TWI432568B - 矽錠切片用水溶性切削液 - Google Patents
矽錠切片用水溶性切削液 Download PDFInfo
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- TWI432568B TWI432568B TW099129114A TW99129114A TWI432568B TW I432568 B TWI432568 B TW I432568B TW 099129114 A TW099129114 A TW 099129114A TW 99129114 A TW99129114 A TW 99129114A TW I432568 B TWI432568 B TW I432568B
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- Prior art keywords
- acid
- water
- cutting fluid
- soluble cutting
- group
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims description 20
- 239000007788 liquid Substances 0.000 title description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000002173 cutting fluid Substances 0.000 claims description 57
- 150000007524 organic acids Chemical class 0.000 claims description 38
- 125000000217 alkyl group Chemical group 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 18
- 238000010494 dissociation reaction Methods 0.000 claims description 17
- 230000005593 dissociations Effects 0.000 claims description 17
- 229910052797 bismuth Inorganic materials 0.000 claims description 16
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 16
- -1 alkylene glycol monoalkyl ether Chemical class 0.000 claims description 14
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 10
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 9
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- 125000002947 alkylene group Chemical class 0.000 claims description 6
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 5
- 239000008187 granular material Substances 0.000 claims description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- XFDUHJPVQKIXHO-UHFFFAOYSA-N 3-aminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1 XFDUHJPVQKIXHO-UHFFFAOYSA-N 0.000 claims description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 239000001530 fumaric acid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims 2
- 229940049920 malate Drugs 0.000 claims 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims 2
- 229940009098 aspartate Drugs 0.000 claims 1
- 235000003704 aspartic acid Nutrition 0.000 claims 1
- 229960005261 aspartic acid Drugs 0.000 claims 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 1
