coating photoresist in conductor layer, then is exposed, and etching is formed
Line pattern 3, so electroplating tin alloy layer 6 is arranged in whole plate on conductive pattern 3, then in conductive pattern 3 in addition to connection terminal
The excellent solder resist 5 of part coating flexibility, prevents the peripheral portion of solder resist from removing from conductive pattern.But coating should
To be heated when solder resist 5, the copper in conductive pattern 3 can be diffused into electroplating tin alloy layer 6, tin-copper alloy layer is formed,
This tin-copper alloy layer is highly brittle.Therefore, flexible print circuit board is connected to another printed wiring board or electronic component uses
When, tin-copper alloy layer there are problems that breaking, and reliability is caused to reduce；In addition, due to using the tin plating operation of whole plate, greatly
The cost of manufacture is increased greatly.
Summary of the invention
In view of the above existing problems in the prior art, the present invention provides a kind of bending-resistant flexible wiring boards, prevent coating from hindering
Brittle tin-copper alloy layer is generated when being heat-treated after solder flux, eliminates the risk of broken string, improves reliability；Electrotinning is prevented simultaneously
The abnormal of alloy-layer is precipitated, and reduces manufacturing cost.
It is a further object of the present invention to provide the production methods of the bending-resistant flexible wiring board.
To achieve the goals above, a kind of bending-resistant flexible wiring board that the present invention uses, including insulating substrate, it is described exhausted
Edge substrate is equipped with conductor layer, and it further includes electroplating tin alloy layer, the first solder resist that being rushed on insulating substrate using mold, which has sprocket hole,
With the second solder resist；
The conductor layer forms conductive pattern after etching, is equipped with electrotinning at the connection terminal in the conductive pattern and closes
Layer gold, the part in conductive pattern in addition to connection terminal are coated with the first solder resist, at the first solder resist coating and phase
The second solder resist is coated at connection terminal in adjacent conductive pattern.
As an improvement, the insulating substrate is the substrate with flexible and plastic film dress.
As an improvement, the insulating substrate with a thickness of 12.5-50 μm.
As an improvement, the electroplating tin alloy layer is using in tin-bismuth alloy electroplating layer, tin-ag alloy layer, tin-silver-copper alloy-layer
It is any.
As an improvement, the connection terminal includes interior pin, outer pin and electroplate lead wire.
As an improvement, being coated with sticker on the insulating substrate, conductor layer is formed by sticker laminated conductor；Or
Sputter conductor forms conductor layer on insulating substrate；Or liquid polyimides is coated on conductor, after solvent seasoning, pass through heat treatment
Insulating substrate and conductor are combined.
As a further improvement, the conductor uses copper foil.
In addition, the present invention also provides a kind of production methods of bending-resistant flexible wiring board, comprising the following steps:
1) conductor layer is set in the one side of insulating substrate, continuously rushes sprocket hole at certain intervals using mold；
2) conductor layer is etched to form conductive pattern；
3) by printing process, first the part in conductive pattern in addition to connection terminal is coated with the first solder resist, then exists
Electroplating tin alloy layer is set at the connection terminal of conductive pattern, then at the first solder resist coating and in adjacent conductive pattern
Soft second solder resist is coated at connection terminal.
As an improvement, after the surface coating photoresist of conductor layer, by exposing, etching, being formed in the step 2)
Conductive pattern.
Compared with prior art, the present invention prints solder resist before tin plating, can prevent adding when printing solder resist
Being heat-treated, which causes copper to be diffused into tin layers, forms brittle tin-copper alloy, using production method of the invention, available bending resistance
Folding, the higher flexible print circuit board of reliability.
In addition, region coating of the present invention in conductive pattern other than connection terminal has excellent first of flexibility
Solder resist, the electrotinning alloy-layer on the connection terminal of conductive pattern, then in the first solder resist dispensing area and conductive pattern
The adjacent of upper connection terminal is coated with the second solder resist, since the second solder resist is by the company of electroplating tin alloy layer and the first solder resist
Place's covering is connect, air has been completely cut off, it is therefore prevented that erosion of the electroplating tin alloy layer to copper, in addition, being electricity below the second solder resist
Tin alloy layers are plated, not will form cavitation, are capable of providing a kind of flexible wires for avoiding connection terminal region from generating precipitation exception
Road printing plate, while The present invention reduces tin plating area, reduce manufacturing cost.
Detailed description of the invention
Fig. 1 is the partial structural diagram of flexible print circuit board in traditional technology；
Fig. 2 is the connection enlarged diagram of solder resist and electroplating tin alloy layer in Fig. 1；
Fig. 3 is the partial structural diagram using the flexible print circuit board of whole plate electroplating tin alloy layer；
Fig. 4 is the connection enlarged diagram of solder resist and electroplating tin alloy layer in Fig. 3；
Fig. 5 is structural schematic diagram of the invention；
Fig. 6 is the connection enlarged diagram of the first solder resist and electroplating tin alloy layer in Fig. 5；
In figure: 1, insulating substrate, 2, sprocket hole, 3, conductive pattern, 4, sticker, 5, solder resist, 5a, marginal portion, 6,
6a, exception, the 7, first solder resist, the 8, second solder resist is precipitated in electroplating tin alloy layer.
