TW200844206A - Thermal-release double-sided adhesive tape or sheet and method of processing adherend - Google Patents

Thermal-release double-sided adhesive tape or sheet and method of processing adherend Download PDF

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Publication number
TW200844206A
TW200844206A TW097101021A TW97101021A TW200844206A TW 200844206 A TW200844206 A TW 200844206A TW 097101021 A TW097101021 A TW 097101021A TW 97101021 A TW97101021 A TW 97101021A TW 200844206 A TW200844206 A TW 200844206A
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Taiwan
Prior art keywords
adhesive
adhesive layer
foaming agent
heat
plasticizer
Prior art date
Application number
TW097101021A
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Chinese (zh)
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TWI422662B (en
Inventor
Tomoko Kishimoto
Yukio Arimitsu
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Nitto Denko Corp
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Publication of TW200844206A publication Critical patent/TW200844206A/en
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Publication of TWI422662B publication Critical patent/TWI422662B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016Plasticisers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/12Esters; Ether-esters of cyclic polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/50Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • H01G4/308Stacked capacitors made by transfer techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848Three or more layers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Capacitors (AREA)

Abstract

Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23+-2 DEG C, and a relative humidity of 65+-5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165 DEG C and a pressure of one atmosphere for one hour.

Description

200844206 九、發明說明: 【發明所屬之技術領域】 離型雙面黏著帶或 黏者體之加工方法。 々及被 【先前技術】 已知有於支持基材上設有含有熱膨㈣微小 :::包劑之,咖(熱膨脹性黏著層)的熱剝離型黏著帶或 々者片(荼照專利文獻!)。熱剝離型黏著帶或黏著片,於達 到接著物品之目的後,加熱熱膨脹性黏著層使其發泡甚至 膨脹,使熱膨脹性點著層之表面變化為凹凸狀,藉此減少 與被黏著體之接著面積而降低黏著力(接著力),從而可容 易地分離作為被黏著體之物品,可用於電子零件或其材料 等之加工時的固^、或搬送等物流等各種各樣的用途。 作為如此之熱剝離型黏著帶或黏著片,例如於使用於基 材之單面上具有含有發泡劑之黏著劑層(含有發泡劑之感 壓性接著劑層)’ 1於另—面上具有未含有發泡劑之黏著 劑層(未含有發泡劑之感壓性接著劑層)的雙面黏著型熱剝 離型黏著帶或黏著片(熱剝離型雙面黏著帶或黏著片)之情 形時,通常於作為熱剝離型黏著層之含有發泡劑之感壓性 接著劑層的表面上貼合用以加工之物品,另一方面於將並 非熱剝離型黏著層之未含有發泡劑之感壓性接著劑層固定 於σ座面上之狀怨下,對物品進行加工,於加工後對其加 熱,藉此使加工後之物品自熱剝離型黏著帶或黏著片剝 離’其後自台座上將熱剝離型雙面黏著帶或黏著片剝離。 127476.doc 200844206 再者,於此情形時,剝離熱剝離型雙面黏著帶或黏著片之 台座可以再利用。 [專利文獻1]日本專利特開昭56·61468號公報 【發明内容】 [發明所欲解決之問題] Γ Ο 然而’該熱剝離型雙面黏著帶或黏著片,若固定於厶座 之側的感壓性接著劑層(即,未含有發泡劑之感壓性^著 ^層)的黏著力過高,則使熱剝離型雙面黏著帶或黏著片 自台座剝離所需的時間較長,且視情況有使台座破損之可 能。另一方面,熱剝離型雙面黏著帶或黏著片,若未人有 發泡劑之感壓性接著劑層之黏著力過低,則固定於^上 之固定性降低,且加工物品時之加工性降低。 ,者’加工之物品係電子零件或其材料之情形時,重要 的是於加工時不受到污举 著帶…Γ 於使用熱剝離型雙面黏 者帶或黏耆片進行加工時,作在 著片“M 熱剥離型雙面黏著帶或黏 片’重要的是使料抑制或# 之污染者。 了电于零件或其材料200844206 IX. Description of the invention: [Technical field to which the invention pertains] A method for processing a double-sided adhesive tape or a sticky body.先前 被 被 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 先前 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热literature!). The heat-peelable adhesive tape or the adhesive sheet is heated to heat or expand the heat-expandable adhesive layer to cause foaming or even swelling, so that the surface of the heat-expandable dot layer is changed into a concave-convex shape, thereby reducing the adhesion to the adherend When the area is lowered and the adhesive force (adhesion force) is lowered, the article which is an adherend can be easily separated, and it can be used for various applications such as solidification during transportation of electronic parts or materials thereof, and transportation such as transportation. As such a heat-peelable adhesive tape or adhesive sheet, for example, an adhesive layer (pressure-sensitive adhesive layer containing a foaming agent) containing a foaming agent is used on one side of a substrate to be in the other side. Double-sided adhesive type heat-peelable adhesive tape or adhesive sheet (heat-peelable double-sided adhesive tape or adhesive sheet) having an adhesive layer containing no foaming agent (pressure-sensitive adhesive layer not containing a foaming agent) In the case of the pressure-sensitive adhesive layer containing the foaming agent as the heat-peelable adhesive layer, the article to be processed is usually bonded, and on the other hand, the adhesive layer which is not the heat-peelable adhesive layer is not contained. The pressure-sensitive adhesive layer of the foaming agent is fixed on the σ seat surface, and the article is processed and heated after processing, thereby peeling off the processed article from the heat-peelable adhesive tape or adhesive sheet. Thereafter, the heat-peelable double-sided adhesive tape or adhesive sheet is peeled off from the pedestal. 127476.doc 200844206 Furthermore, in this case, the detachable heat-dissipating double-sided adhesive tape or the pedestal of the adhesive sheet can be reused. [Patent Document 1] Japanese Patent Laid-Open Publication No. SHO 56-61468 [Summary of the Invention] [Problems to be Solved by the Invention] Γ Ο However, the heat-peelable double-sided adhesive tape or adhesive sheet is fixed to the side of the sley If the adhesion of the pressure-sensitive adhesive layer (that is, the pressure-sensitive adhesive layer containing no foaming agent) is too high, the time required for the heat-peelable double-sided adhesive tape or the adhesive sheet to be peeled off from the pedestal is higher. Long, and depending on the situation, the pedestal may be damaged. On the other hand, in the case of a heat-peelable double-sided adhesive tape or an adhesive sheet, if the adhesive force of the pressure-sensitive adhesive layer which does not have a foaming agent is too low, the fixing property to the fixing is lowered, and when the article is processed, The processability is lowered. When the processed article is an electronic component or a material thereof, it is important that the tape is not contaminated during processing... 时 when using a heat-peelable double-sided adhesive tape or a viscous sheet for processing The film "M heat-peelable double-sided adhesive tape or adhesive sheet" is important to inhibit the material or the # polluter.

:此’本發明之目的在於提供—種 或黏著片,其且有可拉也 丄又面黏者V . 、/、 由熱而剝離之含有發泡咧之翔荽 Μ層,且具有未含有發泡劑之黏著劑層 广“ 之黏著劑層具有於貼著時 :Μ 3有發泡劑 由撕下而容易剝離的黏著力^_者,且於剝離時可藉 本發明之其他目的在於進而提供 於含有發泡劑之黏著劑層上之物Γ p或防止對貼合 口口、或加工該物品而獲得 127476.doc 200844206 之加工之污染的熱剝離型雙面黏著帶或黏著片。 [解決問題之技術手段] —本發明者為達成上述目的而進行銳意研究,結果發現: 若使用以特定之比例含有塑化劑,且具有特定之拉伸黏著 力之未含有發泡劑之黏著劑層’作為未含有發泡劑之黏著 :丨層’且將雙面黏著帶或黏著片自身之加熱減量調整為特 疋大小,則由於未含有發泡劑之黏著劑層含有塑化劑,故 I使未含铸泡劑之黏¥縣的黏著力適度降低為可於貼 者時牢固地貼著,且於剝離時可藉由撕下而容易地剝離之 矛王度,且亦可有效地抑制或防止對被黏著體之;亏染。本發 明係鑒於該等知識見解而完成者。 χ 即,本發明係一種熱剝離型雙面黏著帶或黏著片,其特 徵在於·其係於基材之其中—面上具有未含有發泡劑之黏 著劑層(Α),且於另一面上具有含有發泡劑之黏著劑層(β) 的雙面黏著帶或黏著片,黏著劑層(Α)具有以相對於ι〇〇重 ΐ份之構成黏著劑層(Α)的基礎聚合物為5〜3〇重量份之比 例含有塑化劑,且拉伸黏著力(對聚對苯二曱酸乙二酯薄 膜’剝離角度:180。、拉伸速度:3〇〇 mm/min、溫度: 23±2°C、濕度:65士5%RH)為1 N/20 mm以下的特性,並且 於溫度:165°C且壓力:1氣壓之條件下加熱雙面黏著帶或 黏著片1小時後,塑化劑之減量為2重量%以下。 作為上述塑化劑,可適用具有下述特性(χ)及/或特性(γ) 之塑化劑: 特性(X广於溫度:165<t且壓力:1氣壓之條件下加熱1 127476.doc 200844206 小時後的減量為2重量%以下的特性 特丨生(Y) ·於loot:下之飽和蒸汽壓為〇 〇9 pa以下且沸點 為400°C以上的特性。 ” 又,作為塑化劑,較好的是分子量或重量平均分子量為 500以上之塑化劑,特別可適宜使用偏苯三甲酸酯系塑化 劑或者均苯四甲酸酯系塑化劑。 較好的是本發明之熱剝離型雙面黏著帶或黏著片中,黏 著劑層(A)進而具有如下特性:將剪切黏著力(對 灿3〇似板,貼附面積:寬2〇 mmx長20 mm、沿剪切方 向之拉伸速度·· 5〇 mm/min、溫度:23土ye、濕度: 65士5%RH)設為X(N/cm2),將拉伸黏著力(對聚對苯二甲酸 乙二酯薄膜,剝離角度:180。、拉伸速度:3〇〇 a — 溫度·· 23 士 2°C、濕度:65:fc5%RH)設為 γ(Ν/寬 2〇 _)時, 「Χ/Υ」之値為20以上。又,較好的是黏著劑層(Α)進而具 有如下特性:剪切黏著力(對81183〇4;6八板,貼附面積··寬 20 mmx長20 mm、沿剪切方向之拉伸速度· 5〇 溫度:23土、濕度·· 65土5%RH)g1〇(N/cm2)以上。進而 又,較好的是黏著劑層(A)進而具有如下特性··凝膠分率 為7 5重量。/〇以上。 本發明又係-種被黏著體之加工方法,其特徵在於其係 使用雙面黏著帶或黏著片而加工被黏著體之方法,其係利 用黏著劑層(A)將上述熱剝離型雙面黏著帶或黏著片固定 於σ座上,且於被黏著體貼合於黏著劑層(B)上之狀態 下’對被黏著體實施加工處理。於該被黏著體之加工方法 127476.doc 200844206 2,作為被黏著體,可適宜使用電子系零件類。又,被黏 者體係陶究電容器用胚片,且亦可具有胚片之積層步驟。 本务明進❿又提供一考重其特徵在於利用i述被黏著體之 方法而加以製造的電子零件、或積層陶瓷電容器。 [發明之效果]: The purpose of the present invention is to provide a type or adhesive sheet which has a pullable and viscous surface. V., /, a foamed enamel layer which is peeled off by heat, and which has no The adhesive layer of the foaming agent is wide. "The adhesive layer has the adhesive force when the adhesive layer is adhered to: Μ 3 has a foaming agent which is easily peeled off by peeling off, and the other purpose of the present invention when peeling off is Further, it is provided on the adhesive layer containing the foaming agent or a heat-peelable double-sided adhesive tape or adhesive sheet which prevents contamination of the affixed mouth or the processing of the article to obtain the processing of 127476.doc 200844206. [Technical means for solving the problem] - The present inventors conducted intensive studies to achieve the above object, and as a result, found that: if a plasticizer is contained in a specific ratio, and a specific stretching adhesive force is used, the adhesive agent containing no foaming agent is used. The agent layer 'as an adhesive which does not contain a foaming agent: a layer of tantalum' and adjusts the heating loss of the double-sided adhesive tape or the adhesive sheet itself to a characteristic size, since the adhesive layer not containing a foaming agent contains a plasticizer, Therefore, I did not contain the foaming agent. The adhesiveness is moderately lowered to be able to be firmly adhered to the adhesive, and can be easily peeled off by peeling off during peeling, and can also effectively suppress or prevent the adhesion to the adherend; The present invention has been completed in view of such knowledge. χ That is, the present invention is a heat-peelable double-sided adhesive tape or adhesive sheet characterized in that it is attached to a surface of a substrate without a foaming agent. Adhesive layer (Α), and a double-sided adhesive tape or adhesive sheet having a foaming agent-containing adhesive layer (β) on the other side, the adhesive layer (Α) has a weight relative to ι The base polymer constituting the adhesive layer (Α) is a plasticizer in a proportion of 5 to 3 parts by weight, and has a tensile adhesive force (peeling angle to the polyethylene terephthalate film: 180. Tensile speed: 3〇〇mm/min, temperature: 23±2°C, humidity: 65±5% RH) is 1 N/20 mm or less, and at temperature: 165 ° C and pressure: 1 atmosphere After heating the double-sided adhesive tape or the adhesive sheet for 1 hour, the plasticizer is reduced by 2% by weight or less. As the plasticizer, A plasticizer having the following characteristics (χ) and/or characteristic (γ) can be applied: Characteristics (X is wider than temperature: 165 < t and pressure: 1 atmosphere is heated under the condition of 1 127476.doc 200844206 hours after the reduction is 2% by weight or less characteristic characteristic (Y) · The saturated vapor pressure under the loot: is 〇〇9 Pa or less and the boiling point is 400 ° C or higher." Further, as a plasticizer, a molecular weight is preferred. Or a plasticizer having a weight average molecular weight of 500 or more, and particularly preferably a trimellitate plasticizer or a pyromellitic plasticizer. Preferably, the heat-peelable double-sided adhesive of the present invention is used. In the tape or adhesive sheet, the adhesive layer (A) further has the following characteristics: shear adhesive force (approx. 3, mm 2 mm, length 20 mm, tensile speed in the shear direction) ·················· :180. , stretching speed: 3〇〇a — temperature · 23 ± 2 ° C, humidity: 65: fc5% RH) When γ (Ν / width 2 〇 _), the ratio of "Χ / Υ" is 20 or more . Further, it is preferred that the adhesive layer (Α) has the following characteristics: shear adhesion (for 81183〇4; 6 eight plates, attachment area·width 20 mmx length 20 mm, stretching in the shear direction) Speed · 5 〇 temperature: 23 soil, humidity · · 65 5% RH) g1 〇 (N / cm 2) or more. Further, it is preferred that the adhesive layer (A) further has the following characteristics: The gel fraction is 75 weight. /〇 above. The present invention is also a method for processing an adherend, which is characterized in that it is a method of processing an adherend using a double-sided adhesive tape or an adhesive sheet, which is formed by using an adhesive layer (A) The adhesive tape or the adhesive sheet is fixed to the σ seat, and the adhesive body is processed in a state where the adhesive body is attached to the adhesive layer (B). For the method of processing the adherend, 127476.doc 200844206 2, as the adherend, an electronic component can be suitably used. Further, the viscous system can cover the chip for the capacitor, and may have a lamination step of the slab. In addition, the present invention provides an electronic component or a multilayer ceramic capacitor which is characterized by the method of using the adhesive body described above. [Effects of the Invention]

依據本發明之熱剝離型冑面黏著帶或黏著片,具有可藉 由加熱而剝離之含有發泡劑之黏著劑層,且具有未含有發 _ =黏著劑層,該未含有發泡劑之黏著劑層具有於貼^ 時:牢固地貼著,且於剝離時可藉由撕下而容易地剝離之 黏者力。it而’可抑制或防止對貼合於含有發泡 劑層上之物品、或加工該物品而獲得之加工品的污染’。者 【實施方式】 优高罟翏照圖式對本發 ^ ^ η ^ τγ> 明。再者,有時對同一部件或部分等標註同一符號。 [熱剝離型雙面黏著帶或黏著片] 本發明之熱剝離型雙面 土又回鄱者帶或黏者片,如圖1( 所示,具有:基材、於唁Α^ % % 於W亥基材之其中一面形成之未含有發 泡劑之黏著劑層^ J層㈧[未含有發泡劑之黏著劑層⑷]、於上 述基材之另-面J"形cV·、A人丄 ^成之§有發泡劑之黏著劑層 泡劑之黏著劑層(B)], ,“ 这未έ有备泡劑之黏著劑層 (Α)以相對於丨〇〇重量 ^ 之構成未含有發泡劑之黏著劑層 (A)的基礎聚合物為 ^ 未含有菸、0 1 重®份之比例含有塑化劑,進而 未a有發泡劑之黏著 m㈣,力㈣對笨二甲 臈㈣角度:刚。、拉伸速度:300 127476.doc 200844206 mm/min、溫度·· 23 士 2°C、濕度:65 士 5%RH)為 1 N/20 mm 以下,進而又,於溫度:165。(:且壓力:壓之條件下加 熱該熱剝離型雙面黏著帶或黏著片本身丨小時後,塑化劑 之減量為2重量。/〇以下。 圖1(a)〜(b)係部分地表示本發明之熱剝離型雙面黏著帶 或黏著片之一例的概略剖面圖。圖1(a)〜(b)中,u、化係 熱剝離型雙面黏著帶或黏著片、2係未含有發泡劑之黏著 劑層(A)[未含有發泡劑之黏著劑層(A)]、3係基材、4係橡 膠狀有機彈性層、5係含有發泡劑之黏著劑層[含有發泡劑 之黏著劑層⑻]、6係兩面成為脫模面之隔片(剝離襯墊)。 再者,未含有發泡劑之黏著劑層(A)以相對於1〇〇重量份之 構成未含有發泡劑之黏著劑層⑷之基礎聚合物為5〜3〇重 量份之比例含有塑化劑。又,未含有發泡劑之黏著劑層 (A)之拉伸黏著力(對聚對苯二甲酸乙二醋薄冑,剝離角 度:180。、拉伸速度·· 300 mm/min、溫度:23±坨、渴The heat-peelable facial adhesive tape or adhesive sheet according to the present invention has an adhesive layer containing a foaming agent which can be peeled off by heating, and has a hair _=adhesive layer which does not contain a foaming agent. The adhesive layer has a sticking force when it is attached, and can be easily peeled off by peeling off when peeling off. It can inhibit or prevent contamination of articles attached to the layer containing the foaming agent or processed articles obtained by processing the article. [Embodiment] The image of the ^^ η ^ τγ is shown in the figure. In addition, the same symbol or the like may be denoted by the same symbol. [The heat-peelable double-sided adhesive tape or adhesive sheet] The heat-peelable double-sided soil of the present invention is also a back-to-back belt or an adhesive sheet, as shown in Fig. 1 (shown as: substrate, 唁Α^%% An adhesive layer which does not contain a foaming agent formed on one side of the W-Wa substrate (8) [Adhesive layer (4) not containing a foaming agent], and another surface J" shape cV·, A of the above substrate The adhesive layer (B) of the adhesive agent of the foaming agent is used, and the adhesive layer (Α) of the foam preparation is used in relation to the weight of the crucible. The base polymer constituting the adhesive layer (A) which does not contain a foaming agent is a plasticizer which does not contain smoke, and the ratio of 0 1 weight is contained, and the adhesive of the foaming agent is not a (m), and the force (four) is stupid. Dimethyl hydrazine (four) angle: just., tensile speed: 300 127476.doc 200844206 mm / min, temperature · 23 ± 2 ° C, humidity: 65 ± 5% RH) is 1 N / 20 mm or less, and then, At a temperature of 165. (: and pressure: under pressure, the heat-peelable double-sided adhesive tape or the adhesive sheet itself is heated for 2 hours, and the plasticizer is reduced by 2 weights. / 〇 below. Figure 1 (a) ~ (b) partially A schematic cross-sectional view showing an example of a heat-peelable double-sided adhesive tape or an adhesive sheet of the present invention. In Figs. 1(a) to (b), u, a chemical heat-peelable double-sided adhesive tape or adhesive sheet, and 2 Adhesive layer (A) containing a foaming agent [adhesive layer (A) without a foaming agent], a 3-series substrate, a 4-series rubber-like organic elastic layer, and a 5-layer adhesive layer containing a foaming agent [ An adhesive layer (8) containing a foaming agent, and a separator (release liner) having a release surface on both sides of the 6-series. Further, the adhesive layer (A) not containing a foaming agent is used in an amount of 1 part by weight. The base polymer constituting the adhesive layer (4) which does not contain a foaming agent contains a plasticizer in a proportion of 5 to 3 parts by weight, and further has a tensile adhesive force (A) which does not contain a foaming agent ( For polyethylene terephthalate, the peeling angle: 180., stretching speed · 300 mm / min, temperature: 23 ± 坨, thirst

L 度:。65土5%RH)為1 N/2〇軸以下。進而又,於溫度;’、 165C—且壓力:i氣壓之條件下加熱該熱剥離型雙面黏著帶 或黏著片1小時後,塑化劑之減量為2重量%以下。 la::而t,圖1⑷所示之熱剝離型雙面黏著帶或黏著片 a八有如下之構成·於基材3之其 一 .... /、 面上形成未含有發 泡刎之黏著劑層(A)2,且於基材3 土刊J心乃一面上形成. 泡劑之黏著劑層(B)5。又,圖1(b)所示 有毛 著a . ,、、、求j離型雙面黏 者片lb ’具有如下之構成:於基材3之复 形成未含有發泡劑之黏著劑層⑷2,且於基材3之另一 I27476.doc 200844206 ==形成有橡膠狀有機彈性層4、含有發泡劑之黏著 二 進而’該等熱剝離型雙面黏著帶或黏著片(la, 1 b) ’係以兩面成為 劑層⑻5之表面未:之隔片6保護含有發泡劑 ♦ 表面未含有發泡劑之黏著劑層(Α)2之表面與 之表面接觸之形態重合而捲繞為輥狀,藉此製 1為輥狀之形態的熱剝離型雙面黏著帶。L degree:. 65 5% RH) is below 1 N/2 〇 axis. Further, after heating the heat-peelable double-sided adhesive tape or the adhesive sheet under the conditions of temperature; ', 165C - and pressure: i, the pressure of the plasticizer was 2% by weight or less. La:: and t, the heat-peelable double-sided adhesive tape or the adhesive sheet a shown in Fig. 1 (4) has the following constitution: on one of the substrates 3, the surface is formed without foaming enamel. The adhesive layer (A) 2 is formed on one side of the substrate 3, and the adhesive layer (B) 5 of the foaming agent is formed. Further, as shown in Fig. 1(b), the detachable double-sided adhesive sheet lb' has a constitution in which an adhesive layer not containing a foaming agent is formed on the base material 3. (4) 2, and the other substrate 27 is I27476.doc 200844206 ==The rubber-like organic elastic layer 4 is formed, the adhesive containing the foaming agent is further, and the heat-peelable double-sided adhesive tape or adhesive sheet (la, 1) b) 'The surface of the double-sided agent layer (8) 5 is not: the separator 6 protects the foaming agent ♦ the surface of the adhesive layer (the surface 2) containing no foaming agent is superposed on the surface in contact with the surface. In the form of a roll, a heat-peelable double-sided adhesive tape in the form of a roll was produced.

