TW201000672A - Metal plated article of molded form and method for producing it - Google Patents

Abstract

Disclosed are a plated molded article and a method for producing the same. Specifically disclosed is a plate article wherein a coating layer containing conductive polymer particles and a binder is formed on the surface of a molded article, and a metal plating film is formed on the coating layer by electroless plating through adsorption of a catalyst metal. The binder is present in an amount of 0.1-10 parts by mass per 1 part by mass of the conductive polymer particles, and the coating layer has a thickness of 0.5-100 μm. The sizes of the catalyst metal lumps adsorbed on the coating layer are not more than 150 nm, and the amount of the catalyst metal adsorbed on the coating layer per unit area is from 0.1 μg/cm<SP>2</SP> to 3.0 μg/cm<SP>2</SP>.

Description

201000672 VI. Description of the Invention: [Technical Field] The present invention relates to a plated product of a molded article produced by an electroless plating method and a method for producing the same, which relates in detail to an excellent productivity and a base A metal plating film excellent in material density and excellent in appearance, and a plated product of a molded article produced by electroless plating method and a method for producing the same, which have no exposed portion (unevenness) on the surface of the film. In particular, it is suitable for plating for decorative plating such as electromagnetic wave shielding applied to a casing, and automotive parts. [Patent Document 1] discloses a resin molded body (consisting of a polystyrene resin or a polystyrene blend resin) by electroless plating. A method of forming a plating film having excellent adhesion by applying a treatment. However, in the "in this method", it is necessary to perform a number of steps before forming a plating film on the above-mentioned resin molded body by electroless plating. In other words, as a pretreatment method, it is necessary to obtain (1) a swelling step for improving the hydrophilicity (a good adhesion and appearance of the plating film can be obtained) in order to obtain an appropriate roughening during the etching treatment. (2) a first etching treatment in which an aqueous solution containing permanganate is treated, and (3) a material selected from inorganic acid and perchloric acid in order to achieve moderate coarsening and hydrophilicity of the surface of the resin molded body A second etching treatment in which an aqueous solution of at least one of the groups consisting of an acid and a peroxyacid is treated. -5- 201000672 In addition, in Patent Document 1, it is described that in the case where the surface contamination is serious, the treatment is performed before the swelling step, and it is necessary to carry out the removal in order to remove the second etching step. Treatment of an aqueous solution of a reducing agent. Further, in the embodiment of Patent Document 1, in the case of the above-described complicated etching treatment or the like, the plating film is not formed. [Problem to be Solved by the Invention] The object of the present invention is to provide an excellent etching property, that is, a complicated etching process described in Document 1, and the like. The metal plating film is a method for producing a molded article produced by electroless plating without a uniform exposed portion on the surface of the film. [Means for Solving the Problem] The inventors of the present invention have found that coating a molecular fine particle coating on a resin film such as an extended PET film or a PI film by electroless plating to form a coating layer or coating a microparticle-containing particle After forming a coating layer by the coating material, the resin molding body can be first subjected to a degreasing clock by dedoping the polymer microparticles in the coating layer layer without performing complicated etching treatment or the like. The acid salt is treated with a reductive high-electricity polymer base in a 2-axis, and the like, and the plating is not carried out without the adhesion (unevenness) of the patent material having excellent density. The metal plating film excellent in adhesion to the substrate -6 - 201000672 is a uniform plating material without an exposed portion (unevenness) on the surface of the film. However, as a result of performing plating by a molded article having a shape having irregularities, for example, it is found that the formation of the coating layer is performed by spraying or dipping due to the shape of the unevenness, and thus, the resin film is formed. Compared with the case where the coating layer is formed, it is difficult to uniformly form the coating layer without increasing the thickness of the coating layer. Therefore, the coating layer having a certain thickness (for example, 0.5 μm or more) is formed and electroless plating is performed. In this case, the metal plating film having excellent adhesion to the substrate has no exposed portion (unevenness) on the surface of the film, and it is difficult to obtain a uniform plating material. Therefore, the inventors of the present invention have obtained a metal plating film having excellent adhesion to a substrate even when a molded article having a coating layer having a certain thickness is formed, and there is no exposed portion on the surface of the film ( As a result of careful review of the method of uniform plating, it has been found that as long as the mass ratio of the polymer fine particles and the binder constituting the coating layer is set to a certain range, the electroless plating is applied to the coating film. The size of the catalytic metal block on the layer is set to be less than or equal to a certain extent, and the amount per unit area of the catalytic metal adsorbed on the surface of the coating layer is set to a specific range, even if it is formed to a certain extent In the molded article of the coating layer (0.5 to 100 μm), a metal plating film having excellent adhesion to the substrate can be obtained, and the surface of the film has no exposed portion (unevenness) and is a uniform plating material. The invention is completed. That is, the present invention relates to (1) a plating material which is formed on a surface of a molded article to form a coating layer containing conductive polymer microparticles and a binder, and 201000672 is electroless on the coating layer. The plating method forms a plating material of a metal plating film by adsorption of a catalytic metal, and the binder is present in an amount of 0.1 to 10 parts by mass based on 1 part by mass of the conductive polymer fine particles, and the thickness of the coating layer is 0.5 to 100 μηη, the size of the above-mentioned catalytic metal block adsorbed on the coating layer is 15 or less, and the amount per unit area of the catalytic metal adsorbed on the coating layer is O.bg. (2) The plating material according to the above (1), wherein 60% or more of the particles of the conductive polymer fine particles are present on the upper side of the coating layer. In the above, the average particle diameter of the conductive polymer fine particles is from 1 Å to 100 nm, and the method for producing the (3) plating material is performed by electroless plating of a metal film by an electroless plating solution, A) Coating a reducing polymer microparticle and phase on a molded article a coating for forming a coating layer having a thickness of from 0.5 to 10 parts by mass of the reducing polymer fine particles in an amount of from 0.1 to 10 parts by mass, and a step of forming a coating layer having a thickness of from 0.5 to ιοομπι, on the coating layer, through a catalytic metal a step of forming a metal plating film by electroless plating, and setting a size of the catalyst metal block adsorbed on the coating layer to be 1 5 Onm or less and adsorbing on the coating layer The method of the step of the above-mentioned catalyst metal is defined as a method of the step of O. lpg/cm 2 to 3.0 pg/cm 2 , and (4) the method described in the above (3), wherein the reducing polymer fine particles are used. The use of the dedoping of the conductive polymer microparticles -8 - 201000672 is used to become a reducing microparticle. Here, the term "the size of the catalytic metal block" as used herein means a block in which the catalytic metal deposited on the surface of the coating layer is agglomerated, and a scanning micrograph of the surface of the coating layer is 20 μm>&lt;20 μιη The catalyst metal block appeared in the range is selected