Specific embodiment
In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention is carried out below further detailed
It describes in detail bright.However, it should be understood that the specific embodiments described herein are merely illustrative of the present invention, it is not limited to this hair
Bright range.
As shown in Figure 5, Figure 6, a kind of bending-resistant flexible wiring board, including having the insulation base of flexible and plastic film dress
Plate 1, the insulating substrate 1 are equipped with conductor layer, and it further includes electroplating tin alloy that being rushed on insulating substrate 1 using mold, which has sprocket hole 2,
The 6, first solder resist 7 of layer and the second solder resist 8；
The conductor layer forms conductive pattern 3 after etching, is equipped with electrotinning at the connection terminal in the conductive pattern 3
Alloy-layer 6, the part in conductive pattern 3 in addition to connection terminal are coated with the first solder resist 7, and first solder resist 7 is coated with
The second solder resist 8 is coated at connection terminal in place and adjacent conductive pattern 3.
The production method of the bending-resistant flexible wiring board, comprising the following steps:
1) conductor layer is set in the one side of insulating substrate 1, such as copper foil can be laminated to by insulating substrate using sticker 4
Conductor layer is formed on 1, or sputter conductor forms conductor layer on insulating substrate 1；Or liquid polyimides is coated on conductor, it is molten
After agent is dry, it is combined insulating substrate 1 and conductor to form conductor layer by heat treatment；Then, using mold between certain
Every continuously rushing sprocket hole 2；
2) after the surface coating photoresist of conductor layer, by exposing, etching, conductive pattern 3 is formed；
3) the first solder resist 7, In is coated with by part of the printing process first in conductive pattern 3 in addition to connection terminal
Electroplating tin alloy layer 6 is set at the connection terminal of conductive pattern 3, then at 7 coating of the first solder resist and adjacent conductor figure
The second excellent solder resist 8 of flexibility is coated in case 3 at connection terminal.
Embodiment 1
A kind of production method of bending-resistant flexible wiring board, step include:
Firstly, being coated with sticker 4 in the one side of the plastic film shape insulating substrate 1 with flexible and insulating properties, utilize
Conductor is laminated on insulating substrate 1 by sticker 4, and the general thickness of conductor used herein, preferably copper foil, insulating substrate 1 is
12.5~50 μm, mold is then used, continuously rushes sprocket hole 2 at certain intervals；
Then, by exposing, etching, conductor figure is formed after the surface coating photoresist of conductor such as traditional treatment method
Case 3 removes unwanted photoresist with akaline liquid, is provided in conductive pattern 3 and draws for connecting in subsequent semiconductor
Foot draws for being connected to the outer pin of other printed wiring board or electronic component etc., and being electrolysed the plating used when plating
Line etc.；
Next, it is excellent that relatively thin flexibility is coated on conductive pattern by printing process in order to protect conductive pattern 3
The first solder resist 5 (about 2-10 μm of thickness), at the connection terminal of conductive pattern 3 be equipped with electroplating tin alloy layer 6 (use tin-
Any one of bismuth alloy layer, tin-ag alloy layer, tin-silver-copper alloy-layer use tin-bismuth alloy electroplating layer, thickness in the embodiment
About 0.3-0.5 μm), as shown in Figure 5, Figure 6, then it is coated at 5 coating of the first solder resist with connection terminal adjacent area flexible
The second excellent solder resist 8 (about 2-10 μm of thickness) of property, wherein the type of the first solder resist 5 and the second solder resist 8 can phase
Together, it can also be different；
Finally, semiconductor is engaged with interior pin, resin seal in the flexible print circuit board formed in this way
Afterwards, outer pin is made to be joined to other printing plates or electronic component.
In this illustration, insulating substrate 1 is usually with 12.5 to 50 μm of thickness.Furthermore it is also possible to pass through sputtering method
Or electrolytic plating method forms the double-layer structure of conductor in surface thereof；Another method, is coated with by polyimide resin solution
After on to the copper foil as conductor, volume strip material is formed using the method for drying and curing.
Bending-resistant flexible wiring board is made in embodiment and insulation base (is formed using identical material using conventional method
Plate, conductor and the excellent solder resist of flexibility, are applied to by polyimide resin solution as conductor and with a thickness of 12 μm
After on copper foil, it is dried and solidifies to form 40 μm of thickness) flexible circuit board progress cripping test, bending strength is made
Measuring condition be load: 0.98N, bending angle: 90 degree of side, radius of curvature R: 0.5mm, test N number: 5 samples.Specifically
The results are shown in Table 1.
The test result of the test experiments resistant to bending of table 1
Analytical table 1 is it is found that bending resistance of the invention significantly improves.
