TWI419376B - 螢光體轉化發光二極體 - Google Patents
螢光體轉化發光二極體 Download PDFInfo
- Publication number
- TWI419376B TWI419376B TW098128765A TW98128765A TWI419376B TW I419376 B TWI419376 B TW I419376B TW 098128765 A TW098128765 A TW 098128765A TW 98128765 A TW98128765 A TW 98128765A TW I419376 B TWI419376 B TW I419376B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- die
- light source
- phosphor
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/202,793 US7973327B2 (en) | 2008-09-02 | 2008-09-02 | Phosphor-converted LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201027797A TW201027797A (en) | 2010-07-16 |
| TWI419376B true TWI419376B (zh) | 2013-12-11 |
Family
ID=41723975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098128765A TWI419376B (zh) | 2008-09-02 | 2009-08-27 | 螢光體轉化發光二極體 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7973327B2 (https=) |
| EP (1) | EP2332187B1 (https=) |
| JP (3) | JP5753494B2 (https=) |
| KR (2) | KR20150038604A (https=) |
| CN (1) | CN102132428B (https=) |
| TW (1) | TWI419376B (https=) |
| WO (1) | WO2010027672A2 (https=) |
Families Citing this family (84)
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| US20100327733A1 (en) * | 2009-06-25 | 2010-12-30 | Bridgelux, Inc. | Multiple layer phosphor bearing film |
| US20100328923A1 (en) * | 2009-06-25 | 2010-12-30 | Bridgelux, Inc. | Multiple layer phosphor bearing film |
| WO2010151600A1 (en) | 2009-06-27 | 2010-12-29 | Michael Tischler | High efficiency leds and led lamps |
| US8384121B2 (en) | 2010-06-29 | 2013-02-26 | Cooledge Lighting Inc. | Electronic devices with yielding substrates |
| US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
| US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
| US8232117B2 (en) * | 2010-04-30 | 2012-07-31 | Koninklijke Philips Electronics N.V. | LED wafer with laminated phosphor layer |
| JP5566785B2 (ja) * | 2010-06-22 | 2014-08-06 | 日東電工株式会社 | 複合シート |
| JP2012009696A (ja) * | 2010-06-25 | 2012-01-12 | Panasonic Electric Works Co Ltd | 発光装置およびそれを用いたled照明器具 |
| JP2012069577A (ja) * | 2010-09-21 | 2012-04-05 | Citizen Electronics Co Ltd | 半導体発光装置及びその製造方法 |
| US20120097985A1 (en) * | 2010-10-21 | 2012-04-26 | Wen-Huang Liu | Light Emitting Diode (LED) Package And Method Of Fabrication |
| JP2013541220A (ja) * | 2010-10-27 | 2013-11-07 | コーニンクレッカ フィリップス エヌ ヴェ | 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法 |
| US8373183B2 (en) | 2011-02-22 | 2013-02-12 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED package for uniform color emission |
| JP5745319B2 (ja) * | 2011-04-14 | 2015-07-08 | 日東電工株式会社 | 蛍光反射シート、および、発光ダイオード装置の製造方法 |
| JP5670249B2 (ja) * | 2011-04-14 | 2015-02-18 | 日東電工株式会社 | 発光素子転写シートの製造方法、発光装置の製造方法、発光素子転写シートおよび発光装置 |
| JP5680472B2 (ja) * | 2011-04-22 | 2015-03-04 | シチズンホールディングス株式会社 | 半導体発光装置の製造方法 |
| JP2012243822A (ja) * | 2011-05-16 | 2012-12-10 | Citizen Electronics Co Ltd | Led発光装置とその製造方法 |
| SG189315A1 (en) * | 2011-06-07 | 2013-05-31 | Toray Industries | Resin sheet laminated body, method for producing same, and method for producing led chip with phosphor-containing resin sheet using same |
| JP5730680B2 (ja) * | 2011-06-17 | 2015-06-10 | シチズン電子株式会社 | Led発光装置とその製造方法 |
| WO2013039897A2 (en) * | 2011-09-14 | 2013-03-21 | VerLASE TECHNOLOGIES LLC | Phosphors for use with leds and other optoelectronic devices |
| JP2013077679A (ja) * | 2011-09-30 | 2013-04-25 | Citizen Electronics Co Ltd | 半導体発光装置とその製造方法 |
| US8779694B1 (en) | 2011-12-08 | 2014-07-15 | Automated Assembly Corporation | LEDs on flexible substrate arrangement |
| EP2748277B1 (en) | 2011-12-16 | 2018-08-22 | Lumileds Holding B.V. | PHOSPHOR IN WATER GLASS FOR LEDs |
| CN103187484A (zh) * | 2011-12-27 | 2013-07-03 | 展晶科技(深圳)有限公司 | 发光二极管封装方法 |
| JP5860289B2 (ja) * | 2012-01-05 | 2016-02-16 | シチズン電子株式会社 | Led装置の製造方法 |
| EP2831932B1 (en) * | 2012-03-30 | 2020-09-30 | Lumileds Holding B.V. | Light emitting device with wavelength converting side coat |