from the larger one, and the size of the block is measured and averaged. In addition, the size of the block means the length of the longest side and the length of the shortest side of each block. And the average. In addition, the term "thickness of the coating layer" as used above means that the thickest point and the thinnest point of the coating layer on the molded article are selected, and the thickness is measured by a micrometer. The average number. [Effect of the Invention] According to the present invention, even if it has a shape having irregularities, it is possible to form a molded article having a certain thickness to a certain extent, and it is excellent in productivity, that is, it does not require complicated etching treatment. A metal plating film having excellent adhesion to a substrate is produced by electroless plating, and a uniform plating material is formed on the surface of the film without an exposed portion (unevenness). The above-described effects of the plating material of the present invention are obtained by adsorbing the catalyst on the coating layer by setting the mass ratio of the polymer fine particles constituting the coating layer to the binder to a certain range and performing electroless plating. The size of the metal block is set to be less than or equal to a certain value, and the amount per unit area of the catalyst metal adsorbed on the surface of the coating layer is set to a specific range. For this reason, it can be considered as follows. -9- 201000672 In the plating method described in the cited document 1, for example, after the etching treatment, the surface of the substrate is treated with stannous chloride, and the catalyst metal is adsorbed by the action of the tin treatment on the surface. Palladium. At this time, since the adsorbed palladium does not have a chemical action on the substrate, the adhesion between the substrate and the palladium is low, and thus the formed plating film tends to be poor in adhesion, however, because the substrate The adhesion to palladium is low. Therefore, palladium tends to be adsorbed on the entire substrate on average, so the size of palladium rarely becomes 10 nm or more. On the other hand, in the present invention, the palladium is chemically bonded to the polymer fine particles by the reductive property of the polymer fine particles present on the surface of the coating layer, and the palladium is chemically bonded to the polymer fine particles (in combination, Since the polymer fine particles become electrically conductive and the adhesion between the substrate and palladium is high, it is easy to form a plating film having excellent adhesion. However, since the palladium is only collected on the surface of the coating layer. Since the polymer microparticles are adsorbed with high density, the proportion of the reducing polymer microparticles present on the surface is small, and the catalyst metal, for example, palladium or the like, aggregates and becomes large, and the scanning microscope of FIG. As shown in the photograph, the agglomeration of palladium becomes larger. If it exceeds 15 Onm, the palladium becomes easily peeled off from the surface of the substrate, and it becomes easy to cause aggregation failure. As a result, it becomes a plating film. The density is reduced. Therefore, it is considered that by setting the mass ratio of the polymer fine particles and the binder constituting the coating layer to a certain range, the ratio of the reducing polymer fine particles present on the surface of the coating layer is maintained within a certain range' and adsorption is performed. The size of the catalytic metal block on the coating layer is controlled to be less than or equal to a specific size (150 nm - 10 201000672 or less: for example, a scanning micrograph of Fig. 2). "Reducing the decrease in adhesion caused by the above." 'Excellent closeness effect. In addition to the above, although the size of the catalyst metal adsorbed on the coating layer is controlled to a specific range 'If the amount of the unit area of the catalyst metal adsorbed on the coating layer becomes excessive', it is considered to be subsidized. The adhesion between the adhesive which contributes to the adhesion and the metal plating film is reduced, whereby the adhesion between the coating layer and the metal plating film is lowered. Therefore, by setting the amount of each unit area of the catalyst metal adsorbed on the surface of the coating layer to a specific range, it is considered that the above-mentioned adhesion is reduced, and it contributes to exhibiting excellent adhesion. In addition, the size of the catalytic metal block adsorbed on the coating layer is set to a specific range, and the amount per unit area of the catalytic metal adsorbed on the surface of the coating layer is set to a specific range. It is easily controlled by adjusting the concentration of the catalyst metal of the catalyst liquid used for the treatment, the processing temperature, and the processing time. The coating layer in the plating material of the present invention is such that the ratio of the presence of the reducing polymer fine particles in the upper half is higher, for example, in which 60% or more of the particles in the fine particles are present in the upper half. Preferably, the formation ratio of the organic polymer (adhesive) on the lower side of the coating layer is increased, and the adhesion between the substrate and the coating layer is increased, so that the result is metal plating. The adhesion between the film and the substrate is improved. Further, the presence ratio of the reducing polymer fine particles in the vicinity of the surface of the coating layer becomes high, so that the amount of adsorption of the catalytic metal on the surface becomes increased, and the metal plating film formed thereby is coated even in a relatively thin coating. The film layer is also -11 - 201000672 exposed (uneven) and can be made uniform. In the plating material of the present invention, not only the reducing polymer fine particles but also the conductive polymer fine particles can be produced in the same manner. In this case, it is necessary to dedoping the conductive polymer microparticles to be reductive before electroless plating, and in the plating of the present invention, even 〇·5 to 1〇〇 The film thickness of the film thickness of μιη can also maintain excellent adhesion and uniformity. In addition, the ratio of the presence of the polymer fine particles in the upper half of the coating layer is high, for example, 60% or more of the particles are present in the upper half, and only the reducing polymer particles or the conductive polymer particles are organically The design of the drying temperature and time after coating the substrate on the polymer (adhesive) can be easily achieved. In addition, the plating material of the present invention is obtained by, for example, reducing or adsorbing a catalytic metal such as palladium on a coating layer containing a reducing polymer fine particle formed on a substrate, and adsorbing the catalytic metal such as palladium. A metal plating film is formed on the coating layer, and in the case where the catalytic metal such as palladium is reduced and adsorbed to the polymer fine particles, for example, polypyrrole, it is considered to be in the state shown in the following figure. [化1] Η Η

-12- 201000672 That is, by reduction of reducing polymer microparticles, palladium (metal) is adsorbed to the polymer, and polymer microparticles (polypyrrole) are ionized, doped, and the result is Conductive. [Embodiment] The present invention will be described in further detail. The plating material of the present invention can be coated with a plating material by electroless plating, and a part of the reducing polymer fine particles containing a reducing high-concentration is applied to the molded article by A). a coating having a thickness of 0.5 to ΙΟΟμιη) formed on the coating layer by a catalytic metal plating method to form a metal plating film, and the size of the catalytic metal block on the layer is set to 150 nm to coat the coating film It is produced by the method of the steps of the above-mentioned catalyst metal on the layer of O.lpg/cm2 to 3.0 pg/cm2. In the present invention, a molded article is used as a substrate, and examples thereof include PET resin, LCP resin, PPS resin, PEEK resin, and a hydrocarbon resin (for example, pp; COP resin), PC resin, ABS resin, resin, HIPS resin, and PS. Resin, MS resin, (polypyrrole) makes palladium off the microparticles, and thus, it becomes palladium.