:上所述,本發明之熱剝離型雙面黏著帶或黏著片中, 未3有^ &劑之黏著劑層(Α)以相對於⑽重量份之基礎聚 合:為5〜30重量份之比例含有塑化劑,且未含有發泡劑之 黏者劑層⑷之拉伸黏著力(對聚對苯二甲酸乙二酯薄膜, 剝離。角度·· 18〇°、拉伸速度:300 mm/min、溫度: 3 2 C濕度· 65±5%RH)為1 N/20 mm以下之適度大小, 因此於利用未含有發泡劑之黏著劑層(A)而貼著於台座等 士撐體(特別是藉由貼著使其固定)時,可牢固地貼著(可貼 著而使其固定),X,於自貼著之支撐體上剝離時,可藉 由撕下而容易地剥離。 再者,本發明之熱剝離型雙面黏著帶或黏著片中,於未 含有發泡劑之黏著劑層(A)中以特定比例使用塑化劑,藉 此可控制未含有發泡劑之黏著劑層(A)之拉伸黏著力將其 減低至適度大小。 並且’因使未含有發泡劑之黏著劑層(A)之黏著力(拉伸 黏著力)適度降低,故即使使用塑化劑,將該熱剝離型雙 面黏著帶或黏著片於溫度:165。〇且壓力:!氣壓之條件下 加熱1小時後塑化劑之減量成為2重量%以下,因此於將物 127476.doc 12 200844206 品貼著於作為熱剝離型黏著劑層之含有發泡劑之黏著劑層 之表面而進行加工(特別是於高溫下進行加工)時,或於加 工後藉由加熱自含有發泡劑之黏著劑層剝離時等情形時, 可抑制或防止塑化劑之擴散或揮發,可有效地抑制或防止 對貼合於含有發泡劑之黏著劑層之物品、或加卫該物品而 所得之加工品的污染。As described above, in the heat-peelable double-sided adhesive tape or adhesive sheet of the present invention, the adhesive layer (Α) of the adhesive agent is not polymerized with respect to (10) parts by weight: 5 to 30 parts by weight. The ratio of the adhesive agent containing the plasticizer and the adhesive layer (4) without the foaming agent (for the polyethylene terephthalate film, peeling. Angle · · 18 ° °, stretching speed: 300 Mm/min, temperature: 3 2 C humidity · 65±5% RH) is an appropriate size of 1 N/20 mm or less, so it is attached to the pedestal using an adhesive layer (A) that does not contain a foaming agent. When the support (especially by fixing it), it can be firmly attached (can be attached and fixed), and X can be easily peeled off when peeled off from the support. Stripping. Further, in the heat-peelable double-sided adhesive tape or adhesive sheet of the present invention, a plasticizer is used in a specific ratio in the adhesive layer (A) not containing a foaming agent, whereby the foaming agent can be controlled without containing a foaming agent. The tensile adhesion of the adhesive layer (A) reduces it to a moderate size. Further, 'the adhesive force (stretching adhesive force) of the adhesive layer (A) which does not contain a foaming agent is moderately lowered, so even if a plasticizer is used, the heat-peelable double-sided adhesive tape or adhesive sheet is at a temperature: 165. And pressure:! After the heating under the conditions of air pressure for 1 hour, the amount of the plasticizer is reduced to 2% by weight or less. Therefore, the surface of the adhesive layer containing the foaming agent as a heat-peelable adhesive layer is applied to the surface of the material 127476.doc 12 200844206. It can suppress or prevent the diffusion or volatilization of the plasticizer when it is processed (especially when it is processed at a high temperature) or when it is peeled off by heating from the adhesive layer containing a foaming agent after processing. Contamination of the article adhered to the adhesive layer containing the foaming agent or the processed product obtained by affixing the article is suppressed or prevented.

再者,作為塑化劑,例如可藉由使用具有下述特性(χ) 及/或特性(Υ)之塑化劑,而將於溫度:165它且壓力:1氣 壓之條件下加熱熱剝離型雙面黏著帶或黏著片1小時後塑 化劑之減置控制為2重量%以下。 特性(X) ·於溫度:165t:且壓力:1氣壓之條件下加熱工 小時後的減量為2重量%以下的特性 特性(Y) ··於100。(:下之飽和蒸汽壓為〇 〇9 Pa以下且沸點 為400°c以上的特性 即,於本發明中,藉纟使用以相料1〇〇重量份之構成 未含有發泡劑之黏著劑層(A)之基礎聚合物為5〜%重量份 ^匕例使用有上述具有特性(χ)及/或特性⑺之塑化劑_ 著劑組合物,來形成未含有發泡劑之黏著劑層(Α),可獲 得未含有發泡劑之黏著劑層(Α)之拉伸黏著力(對聚對苯2 甲酸乙二酯薄膜,剝離角度:18〇。、拉伸速度: mm/min、溫度:23±2t、濕度· 65±5%rh)& 卿麵 以下’且於溫度:165。(:且麼力:⑽之條件下加孰雙面 黏著帶或黏著片i小時後塑化劑之減量為2重量%以下的執 剝離型雙面黏著帶或黏著片。 … 127476.doc 13 200844206 作為未含有發泡劑之黏著劑層(A)之拉伸黏著力(對聚對 苯二曱酸乙二酯薄膜,剝離角度:180。、拉伸速度:300 mm/rmn、溫度:23±rc、濕度:65±5%RH),若為} mm以下則並無特別限制,例如可以是0.1〜1 N/20 mm,較 好的是0.8 N/20 mm以下(例如〇 3〜〇 8 N/2〇 mm)。若未含Further, as the plasticizer, for example, by using a plasticizer having the following characteristics (χ) and/or characteristics (Υ), heat peeling can be carried out at a temperature of 165 at a pressure of 1 atmosphere. The reduction of the plasticizer after 1 hour of the double-sided adhesive tape or the adhesive sheet is controlled to 2% by weight or less. Characteristic (X) - Characteristic (Y) at a temperature of 165 t: and a pressure of 1 at a pressure of 2% by weight or less after heating for one hour. (The characteristic that the saturated vapor pressure is 〇〇9 Pa or less and the boiling point is 400 ° C or more, that is, in the present invention, the adhesive which does not contain a foaming agent is used by using 1 part by weight of the phase material. The base polymer of the layer (A) is 5 to % by weight, and the above-mentioned plasticizer having the characteristics (χ) and/or the characteristic (7) is used to form an adhesive which does not contain a foaming agent. The layer (Α) can obtain the tensile adhesion of the adhesive layer (Α) without a foaming agent (for polyethylene terephthalate film, peeling angle: 18 〇., stretching speed: mm/min) , temperature: 23 ± 2t, humidity · 65 ± 5% rh) & below the surface of the 'and at temperature: 165. (: and Mo Li: (10) under the conditions of double-sided adhesive tape or adhesive sheet i hours later plastic A release-type double-sided adhesive tape or adhesive sheet having a reduction amount of 2% by weight or less. 127476.doc 13 200844206 Tensile adhesion as an adhesive layer (A) not containing a foaming agent (for polyparaphenylene) Ethylene diacetate film, peeling angle: 180., stretching speed: 300 mm/rmn, temperature: 23±rc, humidity: 65±5% RH), if it is } mm There is no particular limitation, and may be, for example, 0.1 to 1 N/20 mm, preferably 0.8 N/20 mm or less (for example, 〇 3 to 〇 8 N/2 〇 mm).

有發泡劑之黏著劑層(A)之拉伸黏著力(對聚對苯二甲酸乙 二酉旨薄膜,剝離角度:18〇。、拉伸速度:鳩職/心、溫 度:23±2。〇、濕度:65±5%rh)超過】N/2〇咖,則自貼著 之支撐體剝離時之剝離性降低,變得難以撕下。再者,若 未含有發泡劑之黏著劑層㈧之拉伸黏著力(對聚對苯二甲 酸乙二醋薄膜’剝離角纟:⑽。、拉伸速度:3〇〇 mm/min、溫度:23±2。〇、濕度:M±5%RH)未達(Μ N/20 mm,則黏著力過低,貼著於台座等支樓體上時之固定性 P牛低,加工貼著於含有發泡劑之黏著劑層⑺)之物品時, 或使加工之加工品剝離時進行加熱時,變得易於剝落。 於本發明中’未含有發泡劑之黏著劑層⑷之拉伸黏著 力(對聚對苯二甲酸乙二醋薄膜,剝離角度:18〇。、拉伸 ^度:3G〇 mm/min、溫度:23±2t、濕度:65±5%RH)可 定義為藉由下述[拉伸黏著力之測定方法]測定之值。 [拉伸黏著力之測定方法] 將熱剝離型雙面點荽* + • 又®黏者T或黏著片切斷為寬:20 mmx 長·· 140 mm之尺寸,蔣兮〇 净4 20 mmxl4〇 mm之熱剝離型雙面 黏著帶或黏著片,以未 # 3有發泡劑之黏著劑層(Α)側之黏 者面與聚對苯二甲酸乙二 一知4 Μ之表面接觸之狀態下,於 127476.doc •14· 200844206 溫度· 23 土 2°C及濕度:65士5%1111之環境下,使2 kg之輥往 復1 -人之方法壓接於寬30 mm之聚對苯二甲酸乙二酯薄膜 (商品名「lmnirror S-1〇」,曰本東麗公司製造,厚· 25 μηι)上(根據jis Z 0237),於溫度:23土2°C及濕度:Tensile adhesion of the adhesive layer (A) with foaming agent (for polyethylene terephthalate film, peeling angle: 18 〇., stretching speed: 鸠 job / heart, temperature: 23 ± 2 〇, Humidity: 65±5% rh) When the N/2 〇 coffee is used, the peeling property at the time of peeling from the adhering support body is lowered, and it becomes difficult to tear off. Further, if the adhesive layer (8) which does not contain the foaming agent has a tensile adhesive force (for the polyethylene terephthalate film, the peeling angle 纟: (10)., the stretching speed: 3 〇〇 mm/min, the temperature : 23 ± 2. 〇, humidity: M ± 5% RH) not reached (Μ N / 20 mm, the adhesion is too low, attached to the pedestal and other supporting structures when the fixed P cattle is low, processing close When the article contains the adhesive layer (7) of the foaming agent, or when the processed product is peeled off, it is easily peeled off. In the present invention, the tensile adhesive force of the adhesive layer (4) containing no foaming agent (for polyethylene terephthalate film, peeling angle: 18 〇., stretching degree: 3 G 〇 mm/min, Temperature: 23±2 t, humidity: 65±5% RH) can be defined as a value measured by the following [Method for Measuring Tensile Adhesion]. [Method for Measuring Tensile Adhesion] Cut the heat-peelable double-sided point 荽* + • and the viscous T or the adhesive sheet into a width: 20 mmx long · · 140 mm in size, Jiang Yanjing 4 20 mmxl4 〇mm heat-peelable double-sided adhesive tape or adhesive sheet, which is in contact with the surface of the polyethylene terephthalate layer on the side of the adhesive layer (#) having a foaming agent In the state, at 127476.doc •14· 200844206 temperature · 23 soil 2 ° C and humidity: 65 ± 5% 1111 environment, the 2 kg roller reciprocating 1 - person method is crimped to the width of 30 mm Ethylene phthalate film (trade name "lmnirror S-1〇", manufactured by Sakamoto Toray Co., Ltd., thick · 25 μηι) (according to jis Z 0237), at temperature: 23 ± 2 ° C and humidity:

65±5/〇RH之環i兄下放置3〇分鐘之後,於溫度及濕 度:65士5%RH之環境下、剝離角度· 18〇。、拉伸速度·· 300 mm/分鐘之測定條件下,將聚對苯二甲酸乙二酯薄膜 自熱剝離型雙面黏著帶或黏著片上撕下而使其剝離,測定 該剝離時之應力,讀取應力之最大值(除去測定初期之峰 頂的最大值),將該應力之最大值作為黏著力(Ν/2〇㈤岣, 藉此進行測定。 又,作為將熱剝離型雙面黏著帶或黏著片於溫度: 165°C且壓力:1氣壓之條件下加熱i小時後,熱剝離型雙 面黏著帶或黏著片整體中含有之塑化劑之減量,若為2重 量%以下則並無特別之限制,較好的是i重量%以下(進而 好的是0.5重量%以下),其中特別好的是〇3重量%以下(特 別是0重量%)。若將熱剝離型雙面黏著帶或黏著片於溫 度:165°C且壓力:i氣壓之條件下加熱H、日寺後,塑化^ 之減量超過2重量。/。’則對貼合於含有發泡劑之黏著劑層 (B)之物品進行加工時’或者將該加工之加工品自含有: 泡劑之議層剛離時,產生污染物品或加工品之問 題。 β卜A和有於溫度:After 65 ± 5 / 〇 RH ring i brother placed for 3 〇 minutes, in the temperature and humidity: 65 ± 5% RH environment, peeling angle · 18 〇. , under the measurement conditions of tensile speed··300 mm/min, the polyethylene terephthalate film was peeled off from the heat-peelable double-sided adhesive tape or the adhesive sheet, and peeled off, and the stress at the time of peeling was measured. The maximum value of the reading stress (excluding the maximum value of the peak top at the beginning of the measurement) is used, and the maximum value of the stress is used as the adhesion force (Ν/2〇(5)岣, and the measurement is performed. After the heating or the adhesive sheet is heated at a temperature of 165 ° C and a pressure of 1 atmosphere, the amount of the plasticizer contained in the heat-peelable double-sided adhesive tape or the adhesive sheet is less than 2% by weight. It is not particularly limited, and is preferably i% by weight or less (and further preferably 0.5% by weight or less), and particularly preferably 3% by weight or less (particularly 0% by weight). Adhesive tape or adhesive sheet is heated at a temperature of 165 ° C and pressure: i gas pressure, after the H, the temple, the plasticization ^ reduction of more than 2 weight. /. 'is attached to the adhesive containing foaming agent When the article of layer (B) is processed, or the processed product is processed Comprising: when the protocol layers of the rigid-foam agent from generating the problem of contamination of processed articles or β A and has a temperature Bu:

165°C且壓力:1氣壓之條件下加熱H J吋便的塑化劑之減 127476.doc 200844206 里可疋義為藉由下述[加熱減ϊ之測定方法]而測定之值。 [加熱減量之測定方法] 將剝離隔片後之熱剝離型雙面黏著帶或黏著片[面積: 10 cm2(寬·· 2〇 mm、長·· 50 mm)]置於小玻璃瓶中,於 165°C之溫度且1氣壓之壓力的條件下加熱1小時,將加熱 狀怨下之氣體1 ·〇 mL,於下述氣相層析之測定條件下,注 入至氣相層析測定裝置中,測定蒸發或揮發之塑化劑之重 量,藉由計算求出熱剝離型雙面黏著帶或黏著片中之塑化 劑之減量(重量減少)。 (氣相層析之測定條件) •载體氣體及其流量:氦(He)氣、7,9 mL/min •管柱柱頭壓:34·5 kPa(於40。(:下)165 ° C and pressure: 1 atmosphere to heat the H J 的 plasticizer reduction 127476.doc 200844206 里可疋 meaning the value measured by the following [heat reduction ϊ measurement method]. [Measurement method of heating loss] A heat-peelable double-sided adhesive tape or adhesive sheet [area: 10 cm2 (width··2〇mm, length··50 mm)] after peeling the separator is placed in a small glass bottle, The mixture was heated at a temperature of 165 ° C and a pressure of 1 atm for 1 hour, and the heated gas was subjected to a gas chromatographic measurement apparatus under the following conditions of gas chromatography. The weight of the plasticizer which evaporates or volatilizes is measured, and the amount of reduction (weight reduction) of the plasticizer in the heat-peelable double-sided adhesive tape or the adhesive sheet is calculated by calculation. (Measurement conditions for gas chromatography) • Carrier gas and its flow rate: helium (He) gas, 7,9 mL/min • Column head pressure: 34·5 kPa (at 40° (:)

•注入口溫度:280°C •官柱溫度··於4〇°C下5分鐘、以1(rc/min之比率使之升 溫、於260°C下13分鐘 •偵檢器:FID(280°C) •加壓時間:0.12 min •環路填充時間:0.12 min •環路平衡時間:〇·12 min •注入時間:3.00 min •試樣環路溫度:2〇〇°c •輸送線溫度:2 2 〇。〇 [未含有發泡劑之黏著劑層(A)] 未含有發泡劑之黏著劑層⑷係未含有發泡劑之黏著劑 127476.doc •16- 200844206 層’具有非熱膨脹性或者非發泡性之特性。即,未含有發 泡劑之黏者劑層⑷並非熱剝離型黏著劑層 :劑:黏著劑層⑷至少含有黏著劑、相對於⑽ + 、 里仍 < 比例的塑化劑。再 者,塑化劑之含量,若相對於1〇〇重 ^ ^ a / λ 切之未含有發泡劑 中的基礎聚合物未達5重量 發泡劑之黏㈣層⑷之黏著力降低的效使未= ::若超㈣重量份,則容易產生如下問題:於未 泡劑之黏著劑層⑷之表面過剩析出而成 未含有發泡劑之黏著劑声(Α ’、、、木’、* ’ 产姑、 J層()之黏者力變得過低,而自二 座等被黏著體翹起。作為未$ ^ 口 之塑化劑之人θ / 有發泡劑之黏著劑層㈧中 有二: ,k好的是相對於10〇重量份之構成未含 4之黏著劑層⑷之基礎聚合物為8〜25重量份。 於本發明中,作為塑化劑,可 (取/或特性⑺之塑化劑。 使用上述具有特性• Injection temperature: 280°C • Guan temperature • 5 minutes at 4°C, 1° at rc/min, 13 minutes at 260°C • Detector: FID (280 °C) • Pressurization time: 0.12 min • Loop filling time: 0.12 min • Loop balance time: 〇·12 min • Injection time: 3.00 min • Sample loop temperature: 2 〇〇 °c • Conveying line temperature : 2 2 〇.〇 [Adhesive layer (A) without blowing agent] Adhesive layer (4) without blowing agent is an adhesive that does not contain a foaming agent 127476.doc •16- 200844206 Layer 'has non The property of thermal expansion or non-foaming property. That is, the adhesive layer (4) which does not contain a foaming agent is not a heat-peelable adhesive layer: the adhesive: the adhesive layer (4) contains at least an adhesive, and is still relative to (10) + The proportion of plasticizer. In addition, the content of plasticizer, if compared with 1 〇〇 ^ ^ a / λ cut does not contain the base polymer in the foaming agent less than 5 weight of foaming agent adhesion (4) The effect of lowering the adhesion of the layer (4) is not =: :: if it exceeds (four) parts by weight, the following problem easily occurs: excessive precipitation of the surface of the adhesive layer (4) of the unfoaming agent Adhesive sounds that do not contain a foaming agent (Α ', , , wood ', * ' The origin of the yoghurt and the J layer () are too low, and are lifted from the two seats. $ ^ The plasticizer of the mouth θ / the adhesive layer of the foaming agent (8) has two: k is a base polymer of 10 parts by weight of the adhesive layer (4) which does not contain 4 8 to 25 parts by weight. In the present invention, as a plasticizer, a plasticizer (of / or characteristic (7) can be used.