The present invention carries out one-step print solder resist on completing the molding COF product of route, then progress tin, thereafter again
Second of solder resist printing is carried out, the printing position of second of solder resist is prolonged relative to the printing position of first time solder resist
Exhibition, so that its a part of region overlay that will change tin, eliminates solder resist printing border area because of the otherness of solder resist thickness
Caused tin thickness ununiformity, so as to avoid because product circuit caused by Kinkendal Effect it is bad.In addition, the present invention improve it is curved
Folding endurance energy reduces tin plating area, reduces manufacturing cost.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modification, equivalent replacement or improvement etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of bending-resistant flexible wiring board, including insulating substrate (1), the insulating substrate (1) is equipped with conductor layer, and insulate base
On plate (1) using mold punching have sprocket hole (2), which is characterized in that further include electroplating tin alloy layer (6), the first solder resist (7) and
Second solder resist (8)；
The conductor layer is formed conductive pattern (3) after etching, and electrotinning is equipped at the connection terminal in the conductive pattern (3)
Alloy-layer (6), the part in conductive pattern (3) in addition to connection terminal are coated with the first solder resist (7), first solder resist
(7) the second solder resist (8) are coated at connection terminal at coating and in adjacent conductive pattern (3).
2. a kind of bending-resistant flexible wiring board according to claim 1, which is characterized in that the insulating substrate (1) is tool
There is the substrate of flexible and plastic film dress.
3. a kind of bending-resistant flexible wiring board according to claim 1 or 2, which is characterized in that the insulating substrate (1)
With a thickness of 12.5-50 μm.
4. a kind of bending-resistant flexible wiring board according to claim 1, which is characterized in that the electroplating tin alloy layer (6)
Using any one of tin-bismuth alloy electroplating layer, tin-ag alloy layer, tin-silver-copper alloy-layer.
5. a kind of bending-resistant flexible wiring board according to claim 1, which is characterized in that the connection terminal includes interior draws
Foot, outer pin and electroplate lead wire.
6. a kind of bending-resistant flexible wiring board according to claim 1, which is characterized in that applied on the insulating substrate (1)
Sticker (4) are furnished with, conductor layer is formed by sticker (4) laminated conductor；Or the formation of sputter conductor is led on insulating substrate (1)
Body layer；Or liquid polyimides is coated on conductor, after solvent seasoning, insulating substrate (1) and conductor are carried out by heat treatment
Combination.
7. a kind of bending-resistant flexible wiring board according to claim 6, which is characterized in that the conductor uses copper foil.
8. the production method of bending-resistant flexible wiring board described in a kind of claim 1, which comprises the following steps:
1) conductor layer is set in the one side of insulating substrate (1), is continuously rushed at certain intervals using mold sprocket hole (2)；
2) conductor layer is etched to form conductive pattern (3)；
3) by printing process, first the part in conductive pattern (3) in addition to connection terminal is coated with the first solder resist (7), then
Electroplating tin alloy layer (6) are set at the connection terminal of conductive pattern (3), it is then at the first solder resist (7) coating and adjacent
Conductive pattern (3) in soft second solder resist (8) of coating at connection terminal.
9. a kind of production method of bending-resistant flexible wiring board according to claim 8, which is characterized in that the step 2)
In, after the surface coating photoresist of conductor layer, by exposing, etching, formed conductive pattern (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910778039.9A CN110402019A (en) | 2019-08-22 | 2019-08-22 | A kind of bending-resistant flexible wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910778039.9A CN110402019A (en) | 2019-08-22 | 2019-08-22 | A kind of bending-resistant flexible wiring board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110402019A true CN110402019A (en) | 2019-11-01 |
Family
ID=68329036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910778039.9A Pending CN110402019A (en) | 2019-08-22 | 2019-08-22 | A kind of bending-resistant flexible wiring board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN110402019A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037353A (en) * | 2001-07-24 | 2003-02-07 | Shindo Denshi Kogyo Kk | Flexible circuit board and its manufacturing method |
| JP2006253247A (en) * | 2005-03-09 | 2006-09-21 | Shindo Denshi Kogyo Kk | Flexible printed wiring board and its manufacturing method |
| EP2057680A2 (en) * | 2006-08-31 | 2009-05-13 | Honeywell International Inc. | Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same |
| CN103210704A (en) * | 2010-11-15 | 2013-07-17 | 赛姆布兰特有限公司 | Method for reducing creep corrosion |
-
2019
- 2019-08-22 CN CN201910778039.9A patent/CN110402019A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037353A (en) * | 2001-07-24 | 2003-02-07 | Shindo Denshi Kogyo Kk | Flexible circuit board and its manufacturing method |
| JP2006253247A (en) * | 2005-03-09 | 2006-09-21 | Shindo Denshi Kogyo Kk | Flexible printed wiring board and its manufacturing method |
| EP2057680A2 (en) * | 2006-08-31 | 2009-05-13 | Honeywell International Inc. | Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same |
| CN103210704A (en) * | 2010-11-15 | 2013-07-17 | 赛姆布兰特有限公司 | Method for reducing creep corrosion |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191101 |
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| RJ01 | Rejection of invention patent application after publication |