The step of chemically plating the metal film microparticles and the coating layer with respect to the adhesion layer to 1 part by mass is adsorbed to the coating film by electroless plating, and the amount of adsorption to the upper area is determined as ' Specifically, it can be p I 、 旨, P EI _ I purpose if fat, c 〇 c resin, ABS / PC resin, AS PA resin, pc / ASA -13 - 201000672 resin, PPA resin, glass or alumina For example, a plating material such as a ceramic or a magnesium alloy is used for the plating of the molded article, for example, plating for electromagnetic wave shielding applied to the casing, plating for decoration such as automobile parts, and plating for interior decoration. The reducing polymer fine particles used in the present invention are not particularly limited as long as they have a π-conjugated double bond having a conductivity of less than 0.01 S/cm, and examples thereof include polyacetylene and poly Anthracene, polyparaphenylene, polyparaphenylenevinylene, polypyrrole, polyaniline, polythiophene, and various derivatives thereof may, for example, be polypyrrole. Further, the reducing polymer fine particles are preferably polymer fine particles having a conductivity of 0.05 5 S/cm or less. The reducing polymer microparticles can be synthesized by using a monomer having a π-conjugated double bond, and can also be used as a commercially available reducing polymer microparticle. The average particle diameter of the reducing polymer fine particles is preferably from 10 to 100 nm. The binder used in the present invention may, for example, be polyvinyl chloride, polycarbonate, polystyrene, polymethyl methacrylate, polyester 'poly maple, polyphenylene ether, polybutadiene, poly( N-vinylcarbazole), hydrocarbon resin, ketone resin, phenoxy resin, polyamine, ethyl cellulose, vinyl acetate, ABS resin, polyurethane resin, melamine resin, unsaturated polyester Resin, alkyd resin, epoxy resin, enamel resin, and the like. As the binder used in the present invention, a polymer having a carboxyl group of -14 - 201000672 can be used, and particularly suitable for using a styrene resin as a substrate, and in this case, as long as it is in a molecule The compound of the thiol group is not particularly limited, and examples thereof include a acrylic acid resin having a residue in a molecule, a vinyl chloride resin, an urethane resin, a styrene resin, and the like. The Tg of the above resin is usually 60 ° C or higher and is preferably 70 ° C or higher. Further, in the case of using a mixture of resins, the above-mentioned organic polymer having a carboxyl group is not particularly limited as long as at least one of the above resins has a carboxyl group, and all of the resins do not have a carboxyl group. Further, the amount of the carboxyl group in the case where the above-mentioned organic polymer having a carboxyl group is used is preferably such that the amount of the carboxyl group in the solid component in the coating material for forming the coating layer is in the range of 0.01 to 4.0 mmol/g. . The above amount is preferably in the range of from 〇_1 to 2.4 mmol/g. The amount of the binder to be used is 0.1 parts by mass to 10 parts by mass based on 1 part by mass of the reducing polymer fine particles. When the amount of the binder exceeds 1 part by mass, the metal shovel does not precipitate, and if the binder is not full, the adhesion to the substrate is weakened by 1 part by mass. The coating material for forming a coating layer may contain a solvent in addition to the reducing polymer, the fine particles, and the binder. In the above-mentioned solvent, as long as the reducing polymer microparticles are not damaged, and the reducing polymer microparticles can be dispersed, the binder is not particularly limited, and the molded article is a substrate. Largely dissolved people are not good. However, even a bulking agent which substantially dissolves a molded article can be used by mixing with other solvents having low solubility to lower the solubility and to use -15-201000672. The organic solvent to be used may, for example, be an aliphatic ester such as butyl acetate, an aromatic solvent such as toluene or a ketone such as methyl ethyl ketone, a cyclic saturated hydrocarbon such as cyclohexane or a chain such as n-octane. Saturated hydrocarbons, chain saturated alcohols such as methanol, ethanol, and n-octanol, aromatic esters such as methyl benzoate, aliphatic ethers such as diethyl ether, and the like. Further, when a dispersion liquid which is previously dispersed in an organic solvent is used as the reducing polymer fine particles, the organic solvent used in the dispersion liquid may be used as a part or all of a solvent of the coating material. In addition, the coating material may be added with a resin such as a dispersion stabilizer, a tackifier or an ink binder, and a pigment 0 depending on the application or the object to be coated, and the coating material applied to the substrate may be applied to the substrate prepared as described above. In this case, it is necessary to form a coating layer by drying it by heating or the like. The coating method of the above coating material is not particularly limited as long as it can uniformly form a coating layer, and for example, a spray coating, a screen printing machine, a gravure printing machine, an elastic printing machine, an ink jet printer, or an offset printing plate can be used. Printing or coating by a printing machine, a dipping, a spin coater, a roll coater, or the like is preferably applied to a molded article having irregularities, and is preferably sprayed or immersed. The drying conditions are also not particularly limited and can be carried out at room temperature or under heating. The drying temperature in the case of using a resin substrate having a low Tg as the substrate is preferably carried out at a temperature of 5 to 15 ° C lower than the Tg of the resin substrate to be used. -16- 201000672 In a manner in which the reducing polymer micro ratio becomes higher in the upper half of the coating layer, for example, 60% or more of the fine particles are formed in the upper half, and such a coating is applied. After the cloth, it is dried over time under mild conditions: It can be achieved by a specific method, for example, by drying at a temperature of 30 to 10 degrees, drying at a low temperature of 30 to 60 ° C, and drying. In the case of a temperature difference of 2 or more different temperatures, when benzene is used as an organic solvent, it is dried by drying at 40 ° C for 1 minute at 10 ° C for 10 minutes, and then dried at 80 ° C for 1 minute. 