Ci 件二特::X)中’作為於溫度:165t:且遂力:1氣壓之條 -特二7後广化劑之減量,若為2重量%以下則並 之Γ較好的是1重量%以下(進而好的⑽重量 ^下)於其中特別好的是〇.3重量%以下(特別^重量叫。 、特性⑺t ’作為戰下之塑化劑之飽 進 以下則並無特別之限制,較好的是 以下2好的疋4.2Xl〇4匕以下),特別好的是心…Pa 特:之,下之塑化劑之餘和蒸汽厂堅的下… 特別之限制,越低越好。 I"、、 127476.doc 200844206 另方面’於特性⑺中,4乍為塑化劑之沸點,若為 400。(:以上職無特別之限制,較好的是彻。^上(進而好 的是赋以上)。再者,塑化劑之濟點之上限並無特別之 限制,越高越好。 、·未3有& /包劑之黏著劑層(A)中之塑化劑之減量 (溫度· 16 5 〇C且壓力· 1痛茂a ,分 礼堡之條件下加熱1小時後的減量) 可定義為藉由下述之[黏著劑層⑷中之加熱減量之測定方 法]測定之値。 [黏著劑層⑷中之加熱減量之^ 採取約10 cm之未含有發泡劑之黏著劑層⑷,將其置 於小玻璃瓶t,於165°C之、、四庳n 1 β r Λ又且1軋壓之壓力的條件下加 …、小日守,將加熱狀態之氣體 mL,於與上述[加熱減量 」疋/]中之氣相層析之測定條件相同的條件下,注 入至氣相層析測定裝置中’測定蒸發或揮發之塑化劑之重 量,藉由計算求出未含有發泡劑之黏著 = L) 劑之減量(重量減少)。 化 如上所述’作為塑化劑,若 ⑺之塑化劑,則即使於高 ’、、’ X)及/或特性 、 间,凰%境中,亦可抑制或防丨卜γ 發或揮發,例如於加工 f,'' 之物品《加工品),或者:使:,劑之㈣ ,^ ^ / 、 工後之加工品剝離而進行 加“,塑化劑基本或完全不蒸發或揮發 進仃 或防止物品或加工品受污染有效地抑制 面& |< ,P使於製造熱剝離型雙 面黏者▼或黏著片時,於塗佈黏著劑時或使其乾贤/又 化劑基本或完全不蒸發或揮 ,才塑 T抑制或防止空氣過濾器 127476.doc 200844206 等受污染,且可製造特性穩定之熱剝離型雙面黏著帶或黏 著片。 於本發明中,作為塑化劑,較好的是具有特性(x)及特 性⑺之塑化劑。再者,作為塑化劑’較好的是與用於形 成未含有發泡劑之黏著劑層(A)之黏著劑之基礎聚合 互容性較好者。 具體而言’作為塑化劑’例如可使用偏苯三"吏醋系塑 化劑、均苯四甲酸醋系塑化劑、_塑化劑、己二酸系 塑化劑等,可較好的使用偏苯三甲酸酉旨系塑化劑、均苯四 甲酸醋系塑化劑。塑化劑可單獨使用或者組合2種以上使 用0 作為偏苯三甲酸醋系塑化劑或均苯四甲酸醋系塑化劑, 例如較合適的是具有特性⑻及/或特性⑺之偏苯三甲酸三 =、或具有特性(X)及/或特性⑺之均苯四甲酸四醋。該偏 本二甲酸三酯或均苯四甲酸四醋係藉由偏苯三甲酸或均苯 a甲欠,、1兀醇類(特別是1兀脂肪族醇類)之酯化反應而獲 仔之Sl類。作為上述1元醇類,較好的是碳數為8以上之i =脂肪族醇類(例如:正辛醇、2_乙基己醇、異辛醇、壬 醇、異壬醇、癸醇、異癸醇、十-院醇、十二烧醇等), 進而軏好的是碳數為8〜12(其中尤其好的是碳數為n 特別好的是碳數為元脂肪族醇類。π脂肪族醇類等 1广醇類可單獨使用或組合2種以上使用。再者,1元脂肪 、醇類可具有直鏈狀或分支鏈狀之任意形態。 作為偏本二曱酸酯系塑化劑,例如可列舉偏 127476.doc -19- 200844206 苯三f酸三正妾 -曰、偏本三尹酸三(2_乙基 三f酸三異辛酯、 土匕基)¾、偏苯 癸酯等偏笨三甲酸一 偏本二甲酸三異 f酉夂二烷基_等。又,作 塑化劑,例如可列裹W Μ本四甲酸酯系 幻牛均本四甲酸四正辛醋 (2-乙基己基)酽笪w 日均本四f酸四 )酉日#均本四甲酸四烷基酯等。 於本^明中’塑化劑之分子量 劑(聚酯系塑化南丨笠w 4马承合物型塑化 ㈣& 情形時為重量平均分子量]並益特別 限制’較好的是5。〇以上,進而好的 :寺別 是540以上。 以乂上,特別好的 二1乍為未含有發泡劑之黏著劑層⑷中所使用之黏著 =無特別限制,可自公知之黏著劑中適宜選擇。2 :而…乍為黏著劑,例如可列舉:丙稀酸系黏著劑 :系:黏著劑、乙編基喊系黏著劑、聚石夕氧系黏著劑、 :黏著劑、聚醯胺系黏著劑、胺基甲酸乙醋系黏著 劑:鼠糸黏著劑、苯乙烯_二烯嵌段共聚物系黏著劑、於 該等黏著劑中調配有溶點約為·。〇以下之熱溶融性樹脂 之澄變特性改良型黏著劑等。又,作為黏著劑,可使用放 射線硬化型黏著劑(或能量線硬化型黏著劑)。黏著劑可單 獨使用或者組合2種以上使用。 作為黏著劑,可適宜使用丙烯酸系黏著劑、橡膠系黏著 劑,特別是丙烯酸系黏著劑較合適。作為丙烯酸系黏著 ^可列舉以使用(甲基)丙烯酸烷基酯之1種或2種以上為 早體成分而成的丙烯酸系聚合物(均聚物或共聚物)為基礎 聚合物之丙烯酸系黏著劑。作為上述丙烯酸系黏著劑中之 127476.doc -20- 200844206 (甲基)丙烯酸烷基酯,例如可列舉(甲基)丙烯酸甲酯、(甲 基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙 酉曰、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯 酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊 酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸 辛酉曰、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、 (甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(曱基)丙烯酸癸 酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲 基)丙烯酸十一烧基酯、(甲基)丙烯酸十三烧基酯、(甲基) 丙烯酸十四烧基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙 稀酸十六烧基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙稀 酸十八烧基醋、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸 二十烷基酯等(曱基)丙烯酸烷基酯[較好的是(甲基)丙 烯酸Cn8烧基(直鏈狀或分支鏈狀之烧基)酯]等。 再者,上述丙烯酸系聚合物,亦可以凝聚力、耐熱性、 交聯性等之改質為目的,視需要含有與可與上述(甲基)丙 烯酸烷基酯共聚之其他單體成分對應的單元。作為該單體 成分’例如可列舉丙烯酸、甲基丙烯酸、丙烯酸魏基乙 酯、丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、巴豆酸 專含有緩基之單體;馬來酸酐、伊康酸酐等含有酸酐基之 單體;(曱基)丙稀酸經乙酯、(曱基)丙稀酸經丙酯、(甲基) 丙烯酸羥丁酯、(曱基)丙烯酸羥己酯、(曱基)丙烯酸羥辛 酯、(曱基)丙烯酸羥癸酯、(曱基)丙烯酸羥基十二烷基 酯、甲基丙烯酸(4-羥甲基環己基)曱酯等含有羥基之單 127476.doc -21 - 200844206 體;苯乙烯磺酸、丙烯基磺酸、2-(甲基)丙烯醯胺-2-曱基 丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、 (甲基)丙烯醯氧基萘磺酸等含有磺酸基之單體;2-羥乙基 丙烯醯基磷酸酯等含有磷酸基之單體;(甲基)丙烯醯胺、 N,N-二曱基(曱基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯 胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、 N-羥甲基(曱基)丙烯醯胺、N-羥曱基丙烷(甲基)丙烯醯胺 等(N-取代)醯胺系單體;(曱基)丙烯酸胺基乙酯、(曱基)丙 烯酸N,N-二曱胺基乙酯、(甲基)丙烯酸第三丁胺基乙酯等 (甲基)丙烯酸胺基烷基酯系單體;(甲基)丙烯酸曱氧基乙 酯、(曱基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基 酯系單體;N-環己基馬來醯亞胺、N_異丙基馬來醯亞胺、 N-十二烷基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺 系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基 伊康醯亞胺、N_辛基伊康醯亞胺、N-2-乙基己基伊康醯亞 胺、N-環己基伊康醯亞胺、N-十二烷基伊康醯亞胺等伊康 醯亞胺系單體;N-(曱基)丙烯醯氧基亞甲基琥珀醯亞胺、 N-(甲基)丙稀酸基-6-氧基伸己基琥珀醯亞胺、N_(曱基)丙 烯醯基-8-氧基伸辛基琥珀醯亞胺等琥珀醯亞胺系單體;乙 酸乙烯酯、丙酸乙烯酯等乙烯酯類;N-乙烯基-2-吡咯烷 酮、N-甲基乙烯基吡咯烷酮、N-乙烯基吡啶、N-乙烯基哌 啶酮、N-乙烯基嘧啶、N-乙烯基哌嗪、N-乙烯基咣嗪、N-乙烯基吡咯、N-乙烯基咪唑、N_乙烯基噁唑、N-(曱基)丙 烯醯基-2-吼咯烷酮、N-(曱基)丙烯醯基哌啶、N-(甲基)丙 127476.doc -22· 200844206 f Ο 烯醯基吡咯啶、N-乙烯基嗎啉等含氮雜環系單體;乙烯 基羧酸醯胺類;苯乙烯、α_甲基苯乙烯等苯乙烯系單體; Ν-乙烯基己内醯胺等内醯胺系單體;丙烯腈、甲基丙烯腈 等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含有^ 氧基之丙烯酸系單體;(甲基)丙烯酸聚乙二醇酯、(甲基^ 丙烯酸聚丙二醇酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲 基)丙烯酸甲氧基聚丙二醇酯等二醇系丙烯酸酯單體;(甲 基)丙烯酸四氫呋喃甲醋、說(曱基)丙烯酸醋、聚矽氧(甲 基)丙烯酸S旨等具有雜環、_原子、發原子等之丙稀酸酉旨 系單體,己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙 烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基) 丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三 (甲基)丙烯酸酿、季戊四醇三(甲基)丙烯酸_、二季戍四 醇六(甲基)丙烯酸酷、環氧丙稀酸醋、聚g旨丙婦酸醋、丙 烯酸胺基甲酸乙醋、二乙烯苯、丁基二(甲基)丙烯酸醋、 己基二(甲基)丙烯酸酯等多官能單體;異戊二烯、丁二 稀/、丁烯等烯烴系單體;甲基乙烯醚、乙基乙烯醚等乙 體等i等單體成分可使用i種或者2種以上。 再者’作為橡㈣黏著劑,可列舉以天然橡膠或者各種 口成橡膠[例如··聚異戊:稀橡膠、I乙晞· 丁二烯(SB) 橡膠、苯乙稀·異戊二綱橡膠、苯乙稀·異戊二浠· =乙烯嵌段共聚物⑽)橡膠、苯乙稀· 丁二稀·苯乙稀嵌 &/、來物(SBS)橡膠、苯乙烯•乙烯•丁烯乙稀彼段 /、聚物(SEBS)橡膠、苯乙烯•乙烯•丙烯•苯乙稀後段共 127476.doc •23- 200844206 聚物(SEPS)橡膠、苯乙烯· 橡膠、再生橡膠、丁基橡膠、:显丁丙^段共聚物(SEP) 等]為基礎聚合物之橡膠系點著劑 或該等之改性體 黏著劑除黏著性成分 劑之外,亦哥柏祕ν楚聚合物)等聚合物成分、塑化 '、可根據黏著劑之種類 劑、顏料、染料、填s有交聯劑'增黏 ^ ^ ^ ^ 、 抗老化劑、導電材料、靜電防 止剤4適宜之添加劑。 再者,作為交聯劑,例如 交聯劑、三聚氛胺系交聯齊/、、==糸交聯劑、環氧系 可列舉脲系交聯劑、金屬醇糸交聯劑之外,亦 胪淼丨、八M 蜀知凰糸又聯劑、金屬螯合物系交 二:屬鹽系交聯劑、碳二醯亞胺系交聯劑、 :二::'系交聯劑、胺系交聯劑等,可適宜使用異 :=聯劑、環氧系交聯劑。作為上述異氰酸醋系交 =、!:列舉二異氛酸以乙二酷、二異氛… 二昱着2亂酸1,6 ·己二s旨等低級脂肪族聚異氰酸醋類; ϋ 一 ”-夂%戊二酯、二異氰酸環己二_ 酮、氫化甲婪-s" * —異乳酸異佛爾 環族Γ里本—異錢醋、氣化苯二甲基二異氮酸醋等脂 …異氣酸醋類’· 2,4_甲苯二異氰酸 氰酸酯、4,4,__^a ,甲本一" 耸矣意# 本基甲烷-異鼠酸、苯二甲基二異氰酸_ 丙烧/甲:聚異氰酸醋類等’除此之外,亦可使用三經甲基 本-異氰酸醋三聚物加成物[日本聚胺酿工業股份 二二造、商品名「c〇r〇netl」]、三經甲基丙炫/ Γ酉文己二醋三聚物加成物f日本聚胺§旨工業股份有限 么° I造、商品名「CORONET HL」]等。作為上述環氧 127476.doc -24- 200844206 系交聯劑,例如除n,n,n,,n,_四縮水甘油美門二甲苯二 胺、二縮水甘油苯胺,(N,N,水甘;基:甲基) 環己院、π己二醇二縮水甘油鍵、新戊二醇二縮水甘油 謎、乙二醇二縮水甘㈣、丙二醇二縮水甘油醚、聚乙二 私-縮水甘油喊、聚丙二醇二縮水甘油鍵、山梨醇聚縮水 甘油鍵、丙三醇聚縮水甘油喊、季戊四醇聚縮水甘油鍵、 聚丙三醇聚縮水甘㈣、山梨醇針聚縮水甘油鱗、三經甲 基丙广聚縮水甘油醚、己二酸二縮水甘油醋、鄰苯二甲酸 一縮水甘油酉旨、二綠A 4、丄甘 ―鈿水甘油基-三(2-羥乙基)異三聚氰酸 -日、間本H水甘油㈣、㈣s_:縮水甘油醚之外, 可列舉於分子内具有2個以上環氧基之環氧系樹脂等。Ci two parts:: X) 'as temperature: 165t: and force: 1 bar of pressure - after the second 7 after the broadening agent reduction, if it is 2% by weight or less, and then better is 1 The weight% or less (and further preferably (10) by weight) is particularly preferably 3% by weight or less (particularly, the weight is called. The characteristic (7)t' is not particularly special as the plasticizer under the war. The limit is better than the following 2 good 疋4.2Xl〇4匕), especially good is the heart...Pa special: the next plasticizer and the steam factory firm... Special restrictions, the lower The better. I",, 127476.doc 200844206 In another aspect, in the characteristic (7), 4乍 is the boiling point of the plasticizer, if 400. (There is no special restriction on the above duties, it is better to carry out the above. (There is better to give more than above.) Furthermore, there is no special limit on the upper limit of the plasticizer. The higher the better. The amount of plasticizer in the adhesive layer (A) of the & /package is not reduced (temperature · 16 5 〇C and pressure · 1 painful a, the reduction after heating for 1 hour under the condition of the Fortress) It can be defined as the enthalpy determined by the following [Method for measuring the heating loss in the adhesive layer (4)] [The heating loss in the adhesive layer (4) ^ takes about 10 cm of the adhesive layer containing no foaming agent (4), placed in a small glass bottle t, at 165 ° C, four 庳 n 1 β r Λ and 1 rolling pressure under the condition of adding ..., small day Shou, the gas in the heating state mL, In the same conditions as the measurement conditions of the gas chromatography in the above [heat reduction amount 疋/], the sample is injected into a gas chromatograph measuring apparatus to measure the weight of the plasticizer evaporated or volatilized, and the calculation is performed by the calculation. Adhesion with blowing agent = L) Reduction of the agent (weight reduction). As described above, 'as a plasticizer, if the plasticizer of (7), even in the high ', 'X' and / or characteristics, between, 凰%, can also suppress or prevent γ 发 hair or volatilization For example, in the processing of f, '' articles "processed products", or: to: (4), ^ ^ /, after the work of the processed products are stripped and added, "plasticizers are basically or not evaporated or volatilized into仃 or prevent contamination of articles or processed products, effectively suppressing the surface &|<, P, when manufacturing the heat-peelable double-sided adhesive ▼ or the adhesive sheet, when applying the adhesive or making it dry or rejuvenating The agent is substantially or completely evaporated or volatilized, so that T is inhibited or prevented from being contaminated by the air filter 127476.doc 200844206, and a heat-peelable double-sided adhesive tape or adhesive sheet having stable characteristics can be manufactured. In the present invention, as a plastic The chemical agent is preferably a plasticizer having the properties (x) and (7). Further, as the plasticizer, it is preferably adhered to the adhesive layer (A) for forming a foaming agent. The base of the agent is better in mutual compatibility. Specifically, 'as a plasticizer', for example, benzotriene & q can be used. Uot; vinegar-based plasticizer, pyromellitic acid vinegar plasticizer, _ plasticizer, adipic acid plasticizer, etc., can be used better than trimellitic acid hydrazine plasticizer, Pyromellitic acid vinegar plasticizer. The plasticizer may be used singly or in combination of two or more. It is used as a trimellitic acid vinegar plasticizer or a pyromellitic acid plasticizer. For example, it is suitable to have characteristics. (8) and/or trimellitic acid tris(=) of characteristic (7), or tetrakisperate of pyromellitic acid having the characteristic (X) and/or characteristic (7). The trimeric acid diester or pyromellitic acid tetraacetate is used The esterification reaction of trimellitic acid or homobenzene a, and the esterification of 1 hydric alcohol (especially 1 兀 aliphatic alcohol) to obtain the S1 class. As the above 1-valent alcohol, the carbon number is preferred. It is 8 or more i = aliphatic alcohols (for example: n-octanol, 2-ethylhexanol, isooctanol, decyl alcohol, isodecyl alcohol, decyl alcohol, isodecyl alcohol, ten-indolyl alcohol, twelve burning Alcohol, etc.), and further preferably, the carbon number is 8 to 12 (of which, particularly preferably, the carbon number is n, and the carbon number is preferably a fatty alcohol. The 1,3-aliphatic alcohol and the like are widely used. Use or In addition, the monovalent fat and the alcohol may have any form of a linear chain or a branched chain. As the plasticizer of the partial bismuth phthalate type, for example, 127476.doc -19- 200844206 Triphenyl-f-acid tri-n-indene-indole, partial tri-n-acid tris(2-ethyl tri-f-octyl triisooctyl ester, fluorenyl) 3⁄4, phenyl benzoate, etc. Triiso-f-dialkyl- or the like. Further, as a plasticizer, for example, it can be listed as W Μ tetradecate-based oxen tetrabasic tetracarboxylic acid tetra-n-octyl vinegar (2-ethylhexyl) 酽笪w Daily average four f acid four) 酉日# average tetramethyl tetracarboxylate, etc. In this ^ Mingzhong 'plasticizer molecular weight agent (polyester plasticized Nanxun w 4 horse compound plasticization) (4) & The case is the weight average molecular weight] and the special limit is 'better'. 〇 Above, and then good: Temple is more than 540. It is particularly preferable that the adhesive used in the adhesive layer (4) which does not contain a foaming agent is not particularly limited, and can be suitably selected from known adhesives. 2: And... as an adhesive, for example, an acrylic adhesive: a: an adhesive, an adhesive, an adhesive, a polyoxo adhesive, an adhesive, a polyamide adhesive. The agent, the urethane-based adhesive: a sputum adhesive, a styrene-diene block copolymer adhesive, and a melting point in the adhesive.澄 The following heat-melting resin has a modified property such as a modified adhesive. Further, as the adhesive, a radiation-curable adhesive (or an energy ray-curable adhesive) can be used. The adhesive may be used singly or in combination of two or more. As the adhesive, an acrylic adhesive or a rubber adhesive can be suitably used, and in particular, an acrylic adhesive is suitable. The acryl-based adhesive is an acrylic polymer based on an acrylic polymer (homopolymer or copolymer) in which one or two or more kinds of (meth)acrylic acid alkyl esters are used as an early component. Adhesive. As the alkyl (meth)acrylate of 127476.doc -20- 200844206 in the above acrylic adhesive, for example, methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate may be mentioned. , isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, tert-butyl (meth)acrylate, (A) Ethyl pentyl acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate Ester, decyl (meth) acrylate, isodecyl (meth) acrylate, decyl methacrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, (methyl ) eleven alkyl acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, (methyl) acrylic acid Pyrrolyl ester, heptadecyl (meth)acrylate, (meth)acrylic acid An alkyl (meth) acrylate such as decyl vinegar, hexadecyl (meth) acrylate or eicosyl (meth) acrylate (preferably (N) (C) acrylate (linear) (linear) a branched or branched chain ester) ester] and the like. In addition, the acrylic polymer may be modified for cohesiveness, heat resistance, crosslinkability, etc., and may contain a unit corresponding to another monomer component copolymerizable with the alkyl (meth)acrylate, if necessary. . Examples of the monomer component 'exemplify are monomers such as acrylic acid, methacrylic acid, Wei-ethyl acrylate, carboxy-amyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid, and a maleic anhydride; An anhydride group-containing monomer such as itaconic anhydride; (mercapto)acrylic acid via ethyl ester, (mercapto)acrylic acid propyl ester, (meth)acrylic acid hydroxybutyl ester, (mercapto) hydroxyhexyl acrylate , (mercapto) hydroxyoctyl acrylate, (hydroxy) hydroxy decyl acrylate, (hydroxy) hydroxydodecyl acrylate, 4-hydroxymethylcyclohexyl methacrylate, etc. 127476.doc -21 - 200844206 Benzenesulfonic acid, acrylsulfonic acid, 2-(meth)acrylamidoxime-2-mercaptopropanesulfonic acid, (meth)acrylamide, propanesulfonic acid, (A) a sulfonic acid group-containing monomer such as sulfopropyl acrylate or (meth) acryloxynaphthalenesulfonic acid; a phosphate group-containing monomer such as 2-hydroxyethyl acryloyl phosphinate; (meth) propylene Indoleamine, N,N-dimercapto(fluorenyl) acrylamide, N,N-diethyl(meth)acrylamide, N-isopropyl (Meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxymethyl (decyl) acrylamide, N-hydroxydecyl propane (meth) acrylamide, etc. (N- Substituted) guanamine monomer; (mercapto) aminoethyl acrylate, N, N-diguanidinoethyl (meth) acrylate, tert-butylaminoethyl (meth) acrylate, etc. Alkoxyalkyl acrylate-based monomer; (meth)acrylic acid alkoxyalkyl ester, (meth)acrylic acid ethoxyethyl acrylate (meth) acrylate alkoxyalkyl ester monomer; N- a maleic imide monomer such as cyclohexylmaleimide, N-isopropylmaleimide, N-dodecylmaleimide or N-phenylmaleimide; N-methyl Ikonium imine, N-ethyl Ikonium imine, N-butyl Ikonide, N-octyl Icinoimine, N-2-ethylhexyl Icahn Ikonide imine monomer such as imine, N-cyclohexylkkonium imine, N-dodecylkonkonimide, N-(indenyl) propylene oxime oxymethylene amber Amine, N-(methyl)acrylic acid-6-oxy-extended hexyl succinimide, N_(mercapto) propylene oxime An amber quinone imine monomer such as 8-octyloxyoctyl succinimide; vinyl ester such as vinyl acetate or vinyl propionate; N-vinyl-2-pyrrolidone, N-methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperazine, N-vinylpyridazine, N-vinylpyrrole, N-vinylimidazole, N-vinyl Oxazole, N-(indenyl)propenyl-2-pyrrolidone, N-(indenyl)propenylpiperidine, N-(methyl)propene 127476.doc -22· 200844206 f decene Nitrogen-containing heterocyclic monomer such as pyrrolidine or N-vinylmorpholine; decylamine of vinyl carboxylic acid; styrene monomer such as styrene or α-methylstyrene; Ν-vinyl caprolactone An internal amide monomer such as an amine; a cyanoacrylate monomer such as acrylonitrile or methacrylonitrile; an acrylic monomer containing an oxy group such as glycidyl (meth)acrylate; and a poly(ethylene) acrylate. a glycol-based acrylate monomer such as a diol ester, (polypropylene glycol acrylate, methoxyethylene glycol (meth) acrylate, or methoxypolypropylene glycol (meth) acrylate; Methyl)acrylic acid tetrahydrofuran methyl vinegar, said (fluorenyl) acryl vinegar, poly(oxy) oxy (meth) acrylate, etc., having a heterocyclic ring, a _ atom, an atom, etc. Di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(a) Acrylate, trimethylolpropane tri(meth)acrylic acid brewing, pentaerythritol tris(meth)acrylic acid _, diquaternic quinone tetraol hexa(meth) acrylate aceton, propylene acrylate vinegar, poly g Polyfunctional monomers such as vinegar, acetoacetate, divinylbenzene, butyl bis(meth)acrylate, hexyl di(meth)acrylate; isoprene, butyl dichloride, and butyl For the olefin-based monomer such as a olefin, one or two or more kinds of monomer components such as methyl acetate, ethyl acetate, and the like may be used. In addition, as the rubber (four) adhesive, natural rubber or various kinds of rubber can be cited [for example, polyisobutyl: dilute rubber, I acetyl butadiene (SB) rubber, styrene and isoprene) Rubber, styrene, isoprene, ethylene block copolymer (10), rubber, styrene, butyl, styrene, ampere, styrene, ethylene, styrene Ethylene monomer/polymer (SEBS) rubber, styrene, ethylene, propylene, styrene, 127476.doc •23- 200844206 Polymer (SEPS) rubber, styrene·rubber, recycled rubber, butyl Rubber, propylene, propylene, etc. (SEP), etc.] is a rubber-based pointing agent for a base polymer or a modified body-adhesive agent other than an adhesive component. ), such as polymer components, plasticization, according to the type of adhesive agent, pigments, dyes, s with cross-linking agent 'gluing ^ ^ ^ ^, anti-aging agent, conductive materials, static electricity to prevent 剤 4 suitable additives . Further, as the crosslinking agent, for example, a crosslinking agent, a trimeric amine crosslinking/crosslinking agent, a == hydrazine crosslinking agent, and an epoxy resin may be a urea crosslinking agent or a metal alcohol hydrazine crosslinking agent. , 胪淼丨 胪淼丨, 八 M 蜀 糸 糸 糸 糸 糸 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 An amine crosslinking agent or the like can be suitably used: a crosslinking agent or an epoxy crosslinking agent. As the above isocyanate vinegar cross =,! : Listed as di-iso-acid, E-two cool, two-different atmosphere... Two 2 2 chaotic acid 1,6 · hexanes and other low-grade aliphatic polyisocyanuric acid; ϋ 一"-夂% pentane diester, Dicyclohexanone diisocyanate, hydrogenated formamidine-s" *-iso-lactic acid isophora quinone-iso- vinegar, gasified benzodiazepine sulphuric acid vinegar, etc. Vinegar '· 2,4_toluene diisocyanate cyanate, 4,4,__^a, Jia Benyi"矣意意# Benth methane-isoxanoic acid, benzodimethyl diisocyanate _ 丙烧/甲: polyisocyanuric acid, etc. 'In addition to this, you can also use tri-methyl-isocyanate vinegar terpolymer adduct [Japan polyamine brewing industry shares 22, trade name "c〇r〇netl"], ternary methyl propyl chlorinated / Γ酉文己二 vinegar terpolymer adduct f Japanese polyamine § industrial limited stocks ° I made, trade name "CORONET HL"] . As the above-mentioned epoxy 127476.doc -24- 200844206 crosslinking agent, for example, except n, n, n,, n, _ tetraglycidyl mesitylene diamine, diglycidyl aniline, (N, N, water Gan ; base: methyl) ring hexaxy, π hexanediol diglycidyl bond, neopentyl glycol diglycidol mystery, ethylene glycol dimethyl glycidyl (tetra), propylene glycol diglycidyl ether, polyethylene two private - glycidol , polypropylene glycol diglycidyl bond, sorbitol polyglycidyl bond, glycerol polyglycidyl shunt, pentaerythritol polyglycidyl bond, polyglycerol polyglycidyl (IV), sorbitol needle polyglycidol scale, trimethyl methacrylate Wide polyglycidyl ether, adipic acid diglycidyl vinegar, phthalic acid monoglycidyl hydrazine, dichloro A 4, ruthenium glycoside-tris(2-hydroxyethyl)iso-cyanuric acid An epoxy resin having two or more epoxy groups in the molecule, and the like, in addition to the H-glycidol (tetra) and the (d) s_: glycidyl ether.