- MVZXIDCKTRPHIU-UHFFFAOYSA-N formic acid;phthalic acid Chemical compound OC=O.OC(=O)C1=CC=CC=C1C(O)=O MVZXIDCKTRPHIU-UHFFFAOYSA-N 0.000 claims 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 claims 1
- 229940099690 malic acid Drugs 0.000 claims 1
- 229920001281 polyalkylene Polymers 0.000 claims 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 claims 1
- ZMCBYSBVJIMENC-UHFFFAOYSA-N tricaine Chemical compound CCOC(=O)C1=CC=CC(N)=C1 ZMCBYSBVJIMENC-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 14
- 239000001257 hydrogen Substances 0.000 description 13
- 229910052739 hydrogen Inorganic materials 0.000 description 13
- 230000005764 inhibitory process Effects 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 8
- 239000006260 foam Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000005187 foaming Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000002270 dispersing agent Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- 230000001629 suppression Effects 0.000 description 5
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000003002 pH adjusting agent Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229960004063 propylene glycol Drugs 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 3
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- QCOGKXLOEWLIDC-UHFFFAOYSA-N N-methylbutylamine Chemical compound CCCCNC QCOGKXLOEWLIDC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- KHAVLLBUVKBTBG-UHFFFAOYSA-N dec-9-enoic acid Chemical compound OC(=O)CCCCCCCC=C KHAVLLBUVKBTBG-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 150000001983 dialkylethers Chemical class 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
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- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 125000006353 oxyethylene group Chemical group 0.000 description 2
- 229920005646 polycarboxylate Polymers 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
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- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
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- 239000004094 surface-active agent Substances 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
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- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
