JP5317304B2 - 化学研磨装置 - Google Patents
化学研磨装置 Download PDFInfo
- Publication number
- JP5317304B2 JP5317304B2 JP2012017445A JP2012017445A JP5317304B2 JP 5317304 B2 JP5317304 B2 JP 5317304B2 JP 2012017445 A JP2012017445 A JP 2012017445A JP 2012017445 A JP2012017445 A JP 2012017445A JP 5317304 B2 JP5317304 B2 JP 5317304B2
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- polishing liquid
- chemical polishing
- processing chamber
- injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 136
- 239000000126 substance Substances 0.000 title claims abstract description 96
- 239000011521 glass Substances 0.000 claims abstract description 130
- 239000000758 substrate Substances 0.000 claims abstract description 128
- 239000007788 liquid Substances 0.000 claims abstract description 93
- 238000011282 treatment Methods 0.000 claims abstract description 20
- 239000007921 spray Substances 0.000 claims abstract description 18
- 238000002347 injection Methods 0.000 claims description 113
- 239000007924 injection Substances 0.000 claims description 113
- 238000012545 processing Methods 0.000 claims description 88
- 230000002093 peripheral effect Effects 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 43
- 230000032258 transport Effects 0.000 description 36
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 32
- 238000005406 washing Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 14
- 239000007789 gas Substances 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 11
- 238000007517 polishing process Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 4
- 238000007781 pre-processing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
Description
このため、搬送ローラの周面にガラスの主面が接するときに、ガラス基板に汚損されにくくなる。また、ガラス基板の搬送ローラの周面に接触している部分も研磨液によって適正に研磨される。その結果、ガラス基板を直接的に搬送ローラ上に載置して搬送しても、研磨の不均一が発生したり、ガラス基板の品質が劣化したりするといった不具合が発生しにくくなる。これにより、治具を使用しなくとも、適正にガラス基板に対して順次的に化学研磨処理を施すことが可能になる。
12−搬入部
14−前処理チャンバ
16−第1の処理チャンバ
18−第2の処理チャンバ
20−第3の処理チャンバ
22−第4の処理チャンバ
24−水洗チャンバ
26−搬出部
28−第1の中継部
30−第2の中継部
32−第3の中継部
50−搬送ローラ
282−噴射パイプ
302−噴射パイプ
322−噴射パイプ
444−噴射パイプ
Claims (2)
- 連続的に搬送される複数のガラス基板に対して化学研磨処理を行うように構成された化学研磨装置であって、
ガラス基板を下から支持しつつ、ガラス基板を水平方向に搬送するように構成された複数の搬送ローラと、
前記複数の搬送ローラによって搬送されるガラス基板に対して少なくとも下側から研磨液を噴射するように構成された研磨液噴射手段と、を備え、
前記研磨液噴射手段は、少なくとも化学研磨処理空間内におけるすべての搬送ローラの周面を研磨液にてウエットな状態にするように研磨液を噴射することを特徴とし、かつ、
それぞれがガラス基板に対して同一組成の化学研磨液を噴射するように構成された複数の処理チャンバと、
各処理チャンバを連結するように構成された複数の連結部と、をさらに備え、
前記研磨液噴射手段が前記複数の連結部にも配置されたことを特徴とする化学研磨装置。 - 前記研磨液噴射手段は、ガラス基板に対して下側から研磨液を噴射するように構成された下側研磨液噴射手段と、ガラス基板に対して上側から研磨液を噴射するように構成された上側研磨液噴射手段とを備えており、
前記下側研磨液噴射手段の噴射力が、前記上側研磨液噴射手段の噴射力よりも強くなるように設定されたことを特徴とする請求項1に記載の化学研磨装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012017445A JP5317304B2 (ja) | 2012-01-31 | 2012-01-31 | 化学研磨装置 |
CN201380007542.5A CN104114509B (zh) | 2012-01-31 | 2013-01-28 | 化学研磨装置 |
PCT/JP2013/051732 WO2013115126A1 (ja) | 2012-01-31 | 2013-01-28 | 化学研磨装置 |