60% or more of the particles are present on the upper side of the coating layer, and the thickness of the coating layer formed by the coating layer is 〇·5μηι to ΙΟΟμιη. If the thickness of the coating layer is too thin, it is difficult to uniformly become uniform. The thickness of the film layer is preferably determined. Further, even if the film thickness of the coating layer is increased, the strength of the coating film can be maintained by the example of the coating layer. However, if the coating layer is subjected to the type or blending ratio of the binder, the coating film strength is lowered to the thickness of the coating layer. It is better to set it as ΙΟΟμιη. The substrate on which the coating layer containing the reducing agent produced as described above is formed by electroless plating is electroplated. The electrolytic plating method can be carried out according to a generally known method. In other words, by immersing the substrate in a catalyst liquid for attaching a chlorinated metal, water immersion or the like immersed in the presence of particles-free particles can be formed by sag. The low temperature of 6 °C slows down the temperature, for example, after a minute of use, in the range that can be made into particles. When the coating layer is formed to be 0.5 μm or more, if it is thicker than the thickness, the polymer may be obtained by the catalyst gold plating bath of 175-201000672 due to the polymer fine particles. The catalyst liquid contains a solution of a noble metal (catalyst metal) having a catalytic activity for electroless plating, and examples of the catalytic metal include palladium, gold, uranium, ruthenium, etc., and the metals are monomers or The compounds are all acceptable, and the viewpoint of the stability of the catalytic metal is preferably a palladium compound, particularly preferably palladium chloride. A specific 0.05% palladium chloride-0.05% aqueous hydrochloric acid solution (p Η 3 ) can be mentioned as a suitable specific catalyst liquid. The treatment temperature is 20 to 50 ° C, preferably 30 to 40 ° C, and the treatment time is 0.1 to 20 minutes, preferably 1 to 10 minutes. By the above operation, the reducing polymer fine particles in the coating film are, as a result, conductive fine particles. Further, in the step of adsorbing the above-mentioned catalytic metal such as palladium chloride on the coating layer, the size of the adsorbed catalytic metal block is controlled to be 150 nm or less, and each unit of the above-mentioned catalytic metal adsorbed is adsorbed. The amount of area is controlled from O.lpg/cm2 to 3.0 pg/cm2. When the size of the adsorbed catalyst metal block exceeds 15 Onm, the catalytic metal becomes easily peeled off from the surface of the substrate and becomes liable to cause aggregation failure. As a result, the adhesion of the plating film is caused. reduce. In addition, when the amount per unit area of the adsorbed catalyst metal is less than 0.1 μg/cm 2 , a uniform metal plating film having no unevenness is formed, and in the case of more than 3. (g/cm 2 , The adhesion between the metal plating film and the coating layer is lowered. In addition, the size of the adsorbed catalytic metal block is set to be less than 150 nm -18-201000672, and the adsorbed catalytic metal is The amount per unit area is set to ο cm2 to 3.0 pg/cm2, which can be easily controlled by adjusting the concentration, treatment, and processing time of the catalyst liquid. That is, the size of the adsorbed catalyst metal is mainly When the concentration of the catalyst metal in the pre-media liquid is controlled, if the concentration is lowered, the contact is small, and if the concentration is increased, the catalytic metal tends to become large. The amount of the catalytic metal adsorbed, Mainly by controlling the time of the solution, if the treatment time is shortened, the amount of adsorbed gold is less, and if the treatment time is prolonged, the amount of adsorbed catalyst metal tends to increase. Mainly controlling the speed of the aforementioned adsorption, if the temperature is lowered, The adsorption rate of the catalytic metal decreases, and if the treatment is increased, the adsorption speed tends to rise. Therefore, the treatment temperature rises, which is longer than the adsorption of the catalyst metal. The amount of the medium metal tends to increase. By the above treatment, the base on which the catalyst metal is adsorbed on the coating layer is immersed in the plating solution for depositing the metal, thereby forming an electroless coating film. In addition, it is not particularly limited as long as it is a liquid which is usually used for electroless plating. That is, metal, copper, gold, silver, etc. which can be used for electroless plating are all applicable, and copper is preferable. Specific examples of the electroless copper plating bath include, for example, an ADDCOPPER IW bath (manufactured by Okuno Pharmaceutical Co., Ltd.) leg/temperature of the catalyst medium, and an adsorption material above the treatment temperature, deplating Mineral deposit, nickel ATS, etc. -19- 201000672 The treatment temperature is 20 to 50 ° C, preferably 30 to 40 ° C, for 1 to 30 minutes, preferably 5 to 15 minutes. At room temperature or under heating conditions, for example 2 hours Preferably, the upper curing agent is used, and the substrate to be used is a low Tg like a styrene resin substrate, and is preferably aged at a temperature range of 5 to 15 t lower than that of the substrate. According to the method, it is excellent in productivity, that is, a molded article produced by an electroless plating method, which is not required to be subjected to an etching treatment, and has a metal plating film excellent in adhesion to a substrate, and has no exposed portion on the surface. The present invention also relates to a method for producing a polymer microparticle by using a conductive microparticle by dedoping a conductive microparticle to form a reducing microparticle. After forming the coating layer by the microparticle-incorporating polymer microparticles, the electrophoretic molecular microparticles of the coating layer are dedoped to become a reducing host molecule, and then adsorbed by the catalyst metal by electroless plating. It is achieved by applying a film. Specifically, it consists of the following steps C) to E). C) applying a coating material containing conductive polymer microparticles and 1 to 10 parts by mass of the conductive polymer microparticles to the molded article to form a coating layer having a thickness of 0.5 to 100 μm. The step of treating the conductive polymer microparticles contained in the coating layer to form the reducing polymer microparticles, and the microparticle-reducing property of the plating film having the Tg complex Step of plating with respect to part, dedoping -20-201000672 E) a step of forming a metal plating film by electroless plating on the coating layer by adsorption of a catalytic metal, and adsorbing to the above coating The size of the catalytic metal block on the film layer is set to be less than 15 Onm, and the amount per unit area of the catalytic metal adsorbed on the coating layer is set to be from 0.1 MPa/cm 2 to 3.0 pg/cm 2 . The step C) may be carried out under the same conditions as the above-mentioned step A) except that the reducing polymer fine particles are replaced by the conductive polymer fine particles. The conductive polymer fine particles used in the above-described production method are not particularly limited as long as they are conductive polymers having a 7-conjugated double bond, and examples thereof include polyacetylene and polyacene. Polyparaphenyl, polystyrene, polypyrrole, polyaniline, polythiophene, and various derivatives thereof may, for example, be polypyrrole. The conductive polymer fine particles can be used by synthesizing a monomer having a conjugated double bond, and can be used in commercially available conductive polymer fine particles. The average particle diameter of the above-mentioned reducing polymer microparticles is preferably from 10 to 100 nm. The thickness of the formed coating layer is in the range of 〇.5μηι to 1〇〇μιη2. When the thickness of the coating layer is too small, it may be difficult to form the coating layer uniformly. Therefore, the thickness of the coating layer is preferably 〇 5 μm or more. In addition, even if the film thickness of the coating layer is increased, for example, the coating film strength can be maintained even if it exceeds 100 μm. However, if the coating layer is too thick, the coating film strength is lowered depending on the type