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- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 description 1
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- ZDZVKPXKLLLOOA-UHFFFAOYSA-N Allylmalonic acid Chemical compound OC(=O)C(C(O)=O)CC=C ZDZVKPXKLLLOOA-UHFFFAOYSA-N 0.000 description 1
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- 229910052684 Cerium Inorganic materials 0.000 description 1
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
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- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 description 1
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- 229910052708 sodium Inorganic materials 0.000 description 1
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- 238000005063 solubilization Methods 0.000 description 1
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- 235000010199 sorbic acid Nutrition 0.000 description 1
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- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
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Classifications
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- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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Description
本發明是有關於一種切削矽錠時使用的水溶性切削液。
使用線鋸(wire saw)來進行矽錠的切削加工時,於使用自先前以來所使用的切削液的情況,由於矽錠為硬質或切削液的潤滑性不足,故而晶圓的表面精度不充分。另外,矽錠的切削加工中由於循環使用切削液,故而可列舉起泡等缺點。
水溶性切削液例如提出有由丙二醇等多元醇、芳香族多元羧酸鹽(間苯二甲酸三乙醇胺鹽等)、聚乙二醇等烷二醇的環氧烷加成物及水所構成的組成物(參照專利文獻1)。
另外,為了減少引火的危險性,提高冷卻效率,而提高比熱高的水的含有率,因此存在切割加工裝置中使用的金屬或線腐蝕劣化的問題。
上述問題的對策已開發出藉由調配胺系化合物而抑制腐蝕的水溶性切削液(參照專利文獻2)。
另一方面,為了抑制水與矽的反應中的氫氧產生,而開發出調配有用以將切削時產生的矽微粉末氧化的氧化劑的水溶性切削液(參照專利文獻3)。但是,雖水與矽的反應性得到抑制,但存在腐蝕加工裝置或固定研磨粒線的問題。
另外,切削加工中,通常以線與被加工物的矽錠的冷卻、潤滑、及被加工面的清潔化等為目的,而一邊將切削液供給至加工部位一邊進行加工,但循環使用該切削液時會起泡,切削液或其泡溢出而污染周圍。其對策可列舉將消泡劑添加於儲留槽中的方法、或於泡溢出的部位塗附消泡劑的方法等,但未獲得充分的效果。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2006-96951號公報
[專利文獻2]日本特開2005-15617號公報
[專利文獻3]日本特開2006-88455號公報
因此,本發明的目的在於提供一種水溶性切削液,其於矽錠的切削步驟中,與先前品相比潤滑性優異,可提高切削加工效率,並且不會產生切削液的循環使用中的起泡等問題,另外對加工裝置的金屬部分或線的耐腐蝕性良好,且可抑制由水與矽的反應所引起的氫產生。
本發明者們為了達成上述目的而進行研究,結果達成本發明。
即,本發明為:矽錠切片用水溶性切削液,其特徵在於包含碳數(包括羰基的碳)為4~10的一元或二元脂肪族羧酸(A)、及第一解離段的酸解離常數與第二解離段的酸解離常數的差ΔpKa在特定範圍內的多元有機酸(B)或者該有機酸(B)的鹽(B')作為必需成分;矽錠切片的
