TWI431426B - 正型感光性樹脂組成物及使用它之硬化薄膜形成法 - Google Patents

正型感光性樹脂組成物及使用它之硬化薄膜形成法 Download PDF

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Publication number
TWI431426B
TWI431426B TW097110665A TW97110665A TWI431426B TW I431426 B TWI431426 B TW I431426B TW 097110665 A TW097110665 A TW 097110665A TW 97110665 A TW97110665 A TW 97110665A TW I431426 B TWI431426 B TW I431426B
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TW
Taiwan
Prior art keywords
group
substituted
linear
branched alkyl
formula
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TW097110665A
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English (en)
Chinese (zh)
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TW200903167A (en
Inventor
Satoshi Takita
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Fujifilm Corp
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Publication of TW200903167A publication Critical patent/TW200903167A/zh
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Publication of TWI431426B publication Critical patent/TWI431426B/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0751Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW097110665A 2007-03-27 2008-03-26 正型感光性樹脂組成物及使用它之硬化薄膜形成法 TWI431426B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007081505 2007-03-27
JP2007124402 2007-05-09

Publications (2)

Publication Number Publication Date
TW200903167A TW200903167A (en) 2009-01-16
TWI431426B true TWI431426B (zh) 2014-03-21

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Application Number Title Priority Date Filing Date
TW097110665A TWI431426B (zh) 2007-03-27 2008-03-26 正型感光性樹脂組成物及使用它之硬化薄膜形成法

Country Status (7)

Country Link
US (1) US20100119973A1 (ko)
EP (1) EP2130095A1 (ko)
JP (1) JP5075706B2 (ko)
KR (1) KR101435473B1 (ko)
CN (1) CN101663618B (ko)
TW (1) TWI431426B (ko)
WO (1) WO2008123563A1 (ko)

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JP5524037B2 (ja) * 2010-01-19 2014-06-18 富士フイルム株式会社 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機el表示装置、及び、液晶表示装置
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JP5492760B2 (ja) * 2010-12-13 2014-05-14 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機el表示装置、及び、液晶表示装置
JP5642578B2 (ja) * 2011-01-28 2014-12-17 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機el表示装置および液晶表示装置
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JP5772184B2 (ja) * 2011-04-22 2015-09-02 Jsr株式会社 感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法
JP5628104B2 (ja) * 2011-07-05 2014-11-19 富士フイルム株式会社 感光性樹脂組成物、パターン並びにその製造方法
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JP6065789B2 (ja) * 2012-09-27 2017-01-25 信越化学工業株式会社 化学増幅ポジ型レジスト材料及びパターン形成方法
KR101729599B1 (ko) * 2012-09-28 2017-04-24 후지필름 가부시키가이샤 감광성 수지 조성물, 이것을 사용한 패턴의 제조 방법
JP5500230B2 (ja) * 2012-11-01 2014-05-21 Jsr株式会社 ポジ型感放射線性樹脂組成物
KR101364229B1 (ko) * 2012-12-20 2014-02-17 동우 화인켐 주식회사 감광성 수지 조성물 및 이로부터 제조되는 절연막
JP5982277B2 (ja) 2012-12-21 2016-08-31 群栄化学工業株式会社 硬化性樹脂の製造方法
KR102138141B1 (ko) 2013-02-19 2020-07-27 제이에스알 가부시끼가이샤 네거티브형 감방사선성 수지 조성물, 경화막, 경화막의 형성 방법 및 표시 소자
JP2014211490A (ja) * 2013-04-17 2014-11-13 富士フイルム株式会社 パターン形成方法、電子デバイスの製造方法及び電子デバイス
JP6247858B2 (ja) 2013-08-01 2017-12-13 富士フイルム株式会社 パターン形成方法、及びこれを用いた電子デバイスの製造方法
JP6136727B2 (ja) 2013-08-02 2017-05-31 Jsr株式会社 感放射線性樹脂組成物、硬化膜、その形成方法及び表示素子
JP6244134B2 (ja) * 2013-08-02 2017-12-06 富士フイルム株式会社 パターン形成方法、及び、電子デバイスの製造方法
JP6492444B2 (ja) 2013-09-04 2019-04-03 Jsr株式会社 感放射線性樹脂組成物、硬化膜、その形成方法、及び電子デバイス
JP6216801B2 (ja) * 2013-10-28 2017-10-18 富士フイルム株式会社 感光性樹脂組成物、パターンの製造方法、硬化膜、有機el表示装置の製造方法、および液晶表示装置の製造方法
JP6209617B2 (ja) * 2013-10-28 2017-10-04 富士フイルム株式会社 感光性樹脂組成物、パターンの製造方法、硬化膜、有機el表示装置の製造方法、および液晶表示装置の製造方法
KR102142648B1 (ko) * 2013-12-16 2020-08-10 삼성디스플레이 주식회사 감광성 수지 조성물, 이를 이용한 유기막 형성방법 및 유기막을 포함하는 표시장치
JP6147218B2 (ja) * 2014-03-26 2017-06-14 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機el表示装置、タッチパネル表示装置
JP6318957B2 (ja) 2014-07-31 2018-05-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法、並びに表示素子
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Also Published As

Publication number Publication date
US20100119973A1 (en) 2010-05-13
JP5075706B2 (ja) 2012-11-21
KR101435473B1 (ko) 2014-08-28
TW200903167A (en) 2009-01-16
JP2008304902A (ja) 2008-12-18
CN101663618A (zh) 2010-03-03
CN101663618B (zh) 2012-08-29
KR20100014533A (ko) 2010-02-10
EP2130095A1 (en) 2009-12-09
WO2008123563A1 (en) 2008-10-16

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