or blending ratio of the binder. In the case of -21 - 201000672, the thickness of the coating layer is preferably set to be 10 0 μηη or less. The dedoping treatment in the step D) may, for example, be a boron hydride compound containing a reducing agent such as sodium borohydride or potassium borohydride, dimethylamine borane, diethylamine borane or trimethylamine borane. A method of reducing a solution of an alkylamine borane such as triethylamine borane or a hydrazine or the like, or a method of treating with an alkaline solution. From the standpoint of operability and economy, it is preferred to treat it with an alkaline solution. In particular, the layer formed by using the conductive polymer fine particles can be dedoped by a short time alkali treatment. For example, it is treated in an aqueous solution of sodium hydroxide at a temperature of 20 to 50 ° C, preferably 30 to 40 ° C for 1 to 30 minutes, preferably 3 to 10 minutes. The above step E) can be carried out under the same conditions as the above step B). Further, the present invention relates to a plating material which can be produced by the above-described manufacturing method to form a coating layer containing conductive polymer microparticles and a binder on the surface of a molded article, and electroless plating on the coating layer. The coating method forms a plating material of a metal plating film by adsorption of a catalytic metal, and the binder is present in an amount of 0.1 to 10 parts by mass based on 1 part by mass of the conductive polymer fine particles, and the thickness of the coating layer is 0.5. ΙΟΟμιη, the size of the catalytic metal block adsorbed on the coating layer is 15 On or less, and the amount per unit area of the catalytic metal adsorbed on the coating layer is 〇.lpg/cm 2 to 3.0pg/cm2. Further, it is preferable that 60% of the conductive polymer fine particles are present on the upper half of the coating layer on -22 to 201000672, and the average particle diameter of the conductive polymer fine particles is 10 to 1 00 nm plating. The "size of the catalyst metal block" in the present invention means a block of catalytic metal which is deposited on the surface of the coating film, and a catalyst metal block which is displayed in the range of 20 μm χ 20 μm of the surface of the coating film. It is selected from the larger ones, and the size of the block is measured and averaged. In addition, the size of the block means the average of the length of the longest side of each block and the length of the shortest side. Further, the "thickness of the coating layer" in the present invention means that the thickest point and the thinnest point of the coating layer on the molded article are selected, and the thickness is averaged by the micrometer. . Further, in the plating material of the present invention, a primer layer may be provided on the surface of the molded article in order to improve the adhesion between the surface of the molded article and the coating layer. The formation of the primer layer may be a method of applying a primer coating on the surface of a molded article, forming a smooth coating film, or laminating a resin film formed by a primer coating on the surface of the molded article. Method, etc. The primer coating material is not particularly limited as long as it has good adhesion to the molded article and/or has good adhesion to the coating layer formed on the primer layer. For the above primer coating, the same compound as that used for the formation of the coating layer can be used. As described above, if the same compound as the binder used for the formation of the coating layer is used as the primer coating, the primer layer and the coating layer are integrated, and as a result, the a's adhesion is effective. It is better. Examples of the above compounds include polyvinyl chloride, polycarbonate-23-201000672 ester, polystyrene, polymethyl methacrylate, polyester, polyfluorene, polybutadiene, and poly(N-vinyl). Carbazole), hydrocarbon resin, phenoxy resin, polyamine, ethyl cellulose, vinyl acetate resin, polyurethane resin 'melamine resin, unsaturated fat, alkyd resin, epoxy resin, sand resin Wait. Hereinafter, a specific method for producing the polymer microparticles which are electrically or reductive for the plating of the present invention will be described. (1) Method for Producing Reducing Polymer Microparticles Reducing polymer microparticles can be added by mixing an organic solvent ion-based surfactant and a nonionic surfactant in an emulsion of o/w type; - A single monomer of a conjugated double bond is produced by oxidative polymerization. The monomer having a 7 Γ-conjugated double bond is not particularly limited as long as it is a monomer used for the original polymer, such as pyrrole, N-methylpyrrole, N-ethylpyrrole, and N. -Phenylnaphthopyrrole, N-methyl-3-methylpyrrole, N-methyl-3-ethylpyridin-3-methylpyrrole, N-phenyl-3-ethylpyrrole, 3-methyl Pyripyrrole, 3-n-butylpyrrole, 3-methoxypyrrole, 3-ethoxyxo-n-propoxypyrrole, 3-n-butoxypyrrole, 3-phenylpyrroleylpyrrole, 3- Naphthyl pyrrole, 3-phenoxypyrrole, 3-methylrrole, 3-aminopyrrole, 3-dimethylaminopyrrole, 3-diethyl, 3-diphenylaminopyrrole, 3-methylphenyl a pyrrole derivative such as an aminopyrrole or a 3-phenylpyrrole, an aniline, an o-chloroaniline, a m-chlorobenzene, a polyphenylene ether, a ketone resin ester, an ABS, and a polyester tree. The product is also manufactured, but can be pyrrole, N-role, N-benzox, 3-ethylpyrrolidine, 3-toluphenoxypyraminopyrrolylnaphthalenylamine, p-chloro-24- 201000672 Aniline, o-methoxyaniline, m-methoxyaniline Aniline derivatives such as p-methoxyethoxyaniline, m-ethoxyaniline, p-ethoxyaniline, m-methylaniline and p-methylaniline, thithiophene, 3-n-butylthiophene, 3-n-pentyl Thiophene, 3-n-hexyl-heptylthiophene, 3-n-octylthiophene, 3-n-decylthiophene, phenoxy, 3-n-undecylthiophene, 3-n-dodecylthiophene, phenanthrene, 3-naphthyloxy Examples of the thiophene such as thiophene and 3,4-ethylenedioxythiophene include pyrrole, aniline, thiophene and 3,4-ethylene dioxygen. In addition, the anionic interfacial activity used in the above-mentioned manufacturing may use various substances, and those having a plurality of hydrophobic terminals (having a branched structure or having a complex hydrophobic base) may be such an anionic system having a plurality of hydrophobic terminals. The interface forms a stable micelle, and the separation of the aqueous phase is smooth after the polymerization, and the fine particles dispersed in the organic solvent phase are easily obtained. Even in the anionic lineage with complex hydrophobic ends, sodium di-2-ethylhexyl sulfosuccinate (hydrophobic terminal succinic acid di-2-ethyloctyl sodium (hydrophobic terminal 4) alkyl The benzenesulfonate (two hydrophobic terminals) may be suitably used in an amount of an anionic surfactant in the reaction system; the monomer of the conjugated double bond is 1 mol of less than 0.05 mol, preferably 0.005 mol to 0.03 mol. Anionic surfactant acts as a dopant at 0.05 mol or more, aniline, o-methylaniline, 3-methyl-sialtene, 3-3-n-decylthio 3-methoxythiazide Derivatives, suitable thiophenes, etc., for example, preferred for hydrophobic agents, by means of an active agent, which can be compared with four of the organic solvent-reducing high-reactive surfactants, sulfonate and branched chain tethers. It is preferable that the obtained micro--25-201000672 particles exhibit conductivity, and therefore it is necessary to carry out the step of electroless plating doping in order to use this. Examples of the nonionic surfactant include polyoxyacids, glucosinolates, glycerin