| EP2837041B1 (en) * | 2012-04-13 | 2019-07-03 | Lumileds Holding B.V. | A light conversion assembly, a lamp and a luminaire |
| JP2013232477A (ja) * | 2012-04-27 | 2013-11-14 | Toshiba Corp | 発光モジュール |
| US8629466B2 (en) * | 2012-05-22 | 2014-01-14 | Hong Kong Applied Science and Technology Research Institute Company Limited | Lighting device |
| US8877561B2 (en) | 2012-06-07 | 2014-11-04 | Cooledge Lighting Inc. | Methods of fabricating wafer-level flip chip device packages |
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| CN104471730B (zh) * | 2012-07-20 | 2018-04-17 | 皇家飞利浦有限公司 | 发光器件和创建发光器件的方法 |
| JP5995579B2 (ja) * | 2012-07-24 | 2016-09-21 | シチズンホールディングス株式会社 | 半導体発光装置及びその製造方法 |
| JP6055259B2 (ja) * | 2012-10-03 | 2016-12-27 | 日東電工株式会社 | 封止シート被覆半導体素子、その製造方法、半導体装置およびその製造方法 |
| JP6215525B2 (ja) * | 2012-10-23 | 2017-10-18 | スタンレー電気株式会社 | 半導体発光装置 |
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| KR102103881B1 (ko) * | 2013-03-07 | 2020-04-23 | 포항공과대학교 산학협력단 | Uv led칩을 이용하는 백색 발광소자 |
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| US10720551B1 (en) * | 2019-01-03 | 2020-07-21 | Ford Global Technologies, Llc | Vehicle lamps |
| US10655823B1 (en) | 2019-02-04 | 2020-05-19 | Automated Assembly Corporation | SSL lighting apparatus |
| JP7299537B2 (ja) * | 2020-03-18 | 2023-06-28 | 日亜化学工業株式会社 | 発光装置 |
| JP7119283B2 (ja) | 2020-03-30 | 2022-08-17 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP7091598B2 (ja) | 2020-05-20 | 2022-06-28 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| JP7580206B2 (ja) * | 2020-05-25 | 2024-11-11 | スタンレー電気株式会社 | 半導体発光装置 |
| US10995931B1 (en) | 2020-08-06 | 2021-05-04 | Automated Assembly Corporation | SSL lighting apparatus |
| JP7071680B2 (ja) * | 2021-01-12 | 2022-05-19 | 日亜化学工業株式会社 | 発光装置 |
| JP7455396B2 (ja) * | 2021-07-20 | 2024-03-26 | フェニックス電機株式会社 | 広帯域発光装置 |
| JP2024145784A (ja) * | 2023-03-31 | 2024-10-15 | 日亜化学工業株式会社 | 面状光源、液晶表示装置 |
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2008
- 2008-09-02 US US12/202,793 patent/US7973327B2/en active Active
-
2009
- 2009-08-19 WO PCT/US2009/054361 patent/WO2010027672A2/en not_active Ceased
- 2009-08-19 CN CN200980133270.7A patent/CN102132428B/zh active Active
- 2009-08-19 KR KR20157005739A patent/KR20150038604A/ko not_active Ceased
- 2009-08-19 EP EP09811954.8A patent/EP2332187B1/en active Active
- 2009-08-19 KR KR1020117004957A patent/KR20110051222A/ko not_active Ceased
- 2009-08-19 JP JP2011526096A patent/JP5753494B2/ja active Active
- 2009-08-27 TW TW098128765A patent/TWI419376B/zh active
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2011
- 2011-03-24 US US13/071,292 patent/US8048695B2/en active Active
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2014
- 2014-06-12 JP JP2014121320A patent/JP6010583B2/ja active Active
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2016
- 2016-05-06 JP JP2016093163A patent/JP2016167626A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200725940A (en) * | 2005-12-29 | 2007-07-01 | Anteya Technology Corp | LED package structure |
| WO2007085977A1 (en) * | 2006-01-24 | 2007-08-02 | Philips Intellectual Property & Standards Gmbh | Light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012516026A (ja) | 2012-07-12 |
| CN102132428A (zh) | 2011-07-20 |
| WO2010027672A3 (en) | 2010-05-20 |
| KR20150038604A (ko) | 2015-04-08 |
| KR20110051222A (ko) | 2011-05-17 |
| EP2332187A4 (en) | 2013-05-29 |
| US20110171762A1 (en) | 2011-07-14 |
| JP6010583B2 (ja) | 2016-10-19 |
| JP2014212329A (ja) | 2014-11-13 |
| WO2010027672A2 (en) | 2010-03-11 |
| US8048695B2 (en) | 2011-11-01 |
| EP2332187B1 (en) | 2016-08-10 |
| JP2016167626A (ja) | 2016-09-15 |
| JP5753494B2 (ja) | 2015-07-22 |
| TW201027797A (en) | 2010-07-16 |
| US20100051984A1 (en) | 2010-03-04 |
| EP2332187A2 (en) | 2011-06-15 |
| CN102132428B (zh) | 2015-07-08 |
| US7973327B2 (en) | 2011-07-05 |
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