C 夭…作為土曰黏劑’例如可列舉松香衍生物[例如:松 f争4心匕松香或該等之衍生物(松香醋系樹 二、::松香輯系樹脂等)等]、㈣系樹脂(例如:祐烯樹 等曰;方二族改性峨脂、氯化輪脂、箱稀-紛樹脂 本紛糸樹脂(例如:苯紛·甲搭樹脂、院基盼樹 S由:_樹_如··脂肪族系石油樹脂、芳香族 石、、由=/、將方香族系石油樹脂氯化後所得之月旨環族系 ::Γ族系飽和烴樹脂)等卜苯乙一 糸树:(例如··苯并咬„南_節樹脂等)等。 方^含有發泡劑之勸著劑層(Α),例如可藉由如下之慣用 方法而形成··將黏著劑 【貝用 或其他添加劑等混合,:彳、以及視需要添加之溶劑 由如下之方法而m 片狀之層。具體而言’可藉 y未含有發泡劑之黏著劑層(A):將含 127476.doc -25- 200844206 有黏著劑、塑化劑、及視需要含有之溶劑或其他添加劑的 混合物,塗佈於基材上,視需要使其乾燥或硬化之方法· 或者於適宜之隔片(剝離紙等)上塗佈上述混合物而形成黏 著劑層,將其轉印(移著)於基材上之方法等。再者,未^ 有發泡劑之黏著劑層(Α)可為單層、複數層之任音产= 態。 “月/ 未含有發泡劑之黏著劑層(Α)之厚度並無特別之限制,C 夭 作为 作为 作为 作为 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ [ Resin (for example: 烯 树 曰 曰; 二 族 峨 峨 、 、 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 方 ( ( ( ( ( ( ( _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ E. eucalyptus: (for example, benzo benzophenone _ _ _ _ resin, etc.), etc. ^ 含有 含有 含有 含有 含有 含有 含有 含有 含有 含有 含有 含有 含有 含有 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝 劝[Beam or other additives, etc.,: 彳, and the solvent to be added as needed, m-like layer by the following method. Specifically, 'adhesive layer (A) which does not contain a foaming agent: Contains 127476.doc -25- 200844206 A mixture of an adhesive, a plasticizer, and optionally a solvent or other additive, applied to a substrate, as needed Method of drying or hardening or applying the above mixture to a suitable separator (peeling paper or the like) to form an adhesive layer, transferring (moving) the same to a substrate, etc. The adhesive layer (Α) of the foaming agent may be a single layer or a plurality of layers. The thickness of the adhesive layer (Α) of the month/non-foaming agent is not particularly limited.

例如可自5〜200 μηι(較好的是5〜1〇〇叫、進而好的是ι〇〜5〇 μηι)之範圍適宜選擇。 於本發明中,作為未含有發泡劑之黏著劑層(Α),較好 的是具有如下之特性:將剪切黏著力(對81183046八板,貼 附面積··寬20 mmx長20 mm、沿剪切方向之拉伸速度: mm/min、溫度:23士、濕度:65±5%rh)設又為 X (N/cm2),將拉伸黏著力(對聚對苯二甲酸乙二酯薄膜,剝 離角度:180。、拉伸速度·· 3〇〇 mm/min、溫度:23士、 濕度·· 65 士 5%RH)設為Y(N/寬2〇mm)時,「χ/γ」之値(有時 亦稱為「Χ/Υ比」)為20以上,特別好的是具有χ/γ比為h 以上之特性。再者,若χ/γ比未達2〇,則於含有發泡劑之 黏著劑層(Β)上貼著的被黏著體之加工處理中,有時產生 熱剝離型雙面黏著帶或黏著片或被黏著體橫向偏移,加工 精度降低。 於本發明中,又,未含有發泡劑之黏著劑層(Α)較好的 是具有剪切黏著力(對SUS304BA板,貼附面積:寬2〇_χ 長20 mm、沿剪切方向之拉伸速度:5〇 mm/min、溫度: 127476.doc -26 - 200844206 23 士2C、濕度:65 士 5%RH)為l〇(N/cm2)以上之特性,特別 好的是具有該剪切黏著力為2〇(N/cm2)以上之特性。再 者,若上述奂切黏著力未達1 〇(N/cm2),則與χ/γ比未達如 之情形相同,於含有發泡劑之黏著劑層(Β)上貼著的被黏 著體之加工處理中,有時產生熱剝離型雙面黏著帶或黏著 片或者被黏著體橫向偏移,加工精度降低。 於本發明中,進而又較好的是未含有發泡劑之黏著劑層 (Α)具有凝膠分率為75重量%以上之特性,特別好的是具有 凝膠分率為重量%以上之特性。再者,若上述凝膠分率 未達75重量%,則即使剪切黏著力高,於含有發泡劑之黏 著劑層(B)上貼著的被黏著體之加工處理中,有時也產生 熱剝離型雙面黏著帶或黏著片或者被黏著體橫向偏移,加 工精度降低。 未含有發泡劑之黏著劑層(A)之剪切黏著力可藉由如下 之[为切黏著力之測定方法]而求出。 [剪切黏著力之測定方法] G 將熱剝離型雙面黏著帶或黏著片切斷為寬20 mm、長20 mm之大小,於常溫(23。〇士 2。〇且濕度:6s 士 5%rh之條件 .下依據JIS Z 0237中之貼附方法,以未含有發泡劑之黏 . 著劑層(A)與SUS304BA板接觸之狀態,以寬2〇mmx2()mm 之接著面積使5 kg之輥往返一次之方法壓接於SUS3〇4ba 板上而進行貼合,且以含有發泡劑之黏著劑層(B)與另外 之SUS304BA板相接觸之形態,以寬2〇 mmxi2〇之接著 面積使2 kg之輥往返一次之方法壓接於另外之sus3〇4ba 127476.doc -27- 200844206 板上而進行貼合,於23士2°C下放置0.5小時。此時,未含有 發泡劑之黏著劑層(A)成為被挾持於SUS3 04BA板之間的狀 態。放置後,測定於溫度:23士2°C、濕度:65士5%RH之條 件下,將各SUS304BA板分別沿其他方向(相反方向),於 拉伸速度為50 mm/min之條件下拉伸時的荷重(最大荷 重),求出剪切黏著力(N/cm2 ;對SUS304BA板,貼附面 積:寬20 mmx長20 mm、沿剪切方向之拉伸速度:50 mm/min、溫度:23±2°C、濕度:65士5%RH)。再者,換算 {' 貼附面積為4 cm2(寬20 mmx長20 mm)之情形時的測定値而 求出剪切黏著力(N/cm2)。 又,未含有發泡劑之黏著劑層(A)之X/Y比藉由如下之 [X/Y比之測定方法]而求出。 [X/Y比之測定方法] 以與上述之[拉伸黏著力之測定方法]相同之方式,求出 未含有發泡劑之黏著劑層(A)之拉伸黏著力(對聚對苯二甲 酸乙二酯薄膜,剝離角度:180。、拉伸速度:300 mm/min、溫度:23土2〇C、濕度:65士5%RH)(Y)。又,以與 上述之[剪切黏著力之測定方法]相同之方式,求出未含有 . 發泡劑之黏著劑層(A)之剪切黏著力(對SUS304BA板,貼 附面積:寬20 mmx長20 mm、沿剪切方向之拉伸速度:50 mm/min、溫度:23土2°C、濕度:65士5%RH ; N/cm2)(X)。 繼而,藉由式[X/Y]算出X/Y比。 [基材] 基材用作熱剝離型雙面黏著帶或黏著片之支持母體。作 127476.doc -28- 200844206For example, it can be suitably selected from the range of 5 to 200 μηι (preferably 5 to 1 bark, and further preferably ι〇 to 5〇 μηι). In the present invention, as the adhesive layer (Α) which does not contain a foaming agent, it is preferred to have the following characteristics: shear adhesion (eight plates 81183046, attaching area, width 20 mm x length 20 mm) , stretching speed in the shear direction: mm / min, temperature: 23 ±, humidity: 65 ± 5% rh) set X (N / cm2), will stretch adhesion (for polyethylene terephthalate Diester film, peeling angle: 180., stretching speed··3〇〇mm/min, temperature: 23±, humidity··65 5% RH) When Y (N/width 2〇mm) is set, The χ/γ" (sometimes referred to as "Χ/Υ ratio") is 20 or more, and particularly preferably, the χ/γ ratio is h or more. Further, if the χ/γ ratio is less than 2 Å, a heat-peelable double-sided adhesive tape or adhesive may be generated in the processing of the adherend adhered to the adhesive layer containing the foaming agent. The sheet or the body is laterally offset, and the processing accuracy is lowered. In the present invention, in addition, the adhesive layer (Α) which does not contain a foaming agent preferably has a shear adhesion (for SUS304BA plate, attachment area: width 2 〇 χ length 20 mm, along the shear direction Tensile speed: 5〇mm/min, temperature: 127476.doc -26 - 200844206 23 ± 2C, humidity: 65 ± 5% RH) is a characteristic of l〇 (N/cm2) or more, particularly preferably The shear adhesion is 2 〇 (N/cm 2 ) or more. Furthermore, if the above-mentioned undercut adhesion is less than 1 〇 (N/cm 2 ), the ratio of χ/γ is not the same as that of the adhesive layer (Β) containing the foaming agent. In the processing of the body, a heat-peelable double-sided adhesive tape or an adhesive sheet may be generated or laterally displaced by the adhesive body, and the processing accuracy may be lowered. In the present invention, it is further preferred that the adhesive layer (Α) which does not contain a foaming agent has a gel fraction of 75% by weight or more, and particularly preferably has a gel fraction of more than 5% by weight. characteristic. In addition, when the gel fraction is less than 75% by weight, even if the shear adhesive strength is high, the adhesive body applied to the adhesive layer (B) containing the foaming agent may be processed in the adhesive body. The heat-peelable double-sided adhesive tape or adhesive sheet is generated or laterally offset by the adhesive body, and the processing precision is lowered. The shear adhesive strength of the adhesive layer (A) not containing a foaming agent can be determined by the following [method for measuring the adhesive strength]. [Method for measuring shear adhesion] G Cut the heat-peelable double-sided adhesive tape or adhesive sheet to a width of 20 mm and a length of 20 mm at room temperature (23. Gentleman 2. 〇 and humidity: 6 s 5 The condition of %rh. According to the attachment method in JIS Z 0237, the adhesion layer (A) which does not contain a foaming agent is in contact with the SUS304BA board, and the area of the width of 2 mm mm 2 () mm is made. The roller of 5 kg was crimped to the SUS3〇4ba plate for one-time bonding, and the adhesive layer (B) containing the foaming agent was brought into contact with another SUS304BA plate, and the width was 2〇mmxi2〇 Then, the area of the 2 kg roller was crimped to another sus3〇4ba 127476.doc -27- 200844206 plate and laminated, and placed at 23 ± 2 ° C for 0.5 hour. At this time, it was not contained. The adhesive layer (A) of the foaming agent was held between the SUS3 04BA plates. After standing, the SUS304BA plate was measured under the conditions of temperature: 23 ± 2 ° C and humidity: 65 ± 5% RH. Calculate the load (maximum load) when stretching in other directions (opposite direction) at a tensile speed of 50 mm/min. Adhesion (N/cm2; for SUS304BA plate, attachment area: width 20 mmx length 20 mm, tensile speed in the shear direction: 50 mm/min, temperature: 23 ± 2 ° C, humidity: 65 ± 5% RH). In addition, the shear adhesion (N/cm2) was obtained by measuring the measured area of 4 cm2 (width 20 mmx length 20 mm). The X/Y ratio of the adhesive layer (A) is determined by the following [X/Y ratio measurement method] [Measurement method of X/Y ratio] With the above [Measurement method of tensile adhesion] In the same manner, the tensile adhesion of the adhesive layer (A) not containing the foaming agent was determined (for the polyethylene terephthalate film, the peeling angle: 180°, the stretching speed: 300 mm/min, Temperature: 23 soil 2 〇 C, humidity: 65 ± 5% RH) (Y). Further, in the same manner as the above [measurement method of shear adhesion], an adhesive containing no foaming agent was determined. Shear adhesion of layer (A) (for SUS304BA plate, attachment area: width 20 mmx length 20 mm, tensile speed in the shear direction: 50 mm/min, temperature: 23 soil 2 ° C, humidity: 65士RH ; N/cm2)(X). Then, by the formula [X/Y] X / Y ratio. [Substrate] The substrate used as a heat-peelable double-sided adhesive tape or adhesive sheet of support precursor. For 127476.doc -28- 200844206

為基材,例如可使用紙等紙系基材;布、不織布、網狀物 等纖維系基材;金屬箔、金屬板等金屬系基材;塑膠薄膜 或薄片等塑膠系基材;橡膠薄片等橡膠系基材;發泡片等 發泡體、或者該等之積層體(特別是塑膠系基材與其他基 材之積層體、或者塑膠薄膜(或薄片)彼此之積層體等)等適 宜之薄片體。作為基材,可適宜使用塑膠薄膜或薄片等塑 膠系基材。作為如此之塑膠薄膜或薄片之材料,例如可列 舉:聚乙烯(PE)、聚丙烯(PP)、乙烯_丙烯共聚物、乙烯_ 醋酸乙烯酯共聚物(EVA)等以α-烯烴為單體成分之烯烴系 樹脂;聚對苯二甲酸乙二酯(ΡΕΤ)、聚萘二甲酸乙二酉旨 (PEN)、聚對苯二曱酸丁二酯(ρΒΤ)等聚酯;聚氯乙烯 (PVC);聚苯硫醚(PPS);聚醯胺(尼龍)、全芳香族聚醯胺 (Aramid)等醯胺系樹脂;聚醚醚酮(pEEK)等。該等材料可 單獨使用或者組合或2種以上使用。 再者,作為基材,使用塑膠系基材之情形時,可藉由延 伸處理等而控制伸長係數等變形性。χ,作為基材,於未 含有發泡劑之黏著劑層(Α)或含有發泡劑之黏著劑層⑺)等 中使用放射線硬化性物質時,較好的是使用不抑制放射線 基材之厚度’可根據強度或柔軟性、使用目的等而適宜 選擇,例如通常為1000 _以下(例如卜咖陶),較好的 是1〜5〇〇 gm、進而好的是3〜3⑼_,特別好的是$〜25〇 μηι左右’但是並非限定於此。再者’基材可具有單層之 形態’亦可具有積層之形態。 曰 127476.doc -29- 200844206 土材之表面,為提高與未含有發泡劑之為荽1$ 含有發泡劑之黏著劑層請之”广二者劑層⑷或 面虚王f^寻之在耆性,可實施慣用之表 露二二處理、鉻酸處理、臭氣暴露、火焰暴 方、、二:Γ露、離子化放射線處理等化學性或物理性 卜古處理等,亦可實施利用下塗劑之塗層處理等。 有發泡劑之黏著劑層(Β)]For the substrate, for example, a paper-based substrate such as paper; a fiber-based substrate such as a cloth, a non-woven fabric, or a mesh; a metal-based substrate such as a metal foil or a metal plate; a plastic-based substrate such as a plastic film or a sheet; and a rubber sheet; A rubber-based substrate, a foam such as a foam sheet, or a laminate (especially a laminate of a plastic substrate and another substrate, or a laminate of plastic films (or sheets)) The sheet. As the substrate, a plastic substrate such as a plastic film or a sheet can be suitably used. Examples of the material of such a plastic film or sheet include polyethylene (PE), polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), and the like. Component olefin resin; polyethylene terephthalate (polyethylene terephthalate), polyethylene naphthalate (PEN), polybutylene terephthalate (ρΒΤ) and other polyester; polyvinyl chloride ( PVC); polyphenylene sulfide (PPS); decylamine resin such as polyamidamine (nylon), wholly aromatic polyamine (Aramid); polyetheretherketone (pEEK). These materials may be used singly or in combination of two or more. In the case where a plastic base material is used as the base material, the deformation property such as the elongation coefficient can be controlled by the stretching treatment or the like. When a radiation curable substance is used as the substrate in an adhesive layer (Α) containing no foaming agent or an adhesive layer (7) containing a foaming agent, it is preferred to use a radiation-free substrate. The thickness 'is suitably selected according to strength, flexibility, purpose of use, etc., for example, usually 1000 Å or less (for example, pu tao), preferably 1 to 5 〇〇 gm, and more preferably 3 to 3 (9) _, particularly good. It is about $~25〇μηι' but it is not limited to this. Further, the 'substrate may have a single layer form' or may have a laminated form.曰127476.doc -29- 200844206 The surface of the soil material, in order to improve the adhesive layer containing 发泡1$ containing foaming agent, please contact the layer of the two layers (4) or the face of the virtual king In the case of ambiguity, it can be implemented by conventional treatments such as dew treatment, chromic acid treatment, odor exposure, flame burst, chemistry, or ionizing radiation treatment, etc. Coating treatment with a lower coating agent, etc. Adhesive layer with foaming agent (Β)]

且:有發泡劑之黏著劑層⑻係含有發泡劑之黏著劑層, 生或發泡性之特性。即,含有發泡劑之黏著劑 層()係熱剝離型黏著劑層(或熱膨脹性黏著劑層)。含有發 泡劑之黏著劑層⑻至少含有黏著劑與發泡劑。因此,二 ^有發泡劑之黏著劑層(Β)上貼著被加工品(被黏著體)而固 疋’對被加工品實施預期之加工時,被加工品牢固地固定 於含有發泡劑之黏著劑層(Β)上,因此可順利地進行加 工,於加工後,加熱含有發泡劑之黏著劑層⑺),使發泡 劑發泡及/或熱膨張,藉此使含有發泡劑之黏著劑層⑻膨 脹,藉由該膨脹使含有發泡劑之黏著劑層(Β)與加工後= 加工品(被黏著體)之接著面積(接觸面積)減少,而使含有 發泡劑之黏著劑層(Β)之接著力減少,可使加工品自熱剝 離型雙面黏著帶或黏著片上無任何損傷地容易地剝離。 作為發泡劑,並無特別之限制,可適宜使用熱膨脹性微 小球。發泡劑可單獨使用或者組合2種以上使用。作為熱 膨脹性微小球’可自公知之熱膨脹性微小球中適宜選擇。 作為熱膨脹性微小球,可適宜使用微膠囊化之發泡劑。作 為該熱膨脹性微小球’例如可列舉於具有彈性之殼内内包 I27476.doc -30- 200844206 -、凡丙院戊烧專可藉由加熱而容易地氣化膨脹之 物貝的镟小球等。上述殼多數情況下係由熱熔融性物質或 2可由於熱膨脹而破壞之物f形成。作為形成上述殼之物 ^例如可列舉偏二氯乙婦·丙稀猜共聚物、聚乙稀醇、 κ乙烯丁醛、%甲基丙烯酸甲酯、聚丙烯腈、聚偏二氣乙 烯XK石風等。熱膨脹性微小球可藉由慣用之方法,例如凝 聚法或界面聚合法等製造。再者,熱膨脹性微小球中,例 如亦有商品名「Matsumoto Micr〇sphere」[松本油脂 (股)製造]等市售品。 # 於本發明中,作為發泡劑,亦可使用熱膨脹性微小球以 外之發泡劑。作為如此之發泡劑,可適宜選擇各種無機系 發泡劑或有機系發泡劑等各種發泡劑而使用。作為無機系 發泡劑之代表例,例如可列舉碳酸銨、碳酸氫銨、碳酸氫 鈉、亞硝酸銨、氫氧化硼鈉、各種疊氮類等。&,作為有 機系發泡劑之代表例,例如可列舉水;三氣單氟甲烷、二 就早氟甲烧等氣I化烧烴系、化合物;㉟氮二異丁腈、偶氮 =甲醯胺、偶氮二羧酸鋇等偶氮系化合物;對甲苯磺醯基 齓肼一苯基颯_3,3’-二磺醯基醯肼、4,4,-氧雙(苯磺醯基 醯肼)、丙烯基雙(磺醯基醯肼)等肼系化合物;對曱代亞^ 基、酏基胺脲、4,4,-氧雙(苯磺醯基胺脲)等胺脲系化合 物’"5-嗎琳基],2,3,4-硫雜三嗤等三σ坐系化合物;n,n、二 亞硝基伸戊基四胺、N,N,_二曱基-N,N,_二亞硝基對苯二甲 酿胺等N-亞硝基系化合物等。 稭由加熱處理,可使含有發泡劑之黏著劑層(B)之接著 127476.doc 200844206 力有效且穩定地降低,故較好的是體積膨脹率成為5倍以 上,其中較好的是7倍以上,特別好的是1〇倍以上卻不口破 裂之適度強度的發泡劑。 發泡劑(熱膨脹性微小球等)之調配量,可根據含有發泡 劑之黏著劑層(Β)之膨脹倍率或者接著力之降低性等適宜 設定’通常相對於形成含有發泡劑之黏著劑層⑻的黏著 狀基礎聚合物⑽重量份,例如為卜⑽重量份,較好的Further, the adhesive layer (8) having a foaming agent is an adhesive layer containing a foaming agent, and has properties of raw or foaming properties. That is, the adhesive layer () containing a foaming agent is a heat-peelable adhesive layer (or a heat-expandable adhesive layer). The adhesive layer (8) containing a foaming agent contains at least an adhesive and a foaming agent. Therefore, when the adhesive layer (Β) of the foaming agent is adhered to the workpiece (adhered body) and solidified, the processed product is firmly fixed to the foamed product. On the adhesive layer of the agent, it can be processed smoothly. After processing, the adhesive layer (7) containing the foaming agent is heated to foam and/or thermally expand the foaming agent. The adhesive layer (8) of the foaming agent is expanded, and by the expansion, the adhesive layer (Β) containing the foaming agent and the post-processing area (contact area) of the processed product (adhered body) are reduced, and the foaming is contained. The adhesive force of the adhesive layer of the agent is reduced, and the processed article can be easily peeled off without any damage on the heat-peelable double-sided adhesive tape or the adhesive sheet. The foaming agent is not particularly limited, and a heat-expandable microsphere can be suitably used. The foaming agents may be used singly or in combination of two or more. The heat-expandable microspheres can be suitably selected from known heat-expandable microspheres. As the heat-expandable microspheres, a microencapsulated foaming agent can be suitably used. The heat-expandable microspheres are, for example, those which have an elastic inner shell, I27476.doc -30-200844206, and a small ball which can be easily vaporized and expanded by heating. . In many cases, the above-mentioned shell is formed of a thermally fusible substance or an object f which can be destroyed by thermal expansion. Examples of the material for forming the above-mentioned shell include a vinylidene chloride-acrylic copolymer, a polyethylene glycol, a κ ethylene butyraldehyde, a methyl methacrylate, a polyacrylonitrile, and a polyvinylidene oxide XK stone. Wind and so on. The heat-expandable microspheres can be produced by a conventional method such as a coagulation method or an interfacial polymerization method. Further, among the heat-expandable microspheres, for example, a commercial item such as "Matsumoto Micr〇sphere" [made of Matsumoto Oil & Fats Co., Ltd.] is also available. # In the present invention, as the foaming agent, a foaming agent other than the heat-expandable microspheres may be used. As such a foaming agent, various foaming agents such as various inorganic foaming agents or organic foaming agents can be suitably used and used. Typical examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogencarbonate, sodium hydrogencarbonate, ammonium nitrite, sodium borohydride, various azides, and the like. & As a representative example of the organic foaming agent, for example, water, trimethylmonofluoromethane, dioxane, early fluoromethane, or the like, a gas-fired hydrocarbon system, a compound; 35 nitrogen diisobutyronitrile, azo = An azo compound such as formamide or arsenazodicarboxylate; p-toluenesulfonyl fluorene-p-phenylindole-3,3'-disulfonyl hydrazine, 4,4,-oxybis(benzene sulfonate) Anthracene compounds such as fluorenyl hydrazide, propylene bis(sulfonyl hydrazine); amines such as hydrazine, hydrazinocarbazide, 4,4,-oxybis(phenylsulfonylhydrazide) Urea compound '"5-morphinyl], 2,3,4-thiatriazide and other three-sigma sitting compounds; n, n, dinitroso-amyltetramine, N, N, _ diterpene An N-nitroso compound such as a base-N,N,-dinitroso-p-xylyleneamine or the like. The straw is heat-treated, so that the adhesive layer (B) containing the foaming agent can be effectively and stably lowered by the force of 127476.doc 200844206, so that the volume expansion ratio is preferably 5 times or more, and more preferably 7 More than double, particularly preferably a foaming agent which is more than 1 time but not moderately ruptured. The blending amount of the foaming agent (heat-expandable microspheres, etc.) can be appropriately set according to the expansion ratio of the adhesive layer (Β) containing the foaming agent or the reduction of the adhesive force, etc., usually with respect to the formation of the adhesive containing the foaming agent. The amount of the adhesive base polymer (10) of the agent layer (8) is, for example, (10) parts by weight, preferably