fatty acid vinegars, dehydrated fatty acid esters, polyoxyethylene sorbitan fatty acid esters, and polyoxyacids. The ester, the fatty acid alkanolamine, and the polyoxyethylene alkylphenyl ether may be used in combination of one or more of them. It is especially suitable for stable topographic emulsions. The amount of the nonionic surfactant in the reaction system is preferably 1 mol of the monomer having a π-conjugated double bond, and the anion interface is preferably 〇. 2 mol or less, more preferably 0.05 to 0.15 mol. When 0.0 5 mol, the yield or dispersion stability is lowered. On the other hand, when the above is separated, the separation of the aqueous phase and the organic solvent phase becomes a trapping method to obtain a reducing polymer microparticle in the organic solvent phase, so 0 Among the above-mentioned production, it is preferred that the organic phase of the organic phase forming the emulsion is hydrophobic. Among them, in particular, an aromatic organic solvent of methyl toluene is preferred from the viewpoint of the stability of the 0/W type latex and the affinity with the 7T-conjugated dimer. Even if the amphoteric solvent can be polymerized into a monomer of a 7-conjugated double bond, it is difficult to separate the organic phase from the aqueous phase when the resulting reduced microparticles are recovered. The ratio of the organic phase to the aqueous phase in the emulsion is preferably such that the aqueous phase is at least %. When the aqueous phase is 20% by volume or less, the amount of the monomer having a double bond becomes small, and the production efficiency is deteriorated. Apply, de-vinylene sorbitol vinyl esters. Yiz 0/W is less than 0 · 2 m ο 1 relative to the sex agent phase, and the non-defective agent is a single row of benzene or two bonds with a polymer 75 body r · conjugate -26- 201000672 As the oxidizing agent to be used, for example, an inorganic acid such as sulfuric acid, hydrochloric acid, nitric acid or chlorosulfonic acid, an organic acid such as an alkylbenzenesulfonic acid or an alkylnaphthalenesulfonic acid such as potassium persulfate or ammonium persulfate can be used. And peroxides like hydrogen peroxide. These may be used alone or in combination of two or more. Even if the Lewis acid such as ferrous chloride can polymerize the particles having the π-conjugated double bond, the particles formed can be aggregated and cannot be finely dispersed. A particularly suitable oxidizing agent is a persulfate such as ammonium persulfate. The amount of the oxidizing agent in the reaction system is preferably 0.1 mol or more, more preferably 0.8 mol or less, more preferably 0.2 to 0.6 mol, per mol of the monomer having a π-conjugated double bond. When the amount of polymerization of the monomer is less than 0.1 mol, it is difficult to collect the polymer fine particles. On the other hand, when it is 0.8 mol or more, the particle size of the polymer fine particles is increased, and the dispersion stability is deteriorated. The method for producing the polymer microparticles is carried out, for example, in the following steps: (a) a step of mixing an anionic surfactant, a nonionic surfactant, an organic solvent, and water to prepare an emulsion, and (b) a step of dispersing a monomer having a π-conjugated double bond in an emulsion, (C) a step of oxidatively polymerizing the monomer, and (d) a step of separating the organic phase to recover the polymer fine particles. The foregoing steps can be carried out by methods known to those skilled in the art. For example, the mixing and kneading performed at the time of preparation of the emulsion is not particularly limited, and may be appropriately selected, for example, by using a magnetic stirrer, a stirrer, a homogenizer, or the like, -27-201000672. Further, the polymerization temperature is 0 to 25 ° C, preferably 20 ° C or less. If the polymerization temperature exceeds 25 ° C, the occurrence of side reactions is therefore poor. When the oxidative polymerization reaction is stopped, the reaction system is divided into two phases of the organic phase and the aqueous phase, and the unreacted monomer, oxidizing agent and salt are dissolved in the aqueous phase and remain. Here, if the organic phase liquid separation is recovered by washing with ion-exchanged water several times, the reducing polymer fine particles dispersed in the organic solvent can be obtained. The polymer fine particles obtained by the above-described production method are mainly composed of π. a polymer of a monomer derivative of a conjugated double bond, and is a fine particle containing an anionic surfactant and a nonionic surfactant. Further, it is characterized by having a fine particle diameter and being dispersible in an organic solvent. The polymer microparticles are spherical microparticles' and the average particle diameter thereof is preferably 10 to 100 nm. As described above, the surface area of the fine particles having a small average particle diameter becomes extremely large, and even if the fine particles of the same mass are used, the catalyst metal having a large amount of adsorption can be used, whereby the thin film formation of the coating layer becomes possible. The conductivity of the obtained polymer microparticles is not sufficient. 〇 1 s/cm ' is preferably 0.005 S/cm or less. The reducing polymer fine particles dispersed in the organic solvent thus obtained can be directly concentrated, concentrated, or dried to use a reducing high molecular fine particle component as a coating material. (2) The conductive polymer fine particles used in the method for producing a conductive polymer fine particle can be obtained by, for example, mixing and stirring an organic -28-201000672 solvent with water and an anionic surfactant. In the emulsion, a monomer having a π-conjugated double bond is added, and the monomer is oxidatively polymerized to produce. The monomer and the anionic surfactant having a 7-conjugated double bond may be the same as those exemplified in the production of the reducing fine particles, and examples thereof include pyrrole, aniline, thiophene and 3,4. - Ethylene dioxythiophene or the like, preferably pyrrole. The amount of the anionic surfactant in the reaction system is preferably less than 0.2 mol with respect to 1 mol of the monomer having a π-conjugated double bond, more preferably 5 mol to 0.15 mol. When the yield is less than 0.05 mol, the yield or the dispersion stability is lowered. On the other hand, when the amount is more than 2 mol, the conductive polymer microparticles obtained may have a moisture dependency of conductivity. The organic solvent in which the organic phase of the emulsion is formed in the above-mentioned production is preferably a water-repellent. Among them, in particular, an aromatic organic solvent, toluene or xylene, is preferred from the viewpoints of the stability of the Ο/W type emulsion and the affinity with the monomer. Even if the amphoteric solvent can carry out polymerization of a monomer having a conjugated double bond, it is difficult to separate the organic phase from the aqueous phase when the produced conductive polymer fine particles are recovered. The ratio of the organic phase to the aqueous phase in the emulsion is preferably such that the aqueous phase is at least 7% by volume. When the aqueous phase is 20% by volume or less, the amount of the monomer having a π-conjugated double bond is reduced, and the production efficiency is deteriorated. The oxidizing agent used in the above-mentioned production may be the same as those exemplified in the production of the reducing fine particles, and