CN102569214A - 三维系统级封装堆栈式封装结构 - Google Patents
三维系统级封装堆栈式封装结构 Download PDFInfo
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- CN102569214A CN102569214A CN2011100294092A CN201110029409A CN102569214A CN 102569214 A CN102569214 A CN 102569214A CN 2011100294092 A CN2011100294092 A CN 2011100294092A CN 201110029409 A CN201110029409 A CN 201110029409A CN 102569214 A CN102569214 A CN 102569214A
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
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US12/975,698 | 2010-12-22 | ||
US12/975,698 US8619431B2 (en) | 2010-12-22 | 2010-12-22 | Three-dimensional system-in-package package-on-package structure |
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CN102569214A true CN102569214A (zh) | 2012-07-11 |
CN102569214B CN102569214B (zh) | 2014-05-21 |
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CN201110029409.2A Active CN102569214B (zh) | 2010-12-22 | 2011-01-27 | 三维系统级封装堆栈式封装结构 |
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CN105789062A (zh) * | 2014-09-05 | 2016-07-20 | 台湾积体电路制造股份有限公司 | 封装件结构及其形成方法 |
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US8907469B2 (en) | 2012-01-19 | 2014-12-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package assembly and method of forming the same |
US9613917B2 (en) | 2012-03-30 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package (PoP) device with integrated passive device in a via |
US9111847B2 (en) * | 2012-06-15 | 2015-08-18 | Infineon Technologies Ag | Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package |
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US9368438B2 (en) * | 2012-12-28 | 2016-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package on package (PoP) bonding structures |
US9679839B2 (en) | 2013-10-30 | 2017-06-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chip on package structure and method |
US9373527B2 (en) | 2013-10-30 | 2016-06-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chip on package structure and method |
KR102175723B1 (ko) | 2014-02-25 | 2020-11-09 | 삼성전자주식회사 | 반도체 패키지 |
US9543384B2 (en) * | 2015-02-26 | 2017-01-10 | SK Hynix Inc. | Semiconductor package |
US9627288B2 (en) | 2015-05-29 | 2017-04-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structures and methods of forming the same |
US9589969B1 (en) * | 2016-01-15 | 2017-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and manufacturing method of the same |
US9853011B2 (en) | 2016-03-29 | 2017-12-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
US9653391B1 (en) * | 2016-06-30 | 2017-05-16 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor packaging structure and manufacturing method thereof |
CN107342233A (zh) * | 2017-06-29 | 2017-11-10 | 江苏长电科技股份有限公司 | 低损耗部件埋入式天线封装结构及其制造方法 |
US10886263B2 (en) * | 2017-09-29 | 2021-01-05 | Advanced Semiconductor Engineering, Inc. | Stacked semiconductor package assemblies including double sided redistribution layers |
TWI652788B (zh) * | 2017-11-09 | 2019-03-01 | 大陸商上海兆芯集成電路有限公司 | 晶片封裝結構及晶片封裝結構陣列 |
US11239180B2 (en) * | 2018-07-30 | 2022-02-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of package structure with stacked semiconductor dies |
TWI734545B (zh) * | 2020-07-03 | 2021-07-21 | 財團法人工業技術研究院 | 半導體封裝結構 |
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CN103715166A (zh) * | 2012-10-02 | 2014-04-09 | 台湾积体电路制造股份有限公司 | 用于部件封装件的装置和方法 |
US9748216B2 (en) | 2012-10-02 | 2017-08-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for a component package |
CN103715166B (zh) * | 2012-10-02 | 2018-10-12 | 台湾积体电路制造股份有限公司 | 用于部件封装件的装置和方法 |
CN108962876A (zh) * | 2012-10-11 | 2018-12-07 | 台湾积体电路制造股份有限公司 | Pop结构及其形成方法 |
CN104051365A (zh) * | 2013-03-14 | 2014-09-17 | 英特尔移动通信有限责任公司 | 芯片布置以及用于制造芯片布置的方法 |
CN105789062A (zh) * | 2014-09-05 | 2016-07-20 | 台湾积体电路制造股份有限公司 | 封装件结构及其形成方法 |
US10177115B2 (en) | 2014-09-05 | 2019-01-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structures and methods of forming |
US10672738B2 (en) | 2014-09-05 | 2020-06-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structures and methods of forming |
CN105789062B (zh) * | 2014-09-05 | 2021-02-26 | 台湾积体电路制造股份有限公司 | 封装件结构及其形成方法 |
US11444057B2 (en) | 2014-09-05 | 2022-09-13 | Taiwan Semiconductor Manufacturing Company Ltd | Package structures and methods of forming |
Also Published As
Publication number | Publication date |
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CN102569214B (zh) | 2014-05-21 |
US20120161315A1 (en) | 2012-06-28 |
US8619431B2 (en) | 2013-12-31 |
TWI482261B (zh) | 2015-04-21 |
TW201227913A (en) | 2012-07-01 |
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