C Ο 疋10〜130重量份,進而好的是25〜100重量份。 作為發泡劑之黏著劑層(Β)中制之黏著劑,並益特別 限制’可自上述例示為未含有發泡劑之黏著劑層㈧中使 狀黏著劑的黏著劑(例如:丙稀酸系黏著劑、橡膝系黏 者劑、乙婦基炫基喊系黏著劑、聚石夕氧系黏著劑、聚醋系 黏者劑、聚醯胺系黏著劑、胺基甲酸乙酯系黏著劑、氟系 黏著劑、苯乙稀-二烯後段共聚物系黏著劑、潛變特性改 良,黏著劑、放射線硬化型黏著劑等)等公知甚至慣用之 黏耆劑巾適宜選擇而使用。黏著射單獨使用或者組合2 =上使用。作為黏著劑,較好的是於加熱含有發泡劑之 ^劑層⑻使其膨脹時’儘可能不限制發泡劑(熱膨服性 U小球等)發泡及/或膨脹者。 作為黏著劑’可適宜使用丙烯酸系黏著劑、橡膠系黏著 =飘特別好的是丙稀酸系黏著劑。作為丙稀酸系黏著劑或 =糸黏著劑之具體例’可列舉於上述未含有發泡劑之黏 者劑層(Α)之項中具體例示者等。 黏著劑除了黏著性成分 & (基礎水合物)等聚合物成分等之 127476.doc •32- 200844206 卜亦可根據黏著劑之種類等含右六聯十、 料、毕粗# 士 、寺3有乂聯蜊、增黏劑、顏 塑化劑等適宜之添加劑。再者Ή 止劑、 駚如 冉者,作為父聯劑或增黏劑之具 具體例示者等。 有發泡劑之黏著劑層⑷之項中 法料㈣⑼’例如可藉由如下之慣用方 需要 #者劑、發泡劑(熱膨脹性微小球等)、以及視 而要添加之溶劑或其他添加 具體而言,例如可,由,下形成為片狀之層。 著劑層⑻:將含有Γ著:法等形成含有發泡劑之黏 、發泡劑(熱膨脹性微小球等)、 或橡=劑或其他添加劑的混合物,塗佈於基材 機彈性層上’視需要使其乾燥或硬化之方法; 次者於適宜之隔片(剝離 有發泡劑之黏著劑層,將佈物而形成含 機彈性層上之方法等W轉印(移著)於基材或橡膠狀有 為單声、複數岸再者,含有發泡劑之黏著劑層w 々早層、稷數層之任意形態。 s有發泡劑之黏著劑層B ^ ^ ^ ^ ^ ^ 性等而適宜選擇,心45~二二了根據接者力之減低 左六甘士 勹5 300叫^較好的是20〜150 μιη 工右。其中’於使用熱膨脹 時,含有發泡劑之黏著劑之声,”泡劑之情形 有之赦考4層(Β)之厚度較好的是厚於所含 有之熱知脹性微小球之最 μ m ^ ^ 右5有發泡劑之黏著劑 盾(B)之厚度過薄,則由 表面平滑性,加熱前(未㈣= 加熱處理引起之含有^恶)之接著性降低。又,由 有么泡劑之黏著劑層(B)之變形度小, 127476.doc -33 - 200844206 =著力變得難以順利降低。另_方面,若含有發 :者,)之厚度過厚,則於利用加熱處理進行發泡 L ^付谷易於含有發泡劑之黏著劑層(B)產生凝集破 壞。 [橡膠狀有機彈性層] ,於_中’自賦予熱剝離型雙面黏著帶或黏著片之變 形性或者提高加熱後之剝離性等方面考慮,於基材與 發泡劑之黏著劍声f m夕μ π )之間自又置有橡膠狀有機彈性層, 橡膠狀有機彈性層是視需要設置之層,並非必須設置者。 — 所述藉由叹置橡膝狀有機彈性層,於利用含有發泡 劑=黏著劑層(B) ’使熱剝離型雙面霉占著帶或黏著片與被 黏考體(被加工品等)接著時,可使上述熱剝離型雙面黏著 =黏著片中之含有發泡劑之黏著劑層⑻之表面與被黏 者體之表面形狀良好地吻合,可增大接著面積,又,於加 日:上述熱剝離型雙面黏著帶或黏著片使其自被黏著體剝離 $可同度地(高精度地)控制含有發泡劑之黏I劑層⑻之 加熱膨服’使含有發泡劑之黏著劑層(B)優先地且均勻地 向厚度方向膨脹。即’橡膠狀有機彈性層發揮如下之作 用·使熱剝離型雙面黏著帶或黏著片與被黏著體接著時, =表面提供與被黏著體之表面形狀吻合之較大接著面積的 乍用’為自熱剝離型雙面黏著帶或黏著片剝離被黏著體, 加熱含有發泡劑之黏著劑層(B)而使其發泡及/或膨騰時, 減少熱剝離型雙面黏著帶或黏著片之面方向之發泡及/或 膨脹之約束而使含有發泡劑之黏著劑層(b)呈三維結構變 127476.doc -34- 200844206 化,從而促進形成起伏結構的作用。 橡膝狀有機彈性層較好的是於含有發泡劑之 (B)之基材側之面上,以 曰 上之來能钟番。有 劑之黏著劑層⑻ y〜、°又 再者,橡膠狀有機彈性層亦可設置於某材 與含有發泡劑之黏著劑層夕叫从^ 、基材 ..Η». . . ^ ()之間以外之情形。橡膠狀有 機弹性層亦可介於基材之單面或雙面。 橡膠狀有機彈性層,例如較好的是藉由基於ΑδΤΜ〇 2240之D型型硬度為5()以下,特別是彻下之天铁 橡穋、合成橡膠或具有橡膠彈性之合成樹脂形成。作為: 述合成橡膠或具有橡膠彈性之合成樹脂,例如可列舉腈 糸、二稀系、丙埽酸系等合成橡膠;聚烯煙系、聚酉旨系^ 熱可塑性彈性體;乙稀-醋酸乙稀醋共聚物、聚胺基甲酸 二稀、軟質聚氯乙稀等具有橡膠彈性之合成樹 月曰專。再者,即使是聚氯乙料本質上為硬質系之聚人 =可藉由與塑化劑或柔軟劑等換和劑組合而表現出; 4卜如此之組合物亦可使用為上述橡膠狀有機彈性層 之構成材料。X,構成未含有發泡劑之黏著劑層㈧或: 有發泡劑之黏著㈣(B)之黏著劑等黏著性物質等亦 用為橡膠狀有機彈性層之構成材料。 人有機舞性層例如可藉由如下之形成方法形成··將 各有上述天然橡膠、合成橡膠或具有橡膠彈性之合 等橡膠狀有機彈性層形成材料的塗層液塗佈於基:上二 ,(塗層法);將由上述橡膠狀有機彈性層形成材料形= 薄膜、或預先於1層以上含有發泡劑之黏著劑層(B)上形成 127476.doc -35- 200844206 有由上述橡膠狀有機彈性層形成 與基材接著之方灯 ㈣成之層的積層薄膜 的樹^ Γ );將含有基材之構成材料 、:、、且:物與含有上述橡膠狀有機彈性層形成材料之樹 曰、、且δ物複合擠壓之方式(複合擠壓法)等。 ㈣生層之厗度,例如為5〜300,、較好的是 〜5〇陶左右。再者,若橡膠狀有機彈性層之厚度過 亞’則加熱發泡後不能形成三維結構變化,且有時剝離性 橡膠狀有機彈性層可為單層,亦可以2層以上之層 橡膠狀有機彈性層亦可以天然橡膝或合成橡膠或 橡膠彈性之合成樹脂為主成分之黏著性物質形成, ^用亦可以相關成分為主體之發泡薄膜等形成。發泡可藉 ==法’例如利用機械授样之方法、利用反應生成 _ ’使用發泡劑之方法、除去可溶性物質之方 法、利用噴霧之方法、形成混凝泡之方法、燒結法等。 又’作為橡膠狀有機彈性層,於未含有發泡劑之黏 =或含有發泡劑之黏著劑層⑻等中使用放射線硬化性 貝時’較好的是使用不阻礙放射線之透過者。 [其他層] 外本發明之熱剝離型雙面黏著帶或黏著片中,亦可視需要 又置八他層例如’於基材與未含有發泡劑之黏著劑層 ()1或者於基材與含有發泡劑之黏著劑層⑻之間, ’、口 /、有g或2層以上之中間層。作為該中間層,例如可 列舉各種處理劑(剝離劑或下塗劑等)之塗層層,或者以各 127476.doc • 36 - 200844206 種特性(接著面積之增大性、接著力之增大性、對 體之表面形狀之吻合性、減低接著 等)為目的之層等。 才之處理性、剝離性 [隔片】 於圖!⑷〜附,作為未含有發泡劑之黏著齊 :發泡劑之黏著劑層(B)之表面(黏著面)之保護材料,使: 有隔片⑼離襯墊),隔片可視需要而使用, 用。作為隔片,如圖丨⑷〜(b)所示 ,、使 f: Ο 面者,亦丌盔说*丄 J马又面均成為脫模 亦了為僅其中一面(單面)成為脫模面者 熱剝離型雙面黏著帶或黏著片中,作為隔: 個雙面均成為脫模面之隔片,亦可使 吏= 為脫模面之隔片。 平向次雙面成 再者,隔片可於利用由該隔片保護之 發泡劑之黏著劑層(A)、或含有發泡 曰[未3有 剝離。 名' /包d之黏者劑層(B)等]時 ::如此之隔片’可使用公知甚至慣用之剥離紙等。具 ^、作為^片’例如可使用由聚秒氧系、長鏈院基 等=、硫化鉬等剝離劑進行表面處理之塑膠薄膜或紙 離劑層之基材;由聚四氣乙稀、聚氯三氣乙婦、 氣氣乙嫌乙婦•六㈣烯共聚物、 性 •偏一氟乙稀共聚物等氟系聚合物形成之低接著 二 =烴系樹脂(例如:聚乙稀、聚丙稀等)等無極 之二^形成之低接著性基材等。當然,於具有剝離劑層 ",剝離劑層表面係脫模面,於低接著性基材中, 127476.doc -37- 200844206 低接著性基材之表面係脫模面。 再者’隔片可藉由公知甚至慣用之方法形成。又,隔片 之厚度等亦無特別之限制。 本:明之熱剝離型雙面黏著帶或黏著片可以捲繞為輥狀 之形態形成,亦可以積層黏著片之形態形成。例如,如圖 ()斤7Γ將含有發泡劑之黏著劑層(Β)以雙面成為脫 :面之隔片保護之狀態下捲繞為輥狀,藉此可製作捲繞為 t狀之狀’悲'或形怨之熱剝離型雙面黏著帶或黏著片。當 :為,即使於使用2個隔片,藉由各隔片分別保護未含有發 :劑之黏著劑層㈧、含有發泡劑之黏著劑層(B)之情形 =亦可製作捲繞為輥狀之狀態或形態的熱剝離型雙面 者帶或黏著片。 — 如上所述’本發明之熱剝離型雙面黏著帶或黏著片可且 有片狀或帶狀等形態。 a 本發明之熱剝離型雙面黏著帶或黏著片具有上述構成, 口此於加工被加卫品時,可適宜使用為用以固 之黏著帶或黏著片。具體而言,可藉 ; 荽如丨昆…、 曰两% 3有發泡劑之黏 知“)上貼著加工之被加工品(被黏著體),將未含有發 =之黏著劑層⑷貼著於支㈣(台座等)上,而經由_ 二Ϊ面黏者帶或黏著片將被加工品固定於支撐體上,於 二:::對被加工品實施加工處理。再者,作為對被加 加工處理時之步驟,可任意選擇,例如可列舉對 片進仃電極印刷步驟(圖案形成步驟等 壓步驟(加壓壓製步驟)、切斷步驟(研磨處理步:::二 127476.doc -38- 200844206 驟等)、燒成步驟等’另外亦可列舉組合步驟等。 並且’對被加工品實施加工處理後(特別是達到 的後,或欲解除接著狀態時),可拉 卞)了精由加熱至含有發泡劑 之黏著劑層⑻中之發泡劑的發泡開始溫度以上之严产 使黏著力減低’使實施了加工處理之被加工品剥離二丄 離,分離實施了加工處理之被加工品(加工品)。再者,: 為使實施了加工處理之被加卫品剝離甚至分離時之加熱严 理方法’例如可利用加熱板、熱風乾燥機、近紅外線:免 空氣乾燥器等適宜之加熱機構進行。加熱溫度^為含^ 泡劑之黏著劑層(B)中之發泡劑(熱膨脹性微小球等)二_ 脹開始溫度(發泡開始溫度)以上即可,加熱處理之條^ 根據被加工品之表面狀態或發泡劑(熱膨服性微小球 種類等造成之接著面積之減少性、基材或被加卫品之耐熱 性、加熱方法(熱容量、力口熱機構等)㈣宜設定。作為通 常之加熱處理條件,係於温度1〇〇〜25〇。〇下進行丨〜%秒 熱板等)或5〜15分鐘(熱風乾燥機等)。再者,加熱處理可根 據使用目的而於適宜之階段進行。又,作為加熱源,有時 亦可使用紅外線燈或者加熱水。 又’對被加工品實施加工處理’使加工品自含有發泡劑 之黏者劑層⑻剝離之後,!|由未含有發泡劑之黏著劑層 (A)貼著於支撐體上之狀態的熱剝離型雙面黏著帶或黏著 片’可藉由撕下自支撐體上容易地剝離。因此,支 容易地再利用。 當然’將熱剝離型雙面黏著帶或黏著片於溫度:165。。 127476.doc -39- 200844206 且:力.1氣壓之條件下加熱1小時後的塑化劑之減量為2 重1%以下,故即使被加工品為半導體晶圓或半導體晶片 等電子系零件類’亦可有效地抑制或防止被加工品受污 染。 如上所述,本發明之熱剝離型雙面黏著帶或黏著片可使 用為加工被加工品時栋田 之…、剝離型雙面黏著帶或黏著 片。再者,熱剝離型雙面黏荽黑# u上 、 又囬黏者’或黏者片亦可使用為搬送 被黏著體時之保護材料。 再者’藉由本發明之熱剝離型雙面黏著帶或黏著片保持 之物品(被黏著體或被加工品) 、 ;J仕思遠擇。具體而言,作 為被黏者體,可列舉本!興曰问 咕 』夕』牛牛導體晶囫(矽晶圓等)或半導體晶片 等電子系零件類;陶奢雷交哭十ά Π ^ ^谷為或輻射器等電氣系物品類; Τ晶單元等顯示元件類’除此之外亦可列舉熱感應頭、太 %電池、印刷基板(積層陶:是黏著片冑)、所謂之「胚片」 等各種物品。被黏著體可為單獨,或者亦可組合或2種以 上0 如上所述’於熱剝離型雙面黏著帶或黏著片上貼著被黏 :體(被加工品)後,可藉由實施加卫處理而獲得各種加工 印(加工之被黏著體)。例如,使用半導體晶圓等電子系烫 件類作為被黏著體時,可獲得電子零件或電路基板等作為 加工品。又’使用陶竟電容器用胚片作為作為被黏著體之 情形時,謂得積層陶究電容器等作為加工品。 [被黏著體之加工方法] 於本發明之被黏著體(被加工品)之加工方法中,將上述 127476.doc -40- 200844206 Γ c 熱剝離型雙面黏著帶或黏著片,利用未含有發泡劑之黏著 劑層㈧固^台座上,絲含有發泡劑之黏著劑層⑻上 貼合被黏著體之狀態下,對被黏著體實施加工處理,藉此 加工被黏著體。作為加工處理被黏著體時之步驟,可任責 選擇’亦可具有製造電子零件時之加壓步驟(加塵壓製: 驟:> 積層步驟、切斷步驟’或者製造半導體零件時之研 =驟、切斷步驟。更具體而言,作為於加工處理被黏著 :t之步冑’可列舉對胚片進行電極印刷之步驟(圖案形 成步驟等)、積層步驟、加塵步驟(加壓壓製步驟)、切斷步7 驟(研磨處理步驟、切割步驟等)、研削步驟(背面研磨步驟 :)乂成步驟專,除此之外亦可列舉組合步驟等。 於積層步驟後或切斷步驟後,必須自台座(例如金 屬製台座等)上剝離熱剝離型雙面黏著帶或黏著片之情形 2 —亦可不對貼著於含有發泡劑之黏著劑層(B)上之被黏 著$或加工品造成損傷,而使熱剝離型雙面黏著帶或黏著 片容易地自台座上剝離。 並且,於對被黏著體實施加工處理後(特別是達到黏著 目㈣’或者解除接著狀態時),藉由加熱至含有發泡劑 之黏著劑層(B)中之熱膨脹性微小球之發泡開始溫度或其 =上之溫度,可使黏著力減低,使實施了加工處理之被黏 著體(加工品)剝離甚至分離,分離實施了加工處理之被黏 著體。 點 再者,將熱剝離型雙面黏著帶或黏著片自實施了加工處 理之被黏著體(加工品)剝離甚至分離時之加熱處理,例2 127476.doc -41 - 200844206 可利用加熱板、埶風蘚 , ^ n乾各栈、近紅外線燈、空氣乾燥器等 W 進仃加熱溫度若為含有發泡劑之黏著劑 層(B)中之熱膨脹性微 疮、|V u B 衣之熱知脹開始溫度(發泡開始溫 又)上即可,加熱處理之條件, ^ ^ <怿件,可根據被黏著體之表面 狀恶,或熱膨脹性微 少性、基材或被黏菩雜 造成之接著面積之減 执m冓而-立之耐熱性、加熱方法(熱容量、加 …钺構專)寻而適宜設 a 作為通吊之加熱處理條件,係 Ο ϋ :為0〜25〇t下進行5,秒(加熱板等)或5〜15分鐘 (…風乾耜機等)。於相關之加埶 泡劑之黏著劑層⑻中之心 通书由於含有發 人 ^ …知脹性微小球膨脹及/或發泡, δ有考X泡之黏著齊j居^ η * 層(Β)知脹變形而造成凹凸狀變形, 接者力降低甚至喪失。再者, ^ ^ ^ 口…、處理可根據使用目的而 於適宜之階段進行。又, 作為加熱源,有時亦可僅 線燈或加熱水。 力丁力J使用紅外 於本發明中,作為利用未 J用木a有發泡劑之黏著 貼合熱剝離型雙面黏著帶< 苓ΤΑ黏者片之台座(支持台 為可支持於含有發治南丨少^ 各有毛泡劑之黏者劑層(⑴上貼著之 者則並無特別之限制,可使 皮黏者體 公知甚至慣用之台座 胺f使用之 ^ ,作為台座,例如可列舉 不鏽鋼板、玻璃板、辅助晶 T 口座可根據被黏荖駚夕 種類、被黏著體之加工方法等而適宜選擇。 者體之 [被黏著體] 於本發明中,藉由上述熱剝離型 接荽桿拄$你口 ^ 囬钻考贡或黏著片而 接者保持之物σσ(被黏著體或被加工物)可任意選擇。具體 127476.doc -42- 200844206 而:,二為被黏著體(被加工物),可列舉半 =二體晶片等電子系零件類㈣電容_射 丄3 寺顯不兀件類;以及熱感應 頭、太1¼'電池、印屈丨|其^;,蚀a 心 W基板(積層陶究黏著片等)、所謂之 “各種物品。被黏著體可為單獨者,或可組合2 種以上。 [加工之被黏著體;加工品]C Ο 10 to 130 parts by weight, and more preferably 25 to 100 parts by weight. As an adhesive for the adhesive layer of the foaming agent, it is particularly limited to an adhesive which can be used as an adhesive for the adhesive layer (8) which is not exemplified as the foaming agent (for example: propylene) Acid-based adhesive, rubber-knee-adhesive agent, Ethyl-based Hyun-based adhesive, polyglycolic adhesive, polyglycolic adhesive, polyamido-based adhesive, urethane Adhesives, fluorine-based adhesives, styrene-diene post-copolymer adhesives, improved latent properties, adhesives, radiation-curing adhesives, and the like are known and used, and are suitable for use. Adhesive shots are used alone or in combination 2 = upper use. As the adhesive, it is preferred that when the agent layer (8) containing the foaming agent is heated to expand, the foaming agent (heat-expandable U-ball or the like) is foamed and/or expanded as much as possible. As the adhesive, an acrylic adhesive or a rubber adhesive can be suitably used. It is particularly preferable to use an acrylic adhesive. Specific examples of the acrylic acid-based adhesive or the 糸-adhesive agent are exemplified as the specific examples of the above-mentioned adhesive layer (Α) containing no foaming agent. Adhesives in addition to the adhesive components & (basic hydrates) and other polymer components, etc. 127476.doc •32- 200844206 Bu can also be based on the type of adhesive, etc., including the right six hexa, material, 毕粗# 士,寺3 Suitable additives such as bismuth, adhesion promoter, and plasticizer. Further, a stopper, such as a sputum, as a parent or a tackifier, is specifically exemplified. The material (4) (9) of the adhesive layer (4) having a foaming agent can be, for example, a conventional agent, a foaming agent (heat-expandable microsphere, etc.), and a solvent or other additive to be added. Specifically, for example, a layer formed in a sheet shape may be formed. Coating layer (8): a mixture containing a foaming agent, a foaming agent (heat-expandable microspheres, etc.), or an rubber agent or other additive, which is formed by a method such as a squeezing method, is applied to an elastic layer of a substrate machine. 'Method of drying or hardening as needed; the second is to transfer (move) to a suitable septum (the method of peeling off the adhesive layer of the foaming agent, forming the cloth-containing elastic layer on the cloth) The base material or the rubber material may be a single sound, a plurality of shores, and an adhesive layer w 々 an early layer or a plurality of layers of a foaming agent. s Adhesive layer with a foaming agent B ^ ^ ^ ^ ^ ^ Sex and other suitable choice, heart 45 ~ 22 according to the reduction of the power of the left six gays 勹 5 300 called ^ better 20 ~ 150 μιη workers right. Which 'in the use of thermal expansion, containing foaming agent adhesion The sound of the agent, "In the case of the foaming agent, the thickness of the 4 layers (Β) is better than the most μ m ^ ^ of the heat-expanding microspheres contained in the right 5 adhesives with a blowing agent If the thickness of the shield (B) is too thin, the surface smoothness will be lowered, and the adhesion before heating (not (four) = heat treatment) will decrease. The degree of deformation of the adhesive layer (B) having a foaming agent is small, 127476.doc -33 - 200844206 = the focus becomes difficult to smoothly reduce. On the other hand, if the thickness of the hair is too thick, then Foaming by heat treatment L ^ Fu Gu easily adheres to the adhesive layer (B) containing a foaming agent. [Rubber-like organic elastic layer], self-adhesive heat-dissipating double-sided adhesive tape or adhesive sheet Considering the deformability or improving the peelability after heating, a rubbery organic elastic layer is disposed between the substrate and the foaming agent, and the rubbery organic elastic layer is optionally required. The layer to be set does not have to be set up. - The slap of the rubber-like organic elastic layer is used to make the heat-peelable double-sided mold occupy the tape or the adhesive sheet by using the foaming agent=adhesive layer (B) When the film is adhered to the adherend (processed product, etc.), the surface of the adhesive layer (8) containing the foaming agent in the heat-peelable double-sided adhesive = adhesive sheet can be well matched with the surface shape of the adherend , can increase the area of the joint, and, in addition to the day: the above-mentioned hot peeling type double-sided Tape or adhesive sheet is peeled off from the adherend. The heat-expanding of the adhesive layer (8) containing the foaming agent can be controlled with the same degree (high precision) to make the adhesive layer containing the foaming agent (B) Preferentially and uniformly expands in the thickness direction. That is, the rubbery organic elastic layer functions as follows. When the heat-peelable double-sided adhesive tape or adhesive sheet is adhered to the adherend, the surface is provided with the surface shape of the adherend. The larger the area of the anastomosis is to use the self-heating release type double-sided adhesive tape or adhesive sheet to peel off the adherend, and heat the foaming agent-containing adhesive layer (B) to foam and/or inflate. , reducing the foaming and/or expansion constraint of the heat-peelable double-sided adhesive tape or the direction of the adhesive sheet, so that the adhesive layer (b) containing the foaming agent has a three-dimensional structure, 127476.doc -34- 200844206, Thereby promoting the formation of an undulating structure. The rubber-like organic elastic layer is preferably on the side of the substrate side containing the blowing agent (B), and it can be used in the enamel. Adhesive layer (8) y~, ° Further, the rubber-like organic elastic layer can also be set on a certain material and the adhesive layer containing the foaming agent, called the substrate, .. Η». . . Other than between (). The rubbery organic elastic layer may also be on one or both sides of the substrate. The rubber-like organic elastic layer is preferably formed, for example, by a D-type hardness of 5 or less based on ΑδΤΜ〇 2240, particularly a tin-iron rubber, a synthetic rubber or a synthetic resin having rubber elasticity. Examples of the synthetic rubber or the synthetic resin having rubber elasticity include, for example, synthetic rubbers such as nitrile bismuth, diuret, and propionic acid; polyalkylene, polyfluorene, thermoplastic elastomer, and ethylene-acetic acid. A synthetic rubber tree with rubber elasticity, such as ethylene vinegar copolymer, diuretic diuret, soft polyvinyl chloride. Furthermore, even if the polyvinyl chloride is essentially a rigid type of polymer = can be expressed by a combination with a plasticizer or a softener, etc.; 4 such a composition can also be used as the above rubbery A constituent material of an organic elastic layer. X, which constitutes an adhesive layer (8) which does not contain a foaming agent, or an adhesive such as an adhesive having a foaming agent (4) (B), and the like, is also used as a constituent material of a rubber-like organic elastic layer. The human organic dance layer can be formed, for example, by the following formation method: a coating liquid each having a rubber-like organic elastic layer forming material such as the above-mentioned natural rubber, synthetic rubber or rubber elastic is applied to the base: (coating method); forming a material shape of the above-mentioned rubber-like organic elastic layer = film, or an adhesive layer (B) containing a foaming agent in advance or more than one layer is formed 127476.doc -35- 200844206 The organic elastic layer forms a laminated film of a layer formed by the base lamp (four) of the substrate; the constituent material containing the substrate, and the material and the rubber-like organic elastic layer forming material; The method of composite extrusion of tree rafts and δ objects (composite extrusion method). (4) The degree of growth of the green layer is, for example, 5 to 300, and preferably about ~5 〇. Further, if the thickness of the rubber-like organic elastic layer is too small, the three-dimensional structural change cannot be formed after heating and foaming, and the peelable rubber-like organic elastic layer may be a single layer or a rubbery organic layer of two or more layers. The elastic layer may also be formed of an adhesive material mainly composed of a natural rubber knee or a synthetic rubber or a rubber-elastic synthetic resin, and may be formed by using a foamed film mainly composed of related components. The foaming can be carried out by, for example, a method using a mechanical sample, a method of using a reaction to form a foaming agent by a reaction, a method of removing a soluble substance, a method using a spray, a method of forming a coagulated bubble, a sintering method, and the like. Further, as the rubber-like organic elastic layer, when the radiation-curable shell is used in the adhesive layer (8) containing no foaming agent or the adhesive layer (8) containing a foaming agent, it is preferable to use a person who does not block the transmission of radiation. [Other layers] In the heat-peelable double-sided adhesive tape or adhesive sheet of the present invention, it is also possible to provide another layer such as 'the substrate and the adhesive layer not containing the foaming agent 1 or the substrate. Between the adhesive layer (8) containing a foaming agent, ', port /, g or 2 or more layers of the intermediate layer. As the intermediate layer, for example, a coating layer of various treating agents (such as a release agent or a lower coating agent) or a characteristic of each of 127476.doc • 36 - 200844206 (the increase in area and the increase in adhesion force) may be mentioned. A layer for the purpose of matching the surface shape of the body, reducing the adhesion, etc.). Rationality, stripping [separator] In the picture! (4) ~ Attached, as a protective material that does not contain a foaming agent: the surface of the adhesive layer (B) of the foaming agent (adhesive surface), so that: there is a spacer (9) from the liner), the spacer can be used as needed Use, use. As a spacer, as shown in Figures (4) to (b), the f: Ο , , , , 说 说 说 说 说 说 说 丄 丄 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马In the thermal peeling type double-sided adhesive tape or adhesive sheet, the separator is a separator which is a release surface on both sides, and the 吏 = is a separator of the release surface. In the case of the flat side, the separator may be peeled off by using the adhesive layer (A) of the foaming agent protected by the separator or containing foaming enamel. When the name "/package d layer (B), etc.] is used, such a spacer can be used, and a known or even conventional release paper or the like can be used. For example, a substrate of a plastic film or a release agent layer which is surface-treated with a release agent such as a polysecond oxygen system, a long chain hospital base, or the like, and a release agent such as polysulfide molybdenum may be used; A low-temperature two-hydrocarbon resin (for example, polyethylene), such as a polychlorinated three gas, a gas, a sulphur, a hexa-(tetra) ene copolymer, a fluoroethylene-terminated copolymer, and the like. A low-adhesive substrate such as polypropylene or the like. Of course, in the case of having a release agent layer, the surface of the release agent layer is a release surface, and in the low adhesion substrate, the surface of the low adhesion substrate is a release surface. Further, the spacer can be formed by a known or even conventional method. Further, the thickness of the separator and the like are not particularly limited. Ben: The heat-dissipating double-sided adhesive tape or adhesive sheet of the Ming can be formed into a roll shape, or can be formed by laminating adhesive sheets. For example, as shown in the figure, the adhesive layer (Β) containing the foaming agent is wound into a roll shape in a state where the double-sided surface is protected by the separator of the surface, whereby the winding can be made into a t-shape. Shaped 'sad' or hot-skinned double-sided adhesive tape or adhesive sheet. When: even if two spacers are used, the adhesive layer (8) containing no foaming agent and the adhesive layer (B) containing a foaming agent are separately protected by the respective spacers. A heat-peelable double-sided tape or adhesive sheet in the form of a roll or a form. - As described above, the heat-peelable double-sided adhesive tape or the adhesive sheet of the present invention may have a form such as a sheet shape or a belt shape. A The heat-peelable double-sided adhesive tape or adhesive sheet of the present invention has the above-described constitution, and the mouth can be suitably used as an adhesive tape or an adhesive sheet for curing when processed. Specifically, it can be borrowed; for example, 丨 丨 ... 、 、 、 、 曰 曰 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有It is attached to the support (4) (pedestal, etc.), and the processed product is fixed to the support via the _ Ϊ Ϊ 黏 者 belt or adhesive sheet, and the processed product is processed at 2::: The step of the processing may be arbitrarily selected, for example, the sheet printing step (the pattern forming step isobaric step (pressure pressing step), the cutting step (grinding step:: two 127476.). Doc -38- 200844206, etc., baking step, etc. 'In addition, a combination step or the like may be mentioned. And after the processing of the workpiece is performed (especially after reaching, or when the state to be released is released), The fineness of the foaming agent heated in the adhesive layer (8) containing the foaming agent is more than the foaming start temperature, so that the adhesive force is reduced, and the processed product is peeled off, and the separation is carried out. Processed processed product (processed product). Further, the heating method for removing or even separating the cured product subjected to the processing can be carried out, for example, by a heating means such as a hot plate, a hot air dryer, a near infrared ray: an airless dryer, or the like. The temperature ^ is a foaming agent (heat-expandable microsphere, etc.) in the adhesive layer (B) containing the foaming agent, and the swelling start temperature (foaming start temperature) or more may be used, and the heat treatment is performed according to the processed product. The surface state or the foaming agent (the reduction in the area of the heat-expandable microspheres, etc., the heat resistance of the substrate or the reinforced material, and the heating method (heat capacity, heat and heat mechanism, etc.) (4) should be set. The usual heat treatment conditions are at a temperature of 1 〇〇 to 25 〇. 〇 % % % % % % % % % % % % % % % % % % % % % % % % % % ( ( ( ( ( ( ( ( ( ( ( ( ( ( Further, as a heating source, an infrared lamp or heated water may be used. Further, 'the processed product is processed', and after the processed product is peeled off from the adhesive layer (8) containing the foaming agent, !| The heat-peelable double-sided adhesive tape or the adhesive sheet which is adhered to the support by the adhesive layer (A) which does not contain a foaming agent can be easily peeled off by peeling off the self-supporting body. Reuse. Of course, 'The heat-peelable double-sided adhesive tape or adhesive sheet is at a temperature of 165. 127476.doc -39- 200844206 and: The reduction of the plasticizer after heating for 1 hour under the pressure of 1 MPa is Since the weight is 1% or less, even if the processed product is an electronic component such as a semiconductor wafer or a semiconductor wafer, it is possible to effectively suppress or prevent contamination of the workpiece. As described above, the heat-peelable double-sided adhesive of the present invention The tape or the adhesive sheet can be used for the processing of the processed product, the detachable double-sided adhesive tape or the adhesive sheet. Further, the heat-peelable double-sided adhesive 荽 black # u, the sticky back' or the sticky The sheet can also be used as a protective material for transporting the adherend. Further, the article (adhered or processed) held by the heat-peelable double-sided adhesive tape or the adhesive sheet of the present invention is selected by J Shisi. Specifically, as a sticky body, you can list this! Xing 曰 咕 咕 』 』 』 』 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛 牛In addition to the display element type, various items such as a heat-sensitive head, a too% battery, a printed substrate (a laminated ceramic: an adhesive sheet), and a so-called "embryo" may be cited. The adherends may be used alone or in combination of two or more types. As described above, after being adhered to the heat-peelable double-sided adhesive tape or the adhesive sheet, the adhesive body (processed product) may be used for reinforcement. Various processing marks (processed adherends) are obtained by processing. For example, when an electronic solder such as a semiconductor wafer is used as the adherend, an electronic component, a circuit board, or the like can be obtained as a processed product. Further, when a ceramic piece for a ceramic capacitor is used as the adherend, it is said that a laminated ceramic capacitor or the like is used as a processed product. [Processing Method of Adhered Body] In the processing method of the adherend (processed product) of the present invention, the above-mentioned 127476.doc -40- 200844206 Γ c heat-peelable double-sided adhesive tape or adhesive sheet is not contained. The adhesive layer of the foaming agent (8) is fixed on the pedestal, and the adhesive layer (8) containing the foaming agent is attached to the adherend, and the adherend is processed to thereby process the adherend. As a step in processing the adherend, it is optional to select 'the pressurization step when manufacturing electronic parts (dusting: step: > lamination step, cutting step) or research on manufacturing semiconductor parts = The step of cutting and cutting, more specifically, as a step of processing: a step of performing electrode printing on the green sheet (pattern forming step, etc.), a laminating step, a dusting step (pressurizing pressing) Step), cutting step 7 (grinding step, cutting step, etc.), grinding step (back grinding step:), stepping step, etc., in addition to the combination step, etc. After the step of laminating or cutting step After that, it is necessary to peel off the heat-peelable double-sided adhesive tape or the adhesive sheet from the pedestal (for example, a metal pedestal, etc.) 2 or not to adhere to the adhesive layer (B) containing the foaming agent. Or the processed product causes damage, and the heat-peelable double-sided adhesive tape or adhesive sheet is easily peeled off from the pedestal. Further, after the processing of the adherend (especially to achieve the adhesion (4)' or the release state By heating to the foaming start temperature of the heat-expandable microspheres in the adhesive layer (B) containing the foaming agent or the temperature above it, the adhesive force can be reduced, and the adherend subjected to the processing can be performed ( The processed product is peeled off or even separated, and the adhered body subjected to the processing is separated. Further, when the heat-peelable double-sided adhesive tape or the adhesive sheet is peeled off or even separated from the processed adherend (processed product) subjected to the processing, Heat treatment, Example 2 127476.doc -41 - 200844206 It is possible to use a heating plate, a hurricane, a dry stack, a near-infrared lamp, an air dryer, etc., if the heating temperature is an adhesive layer containing a foaming agent. (B) The heat-expandable micro-sore, |V u B clothing, the heat-expanding start temperature (the foaming start temperature is again), the condition of the heat treatment, ^ ^ <怿, according to the adherend The surface-like odor, or the slight thermal expansion, the reduction of the area of the substrate or the adhesion of the substrate, the heat resistance, the heating method (heat capacity, addition, etc.) Heating treatment conditions for lifting, system Ο ϋ : 5 to 25 〇t for 5, seconds (heating plate, etc.) or 5 to 15 minutes (...drying machine, etc.). The heart-passing book in the adhesive layer (8) of the relevant foaming agent is contained in the heart. ^ ...study of swelling and/or foaming of microspheres, δ has the adhesion of X-bubbles, and the η* layer (Β) is swelled and deformed to cause uneven deformation, and the strength of the receiver is reduced or even lost. ^ ^ ^ 口..., processing can be carried out at an appropriate stage depending on the purpose of use. Also, as a heating source, it is also possible to use only a line lamp or heating water. Li Dingli J uses infrared in the present invention, and is used as a utilization. Wood a has a foaming agent adhesively attached to the heat-peelable double-sided adhesive tape < 苓ΤΑ 者 片 片 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座 座((1) There is no special restriction on the person who is attached to it. It can be used as a pedestal for the pedestal amine, which is known or even used as a pedestal. For example, a stainless steel plate, a glass plate, and an auxiliary crystal T-seat can be used. It is suitable for the type of sticky enamel, the processing method of the adhesive body, and the like. In the present invention, the object σσ (adhered or processed) is retained by the above-mentioned heat-peeling type connecting rod 你$你口^ back-drilling or adhesive sheet. Can be chosen at will. Specific 127476.doc -42- 200844206 and:, the second is the adherend (processed object), can be listed as a semi-two-body wafer and other electronic components (four) capacitor _ 丄 丄 3 temple display ; 类 ;; Head, too 11⁄4' battery, yin yin|, ^, etch a core W substrate (layered ceramic adhesive sheet, etc.), so-called "various items. The adherends may be separate, or may be combined in two or more. [Processed adherend; processed product]

