TWI431676B - Substrate processing device and processing method thereof - Google Patents

Substrate processing device and processing method thereof Download PDF

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Publication number
TWI431676B
TWI431676B TW099127759A TW99127759A TWI431676B TW I431676 B TWI431676 B TW I431676B TW 099127759 A TW099127759 A TW 099127759A TW 99127759 A TW99127759 A TW 99127759A TW I431676 B TWI431676 B TW I431676B
Authority
TW
Taiwan
Prior art keywords
substrate
processing liquid
width direction
pattern
supplied
Prior art date
Application number
TW099127759A
Other languages
English (en)
Chinese (zh)
Other versions
TW201137955A (en
Inventor
Keigo Ohmori
Akinori Iso
Yuichi Imaoka
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201137955A publication Critical patent/TW201137955A/zh
Application granted granted Critical
Publication of TWI431676B publication Critical patent/TWI431676B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Spray Control Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099127759A 2009-09-02 2010-08-19 Substrate processing device and processing method thereof TWI431676B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009202843A JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法

Publications (2)

Publication Number Publication Date
TW201137955A TW201137955A (en) 2011-11-01
TWI431676B true TWI431676B (zh) 2014-03-21

Family

ID=43809579

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099127759A TWI431676B (zh) 2009-09-02 2010-08-19 Substrate processing device and processing method thereof

Country Status (4)

Country Link
JP (1) JP5352388B2 (enrdf_load_stackoverflow)
KR (1) KR101153050B1 (enrdf_load_stackoverflow)
CN (1) CN102001834B (enrdf_load_stackoverflow)
TW (1) TWI431676B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (ja) * 2012-01-31 2013-10-16 株式会社Ｎｓｃ 化学研磨装置
JP2014110592A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 画像処理装置
CN105967529A (zh) * 2016-05-13 2016-09-28 多氟多化工股份有限公司 一种ag玻璃加工流水线及其玻璃输送设备
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113292246B (zh) * 2021-06-02 2022-05-17 中建材玻璃新材料研究院集团有限公司 一种用于玻璃减薄的连续生产装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978065B2 (ja) * 2002-03-28 2007-09-19 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP3689390B2 (ja) * 2002-06-25 2005-08-31 松下電工株式会社 基材の液処理方法
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2004275989A (ja) * 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd 基板処理装置
JP4495618B2 (ja) * 2004-03-29 2010-07-07 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP2006135162A (ja) * 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd 噴霧方法および装置
JP2007088289A (ja) 2005-09-22 2007-04-05 Sharp Corp 基板処理装置および基板処理方法
JP4859242B2 (ja) * 2006-07-27 2012-01-25 芝浦メカトロニクス株式会社 基板の処理装置

Also Published As

Publication number Publication date
KR101153050B1 (ko) 2012-06-04
JP2011054790A (ja) 2011-03-17
CN102001834B (zh) 2013-03-27
KR20110025137A (ko) 2011-03-09
TW201137955A (en) 2011-11-01
JP5352388B2 (ja) 2013-11-27
CN102001834A (zh) 2011-04-06

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