a particularly suitable oxidizing agent is a persulfate such as ammonium persulfate. -29- 201000672 The amount of the oxidizing agent in the reaction system is preferably 0.1 mol or more, more preferably 〇·8ιηο1 or less, more preferably 0.2 to 0.6 mol, per mol of the monomer having a π-co-double bond. When the degree of polymerization of the monomer is less than 0.1 mol, it is difficult to separate and collect the conductive polymer fine particles. On the other hand, when it is 0.8 mol or more, the particle size of the conductive polymer fine particles becomes large, and the dispersion is stable. Sexual deterioration. The method for producing the conductive polymer fine particles is carried out, for example, in the following steps: (a) a step of mixing and stirring an anionic surfactant, an organic solvent and water to prepare an emulsion, and (b) having a 7 Γ-conjugate a step of dispersing a monomer of a double bond in an emulsion, (C) a step of oxidatively polymerizing a monomer, contacting a polymer microparticle with an anionic surfactant, and (d) separating the organic phase to recover a high conductivity The step of molecular microparticles. The foregoing steps can be carried out by methods known to those skilled in the art. For example, the mixing and stirring which is carried out at the time of preparation of the emulsion is not particularly limited, and can be suitably selected, for example, by using a magnetic stirrer, a stirrer, a homogenizer or the like. Further, the polymerization temperature is 〇 25 ° C, preferably 20 ° C or less. If the polymerization temperature exceeds 25 ° C, the occurrence of side reactions is therefore poor. If the oxidative polymerization reaction is stopped, the reaction system is divided into two phases of an organic phase and an aqueous phase, and at this time, unreacted monomers, oxidizing agents and salts are dissolved in the aqueous phase and remain. Here, if the organic phase is separated and recovered by ion exchange water washing -30-201000672 several times, the conductive polymer fine particles dispersed in the organic solvent can be obtained, and the conductive polymer fine particles obtained by the above-described production method can be obtained. 'It is mainly composed of a monomer derivative having a 7-conjugated double bond' and is a microparticle containing an anionic surfactant. Further, it is characterized by a fine particle size and can be dispersed in an organic solvent. The polymer microparticles are spherical microparticles' and the average particle diameter thereof is preferably 10 to 100 nm. As described above, the surface area of the fine particles having a small average particle diameter becomes extremely large, and even if the fine particles of the same mass are subjected to de-doping treatment to be reductive, they become adsorbable to a large amount of catalytic metal. Thereby, thin film formation of the coating layer is possible. The conductive polymer fine particles dispersed in the organic solvent thus obtained can be directly, concentrated, or dried to use a fine particle component of a conductive cartridge molecule as a coating material. [Examples] Next, the present invention will be described in further detail in the examples, but the present invention is not limited by the examples. Example 1: Production of a plating material 1.5 mmol of an anionic surfactant PELEX OT-P (manufactured by Kao Co., Ltd.), 100 mL of toluene, and 100 mL of ion-exchanged water were added and kept at 20 ° C while stirring until emulsification. To the obtained emulsion, -31 - 201000672, pyrrole monomer 2 1 · 2 m m ο 1 ' was stirred for 1 hour, followed by addition of 6 mmol for 2 hours of polymerization. After the completion of the reaction, the mixture was washed several times with ion-exchanged water to obtain 5 nm of conductive polymer microparticles dispersed in toluene. The solid content of the conductive poly smear microparticles in the nail obtained here is about 1.2%. It is used as a binder ARASTAR 700 (manufactured by Arakawa Chemical Industry Co., Ltd., styrene maleic acid) as opposed to conductive polypyrrole; The mixture is added in a mixing ratio of 〇_5 parts by mass to obtain a conductive material. The obtained coating was made of a small spray gun W-10 ANEST Iwata Co., Ltd., caliber: 1.0 mm, with a pressure of 0_3 MPa, a polycarbonate resin at 10 cm x 10 cm ((registered trademark) 301-22m Sumitomo Dow Co., Ltd. 5μηι The obtained film was dried at 40 ° C for 10 minutes, and then a polycarbonate resin having a coating film was formed at 3 〇 minutes. The film thickness of the formed polypyrrole film was electronic K4. 02B (manufactured by ANRITSU Co., Ltd.) was measured. The polycarbonate 1 Μ sodium hydroxide aqueous solution formed in the above-prepared coating film was immersed in 35 t for 5 minutes, and then, at 100 ppm of chlorinated pin - 0.01 M hydrochloric acid aqueous solution [after immersion for 5 minutes, washing with ion-exchanged water. Next, immersing the resin in an electroless plating bath ATS ADDCOPPER IW Pharmaceutical Industry Co., Ltd.), immersing 1 〇 per sulphuric acid at 3 5 〇C The machine phase recovers the average particle size benzene dispersion, and this limited zipper is coated with 1-102P (jet air CALIBRE) as 7〇t: dry micrometer - resin, surface treatment . Yin Yu 3 5. . Polycarbonate bath (Okuno clock, -32-201000672 copper plating. Thereafter, it was thickened to a copper film thickness of 4 Ομηι with copper sulfate plating. Example 2 In addition to the catalyst treatment conditions, 200 ppm of chlorination was used. Palladium-0.01 Μ aqueous hydrochloric acid, immersed in the solution at 45 ° C for 5 minutes, the size of the catalytic metal adsorbed on the coating layer is set to 15 Onm, and the amount of catalytic metal adsorbed on the coating layer The plating operation was carried out in the same manner as in Example 1 except that the reaction was carried out in the same manner as in Example 1. Example 3 In addition to the adhesive, ARASTAR 700 (manufactured by Arakawa Chemical Industry Co., Ltd., styrene maleic acid) was used as a relative The plating material was obtained by the same operation as in Example 1 except that 1 part by mass of the conductive polypyrrole was added in an amount of 〇·1 by mass, and a conductive polypyrrole coating was obtained. Example 4 In addition to the binder ARASTAR 700 (manufactured by Arakawa Chemical Industry Co., Ltd., styrene maleic acid) is added in an amount of 10 parts by mass based on 1 part by mass of the conductive polypyrrole to obtain a conductive polypyrrolic coating. A plating material was obtained in the same manner as in Example 1. Example 5 A plating material was obtained in the same manner as in Example 1 of -33-201000672 except that the thickness of the coating layer was changed to 0.5 μm. 6 The same procedure as in Example 1 was carried out except that the thickness of the coating layer was changed to ΙΟΟμηη. Example 7 A coating material was obtained by substituting the coating for coating by dip coating to dip coating. In the same manner as in Example 1, a plating material was obtained. Example 8 In addition to the material of the substrate, ABS was used, and p〇RIMENT (trademark) (manufactured by Nippon Shokubai Co., Ltd., acrylamide) was used as a solvent. The same operation as in Example 1 was carried out to obtain plating Example 9