U 又,於本發明中,經由熱剝離型雙面黏著帶或黏著片, 將作為被黏著體之被加K被加卫體)貼著於台座上後, 了施加工,藉此可獲得各種加工品。例如,於使用半導體 圓# 子系零件類作為被黏著體(被加工品)之情形時, 可獲得電子零件或電路基板等作為加卫品。又,於使用陶 瓷電容器用胚片作為被黏著體之情形時,可獲得積層陶瓷 電容器等作為加工品。即,於本發明中,電子零件或積層 陶瓷電容器,可使用上述之熱剝離型雙面黏著帶或黏著片 而製造,又可利用如上述之被黏著體之加工方法而製造。 [實施例] 以下,基於實施例對本發明加以更詳細之說明,但本發 明並不受該等實施例任何限定。 (實施例1) 將相對於丙烯酸系共聚物(以丙烯酸乙酯:70重量份、 丙稀酸2-乙基己醋·· 30重量份、丙稀酸2 -經乙S旨:5重量 份、丙烯酸:3重量份為單體成分之丙烯酸系共聚物): 100重量份,進而含有異氰酸酯系交聯劑(商品名 127476.doc -43- 200844206 CORONET L」曰本聚胺酯工業股份有限公司製造…重 量份、交聯觸媒(商品名「Embilizer 〇1^」T〇ky〇 FineU, in the present invention, a heat-peelable double-sided adhesive tape or an adhesive sheet is attached to the pedestal by applying a K-added body as an adherend, and then a work is performed to obtain various kinds of work. Processed products. For example, when a semiconductor wafer # sub-component is used as the adherend (processed product), an electronic component, a circuit board, or the like can be obtained as a garnish. Further, when a green sheet for a ceramic capacitor is used as the adherend, a laminated ceramic capacitor or the like can be obtained as a processed product. That is, in the present invention, the electronic component or the laminated ceramic capacitor can be produced by using the above-described heat-peelable double-sided adhesive tape or adhesive sheet, or can be produced by the above-described method of applying an adherend. [Examples] Hereinafter, the present invention will be described in more detail based on the examples, but the present invention is not limited by the examples. (Example 1) With respect to the acrylic copolymer (70 parts by weight of ethyl acrylate, 30 parts by weight of 2-ethylhexyl acrylate, and 2 parts of acrylic acid 2 - by S: 5 parts by weight) Acrylic acid: 3 parts by weight of the acrylic copolymer which is a monomer component): 100 parts by weight, and further contains an isocyanate crosslinking agent (trade name: 127476.doc -43 - 200844206 CORONET L) manufactured by 聚本聚胺酯工业股份有限公司Parts by weight, cross-linking catalyst (trade name "Embilizer 〇1^" T〇ky〇Fine

