TWI422662B - A heat-stripped double-sided adhesive tape or an adhesive sheet, and a method of processing the adhesive body - Google Patents

A heat-stripped double-sided adhesive tape or an adhesive sheet, and a method of processing the adhesive body Download PDF

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Publication number
TWI422662B
TWI422662B TW097101021A TW97101021A TWI422662B TW I422662 B TWI422662 B TW I422662B TW 097101021 A TW097101021 A TW 097101021A TW 97101021 A TW97101021 A TW 97101021A TW I422662 B TWI422662 B TW I422662B
Authority
TW
Taiwan
Prior art keywords
adhesive
adhesive layer
foaming agent
heat
plasticizer
Prior art date
Application number
TW097101021A
Other languages
English (en)
Chinese (zh)
Other versions
TW200844206A (en
Inventor
岸本知子
有滿幸生
Original Assignee
日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW200844206A publication Critical patent/TW200844206A/zh
Application granted granted Critical
Publication of TWI422662B publication Critical patent/TWI422662B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Capacitors (AREA)
TW097101021A 2007-01-15 2008-01-10 A heat-stripped double-sided adhesive tape or an adhesive sheet, and a method of processing the adhesive body TWI422662B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007005344 2007-01-15

Publications (2)

Publication Number Publication Date
TW200844206A TW200844206A (en) 2008-11-16
TWI422662B true TWI422662B (zh) 2014-01-11

Family

ID=39186847

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097101021A TWI422662B (zh) 2007-01-15 2008-01-10 A heat-stripped double-sided adhesive tape or an adhesive sheet, and a method of processing the adhesive body

Country Status (6)

Country Link
US (1) US7691225B2 (enExample)
EP (1) EP1944345B1 (enExample)
JP (1) JP5349803B2 (enExample)
KR (1) KR101426087B1 (enExample)
CN (1) CN101235259B (enExample)
TW (1) TWI422662B (enExample)

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DE102008004388A1 (de) * 2008-01-14 2009-07-16 Tesa Ag Geschäumte, insbesondere druckempfindliche Klebemasse, Verfahren zur Herstellung sowie die Verwendung derselben
JP2010039472A (ja) * 2008-07-08 2010-02-18 Nitto Denko Corp 電子ペーパーの製造方法、及び電子ペーパー形成工程用両面粘着テープ
JP2010053298A (ja) * 2008-08-29 2010-03-11 Bridgestone Corp エチレン酢酸ビニル共重合体組成物、エチレン酢酸ビニル共重合体膜及びその製造方法
US8211270B2 (en) * 2008-11-21 2012-07-03 Nitto Denko Corporation Method of detaching attached boards from each other
DE102008062131A1 (de) * 2008-12-16 2010-06-17 Tesa Se Klebeband, insbesondere zur Verklebung optoelektronischer Bauteile
EP2226851B1 (de) * 2009-03-04 2014-03-12 Tesa Se Klebeband, insbesondere zur Verklebung von Photovoltaik-Modulen
CN101709559B (zh) * 2009-09-15 2012-07-04 苏州斯迪克新材料科技股份有限公司 一种高亮面离型纸及其制备方法和其应用
JP5456431B2 (ja) * 2009-10-20 2014-03-26 日東電工株式会社 加熱剥離型粘着シート
JP5144634B2 (ja) * 2009-12-22 2013-02-13 日東電工株式会社 基板レス半導体パッケージ製造用耐熱性粘着シート、及びその粘着シートを用いる基板レス半導体パッケージ製造方法
JP2011151362A (ja) * 2009-12-24 2011-08-04 Nitto Denko Corp ダイシングテープ一体型半導体裏面用フィルム
DE102010005182B4 (de) * 2010-01-20 2021-12-09 Uzin Tyro Ag Selbstklebefolie
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JP2012149181A (ja) * 2011-01-19 2012-08-09 Nitto Denko Corp 両面粘着テープ又はシート、および被着体の加工方法
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JP5591859B2 (ja) * 2012-03-23 2014-09-17 株式会社東芝 基板の分離方法及び分離装置
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JP6054208B2 (ja) * 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート
KR102195502B1 (ko) * 2013-04-05 2020-12-28 니타 가부시키가이샤 가고정용 양면 점착 테이프 및 그것을 사용한 피가공물의 가고정 방법
KR20150060085A (ko) 2013-11-25 2015-06-03 쓰리엠 이노베이티브 프로퍼티즈 캄파니 재작업성이 우수한 양면 코팅 테이프
WO2015098270A1 (ja) * 2013-12-25 2015-07-02 Dic株式会社 粘着剤組成物及び粘着フィルム
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JP6501555B2 (ja) * 2015-02-20 2019-04-17 昭和電工株式会社 透明導電膜で形成された配線を含む基材の一時的な保護に使用される組成物、塗膜および一時的な保護方法
CN105280540B (zh) * 2015-09-11 2018-09-11 京东方科技集团股份有限公司 载体基板与衬底基板的贴附方法及显示面板的制造方法
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DE202015009135U1 (de) * 2015-10-15 2016-11-04 Tesa Se Selbstklebeartikel und dessen Verwendung zur Verklebung auf gestrichener Raufasertapete
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US20190216173A1 (en) * 2018-01-15 2019-07-18 I-Hui Chao Adherable Footwear Cushion
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JP7697512B2 (ja) * 2021-07-09 2025-06-24 Dic株式会社 粘着テープ、物品、及び物品の解体方法
WO2023048053A1 (ja) * 2021-09-24 2023-03-30 デンカ株式会社 耐熱性に優れる粘着テープ
WO2025169550A1 (ja) * 2024-02-09 2025-08-14 三井化学Ictマテリア株式会社 粘着性フィルム
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Publication number Priority date Publication date Assignee Title
JP2002363513A (ja) * 2001-06-08 2002-12-18 Oji Paper Co Ltd 粘着シート、包装材、及び包装製品
TW200427810A (en) * 2003-03-31 2004-12-16 Nitto Denko Corp Heat-peelable double-faced pressure-sensitive adhesive sheet, method of processing adherend, and electronic part
JP2004359844A (ja) * 2003-06-05 2004-12-24 Nitto Denko Corp 粘着テープ又はシート

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KR20080067299A (ko) 2008-07-18
TW200844206A (en) 2008-11-16
CN101235259B (zh) 2012-11-21
KR101426087B1 (ko) 2014-07-31
US20080169062A1 (en) 2008-07-17
JP2008195927A (ja) 2008-08-28
US7691225B2 (en) 2010-04-06
JP5349803B2 (ja) 2013-11-20
CN101235259A (zh) 2008-08-06
EP1944345A1 (en) 2008-07-16
EP1944345B1 (en) 2014-04-23

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