The same procedure as in Example 1 was carried out except that the material of the substrate was set to PC/ABS, and SOLBINE (manufactured by Kyoshin Chemical Industry Co., Ltd. and vinyl chloride vinyl acetate as a binder) was used. 1 In addition to the catalyst treatment conditions, a 20 ppm palladium chloride-hydrochloric acid aqueous solution was used, and the solution was immersed in the solution at 35 ° C for 5 minutes to carry out the adsorption of the externally-registered binder. MFK was applied to the plating • 0 1 Μ -34- 201000672 The size of the catalyst metal on the film layer was set to 2 Onm, and the amount of the catalyst metal adsorbed on the film was set to 0.05 pg/cm2, and the same operation was carried out to obtain a plating material. Comparative Example 2 In addition to the catalyst treatment conditions, a 500 ppm palladium chloride aqueous solution was used, and the solution was immersed at 50 ° C for 5 minutes to set the size of the catalytic metal on the film layer to 200 nm. 1 The same operation was performed to obtain a plating. Comparative Example 3 In addition to the catalyst treatment conditions, a 50 ppm palladium chloride-hydrochloric acid aqueous solution was used, and the solution was immersed at 35 ° C for 20 minutes, and the amount of the catalytic metal on the nj coating layer was set to 4 pg/cm 2 . In the same manner as in Example 1, the plating was obtained. Comparative Example 4 Conductivity was obtained by adding an ARSTAR 700 (manufactured by Arakawa Chemical Co., Ltd., styrene maleic acid) of a binder to a mixing ratio of 导电·0 5 parts by mass relative to a conductive polycondensation amount. In the same manner as in Example 1, the same operation as in Example 1 was carried out to obtain a plating comparative example 5 except that the binder ARASAR 700 (Arakawa Chemical Industry Co., Ltd. Example 1 0.1 Μ applied for 0.01 Μ was attached to ί and 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The same operation as in Example 1 was carried out to obtain a plating material. Comparative Example 6 A plating apparatus was obtained in the same manner as in Example 1 except that the thickness of the coating layer was changed to 〇·3 μm. Comparative Example 7 A plating apparatus was obtained in the same manner as in Example 1 except that the thickness of the coating layer was changed to ΙΙΟμη. Test Example 1 Among the platings of Examples 1 to 9 and Comparative Examples 1 to 7 produced as described above, various evaluation tests were carried out, and the results were summarized in Table 1. In addition, the evaluation test items and their evaluation methods and evaluation criteria are as follows. • Pd (palladium) amount The catalyst-treated sample was cut into about 3 cm x 4 cm, and the IG was taken out after nitric acid (1+9) and quantified by flameless atomic absorption spectrophotometry. • The P d (palladium) particle size is observed after the catalyst treatment. The scanning microscopy ISM_6700F (-36-201000672 manufactured by Sakamoto Electronics Co., Ltd.) is used to observe the average particle size of 10 palladium blocks. . . Film uniformity The coating layer after coating was applied visually. In addition, the evaluation criteria are as follows. 〇 : No unevenness is applied, and there is no exposed portion of the substrate. X: There is an uncoated portion, and a part of the substrate is exposed. • Appearance of plating The state of the plating film was visually observed, and the exposed area of the substrate was measured. In addition, the evaluation criteria are as follows. 〇: It was completely covered and there was no unevenness. △: It is completely covered, and some parts have plaques. X: The exposed portion of the substrate was not completely covered. • Tape test Using the JI S Η 8 5 0 4 tape test method as a reference, a strip of 2 mm side length strips was cut with a cutter to perform a tear test with a tape. In addition, the evaluation criteria are as follows. 〇: No peeling X: Stripping -37 - 201000672 • Peeling strength The measurement was carried out in accordance with JIS C6471. • Peeling section The peeling surface was visually observed to determine whether or not peeling occurred between which layers. A: substrate-coating layer B: coating layer-copper plating film C: peeling due to breakage in the coating layer due to the decrease in coating film strength. Further, in Table 1, 'ABS means acrylonitrile butyl styrene copolymer, and P C means polycarbonate resin' polypyrrole 1 binder ratio means a mass ratio of polypyrrole to binder. -38- 201000672

Book η key &lt; 0Q &lt; CQ &lt; CQ &lt;&lt;&lt; 1 OQ ΡΟ &lt; 1 1 u ο 寸 Ο Η 〇 \ ο mm· 1 II 1 1 1 o 醅 _ 〇〇〇〇〇〇 〇〇〇1 XXX 1 1 X 〇〇〇&lt;1 &lt;] 〇〇〇〇XXX 〇XX 〇Coater uniformity〇〇〇〇〇〇〇〇〇〇〇〇〇〇X 〇s 2 1 o ο ^ 1 ο ιη Ό w Oh. ft 15 s' m 3 ΙΟ ίΤί 〇l〇ίη ^Τ) in &lt;Τ] o ^-H ^-H 劁polypyrrole: binder than yn ο rH ο Γ·^ ο ο 〇^Η Τ Η Η 〇〇 y-^ m 〇in ο uo ο ο ι—Η 〇ο Τ**Η 1:0.05 l〇Ο 〇t—H 荦班劁剑剑劁劁剑劁劁劁剡劁剑剑剑剑柁mm light m Β mug( m light mm for ( » 善( 骚/IstS ο ο 卜 〇 ο 〇 o o o 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2卜 r - t t1ml1 ίι®Π Ρί οί Pi Pi Pi Pi Ρί ο 〇 〇&lt; Pi P&lt; οά &&lt; Η &lt; Η &lt; Η &lt; Η &lt; Η &lt; H &lt; Η S ω g &lt; Η &lt; Η &lt; Η &lt; Η &lt; H &lt; Η &lt; Η &lt;Π 〇〇C/D 2 CO X Xfl O) m Ρί Ο α, -4 〇CO CO 00 GO CO SX/l ζη 2 in &lt;&lt;&lt;&lt;&lt;&lt; &lt &lt;&lt;&lt;&lt;&lt;&lt;&lt;&lt;&lt;&lt;&lt;&lt;&gt; UUUUU Ο GO QQ u Oh υ U u UUUU dn Ph dn Oh Ph &lt; C/D &lt; 〇Η CU Ph CL, PU CL, Cu ι Η ( Ν r^i 寸^s〇卜00 m τ-Η (Ν 匡m 匡 inch s (D *=7 m I> 习 习 辑 辑 握 镒镒镒镒镒Μ 镒镒镒镒镒Μ 镒镒镒镒镒Μ U κ 13⁄4 13⁄4 IU u IK JlJ J-Λ AJ ^-Λ AJ J-Λ AJ -LA -39- 201000672 [Simple diagram of the diagram] Figure 1 is a scanning micrograph of the surface of the coating film in the case where the size of the catalytic metal exceeds 150 nm. . Fig. 2 is a scanning micrograph of the surface of the coating film in the case where the size of the catalytic metal is 15 or less. -40-

Claims (1)

201000672 VII. Patent application scope: A kind of plating material is formed on the surface of a molded article to form a coating layer containing conductive microparticles and a binder, and the catalyst layer is passed through the catalyst by electroless it. The coating of the metal plating film by the adsorption of the metal is characterized in that the binder is present in an amount of 0.1 to 10 parts by mass based on 1 part by mass of the conductive polymer fine particles, and the thickness of the coating layer is 0 5 to 1 0 0 μπι 'The size of the above-mentioned catalytic metal block adsorbed on the coating layer is 15 or less, and the amount per ill area of the catalytic metal adsorbed on the coating layer is 〇.lpg /cm2 to 3.〇pg/cm2. 2. The plating material of claim 1, wherein 60% or more of the conductive polymer microparticles are present in the upper half of the coating layer, and the average particle diameter of the conductive polymer microparticles It is 10 to 100 nm. 3. A method for producing a shovelling material, which is carried out by electroless plating of a metal film on an electroless plating bath, characterized in that A) is coated with a reducing polymer microparticle on a molded article and is highly reductive. 1 part by mass of the molecular fine particles is 0.1 to 10 parts by mass of the coating material of the binder, forming a coating layer having a thickness of 0.5 to ΙΟΟμηη, and Β) adsorbing through the catalytic metal on the coating layer by electroless plating a step of forming a metal plating film by a coating method, and setting a size of the catalyst metal block adsorbed on the coating film layer to 15 Onm or less, and per unit of the catalytic metal adsorbed on the coating film layer The amount of the area is determined by the method of the steps of O.lpg/cm2 to 3.0pg/cm2. The method of claim 3, wherein the reducing polymer microparticles are subjected to dedoping treatment to obtain reducing microparticles. -42-