Chemical CO·,LTD·製造):〇·〇5重量份、作為塑化劑之偏 苯三曱酸酯系塑化劑(商品名rM〇N〇CIZER W7〇〇」大日 本/由墨工業么司製造,分子量:MS、沸點·· 、 l〇〇°C下之飽和蒸汽壓:0·087 Pa、於165。〇且大氣壓之條 件下加熱1小時後之減量:0 · 1重量。/❹以下)丨〇重量份、作為 溶劑之甲苯的樹脂組合物(混合物),塗佈於作為基材之聚 醋薄膜(厚度·· 100 μιη)上,以使乾燥後之厚度成為i 〇 μιη,於120°C下加熱乾燥2分鐘,形成黏著劑層(未含有發 泡劑之黏著劑層),於該未含有發泡劑之黏著劑層上積層 隔片。 繼而,於相對於形成基材之未含有發泡劑之黏著劑層之 面為相反側之面上,塗佈相對於丙烯酸系共聚物(以丙稀 酸乙酯:70重量份、丙烯酸2-乙基己酯:30重量份、丙烤 酸2-羥乙酯:5重量份、丙烯酸:3重量份為單體成分之丙 烯酸系共聚物):100重量份,進而含有異氰酸酯系交聯劑 (商品名「CORONET L」,日本聚胺酯工業股份有限公司製 造):2重量份、交聯觸媒(商品名「Embilizer OL-1」, Tokyo Fine Chemical CO.,LTD.製造):0.05重量份、作為 發泡劑之熱膨脹性微小球(商品名「Matsumoto Microsphere F-80SD」,松本油脂製薬社製造;發泡開始溫 度:1 5 0°C ) : 3 0重量份、作為溶劑之曱苯的樹脂組合物(混 合物),以使乾燥後之厚度成為30 μιη,於70°C下加熱乾燥 127476.doc -44- 200844206 3分鐘,形成 如—★夕作為熱剝離型黏著劑層之黏著劑層(含有發泡 劑之黏著劑 μ 9 )’於該含有發泡劑之黏著劑層上積層隔 片,製作且右「 ^ 〃 未含有發泡劑之黏著劑層/基材/含有發泡 劑之黏著劑 9」之層構成的熱剝離型雙面黏著帶或黏著 片。 (實施例2) & ^匕未S有發泡劑之黏著劑層之樹脂組合物中,將異 =:S日系乂聯劑(商品名「⑶RONET L」,日本聚胺醋工業 有限a司製造)之使用量由3重量份替換為2重量份, 且將偏苯二审减& / 、 一甲酉夂自曰糸塑化劑(商品名r MONOCIZER W700 J , JU r,, 人日本油墨工業公司製造)之使用量由10重量份替 換為2〇重晋/八 tr/v . , —. 伤,除此之外,以與實施例1相同之方式進 仃’製作熱剝離型雙面黏著帶或黏著片。 (比較例1) —於構成未含有發泡劑之黏著劑層之樹脂組合物中,將偏 苯三甲酸醋系塑化劑(商品名「MONOCIZERW7⑻」,大日 本油墨工業公司製造)之使用量由10重量份替換為〇重量份 (即’不添加塑化劑>’除此之外,以與實施例ι相同之方式 進行,製作熱剝離型雙面黏著帶或黏著片。 (比較例2) #於構成未含有發泡劑之黏著劑層之樹脂組合物中,將偏 苯三甲酸酯系塑化劑(商品名rM〇N〇CIZER W7〇〇」,大日 本油墨工業公司製造)之使用量由10重量份替換為7〇重: 份’除此之外’以與實施例14目同之方式進行,製作里 127476.doc -45- 200844206 離型雙面黏著帶或黏著片。 (比較例3) 2構成未含㈣泡劑之黏I劑層之樹月旨組合物中,替換 偏苯一甲II日系塑化劑(商品名厂腸N〇cizer w7〇〇」、 日mi業公司製造)’使㈣重量份之鄰苯二〒酸酉匕 糸塑化劑(商口玄「η ••曰 ⑽名dop」,J-plus股份有限公司四日市公 n 里.39G、mc、於刚。c下之飽和(manufactured by Chemical Co., Ltd.): 重量·〇 5 parts by weight, a trimellitate plasticizer as a plasticizer (trade name rM〇N〇CIZER W7〇〇), Big Japan/Ink Industries Made by the company, molecular weight: MS, boiling point · ·, saturated vapor pressure at l ° ° C: 0. 087 Pa, at 165. 减 and the amount of heating after 1 hour of atmospheric pressure: 0 · 1 weight. / ❹ In the following, a resin composition (mixture) of toluene as a solvent is applied to a polyester film (thickness·100 μm) as a substrate so that the thickness after drying becomes i 〇μιη, The film was dried by heating at 120 ° C for 2 minutes to form an adhesive layer (adhesive layer not containing a foaming agent), and a separator was laminated on the adhesive layer not containing the foaming agent. Then, on the opposite side to the surface of the adhesive layer on which the foaming agent is not formed, the coating is applied to the acrylic copolymer (ethyl acrylate: 70 parts by weight, acrylic acid 2- Ethylhexyl ester: 30 parts by weight, 2-hydroxyethyl acrylate: 5 parts by weight, acrylic acid: 3 parts by weight of an acrylic copolymer having a monomer component): 100 parts by weight, and further containing an isocyanate crosslinking agent ( "CORONET L", manufactured by Japan Polyurethane Industry Co., Ltd.): 2 parts by weight, cross-linking catalyst (trade name "Embilizer OL-1", manufactured by Tokyo Fine Chemical Co., Ltd.): 0.05 part by weight, as Heat-expandable microspheres of a foaming agent (product name "Matsumoto Microsphere F-80SD", manufactured by Matsumoto Oil & Fat Co., Ltd.; foaming start temperature: 150 °C): 30 parts by weight of a resin combination of benzene as a solvent The mixture (mixture) is dried to a thickness of 30 μm, and dried at 70 ° C for 137476.doc -44 - 200844206 for 3 minutes to form an adhesive layer (as a heat-peelable adhesive layer). Foaming agent adhesive μ 9 'The heat formed by laminating the separator on the adhesive layer containing the foaming agent, and making the right layer of the adhesive layer/substrate/foaming agent-containing adhesive 9 containing no foaming agent Peel-off double-sided adhesive tape or adhesive sheet. (Example 2) < 匕 树脂 树脂 树脂 树脂 有 有 有 有 有 有 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 : 树脂 : 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂The amount of use is changed from 3 parts by weight to 2 parts by weight, and the benzoic acid is reduced & /, a methacrylate self-plasticizer (trade name r MONOCIZER W700 J , JU r,, Japanese ink The amount of use by the industrial company was changed from 10 parts by weight to 2 〇 晋 / 八 。 。 。 。 。 。 。 。 。 。 。 。 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作Adhesive tape or adhesive sheet. (Comparative Example 1) - Use of a trimellitic acid vinegar-based plasticizer (trade name "MONOCIZERW 7 (8)", manufactured by Dainippon Ink Co., Ltd.) in a resin composition constituting an adhesive layer containing no foaming agent A heat-peelable double-sided adhesive tape or an adhesive sheet was produced in the same manner as in Example ι except that 10 parts by weight was replaced by hydrazine parts by weight (i.e., 'no plasticizer added>'). 2) #In the resin composition constituting the adhesive layer containing no foaming agent, a trimellitate plasticizer (trade name: rM〇N〇CIZER W7〇〇), manufactured by Dainippon Ink Co., Ltd.) The amount used was changed from 10 parts by weight to 7 ounces: Parts 'except this' were carried out in the same manner as in Example 14 to make a detached double-sided adhesive tape or adhesive sheet. (Comparative Example 3) 2 The composition of the composition of the viscous I agent layer which does not contain the (iv) foaming agent is replaced by the benzotriene II plasticizer (trade name: Intestine N〇cizer w7〇〇), day mi Manufactured by the company) 'Make (four) parts by weight of phthalic acid bismuth plasticizer (Shangkou Xuan "η • Said ⑽ name dop ", J-plus Ltd. Yokkaichi public n in .39G, mc, saturated at just the .c

:二…5 Pa、於16穴且大氣麼之條件下加糾、時後之: 2...5 Pa, at 16 points and the atmosphere is under the conditions of correction, after the time

減里· 1 0重量%以飞*、,β/'ν 1_L 、/ 里。以下)除此之外,以與實施例〗相同之方 式進灯,製作熱剝離型雙面黏著帶或黏著片。 (評價) '皆κ施例1〜2及比較例i〜3中所得之熱剝離 或黏著片,藉由如下之測定方法或評價方法,測定;= 未a有^泡刎之黏著劑層之黏著力、未含有發泡劑之黏著 劑層之剪切黏著力、未含有發泡劑之黏著劑層之χ/γ比、 未含有發泡劑之黏著劑層之凝膠分率、台座剝離性、橫向 偏移防止性、加熱減量。 (黏著力之測定方法) 將熱剝離型雙面黏著帶或黏著片切斷為寬2〇 mm、長 140 mm之大小,將未含有發泡劑之黏著劑層側之隔片剝離 之後,依照JIS Z 0237將作為被黏著體之聚對苯二甲酸乙 二酯薄膜(商品名「lumirror S_10」,曰本東麗公司製造; 厚25 mm、寬30 mm),貼合於未含有發泡劑之黏著劑層上 後(具體而a,於溫度· 23 士 2。(3及濕度:5〇 土 5%RH之環境 127476.doc -46- 200844206 下,使2 kg之輥往返!次壓接而貼合),置於附有設定為 23 C之恆溫槽之拉力試驗機(商品名「島津入以叫以冲 20kN」,島津製作所公司製造)上,放置3〇分鐘。放置後, 測定將被黏著體於剝離角度·· 18〇。、拉伸速度·· 3〇〇 mm/mln之條件下,自熱剝離型雙面黏著帶或黏著片撕下 呀荷重之最大荷重(除去測定初期之峰頂的荷重之最大 値),將該最大荷重作為黏著力,求出未含有發泡劑之黏Less than 10% by weight fly *,, β / 'ν 1_L, / Lane. In the following, except that the lamp was placed in the same manner as in the Example, a heat-peelable double-sided adhesive tape or an adhesive sheet was produced. (Evaluation) 'The thermal peeling or adhesive sheet obtained in the respective κ application examples 1 to 2 and the comparative examples i to 3 was measured by the following measurement method or evaluation method; = the adhesive layer having no a foaming layer Adhesion, shear adhesion of the adhesive layer not containing the foaming agent, χ/γ ratio of the adhesive layer not containing the foaming agent, gel fraction of the adhesive layer not containing the foaming agent, detachment of the pedestal Sex, lateral offset prevention, heating reduction. (Method for measuring adhesion) The heat-peelable double-sided adhesive tape or adhesive sheet is cut into a width of 2 mm and a length of 140 mm, and the separator on the side of the adhesive layer not containing the foaming agent is peeled off, according to JIS Z 0237 will be used as an adhesive polyethylene terephthalate film (trade name "lumirror S_10", manufactured by Sakamoto Toray Co., Ltd.; 25 mm thick and 30 mm wide), which is bonded to a non-foaming agent. After the adhesive layer (specifically, a, at a temperature of 23 ± 2. (3 and humidity: 5 〇 5% RH environment 127476.doc -46- 200844206, make 2 kg of rolls back and forth! On the other hand, it is placed on a tensile tester (named "Shimadzu Ikei, Ishigaki 20kN", manufactured by Shimadzu Corporation) with a thermostat set to 23 C, and placed for 3 minutes. The maximum load of the load is removed by the self-heating peeling type double-sided adhesive tape or the adhesive sheet under the condition of the peeling angle··18〇, the stretching speed··3〇〇mm/mln (except the initial measurement) The maximum load of the peak is 値), and the maximum load is used as the adhesion force to determine that the foam is not contained. The sticky

著劑層之黏著力(N/20 mm)。再者,該黏著力之測定結果 表示於表1之「黏著力(N/2〇mm)」之攔中。 (剪切黏著力之測定方法) 將熱剝離型雙面黏著帶或黏著片切斷為寬2〇 長μ 之方法壓接於未含有發泡劑之黏著劑層上使其貼合之後, 於23土下放置G.5小時。放置後,於溫度:23±2。〇、渴 度:65±5%RH之條件下,如圖2所示,將熱剝離型雙面黏 著帶或黏著片、咖嶋板,分別沿不同之方向(相反之 方向),於拉伸速度5〇mm/min之條件拉伸,測定此時之荷 重(最大=重),求出未含有發泡劑之黏著劑層之剪切黏著 力(N/cm )。 大j將未3有發泡劑之黏著劑層側之隔片剝離 後’將作為被黏著體之SUS304BA板(藉由砂紙n〇.则研磨 後),以寬20 mmx2〇 mm之接著面積,以5 kg之輕往返卜欠 再者,圖2係表示測定熱剝離型 前w針#上士 1又面黏者帶或黏著片之 J切钻者力枯之拉伸方向的概 ^ ^ ^ ^ ^ 於圖2中,7係熱剝離 i又面黏者T或黏著片,7a係熱 …、到離型雙面黏著帶或黏著 127476.doc -47- 200844206 片7之拉伸方向,W^、SUS3〇4BA板,8^^、sus3〇化A板8之 拉伸方向。於圖2中’於熱剝離型雙面黏著帶或黏著片7之 未含有發泡劑之黏著劑層上,以2〇mmx2〇mm之貼附面積 貼合有SUS304BA板8,於拉伸速度5〇 mm/min之條件,將 熱剝離型雙面黏著帶或黏著片7沿拉伸方向7a之方向(即, 圖2中右側之方向)拉伸,另一方面將8仍3剛八板8沿拉伸 方向8a之方向(即,圖2中左側之方向)拉伸。 (X/Y比之測定方法)Adhesion of the agent layer (N/20 mm). Further, the measurement result of the adhesive force is shown in the "adhesion (N/2 〇 mm)" of Table 1. (Method for Measuring Shear Adhesion) After the heat-peelable double-sided adhesive tape or adhesive sheet is cut into a width of 2 inches and μ, the pressure-sensitive adhesive layer containing no foaming agent is pressure-bonded to be adhered thereto, Place G. for 5 hours under 23 soil. After standing, at a temperature of 23 ± 2. 〇, thirst: 65±5% RH, as shown in Figure 2, the heat-peelable double-sided adhesive tape or adhesive sheet, curry plate, in different directions (the opposite direction), in the stretch The film was stretched at a speed of 5 〇 mm/min, and the load at this time (maximum = weight) was measured, and the shear adhesion (N/cm) of the adhesive layer not containing the foaming agent was determined. The large j will be peeled off after the separator on the side of the adhesive layer of the foaming agent, and will be used as the SUS304BA plate of the adherend (after grinding by sandpaper n〇.), with a width of 20 mm x 2 mm. In the light weight of 5 kg, the figure 2 shows the tensile direction of the J-cutting force of the sergeant 1 and the adhesive tape or the adhesive sheet. ^ ^ In Figure 2, the 7-series thermally stripped i-faced T or adhesive sheet, 7a is hot..., to the release double-sided adhesive tape or adhesive 127476.doc -47- 200844206 The stretch direction of the sheet 7, W ^, SUS3 〇 4BA board, 8 ^ ^, sus3 〇 A board 8 the direction of stretching. In Fig. 2, on the adhesive layer of the heat-peelable double-sided adhesive tape or the adhesive sheet 7 which does not contain a foaming agent, the SUS304BA plate 8 is attached to the adhesion area of 2 mm x 2 mm, at the stretching speed. Under the condition of 5 〇mm/min, the heat-peelable double-sided adhesive tape or adhesive sheet 7 is stretched in the direction of the stretching direction 7a (i.e., in the direction of the right side in Fig. 2), and on the other hand, 8 is still 3 8 is stretched in the direction of the stretching direction 8a (i.e., in the direction of the left side in Fig. 2). (Measurement method of X/Y ratio)

對熱剝離型冑面黏著帶或黏著片,以與上述之(黏著力 之測定方法)相同之方式,纟出未含有發泡劑之黏著劑層 之黏著力(對聚對苯二甲酸乙二醋薄膜之黏著力、剝離角 度·· 180。、拉伸速度··鳩mm/min、溫度·· 23士代、濕 度:65土5%RH)(Y)。又,以與上述之(剪切黏著力之測定 方法)相同之方式,求出未含有發泡劑之黏著劑層之剪切 黏著力(對SUS304BA板之剪切黏著力、貼附面積:寬2〇 mmx長20。麵、沿剪切方向之拉伸速度· 5〇 、溫 度:23土、濕度=65土5〇/〇RH ; N/Cm2)(X)。繼而,藉由式 [X/Y]算出χ/γ比。 (凝膠分率之測定方法) 將用於形成未含有發泡劑之黏著劑層之黏著劑組合物塗 佈於剝離襯墊上後,於uot下加熱乾燥2分鐘,形成未$ 有發泡劑之黏著劑層。繼而,稱量未含有發泡劑之黏著二 ',測定其重量’將該重量作為浸潰前重量⑷。繼而, 將該未含有發泡劑之黏著劑層於曱笨中、常溫(U 土 2它)下 127476.doc •48· 200844206 二/貝72小時後,取出未溶解部分,使用烘箱等使甲苯完全 蒸發,稱量乾燥後之未溶解部分,測定其重量,將該重量 作為浸潰後重量(B)。 繼而,由下述式算出凝膠分率。 , 减膠分率(重量。/〇)=(Β/Α)χ 100 (1) . (式⑴中,八係浸潰前重量,Β係浸潰後重量。) (台座剝離性之評價方法) 將熱剝離型雙面黏著帶或黏著片切斷為寬1〇〇 mm、長 ( 100 mm之大小而製作樣本,將該樣本,以未含有發泡劑之 黏著劑層與SUS304BA板接觸之形態下,使2 kg之輥往返1 次之方法壓接於SUS304BA板上進行貼合後,於含有發泡 劑之黏著劑層上以不形成皺褶之方式貼合市售之鋁箔(8〇 mmx80 mm)。其後,於60°C下加熱2小時,使其冷卻至常 zrn (23±2 C )’將樣本(熱剝離型雙面黏著帶或黏著片)之4角 之一立而’相對於台座垂直,以5〇 mm/min之速度撕下時, 目視觀察鋁箔有無折斷或皺褶,藉由下述評價標準,評價 I’ 台座剝離性。 •台座剝離性之評價標準 • 〇:鋁箔中不產生折斷或皺褶。 x :鋁箔中不產生折斷或皺褶。 (橫向偏移防止性之評價方法) 將熱剝離型雙面黏著帶或黏著片切斷為寬1 〇 mm、長 100 mm之大小而製作樣本,將該樣本,以寬1〇 mmx長2〇 mm之接著面積,未含有發泡劑之黏著劑層與sus304BA板 127476.doc -49- 200844206 接觸之形態下,使2 kg之輥往返1次之方法,壓接於 SUS304BA板上而進行貼合後,於4〇±4t之環境下於貼合 部分施加5 N之荷重,進而於熱剝離型雙面黏著帶或黏著 片之未貼著於SUS304BA板上之端部側,以5 N之力於剪切 方向上施加荷重,於該狀態下放置丨小時後,測定熱剝離 型雙面黏著V或黏著片之偏移量(mm)。繼而,根據下述評 價標準,評價橫向偏移防止性。 •橫向偏移防止性之評價標準 〇:偏移量未達0.2 mm。 x ·偏移量為〇·2 mm以上。 (加熱減量之測定方法) 將剝離了 2個隔片之熱剝離型雙面黏著帶或黏著片(寬: 20 mm、長:50 mm)置於小玻璃瓶中,於165^之溫度且1 乳壓之壓力的條件下,加熱i小日夺,將加熱狀態之氣體ι 〇 mL於下述氣相層析之载條件下注人至氣相層析測定裝 置中測疋蒸發或揮發之塑化劑之重量,藉由計算熱剝離 型雙面黏著帶或黏著片中之塑化劑之減量(重量減少)而求 出。再者,該加熱減量(於165t且大氣壓之條件下加熱1 小h後之減ϊ)之測定結果表示於表k「加熱減量」之搁 中。 (氣相層析之測定條件) •載體氣體及其流量:氦(He)氣、7·9 mL/min •官柱柱頭壓·· 34.5 kPa(於40°C下)For the thermal release type adhesive tape or adhesive sheet, the adhesion of the adhesive layer not containing the foaming agent is extracted in the same manner as described above (the method for measuring the adhesive force) (for polyethylene terephthalate) Adhesive force of vinegar film, peeling angle··180., stretching speed··鸠mm/min, temperature··23 dynasty, humidity: 65 5% RH) (Y). Further, the shear adhesive strength of the adhesive layer not containing the foaming agent was determined in the same manner as described above (measurement method of shear adhesive force) (shear adhesion to SUS304BA sheet, attachment area: width) 2〇mmx length 20. Surface, tensile speed in the shear direction · 5 〇, temperature: 23 soil, humidity = 65 soil 5 〇 / 〇 RH; N / Cm2) (X). Then, the χ/γ ratio is calculated by the formula [X/Y]. (Method for Measuring Gel Fraction Ratio) An adhesive composition for forming an adhesive layer containing no foaming agent was applied onto a release liner, and then dried by heating under a uot for 2 minutes to form a foam. Adhesive layer of the agent. Then, the adhesive which did not contain the foaming agent was weighed and the weight was measured as the weight before the impregnation (4). Then, the adhesive layer containing no foaming agent is placed in the sputum, at room temperature (U soil 2) under 127476.doc •48·200844206 bis/bei 72 hours, the undissolved portion is taken out, and the toluene is used in an oven or the like. After completely evaporating, the undissolved portion after drying was weighed, and the weight was measured, and this weight was taken as the weight after the impregnation (B). Then, the gel fraction was calculated from the following formula. , reduction of the gel fraction (weight. / 〇) = (Β / Α) χ 100 (1). (In the formula (1), the weight of the eight systems before the impregnation, the weight of the lanthanide after the impregnation.) (Evaluation method of detachment of the pedestal The heat-peelable double-sided adhesive tape or adhesive sheet is cut into a sample having a width of 1 mm and a length (100 mm), and the sample is contacted with a SUS304BA plate with an adhesive layer not containing a foaming agent. In the form of a roll of 2 kg, the SUS304BA plate was bonded to the SUS304BA plate for bonding, and then the commercially available aluminum foil was attached to the adhesive layer containing the foaming agent without wrinkles. Mmx80 mm). Thereafter, it was heated at 60 ° C for 2 hours and allowed to cool to a constant zrn (23 ± 2 C )'. One of the four corners of the sample (heat-peelable double-sided adhesive tape or adhesive sheet) was placed. 'When it is torn at a speed of 5 mm/min relative to the pedestal, visually observe whether the aluminum foil is broken or wrinkled, and evaluate the peelability of the I' pedestal by the following evaluation criteria. • Evaluation criteria for detachment of the pedestal • 〇 : No breakage or wrinkles are formed in the aluminum foil. x : No breakage or wrinkles are formed in the aluminum foil. (Evaluation method for lateral offset prevention) The peeling type double-sided adhesive tape or adhesive sheet is cut into a width of 1 mm and a length of 100 mm to prepare a sample, and the sample is covered with a width of 1 mm x 2 mm and a thickness of 2 mm, without adhesion of a foaming agent. In the form of contact with the sus304BA plate 127476.doc -49- 200844206, the 2 kg roller is reciprocated once, crimped onto the SUS304BA plate and bonded, and then placed in a 4〇±4t environment. Applying a load of 5 N to the combined portion, and applying a load to the shearing direction with a force of 5 N on the end side of the heat-peelable double-sided adhesive tape or the adhesive sheet which is not attached to the SUS304BA plate, in this state After leaving for a few hours, the offset (mm) of the heat-peelable double-sided adhesive V or the adhesive sheet was measured. Then, the lateral offset prevention property was evaluated according to the following evaluation criteria. • Evaluation criteria for lateral offset prevention: The offset is less than 0.2 mm. x · The offset is 〇·2 mm or more. (Measurement method of heating loss) The heat-peelable double-sided adhesive tape or adhesive sheet with 2 spacers peeled off (width: 20 mm , length: 50 mm) in a small glass bottle, at a temperature of 165 ° and a pressure of 1 milk pressure Next, heat the i-day, and charge the gas ι 〇 mL in the heated state to the weight of the plasticizer which evaporates or volatilizes in the gas chromatography apparatus under the following conditions of gas chromatography. It is determined by calculating the amount of reduction (weight reduction) of the plasticizer in the heat-peelable double-sided adhesive tape or the adhesive sheet. Furthermore, the heating loss (decrease after heating for 1 hour at 165 t and atmospheric pressure) The measurement results are shown in Table k "heating reduction". (Measurement conditions for gas chromatography) • Carrier gas and its flow rate: helium (He) gas, 7·9 mL/min • Column head pressure·· 34.5 kPa (at 40 ° C)

•注入口溫度:2 8 0 °C 127476.doc •50- 200844206 •管柱溫度:於40°C下5分鐘、以l〇°C/min之比率使之升 溫、於260°C下13分鐘 •偵檢器·· FID(280°C)• Injection temperature: 2 80 °C 127476.doc •50- 200844206 • Column temperature: 5 minutes at 40 ° C, temperature rise at l ° ° C / min, 13 minutes at 260 ° C • Detector ·· FID (280 ° C)

•加壓時間:0.12 min •環路填充時間:〇· 12 min •環路平衡時間:0· 12 min •注入時間:3.00 min •試樣環路溫度:200°C •輸送線溫度:220°C• Pressurization time: 0.12 min • Loop filling time: 〇 · 12 min • Loop balance time: 0 · 12 min • Injection time: 3.00 min • Sample loop temperature: 200 ° C • Conveying line temperature: 220 ° C

