JP5352388B2 - 基板の処理装置及び処理方法 - Google Patents

基板の処理装置及び処理方法 Download PDF

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Publication number
JP5352388B2
JP5352388B2 JP2009202843A JP2009202843A JP5352388B2 JP 5352388 B2 JP5352388 B2 JP 5352388B2 JP 2009202843 A JP2009202843 A JP 2009202843A JP 2009202843 A JP2009202843 A JP 2009202843A JP 5352388 B2 JP5352388 B2 JP 5352388B2
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JP
Japan
Prior art keywords
substrate
processing liquid
pattern
width direction
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009202843A
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English (en)
Japanese (ja)
Other versions
JP2011054790A (ja
JP2011054790A5 (enrdf_load_stackoverflow
Inventor
圭悟 大森
明典 磯
裕一 今岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2009202843A priority Critical patent/JP5352388B2/ja
Priority to TW099127759A priority patent/TWI431676B/zh
Priority to CN2010102706711A priority patent/CN102001834B/zh
Priority to KR1020100085441A priority patent/KR101153050B1/ko
Publication of JP2011054790A publication Critical patent/JP2011054790A/ja
Publication of JP2011054790A5 publication Critical patent/JP2011054790A5/ja
Application granted granted Critical
Publication of JP5352388B2 publication Critical patent/JP5352388B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Spray Control Apparatus (AREA)
JP2009202843A 2009-09-02 2009-09-02 基板の処理装置及び処理方法 Active JP5352388B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009202843A JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法
TW099127759A TWI431676B (zh) 2009-09-02 2010-08-19 Substrate processing device and processing method thereof
CN2010102706711A CN102001834B (zh) 2009-09-02 2010-09-01 基板的处理装置及处理方法
KR1020100085441A KR101153050B1 (ko) 2009-09-02 2010-09-01 기판의 처리 장치 및 처리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009202843A JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法

Publications (3)

Publication Number Publication Date
JP2011054790A JP2011054790A (ja) 2011-03-17
JP2011054790A5 JP2011054790A5 (enrdf_load_stackoverflow) 2013-02-14
JP5352388B2 true JP5352388B2 (ja) 2013-11-27

Family

ID=43809579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009202843A Active JP5352388B2 (ja) 2009-09-02 2009-09-02 基板の処理装置及び処理方法

Country Status (4)

Country Link
JP (1) JP5352388B2 (enrdf_load_stackoverflow)
KR (1) KR101153050B1 (enrdf_load_stackoverflow)
CN (1) CN102001834B (enrdf_load_stackoverflow)
TW (1) TWI431676B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317304B2 (ja) * 2012-01-31 2013-10-16 株式会社Ｎｓｃ 化学研磨装置
JP2014110592A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 画像処理装置
CN105967529A (zh) * 2016-05-13 2016-09-28 多氟多化工股份有限公司 一种ag玻璃加工流水线及其玻璃输送设备
JP7312738B2 (ja) * 2020-12-11 2023-07-21 芝浦メカトロニクス株式会社 基板処理装置
CN113292246B (zh) * 2021-06-02 2022-05-17 中建材玻璃新材料研究院集团有限公司 一种用于玻璃减薄的连续生产装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3978065B2 (ja) * 2002-03-28 2007-09-19 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP3689390B2 (ja) * 2002-06-25 2005-08-31 松下電工株式会社 基材の液処理方法
JP2004055711A (ja) * 2002-07-18 2004-02-19 Tokyo Kakoki Kk 基板処理装置
JP2004275989A (ja) * 2003-03-19 2004-10-07 Sumitomo Precision Prod Co Ltd 基板処理装置
JP4495618B2 (ja) * 2004-03-29 2010-07-07 芝浦メカトロニクス株式会社 基板の処理装置及び処理方法
JP2006135162A (ja) * 2004-11-08 2006-05-25 Fuji Photo Film Co Ltd 噴霧方法および装置
JP2007088289A (ja) 2005-09-22 2007-04-05 Sharp Corp 基板処理装置および基板処理方法
JP4859242B2 (ja) * 2006-07-27 2012-01-25 芝浦メカトロニクス株式会社 基板の処理装置

Also Published As

Publication number Publication date
KR101153050B1 (ko) 2012-06-04
TWI431676B (zh) 2014-03-21
JP2011054790A (ja) 2011-03-17
CN102001834B (zh) 2013-03-27
KR20110025137A (ko) 2011-03-09
TW201137955A (en) 2011-11-01
CN102001834A (zh) 2011-04-06

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