製造方法,其包括使用該矽錠切片用水溶性切削液,利用固定研磨粒線來切割矽錠的步驟;矽晶圓,其是使用矽錠切片用水溶性切削液來切割矽錠而製造;以及電子材料,其是使用該矽晶圓而製造。
本發明的水溶性切削液於矽錠的切削步驟中,與先前品相比潤滑性優異,因此可提高切削加工效率。
另外,由於由水與矽的反應所引起的引火性的氫產生得到抑制,故而安全性優異。並且,由於上述水溶性切削液為低泡性,故而不會產生循環使用中的起泡等問題。
本發明的矽錠切片用水溶性切削液的特徵在於:包含具有特定碳數的脂肪族羧酸(A)、具有特定ΔpKa的多元有機酸(B)作為必需成分。
作為本發明矽錠切片用水溶性切削液的必需成分的脂肪族羧酸(A)的包括羰基的碳的碳數通常為4~10,較佳為6~10。當上述碳數為3以下時,潤滑性不充分,當上述碳數為11以上時,於水中的溶解性降低。
脂肪族羧酸(A)的元數為一元或二元,較佳為二元。
另外,脂肪族羧酸(A)為脂肪族飽和羧酸或脂肪族不飽和羧酸,較佳為脂肪族飽和羧酸。
脂肪族羧酸(A)的具體例可列舉脂肪族單羧酸或脂肪族二羧酸。
脂肪族單羧酸可列舉:丁酸(butyric acid)、戊酸
(valerianic acid)、己酸(caproic acid)、庚酸(enanthic acid)、辛酸(caprylic acid)、壬酸(pelargonic acid)、癸酸(capric acid)、丁烯酸(crotonic acid)、異丁烯酸(isocrotonic acid)、山梨酸(sorbic acid)、4-癸烯酸(obtusilic acid)、癸烯酸(caproleic acid)等。
脂肪族二羧酸可列舉:辛二酸(suberic acid)、壬二酸(azelaic acid)、癸二酸(sebacic acid)、甲基順丁烯二酸(citraconic acid)、甲基反丁烯二酸(mesaconic acid)、亞甲基丁二酸(methylene succinic acid)、烯丙基丙二酸(allyl malonic acid)、亞異丙基丁二酸、2,4-己二烯二酸等。
脂肪族羧酸(A)中,就潤滑性與抑泡性的觀點而言,較佳為脂肪族二羧酸,更佳為壬二酸、癸二酸。
本發明的切削液亦有在使用前以水或水混合性有機溶劑進一步稀釋的情況,相對於切削液,使用時的切削中的脂肪族羧酸(A)的含量通常為0.01重量百分比(wt%)~10wt%,較佳為0.01wt%~5wt%,更佳為0.01wt%~1wt%。
當上述含量小於0.01wt%時,潤滑性不充分,若超過10wt%,則抑泡性不充分。
作為本發明矽錠切片用水溶性切削液的另一必需成分的多元有機酸(B)是第一解離段的酸解離常數與第二解離段的酸解離常數的差ΔpKa在特定範圍內的多元有機酸。
即,本發明的多元有機酸(B)的下述數式(1)所表
示的ΔpKa為0.9~2.3。
ΔpKa=(pKa2)-(pKa1) (1)
此處,當將作為n元酸的有機酸(B)表示為HnA時,將成為Hn-1A+H+的第一解離段的酸解離常數表示為pKa1,且將成為Hn-2A+H+的第二解離段的酸解離常數表示為pKa2。其差為ΔpKa。
此外,其中的酸解離常數pKa1、pKa2表示水溶液中的化合物的解離常數的倒數的對數值,pKa例如記載於「化學便覽基礎編II改訂4版」[1993年,丸善(股)]第317~321頁。ΔpKa可使用該表的值來算出。
有機酸(B)的ΔpKa通常為0.9~2.3,較佳為1.4~2.2。
當上述ΔpKa小於0.9時,由水與矽的反應所引起的氫產生的抑制不充分,若超過2.3,則對金屬的耐腐蝕性下降。
多元有機酸(B)可列舉多元羧酸、多元磺酸、多元有機磷酸等,較佳為多元羧酸。
多元有機酸(B)的具體例可列舉:反丁烯二酸(pKa1=2.85,pKa2=4.10,ΔpKa=1.25)、鄰苯二甲酸(pKa1=2.75,pKa2=4.93,ΔpKa=2.18)、間苯二甲酸(pKa1=3.50,pKa2=4.50,ΔpKa=1.00)、對苯二甲酸(pKa1=3.54,pKa2=4.46,ΔpKa=0.92)、蘋果酸(pKa1=3.24,pKa2=4.71,ΔpKa=1.47)、天門冬胺酸(asparaginic acid)(pKa1=1.93,pKa2=3.70,ΔpKa=1.77)、間胺基苯甲酸(pKa1=
3.12,pKa2=4.72,ΔpKa=1.60)、檸檬酸(pKa1=2.90,pKa2=4.34,ΔpKa=1.44)、丁二酸(pKa1=4.00,pKa2=5.20,ΔpKa=1.20)等。
就由水與矽的反應所引起的氫產生的抑制性的觀點而言,多元有機酸(B)較佳為鄰苯二甲酸、蘋果酸、檸檬酸。
多元有機酸(B)的鹽(B')可列舉:有機酸(B)的銨(B'1)、有機酸(B)的脂肪族胺鹽(B'2)、有機酸(B)的無機鹼鹽(B'3)、有機酸(B)的烷醇胺鹽(B'4)、及該些鹽的混合物。