[表1] 實施例 比較例 1 2 1 2 3 拉伸黏著力 (N/20 mm) 0.8 0.7 5.1 0.1 0,9 剪切黏著力 (N/cm2) 33 21 48 8 39 X/Y比 41.3 — 30.0 9.4^ 80.0 43.3 凝膠分率 (重量%) 88 82 93 58 65 台座剝離性 〇彳 〇 X 〇 〇 橫向偏移防止 性 〇 〇 〇 X 〇 加熱減量 (重量°/〇) 0.3 0.7 - 2.1 7.9 如表1所表明之,實施例1〜2之熱剝離型雙面黏著帶或黏 著片’與比較例1之熱剝離型雙面黏著帶或黏著片相比, 於未含有發泡劑之黏著劑層中以特定量之比例含有塑化 劑’因此未含有發泡劑之黏著劑層之黏著力適度降低,具 有適度大小,可自支撐體等被黏著體上容易地剝離熱剝離 型雙面黏著帶或黏著片。並且,實施例1〜2之熱剝離型雙 127476.doc •51 - 200844206 面黏著帶或黏著片,於未含有發泡劑之黏著劑層中含有塑 化劑,於165。(:且大氣壓加熱1小時後塑化劑之加熱減量為 重畺/〇以下,因此於咼溫下加工含有發泡劑之黏著劑層 上貼著之被黏著體(被加工品)時,或者於加工後藉由加熱 將加工品自含有發泡劑之黏著劑層剝離時等情況下,塑化 劑之蒸發或揮發較少,且可抑制或防止污染被黏著體。 相對於此,如比較例i之熱剝離型雙面黏著帶或黏著片 般,於未含有發泡劑之黏著劑層中為含有塑化劑之情形 時’未含有發泡劑之黏著劑層之黏著力過高,於自支撐體 等被黏著體上剝離熱剝離型雙面黏著帶或黏著片時之操作 性上存在問題(操作性差)。又,如比較例2之熱剝離型雙面 黏著帶或黏著片般,於未含有發泡劑之黏著劑層中含有過 剩之塑化劑之情形時,未含有發泡劑之黏著劑層之黏著力 變得過低,於加工於含有發泡劑之黏著劑層上貼著之被黏 著體(被加工品)時,有時未含有發泡劑之黏著劑層自支撐 體上剝、落。進而,如比較例3之熱剝離型雙面黏著帶或黏 著片般,使用鄰苯二甲酸酯系塑化劑作為塑化劑之情形 ^塱化七彳之加熱減量大,於高溫下加工含有發泡劑之黏 著劑層上貼著之被黏著體(被加工品)時,或於加工後藉由 加熱將加工品自含有發泡劑之黏著劑層剝離時等情形時, 有日守產生塑化劑蒸發或揮發,被黏著體受污染之問題。 因此,確認例如藉由使用具有於溫度:165°C且壓力·· 2 乳壓之條件下加熱丨小時後之減量為2重量%以下之特性及/ 或於loot:下之飽和蒸汽壓為〇 〇9 Pa以下且沸點為4〇〇它以 127476.doc -52- 200844206 特性的塑化劑作為塑化劑,可獲得將貼合於支撐體側 之黏者劑層即未含有發泡劑之黏著劑層的黏著力適度減低 至可藉由撕下而容易地剝離之程度,且基本或完全無污染 問題之熱剝離型雙面黏著帶或黏著片。 【圖式簡單說明】 圖Ua)、(b)係部分表示本發明之熱剝離型雙面黏著帶或 黏著片之一例的概略剖面圖。[Table 1] Example Comparative Example 1 2 1 2 3 Tensile adhesion force (N/20 mm) 0.8 0.7 5.1 0.1 0,9 Shear adhesion (N/cm2) 33 21 48 8 39 X/Y ratio 41.3 — 30.0 9.4^ 80.0 43.3 Gel fraction (% by weight) 88 82 93 58 65 Peel stripping 〇彳〇X 〇〇lateral shift prevention 〇〇〇X 〇heat reduction (weight °/〇) 0.3 0.7 - 2.1 7.9 As shown in Table 1, the heat-peelable double-sided adhesive tape or adhesive sheet of Examples 1 to 2 was adhered to the heat-peelable double-sided adhesive tape or adhesive sheet of Comparative Example 1 without containing a foaming agent. The plasticizer is contained in a specific amount in the agent layer. Therefore, the adhesive layer of the adhesive layer containing no foaming agent is moderately reduced, and has an appropriate size, and can be easily peeled off from the adherend by a support or the like. Adhesive tape or adhesive sheet. Further, the heat-peelable double 127476.doc • 51 - 200844206 surface adhesive tape or adhesive sheet of Examples 1 to 2 contains a plasticizer in an adhesive layer not containing a foaming agent, at 165. (: After heating at atmospheric pressure for 1 hour, the heating loss of the plasticizer is less than 畺/〇, so when the adherend (processed product) attached to the adhesive layer containing the foaming agent is processed at a temperature of 咼, or When the processed product is peeled off from the adhesive layer containing the foaming agent by heating after the processing, the plasticizer is less evaporated or volatilized, and the adherend can be suppressed or prevented from being contaminated. i is a heat-peelable double-sided adhesive tape or adhesive sheet. When the plasticizer is contained in the adhesive layer containing no foaming agent, the adhesion of the adhesive layer not containing the foaming agent is too high. When the self-supporting body or the like is peeled off from the adhesive body, the detachable heat-dissipating double-sided adhesive tape or the adhesive sheet has a problem in handling property (poor operability). Further, as in the heat-peelable double-sided adhesive tape or the adhesive sheet of Comparative Example 2, In the case where the adhesive layer containing no foaming agent contains an excessive amount of the plasticizer, the adhesive layer of the adhesive layer not containing the foaming agent becomes too low, and is processed on the adhesive layer containing the foaming agent. When it is stuck to the body (processed product), there is The adhesive layer containing no foaming agent was peeled off from the support. Further, as in the heat-peelable double-sided adhesive tape or the adhesive sheet of Comparative Example 3, a phthalate plasticizer was used as the plasticizer. In the case of the agent, the heating loss of the sputum is high, when the adhesive body (processed product) attached to the adhesive layer containing the foaming agent is processed at a high temperature, or the processed product is heated by the processing. When the adhesive layer containing the foaming agent is peeled off, etc., there is a problem that the plasticizer evaporates or volatilizes and is contaminated by the adherend. Therefore, it is confirmed that the pressure is 165 ° C and the pressure is used, for example. · 2 Under the conditions of milk pressure, the reduction after heating for 丨 hours is 2% by weight or less and/or the saturated vapor pressure at loot: 〇〇9 Pa or less and the boiling point is 4 〇〇 It is 127476.doc -52 - 200844206 A plasticizer with a characteristic as a plasticizer, it is possible to reduce the adhesion of the adhesive layer which is bonded to the side of the support, that is, the adhesive layer which does not contain a foaming agent, to be easily reduced by tearing off Heat stripping type with a degree of peeling and no or no pollution at all Face adhesive tape or adhesive sheet. [Brief Description of the drawings] FIG Ua), (b) based heat release part of the present invention represents a double-sided adhesive tape or adhesive schematic cross-sectional view showing an example of a sheet.

—圖2係表示測定熱剝離型雙面黏著帶或黏著片之剪切黏 著力^之拉伸方向的概略圖。 【主要元件符號說明】 la、lb 熱剝離型雙面黏著帶或黏著片 2 未含有發泡劑之黏著劑層(A)(未含有發泡劑 之黏著劑層) 3 基材 4 橡膠狀有機彈性層 5 含有發泡劑之黏著劑層(含有發泡劑之黏著 劑層) 6 雙面均成為脫模面之隔片 7 熱剝離型雙面黏著帶或黏著片 7a 8 熱剝離型雙面黏著帶或黏著片7之拉伸方向 SUS304BA 板 8a SUS304BA板8之拉伸方向 127476.doc -53 -Fig. 2 is a schematic view showing the direction in which the shear adhesive force of the heat-peelable double-sided adhesive tape or the adhesive sheet is measured. [Description of main component symbols] la, lb Thermal release type double-sided adhesive tape or adhesive sheet 2 Adhesive layer (A) without foaming agent (adhesive layer without foaming agent) 3 Substrate 4 Rubbery organic Elastic layer 5 Adhesive layer containing foaming agent (adhesive layer containing foaming agent) 6 Spacer with double-sided peeling surface 7 Thermal peeling type double-sided adhesive tape or adhesive sheet 7a 8 Thermal peeling type double-sided Stretching direction of adhesive tape or adhesive sheet 7 SUS304BA plate 8a SUS304BA plate 8 stretching direction 127476.doc -53 -

Claims (1)

200844206 十、申請專利範圍: 1.200844206 X. The scope of application for patents: 1. 2· 一種熱剝離型雙面黏著帶或黏著片,其特徵在於:其係 於基材之其中一面上具有未含有發泡劑之黏著劑層(a), 且於另一面上具有含有發泡劑之黏著劑層(B)的雙面黏著 帶或黏著片,黏著劑層(A)具有以相對於1〇〇重量份之構 成黏著劑層(A)的基礎聚合物為5~3〇重量份之比例含有 塑化劑,且拉伸黏著力(對聚對苯二f酸乙二酯薄膜,剥 離角度:180。、拉伸速度:3〇〇 mm/min、溫度: 23士2°C、濕度:65±5%RH)41 N/2〇 mm 以下的特性 ^ 並 ^於溫度:165t:且麼力:1氣壓之條件下加熱雙面黏著 帶或黏著片1小時後’塑化劑之減量為2重量%以下。 如請求項1之熱剝離型雙面黏著帶或黏著片,其中塑化 劑係具有下述特性(X)及/或特性(γ)之塑化劑: 特性W·.於溫度:16代且壓力:i氣壓之條件下加熱 小時後的減量為2重量。/❶以下的特性,2. A heat-peelable double-sided adhesive tape or adhesive sheet characterized in that it has an adhesive layer (a) not containing a foaming agent on one side of the substrate and foaming on the other side a double-sided adhesive tape or adhesive sheet of the adhesive layer (B), the adhesive layer (A) having a weight of 5 to 3 inches with respect to 1 part by weight of the base polymer constituting the adhesive layer (A) The proportion of the mixture contains a plasticizer, and the tensile adhesion (for the polyethylene terephthalate ethylene glycol film, peeling angle: 180., stretching speed: 3 〇〇 mm / min, temperature: 23 ± 2 ° C , Humidity: 65±5%RH) Characteristics below 41 N/2〇mm ^ and ^ Temperature: 165t: and Mo force: 1 pressure to heat the double-sided adhesive tape or adhesive sheet for 1 hour after 'plasticizer The amount of reduction is 2% by weight or less. The heat-peelable double-sided adhesive tape or adhesive sheet according to claim 1, wherein the plasticizer is a plasticizer having the following characteristics (X) and/or characteristics (γ): Characteristic W·. at a temperature of 16 generations and Pressure: The amount of reduction after heating for one hour under the condition of i is 2 weight. /❶The following features, 特性(Y) ·於loot:下之飽和蒸汽壓為〇 〇9卜以 點為400°C以上的特性。 下且沸 面黏著帶或黏著片,其中, 均分子量為5〇〇以上之塑化 3 ·如凊求項1或2之熱剝離型雙 塑化劑係分子量或重量平 劑。 4·如請求項1或2之熱剝 塑化劑係偏苯三曱酸 化劑。 離型雙面黏著帶或黏著片,其中, 酯系塑化劑或者均苯四曱酸酯系塑 5 ·如睛求項1或2之熱剝離型雙 面黏著帶或黏著片 其中, 127476.doc 200844206 黏著劑層(A)進而具有如下特性··將剪切黏著力(對 SUS304BA板,貼附面積:寬2〇 mmx長2〇 mm、沿剪切 方向之拉伸速度:50 mm/min、溫度:23±2°C、濕度: 65士5%RH)設為X(N/Cm2),將拉伸黏著力(對聚對苯二甲 酸乙二酯薄膜,剝離角度:18〇。、拉伸速度:3〇〇 mm/min、溫度:23 土 2cc、濕度:65±5%rh)設為 γ(Ν/寬 20 mm)時,「χ/Υ」之値為2〇以上。 6·Characteristic (Y) · The saturated vapor pressure under the loot: is a characteristic of 〇 卜 9 以 and the point is 400 ° C or more. Next, a boiling adhesive tape or an adhesive sheet in which a plasticizer having a molecular weight of 5 Å or more is used. 3. The thermal release type double plasticizer of the first or second aspect is a molecular weight or a weighting agent. 4. The hot stripping plasticizer of claim 1 or 2 is a trimellitic acidifier. Release double-sided adhesive tape or adhesive sheet, wherein, ester plasticizer or pyromellitic acid plastic 5 · heat-peelable double-sided adhesive tape or adhesive sheet of item 1 or 2, 127476. Doc 200844206 Adhesive layer (A) has the following characteristics: · Shear adhesion (for SUS304BA plate, attachment area: width 2〇mmx length 2〇mm, tensile speed in the shear direction: 50 mm/min , temperature: 23 ± 2 ° C, humidity: 65 ± 5% RH) set to X (N / Cm2), tensile adhesion (for polyethylene terephthalate film, peeling angle: 18 〇. Tensile speed: 3〇〇mm/min, temperature: 23 soil 2cc, humidity: 65±5%rh) When γ (Ν/width 20 mm) is set, the “χ/Υ” is 2〇 or more. 6· 如請求項1或2之熱剝離型雙面黏著帶或黏著片,其中, 黏著劑層(A)進而具有如下特性:剪切黏著力(對 SUS3〇4BA板,貼附面積:寬2G mmx長20 mm、沿剪切 方向之拉伸速度:5〇 _/min、溫度:23似、濕度: 65土5%RH)為 l〇(N/cm2)以上。 如請求項1或2之熱剥離型雙面黏著帶或黏著片,1中, 黏著劑層㈧進而具有如下特性:凝膠分率為75重量%以 上0 :被黏著體之加工方法’其特徵在於其係使 著帶或黏著片而加工被黏著體之方二…… ,7., 溉β者體之方法,其係將請求項 中任一項之熱剝離型雙面黏著 劑層(Α)固定於台座上,…“ 者片利用黎者 ;被黏著體貼合於黏著劑層 ⑻上之“ τ ’對被黏著體實施加卫處理。 9.如請求項8之被黏著體 電子系零件類。 方法,其中’被黏著體係 10·如請求項8之被黏著 陶竟電容器用胚片, 體之加工方法,其中, 且具有胚片之積層步驟 被黏著體係 127476.doc 200844206 11 · 一種電子零件,其特徵在於利用如請求項9之被黏著體 之加工方法製造者。 12· —種積層陶瓷電容器,其特徵在於利用如請求項10之被 黏著體之加工方法製造者。 127476.docThe heat-peelable double-sided adhesive tape or adhesive sheet according to claim 1 or 2, wherein the adhesive layer (A) further has the following characteristics: shear adhesion (for SUS3〇4BA plate, attachment area: 2G mmx long) 20 mm, tensile speed in the shear direction: 5 〇 _ / min, temperature: 23, humidity: 65 5% RH) is l 〇 (N / cm 2) or more. The heat-peelable double-sided adhesive tape or adhesive sheet of claim 1 or 2, wherein the adhesive layer (8) further has the following characteristics: a gel fraction of 75% by weight or more 0: a method of processing the adherend' The method of processing the adhered body by tape or adhesive sheet, and the method of absorbing the beta body, which is the thermal peeling type double-sided adhesive layer of any one of the claims. ) Fixed on the pedestal, ... "The film is used by the liters; the τ 'adhered to the adhesive layer (8) is applied to the viscous body. 9. The adhesive body of the claim 8 is an electronic component type. The method, wherein the 'adhesive system 10' is as claimed in claim 8 is a ceramic chip, a processing method of the body, wherein the step of laminating the substrate is adhered to the system 127476.doc 200844206 11 · an electronic component, It is characterized by the use of a method of processing an adherend as claimed in claim 9. A multilayer ceramic capacitor characterized by using the method of processing an adherend as claimed in claim 10. 127476.doc
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556972B (en) * 2012-10-05 2016-11-11 Mitsubishi Plastics Inc Sided adhesive sheet having a releasability and a method for peeling

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (en) * 2002-10-15 2008-06-25 日東電工株式会社 Tip workpiece fixing method
DE102008004388A1 (en) * 2008-01-14 2009-07-16 Tesa Ag Foamed, in particular pressure-sensitive adhesive, method of production and use thereof
JP2010039472A (en) * 2008-07-08 2010-02-18 Nitto Denko Corp Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation process
JP2010053298A (en) * 2008-08-29 2010-03-11 Bridgestone Corp Ethylene-vinyl acetate copolymer composition, ethylene-vinyl acetate copolymer film, and its preparation
US8211270B2 (en) * 2008-11-21 2012-07-03 Nitto Denko Corporation Method of detaching attached boards from each other
DE102008062131A1 (en) * 2008-12-16 2010-06-17 Tesa Se Adhesive tape, in particular for bonding optoelectronic components
ES2468490T3 (en) * 2009-03-04 2014-06-16 Tesa Se Adhesive tape, specially intended for joining photovoltaic modules
CN101709559B (en) * 2009-09-15 2012-07-04 苏州斯迪克新材料科技股份有限公司 High-brightness release paper, and preparation method and applications thereof
JP5456431B2 (en) * 2009-10-20 2014-03-26 日東電工株式会社 Heat release type adhesive sheet
JP5144634B2 (en) * 2009-12-22 2013-02-13 日東電工株式会社 Heat-resistant adhesive sheet for substrate-less semiconductor package manufacturing, and substrate-less semiconductor package manufacturing method using the adhesive sheet
JP2011151362A (en) * 2009-12-24 2011-08-04 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface
DE102010005182B4 (en) * 2010-01-20 2021-12-09 Uzin Tyro Ag Self-adhesive film
WO2012012115A1 (en) * 2010-06-30 2012-01-26 First Solar, Inc Double- sided pressure - sensitive adhesive tape
JP2012149182A (en) * 2011-01-19 2012-08-09 Nitto Denko Corp Double-sided adhesive tape or sheet, and method for processing adherend
JP2012149181A (en) * 2011-01-19 2012-08-09 Nitto Denko Corp Double-sided adhesive tape or sheet, and method for processing adherend
JP5591859B2 (en) * 2012-03-23 2014-09-17 株式会社東芝 Substrate separation method and separation apparatus
JP2014011242A (en) * 2012-06-28 2014-01-20 Nitto Denko Corp Led manufacturing method
JP2014040094A (en) * 2012-07-24 2014-03-06 Nitto Denko Corp Peelable foam laminate for electronic apparatus, and electric or electronic apparatuses
JP6140491B2 (en) * 2012-08-07 2017-05-31 日東電工株式会社 Double-sided adhesive sheet and portable electronic device
JP5525017B2 (en) * 2012-09-03 2014-06-18 日東電工株式会社 Non-electric equipment having a dismantling structure and a dismantling structure
JP6054208B2 (en) * 2013-03-04 2016-12-27 日東電工株式会社 Thermally peelable adhesive sheet
WO2014162943A1 (en) * 2013-04-05 2014-10-09 ニッタ株式会社 Temporary fixing double-sided adhesive tape and temporary fixing method for workpiece using same
KR20150060085A (en) 2013-11-25 2015-06-03 쓰리엠 이노베이티브 프로퍼티즈 캄파니 Double coated tape exhibiting improved reworkable capability
JP5835525B1 (en) * 2013-12-25 2015-12-24 Dic株式会社 Adhesive composition and adhesive film
CH709370A1 (en) * 2014-03-07 2015-09-15 Fofitec Ag Roll material for one or a Submikrometerschicht on a flexible support and use thereof.
JP6501555B2 (en) * 2015-02-20 2019-04-17 昭和電工株式会社 Composition for use in temporary protection of a substrate including a wiring formed of a transparent conductive film, coating film and temporary protection method
CN105280540B (en) * 2015-09-11 2018-09-11 京东方科技集团股份有限公司 The manufacturing method of the attaching method and display panel of carrier substrate and underlay substrate
DE102015220065A1 (en) 2015-10-15 2017-04-20 Tesa Se Adhesive, in particular for stripable adhesive strips, and use for bonding to coated woodchip wallpaper
DE202015009135U1 (en) * 2015-10-15 2016-11-04 Tesa Se Self-adhesive articles and their use for bonding to coated woodchip wallpaper
JP6427508B2 (en) * 2016-01-08 2018-11-21 株式会社ニトムズ Article support for wallpaper and anchor sheet for attachment
JP6257680B2 (en) * 2016-03-31 2018-01-10 住友化学株式会社 Manufacturing method of polarizing film, laminated film
WO2018009465A1 (en) * 2016-07-07 2018-01-11 3M Innovative Properties Company Adhesive for light redirecting film
JP6967908B2 (en) * 2016-09-09 2021-11-17 ニッタ株式会社 A temperature-sensitive adhesive sheet and a method for manufacturing a wafer using the same.
PT3572478T (en) * 2017-01-20 2024-02-06 Mitsui Chemicals Tohcello Inc Adhesive film, and method for manufacturing electronic device
US11434396B2 (en) * 2017-05-29 2022-09-06 Toyo Ink Sc Holdings Co., Ltd. Synthetic rubber pressure-sensitive adhesive, pressure-sensitive adhesive sheet, and polishing member laminate
SG11202003421PA (en) * 2017-11-02 2020-05-28 Toyo Boseki Release film for producing ceramic green sheet
US20190216173A1 (en) * 2018-01-15 2019-07-18 I-Hui Chao Adherable Footwear Cushion
EP3546952B1 (en) * 2018-03-26 2024-03-06 Roche Diagnostics GmbH Method for unsealing an opening of a laboratory sample container, method for handling a laboratory sample container, laboratory apparatus and laboratory automation system
US11090912B2 (en) 2018-08-07 2021-08-17 Taj Tech Llc Heat sealable thermo-printable tape
JP7019203B2 (en) * 2018-09-21 2022-02-15 中芯集成電路(寧波)有限公司上海分公司 Image sensor module and its manufacturing method
KR102321466B1 (en) * 2019-09-03 2021-11-04 주식회사 엘비루셈 Adhesive Tape used for Debonding Semiconductor Wafer
KR102228954B1 (en) * 2019-09-03 2021-03-18 주식회사 엘비루셈 Debonding Method of Semiconductor Wafer
JPWO2023048053A1 (en) * 2021-09-24 2023-03-30

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661468A (en) 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS5787481A (en) * 1980-11-20 1982-05-31 Toagosei Chem Ind Co Ltd Removable adhesive mass composition
JP3676886B2 (en) * 1996-08-07 2005-07-27 日東電工株式会社 Adhesive tape for re-peeling packaging
JP2001106998A (en) * 1999-08-02 2001-04-17 Somar Corp Adhesive sheet and reinforcing material for film for printing using the same
JP2002363513A (en) * 2001-06-08 2002-12-18 Oji Paper Co Ltd Pressure-sensitive adhesive sheet, wrapping material, and wrapped product
WO2003091291A1 (en) * 2002-04-25 2003-11-06 Kaneka Corporation Process for producing (meth)acrylic polymer terminated by crosslinkable silyl group
JP2004300231A (en) * 2003-03-31 2004-10-28 Nitto Denko Corp Thermally peelable double sided adhesive sheet, method for processing adherend and electronic part
JP4493288B2 (en) * 2003-06-05 2010-06-30 日東電工株式会社 Adhesive tape or sheet
JP4673565B2 (en) * 2004-03-05 2011-04-20 ソマール株式会社 Cooling-peelable pressure-sensitive adhesive composition, cooling-peelable pressure-sensitive adhesive sheet, and method for producing electronic components using the same
KR20060126809A (en) 2004-03-11 2006-12-08 닛토덴코 가부시키가이샤 Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet
JP4588021B2 (en) 2004-03-11 2010-11-24 日東電工株式会社 Heat-peelable pressure-sensitive adhesive sheet and method for processing an adherend using the heat-peelable pressure-sensitive adhesive sheet
JP4689256B2 (en) 2004-12-10 2011-05-25 矢崎総業株式会社 Halogen-free adhesive tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556972B (en) * 2012-10-05 2016-11-11 Mitsubishi Plastics Inc Sided adhesive sheet having a releasability and a method for peeling

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