TWI414046B - 降低封裝串擾及損耗之半導體裝置 - Google Patents

降低封裝串擾及損耗之半導體裝置 Download PDF

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Publication number
TWI414046B
TWI414046B TW095139041A TW95139041A TWI414046B TW I414046 B TWI414046 B TW I414046B TW 095139041 A TW095139041 A TW 095139041A TW 95139041 A TW95139041 A TW 95139041A TW I414046 B TWI414046 B TW I414046B
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TW
Taiwan
Prior art keywords
die
buffer
covering
filler
dielectric constant
Prior art date
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TW095139041A
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English (en)
Chinese (zh)
Other versions
TW200729427A (en
Inventor
康狄 布萊恩Ｗ
麻哈林根 馬里
夏爾 麥哈許Ｋ
Original Assignee
飛思卡爾半導體公司
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Application filed by 飛思卡爾半導體公司 filed Critical 飛思卡爾半導體公司
Publication of TW200729427A publication Critical patent/TW200729427A/zh
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Publication of TWI414046B publication Critical patent/TWI414046B/zh

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Classifications

    • H10W74/121—
    • H10W40/778—
    • H10W74/473—
    • H10W76/10—
    • H10W72/0198—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095139041A 2005-10-24 2006-10-23 降低封裝串擾及損耗之半導體裝置 TWI414046B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/257,802 US7435625B2 (en) 2005-10-24 2005-10-24 Semiconductor device with reduced package cross-talk and loss

Publications (2)

Publication Number Publication Date
TW200729427A TW200729427A (en) 2007-08-01
TWI414046B true TWI414046B (zh) 2013-11-01

Family

ID=37968396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139041A TWI414046B (zh) 2005-10-24 2006-10-23 降低封裝串擾及損耗之半導體裝置

Country Status (5)

Country Link
US (2) US7435625B2 (enExample)
JP (1) JP2009513019A (enExample)
KR (1) KR101296701B1 (enExample)
TW (1) TWI414046B (enExample)
WO (1) WO2007050420A2 (enExample)

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JP5018909B2 (ja) * 2009-06-30 2012-09-05 株式会社デンソー 半導体装置
JP2011054806A (ja) * 2009-09-02 2011-03-17 Renesas Electronics Corp 半導体装置およびその製造方法
WO2011139845A2 (en) * 2010-04-28 2011-11-10 Hoya Corporation Usa Cross-talk reduction in a bidirectional optoelectronic device
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CN102714542B (zh) * 2010-06-25 2015-08-19 Hoya美国公司 双向光电子设备中的串扰减小
KR20120000805A (ko) 2010-06-28 2012-01-04 삼성전자주식회사 반도체 패키지의 몰딩 방법
CN102714555B (zh) * 2010-09-06 2016-06-15 华为技术有限公司 双向光电子设备中的串扰减小
WO2013063410A1 (en) 2011-10-28 2013-05-02 Hoya Corporation Usa Optical waveguide splitter on a waveguide substrate for attenuating a light source
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KR101905893B1 (ko) * 2012-06-13 2018-10-08 에스케이하이닉스 주식회사 복수의 유전층을 포함하는 임베디드 패키지 및 제조 방법
US9226428B2 (en) * 2012-06-28 2015-12-29 Intel Corporation High heat capacity electronic components and methods for fabricating
US20140103508A1 (en) * 2012-10-11 2014-04-17 Texas Instruments Incorporated Encapsulating package for an integrated circuit
EP2731130A1 (en) * 2012-11-12 2014-05-14 Nxp B.V. Cavity package for an integrated circuit
US9312231B2 (en) * 2013-10-31 2016-04-12 Freescale Semiconductor, Inc. Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
US9461005B2 (en) * 2015-02-12 2016-10-04 Ampleon Netherlands B.V. RF package with non-gaseous dielectric material
US10431526B2 (en) * 2017-10-09 2019-10-01 Cree, Inc. Rivetless lead fastening for a semiconductor package
US10897824B2 (en) * 2017-10-30 2021-01-19 Baker Hughes, A Ge Company, Llc Encapsulation of downhole microelectronics and method the same
US11410898B2 (en) * 2017-10-31 2022-08-09 Nagase Chemtex Corporation Manufacturing method of mounting structure, and sheet therefor
US10446414B2 (en) * 2017-12-22 2019-10-15 Texas Instruments Incorporated Semiconductor package with filler particles in a mold compound
US10672703B2 (en) 2018-09-26 2020-06-02 Nxp Usa, Inc. Transistor with shield structure, packaged device, and method of fabrication

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US4788583A (en) * 1986-07-25 1988-11-29 Fujitsu Limited Semiconductor device and method of producing semiconductor device
JPS6379353A (ja) * 1986-09-24 1988-04-09 Hitachi Ltd 樹脂封止型半導体装置
JPH05283561A (ja) * 1992-03-30 1993-10-29 Nec Corp 樹脂封止型半導体装置
US5382829A (en) * 1992-07-21 1995-01-17 Mitsubishi Denki Kabushiki Kaisha Packaged microwave semiconductor device
TW200529088A (en) * 2004-02-04 2005-09-01 Semiconductor Energy Lab ID label, ID tag, and ID card

Also Published As

Publication number Publication date
US20070090542A1 (en) 2007-04-26
WO2007050420A3 (en) 2007-08-30
WO2007050420A2 (en) 2007-05-03
KR101296701B1 (ko) 2013-08-20
US7435625B2 (en) 2008-10-14
US20090001614A1 (en) 2009-01-01
KR20080065980A (ko) 2008-07-15
TW200729427A (en) 2007-08-01
US7701074B2 (en) 2010-04-20
JP2009513019A (ja) 2009-03-26

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