有機酸(B)的脂肪族胺鹽(B'2)可列舉:有機酸(B)的甲胺、乙胺、丙胺、異丙胺、丁胺、己胺、二甲胺、乙基甲胺、丙基甲胺、丁基甲胺、二乙胺、丙基乙胺、二異丙胺、二己胺、乙二胺、丙二胺、三亞甲基二胺、四亞甲基二胺、六亞甲基二胺、哌啶(piperidine)、哌嗪(piperazine)、奎寧環(quinuclidine)、1,4-二氮雜雙環[2.2.2]辛烷(1,4-diazabicyclo[2.2.2]octane,DABCO)、1,8-二氮雜環[5,4,0]十一-7-烯(1,8-diazabicyclo[5.4.0]undec-7-ene,DBU)及1,5-二氮雜雙環(4.3.0)壬-5-烯(1,5-diazabicyclo(4.3.0)non-5-ene,DBN)等的鹽。
有機酸(B)的無機鹼鹽(B'3)可列舉有機酸(B)的鋰、鈉、鉀、鈣及鎂等的鹽。
有機酸(B)的烷醇胺鹽(B'4)可列舉:有機酸(B)的單乙醇胺、二乙醇胺、三乙醇胺、N-甲基二乙醇胺、N,N-
二甲基乙醇胺、N,N-二乙基乙醇胺、2-胺基-2-甲基-1-丙醇、N-(胺基乙基)乙醇胺、2-(2-胺基乙氧基)乙醇、乙二胺的環氧乙烷加成物(加成莫耳數10)及羥基胺等的鹽。
代替多元有機酸(B),可使用該多元有機酸(B)的鹽(B'),亦可將有機酸(B)與該有機酸(B)的鹽(B')併用。另外,亦可與另行調配有所含多元有機酸(B)的一部分或全部的鹼性化合物在系統內形成鹽。
本發明的有機酸(B)是為了提高由水與矽的反應所引起的氫產生的抑制性而包含。
相對於使用時的切削液,本發明的切削液中的有機酸(B)的含量通常為0.01wt%~10wt%,較佳為0.05wt%~5wt%,更佳為0.1wt%~1wt%。
當上述含量小於0.01wt%時,反應抑制性不充分,若超過10wt%,則效果同等,在經濟上無意義。
所謂本發明的水溶性切削液的水溶性,是指與水以任意比例混合而不分離。
並且,本發明的水溶性切削液可在使用前利用水、或者可與水以任意比例混合的水混合性有機溶劑加以稀釋而使用。
本發明的矽錠切片用水溶性切削液中較佳為,為了使其以穩定的流量循環而降低黏度,或者為了使切粉的分散性良好而含有聚氧伸烷基加成物(C),該聚氧伸烷基加成物(C)是由下述化學式(2)表示。
R1O-(AO)n-R2 (2)
[式(2)中,R1及R2分別獨立地表示氫原子或烷基;AO表示碳數為2~4的氧伸烷基;(AO)n表示一種或兩種以上的環氧烷的加成形式,兩種情況的加成形式可為嵌段狀,亦可為無規狀;n表示AO的平均加成莫耳數,為1~10的數]
式中,R1及R2分別獨立地表示氫原子或烷基。
烷基可列舉碳數1~6的烷基,例如可列舉甲基、乙基等。
R1及R2較佳為氫原子、甲基、乙基。
式中的AO表示碳數為2~4的氧伸烷基,可列舉氧乙烯基、氧丙烯基、氧丁基等。就水溶性方面而言,較佳為氧乙烯基、氧丙烯基。
n表示AO的平均加成莫耳數,通常為1~10的數。較佳為1~5,更佳為1~3。若該平均加成莫耳數超過10,則黏度變得過高,會產生起泡。
(AO)n表示一種環氧烷或兩種以上環氧烷的加成形式,兩種情況的加成形式可為嵌段狀,亦可為無規狀。
本發明中的聚氧伸烷基加成物(C)的數量平均分子量通常為500以下,較佳為300以下,更佳為200以下。
若該數量平均分子量超過500,則黏度變得過高,起泡成為問題。
聚氧伸烷基加成物(C)的具體例可列舉:烷二醇及聚烷二醇等的水溶性二醇、以及烷二醇的烷基醚及聚烷二醇的烷基醚等水溶性醚等。
聚氧伸烷基加成物(C)中,烷二醇可列舉:乙二醇、1,2-丙二醇、1,3-丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇等。
聚氧伸烷基加成物(C)中,聚烷二醇可列舉:聚乙二醇(二乙二醇及三乙二醇等)、聚1,2-丙二醇(二1,2-丙二醇等)、聚1,3-丙二醇、聚1,2-丁二醇、聚1,3-丁二醇、聚1,4-丁二醇等。
聚氧伸烷基加成物(C)中,烷二醇的單或二烷基醚可列舉:乙二醇單甲醚、乙二醇二甲醚、1,2-丙二醇單甲醚及1,2-丙二醇二甲醚等。
聚氧伸烷基加成物(C)中,聚烷二醇的單或二烷基醚可列舉:聚乙二醇單甲醚[二乙二醇單甲醚及三乙二醇單甲醚等]、聚乙二醇二甲醚[二乙二醇二甲醚及三乙二醇二甲醚等]及聚1,2-丙二醇單甲醚[二1,2-丙二醇單甲醚等]等。
聚氧伸烷基加成物(C)中,就作業性的觀點而言,較佳為烷二醇、烷二醇單烷基醚、聚烷二醇及聚烷二醇單烷基醚。更佳為氧伸烷基的碳數為2~4的烷二醇、聚烷二醇及該些烷二醇的單甲醚、單乙醚。
尤佳為1,2-丙二醇、二乙二醇、1,2-丙二醇單甲醚、1,2-丙二醇二甲醚、二乙二醇單甲醚、二乙二醇二甲醚。
就水分相溶性的觀點而言,本發明的聚氧伸烷基加成物(C)的親水親油平衡值(Hydrophile-Lipophile Balance,HLB)較佳為8~45,更佳為10~45,若為該範圍,則就水分相溶性的觀點而言優異。
此處的HLB是表示親水性與親油性的平衡性的指標,例如已知利用「乳化、可溶化的技術」[昭和51年,工學圖書(股)]或「新界面活性劑入門」[1996年,藤本武彥著]第132頁及第197~199頁所記載的小田法而獲得的計算值,並非利用格里芬法(Griffin method)而獲得的計算值。
並且,關於用以導出HLB的有機性值及無機性值,可使用「有機概念圖-基礎與應用-」[昭和59年,三共出版(股)]或「新界面活性劑入門」[1996年,藤本武彥著]第198頁中記載的表的值而算出。
相對於使用時的切削液,本發明的切削液中的聚氧伸烷基加成物(C)的含量較佳為60wt%~90wt%,更佳為65wt%~80wt%。