KR1020147022140A KR101995854B1 (ko) | 2012-01-31 | 2013-01-28 | 화학연마장치 |
TW102103498A TWI586618B (zh) | 2012-01-31 | 2013-01-30 | Chemical grinding equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012017445A JP5317304B2 (ja) | 2012-01-31 | 2012-01-31 | 化学研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013155086A JP2013155086A (ja) | 2013-08-15 |
JP5317304B2 true JP5317304B2 (ja) | 2013-10-16 |
Family
ID=48905165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012017445A Expired - Fee Related JP5317304B2 (ja) | 2012-01-31 | 2012-01-31 | 化学研磨装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5317304B2 (ja) |
KR (1) | KR101995854B1 (ja) |
CN (1) | CN104114509B (ja) |
TW (1) | TWI586618B (ja) |
WO (1) | WO2013115126A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105645777B (zh) * | 2016-03-18 | 2017-03-29 | 张源兴 | Ag防眩光平板显示玻璃自动化生产线 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5228949A (en) * | 1991-11-07 | 1993-07-20 | Chemcut Corporation | Method and apparatus for controlled spray etching |
JP2000109216A (ja) * | 1998-10-02 | 2000-04-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000323813A (ja) * | 1999-05-12 | 2000-11-24 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
KR20020093578A (ko) * | 2001-06-08 | 2002-12-16 | 수미도모 프리시젼 프로덕츠 캄파니 리미티드 | 기판 처리 장치 |
JP2003077886A (ja) * | 2001-06-14 | 2003-03-14 | Alps Electric Co Ltd | ウエット処理装置 |
JP2003055779A (ja) * | 2001-08-13 | 2003-02-26 | Kameria:Kk | 基板のエッチング方法、およびエッチング装置 |
JP2003124285A (ja) * | 2001-10-17 | 2003-04-25 | Dainippon Printing Co Ltd | ウエット処理装置及び搬送方法 |
JP4071220B2 (ja) * | 2004-03-17 | 2008-04-02 | 西山ステンレスケミカル株式会社 | ガラス基板の製造方法 |
KR100728890B1 (ko) * | 2006-06-07 | 2007-06-20 | (주)에스엠씨 | 가요성 필름 에칭장치 |
KR101387711B1 (ko) | 2007-04-10 | 2014-04-23 | 에프엔에스테크 주식회사 | 평판디스플레이 유리기판 에칭장치 |
JP5352388B2 (ja) * | 2009-09-02 | 2013-11-27 | 芝浦メカトロニクス株式会社 | 基板の処理装置及び処理方法 |
JP4975169B1 (ja) * | 2011-02-10 | 2012-07-11 | 株式会社Nsc | ガラス基板の製造方法及びその装置 |
JP5383769B2 (ja) * | 2011-10-13 | 2014-01-08 | 株式会社Nsc | 枚葉式化学研磨装置 |
-
2012
- 2012-01-31 JP JP2012017445A patent/JP5317304B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-28 KR KR1020147022140A patent/KR101995854B1/ko active IP Right Grant
- 2013-01-28 CN CN201380007542.5A patent/CN104114509B/zh not_active Expired - Fee Related
- 2013-01-28 WO PCT/JP2013/051732 patent/WO2013115126A1/ja active Application Filing
- 2013-01-30 TW TW102103498A patent/TWI586618B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN104114509A (zh) | 2014-10-22 |
TWI586618B (zh) | 2017-06-11 |
KR101995854B1 (ko) | 2019-07-03 |
WO2013115126A1 (ja) | 2013-08-08 |
CN104114509B (zh) | 2016-08-24 |
KR20140128326A (ko) | 2014-11-05 |
JP2013155086A (ja) | 2013-08-15 |
TW201408613A (zh) | 2014-03-01 |
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