相對於切削液,本發明的水溶性切削液中的水的量較佳為10wt%~40wt%,更佳為20wt%~35wt%。
本發明的水溶性切削液亦可更包含pH調整劑(D)、分散劑(E)等。
pH調整劑(D)可列舉鹽酸等無機酸,或氫氧化鈉、氫氧化鉀等鹼金屬的氫氧化物等。
pH調整劑是為了在使用本發明的水溶性切削液對經切片(slicing)的被加工物進行清洗時,清洗液不表現出強酸或強鹼性,而以較佳為製成1wt%的水溶液時的pH值為5~9,更佳為5~8的方式添加。相對於切削液,pH調整劑的含量為5wt%以下。
分散劑(E)可列舉:萘磺酸福馬林(naphthalene sulfonic acid formalin)縮合物及/或其鹽、聚羧酸鹽、聚苯乙烯磺酸鹽、聚乙烯基磺酸鹽、聚烷二醇硫酸酯鹽、聚乙烯醇磷酸酯鹽、三聚氰酸磺酸鹽及木質素磺酸鹽(lignin sulfonate)等。相對於切削液,分散劑的含量為0.01wt%~5wt%,較佳為0.1wt%~1wt%。若上述分散劑的含量為0.01wt%以上,則存在分散效果容易進一步發揮的傾向,若上述分散劑的含量為5wt%以下,則存在切粉難以凝集的傾向。
本發明的水溶性切削液可適宜在利用線對矽錠進行切片加工時使用。
加工矽錠的方法可列舉使用游離研磨粒及固定研磨粒線的方法。本發明的水溶性切削液尤其適合於使用固定研磨粒線的矽錠的切片加工。
[實例]
以下,利用實例及比較例來進一步說明本發明,但本發明並不限定於該些例子。以下,只要未特別規定,則%表示wt%,份表示重量份。
實例1~7及比較例1~6
以表1記載的調配比(重量份)來調配氫氧化鉀水溶液以外的各成分,然後以氫氧化鉀水溶液將pH值調整為5.8左右,來製備實例1~7及比較例1~6的水溶性切削液。
此外,表1中的「鄰苯二甲酸鹽(B-4)」是使用鄰苯二甲酸/三乙醇胺(1:2莫耳)的鹽。
水溶性切削液的性能評價方法
對所得的水溶性切削液進行潤滑性、反應抑制性、抑泡性的評價試驗。結果示於表1。
(a)潤滑性試驗(摩擦係數)
摩擦係數是使用銷(球)對盤型(pin(ball)-on-disk type)的摩擦磨耗試驗器(Rhesca製造,FRP-2000),測定浸漬於20g水溶性切削液中的矽晶圓與鋼球間的摩擦係數,來評價潤滑性。
潤滑性試驗是在以下條件下進行。
矽晶圓:試驗片40mm×40mm
荷重:100g
線速度:5.23cm/s
測定溫度:25℃
通常,期望摩擦係數為0.40以下,若摩擦係數高則潤滑性不足,因此晶圓的表面精度變得不充分。
(b)反應抑制性
由水與矽的反應所引起的氫產生的抑制性的評價是利用以下所示的方法進行。
(1)於玻璃樣品瓶中添加18g的水性切削液及2g的矽粉末(高純度化學研究所製造,純度99%,平均粒徑1μm),使用38kHz的超音波清洗機照射超音波2分鐘,使矽粉末分散而獲得漿料。
(2)向於裝滿水並倒過來扣在水槽中的量筒中導入玻璃管的一端,且將另一端以有空洞的橡皮塞(rubber stopper)封口的玻璃樣品瓶中,放入上述漿料。
以下述方式設置:在上述加入有漿料的玻璃樣品瓶的口上,以連通玻璃管的橡皮塞封住該樣品瓶,於裝滿水並倒過來扣在水槽中的量筒中導入該玻璃管的另一端,使產生的氫氣與量筒內部的水進行取代。
(3)將該些水槽、量筒、玻璃管及加入有漿料的樣品瓶的一系列套組在60℃的恆溫高溫槽中靜置2小時,利用水上取代法將其間產生的氫回收於量筒中,測定氫產生量。
反應抑制性的評價是依據以下判斷基準來進行。
○:氫氣產生量小於10ml
△:氫氣產生量為10ml~20ml
×:氫氣產生量為20ml以上
(c)抑泡性試驗(起泡)
抑泡性試驗是使用高溫高壓液流試驗機(辻井染機工業製造,LJ-2000),在以下條件下進行。
水溶性切削液量:1300g
流量:2.9L/min
循環時間:20分鐘
試驗開始時的溫度:25℃
抑泡性的評價是使切削液循環,測量20分鐘後的泡的高度,依據以下的判定基準來進行。
○:小於15mm
△:15mm~25mm
×:超過25mm
如表1所明示,實例1~7的本發明水溶性切削液均由於摩擦係數低而潤滑性優異,反應抑制性與抑泡性亦均優異。
另一方面,使用碳數少的乙二酸作為必需成分脂肪族羧酸的比較例1、及不使用脂肪族羧酸的比較例2~4是摩擦係數高而潤滑性差。
僅使用ΔpKa為0.73的壬二酸作為脂肪族羧酸且不併用必需成分的特定範圍內的ΔpKa的有機酸的比較例5在反應抑制性方面較差。另外,使用ΔpKa為4.08的順丁烯二酸的比較例6在反應抑制性方面亦較差。
另一方面,使用高分子量的聚乙二醇作為聚氧伸烷基加成物的比較例4與比較例5的抑泡性差。
[產業上的可利用性]
本發明的水溶性切削液由於潤滑性、由水與矽所引起的氫產生的反應抑制性、抑泡性優異,故而作為切削矽錠時所使用的水溶性切削液而有用。
使用本發明的水溶性切削液對矽錠進行切削加工而製造的矽晶圓可用作例如記憶元件、振盪元件、增幅元件、電晶體(transistor)、二極體(diode)、太陽電池、大規模積體電路(Large-Scale Integration,LSI)的電子材料,該些電子材料可用於例如太陽光發電裝置、個人電腦、行動電話、顯示器(displayer)、音頻設備(audio)等。
另外,本發明的水溶性切削液作為切削水晶、碳化矽、藍寶石(sapphire)等硬質的被加工物時所使用的切削液亦有用。
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
Claims (10)
- 一種矽錠切片用水溶性切削液,其特徵在於:包含碳數(包括羰基的碳)為4~10的一元或二元脂肪族羧酸(A)、及下述數式(1)所表示的ΔpKa為0.9~2.3的多元有機酸(B)或者該有機酸(B)的鹽(B')作為必需成分,ΔpKa=(pKa2)-(pKa1) (1)其中,將使作為n元酸HnA的有機酸(B)成為Hn-1A+H+的解離段為1時的酸解離常數表示為pKa1,將使成為Hn-2A+H+的解離段為2時的酸解離常數表示為pKa2,其中上述多元有機酸(B)或上述有機酸(B)的鹽(B')是選自由反丁烯二酸、反丁烯二酸鹽、鄰苯二甲酸、鄰苯二甲酸鹽、間苯二甲酸、間苯二甲酸鹽、對苯二甲酸、對苯二甲酸鹽、蘋果酸、蘋果酸鹽、天門冬胺酸、天門冬胺酸鹽、間胺基苯甲酸、間胺基苯甲酸鹽、檸檬酸、檸檬酸鹽、丁二酸以及丁二酸鹽所組成的組群中的一種以上。
- 如申請專利範圍第1項所述之水溶性切削液,其中上述多元有機酸(B)為多元羧酸。
- 如申請專利範圍第1項或第2項所述之水溶性切削液,其中上述多元有機酸(B)為芳香族多元羧酸(B1)、及/或羥基多元羧酸(B2)。
- 如申請專利範圍第1項或第2項所述之水溶性切削液,其中上述多元有機酸(B)或上述有機酸(B)的鹽(B')是選自由鄰苯二甲酸、鄰苯二甲酸鹽、間苯二甲酸、間苯 二甲酸鹽、對苯二甲酸、對苯二甲酸鹽、檸檬酸、檸檬酸鹽、蘋果酸及蘋果酸鹽所組成的組群中的一種以上。
- 如申請專利範圍第1項或第2項所述之水溶性切削液,其更含有由下述化學式(2)所表示的數量平均分子量為500以下的聚氧伸烷基加成物(C):R1O-(AO)n-R2 (2)[式(2)中,R1及R2分別獨立地表示氫原子或烷基;AO表示碳數為2~4的氧伸烷基;(AO)n表示一種環氧烷或兩種以上的環氧烷的加成形式,異種情況的加成形式可為嵌段狀,亦可為無規狀;n表示AO的平均加成莫耳數,是1~10的數]。
- 如申請專利範圍第5項所述之水溶性切削液,其中上述聚氧伸烷基加成物(C)的親水親油平衡值為8~45。
- 如申請專利範圍第5項所述之水溶性切削液,其中上述聚氧伸烷基加成物(C)是選自由烷二醇、烷二醇單烷基醚、聚烷二醇及聚烷二醇單烷基醚所組成的組群中的一種以上聚氧伸烷基加成物。
- 如申請專利範圍第5項所述之水溶性切削液,其中相對於上述聚氧伸烷基加成物(C),上述脂肪族羧酸(A)的含量為0.001重量百分比~1.0重量百分比。
- 如申請專利範圍第5項所述之水溶性切削液,其中相對於上述聚氧伸烷基加成物(C),芳香族多元羧酸(B1)與羥基多元羧酸(B2)的合計含量為0.01重量百分比~10重量百分比。
- 一種矽錠切片的製造方法,其包括如下步驟:使用如申請專利範圍第1項至第9項中任一項所述之矽錠切片用水溶性切削液,利用固定研磨粒線來切割矽錠。
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JP5000991B2 (ja) | 2006-11-28 | 2012-08-15 | 三洋化成工業株式会社 | エレクトロニクス材料用洗浄剤 |
JP2008182221A (ja) | 2006-12-28 | 2008-08-07 | Sanyo Chem Ind Ltd | 半導体基板用洗浄剤 |
JP2009062426A (ja) | 2007-09-05 | 2009-03-26 | Kyodo Yushi Co Ltd | 遊離砥粒ワイヤソー用水溶性加工油剤、スラリー及び切断加工方法 |
JP2009079083A (ja) | 2007-09-25 | 2009-04-16 | Kyodo Yushi Co Ltd | 遊離砥粒ワイヤソー用水溶性加工油剤 |
JP5179888B2 (ja) * | 2008-01-16 | 2013-04-10 | 松山株式会社 | 玉葱処理装置 |
JP5679642B2 (ja) | 2009-07-15 | 2015-03-04 | ユシロ化学工業株式会社 | 固定砥粒ワイヤソー用水溶性加工液 |
US7863476B1 (en) * | 2009-11-23 | 2011-01-04 | Oil Chem Technologies | Multifunctional anionic surfactants |
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CN102482613A (zh) | 2012-05-30 |
KR20120061821A (ko) | 2012-06-13 |
JP2011068884A (ja) | 2011-04-07 |
US9522481B2 (en) | 2016-12-20 |
TW201125967A (en) | 2011-08-01 |
US20120156123A1 (en) | 2012-06-21 |
WO2011024486A1 (ja) | 2011-03-03 |
CN102482613B (zh) | 2016-01-20 |
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