KR101296701B1 - 감소된 패키지 크로스-토크 및 손실을 갖는 반도체디바이스 - Google Patents

감소된 패키지 크로스-토크 및 손실을 갖는 반도체디바이스 Download PDF

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KR101296701B1
KR101296701B1 KR1020087009842A KR20087009842A KR101296701B1 KR 101296701 B1 KR101296701 B1 KR 101296701B1 KR 1020087009842 A KR1020087009842 A KR 1020087009842A KR 20087009842 A KR20087009842 A KR 20087009842A KR 101296701 B1 KR101296701 B1 KR 101296701B1
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die
buffer
buffer region
dielectric constant
capsule
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Korean (ko)
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KR20080065980A (ko
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브라이언 더블유. 콘디
마리 마하링앰
마헤쉬 케이. 샤
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프리스케일 세미컨덕터, 인크.
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    • H10W74/121—
    • H10W40/778—
    • H10W74/473—
    • H10W76/10—
    • H10W72/0198—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020087009842A 2005-10-24 2006-10-18 감소된 패키지 크로스-토크 및 손실을 갖는 반도체디바이스 Expired - Fee Related KR101296701B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/257,802 2005-10-24
US11/257,802 US7435625B2 (en) 2005-10-24 2005-10-24 Semiconductor device with reduced package cross-talk and loss
PCT/US2006/040869 WO2007050420A2 (en) 2005-10-24 2006-10-18 Semiconductor device with reduced package cross-talk and loss

Publications (2)

Publication Number Publication Date
KR20080065980A KR20080065980A (ko) 2008-07-15
KR101296701B1 true KR101296701B1 (ko) 2013-08-20

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KR1020087009842A Expired - Fee Related KR101296701B1 (ko) 2005-10-24 2006-10-18 감소된 패키지 크로스-토크 및 손실을 갖는 반도체디바이스

Country Status (5)

Country Link
US (2) US7435625B2 (enExample)
JP (1) JP2009513019A (enExample)
KR (1) KR101296701B1 (enExample)
TW (1) TWI414046B (enExample)
WO (1) WO2007050420A2 (enExample)

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CN102714542B (zh) * 2010-06-25 2015-08-19 Hoya美国公司 双向光电子设备中的串扰减小
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CN102714555B (zh) * 2010-09-06 2016-06-15 华为技术有限公司 双向光电子设备中的串扰减小
WO2013063410A1 (en) 2011-10-28 2013-05-02 Hoya Corporation Usa Optical waveguide splitter on a waveguide substrate for attenuating a light source
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KR101905893B1 (ko) * 2012-06-13 2018-10-08 에스케이하이닉스 주식회사 복수의 유전층을 포함하는 임베디드 패키지 및 제조 방법
US9226428B2 (en) * 2012-06-28 2015-12-29 Intel Corporation High heat capacity electronic components and methods for fabricating
US20140103508A1 (en) * 2012-10-11 2014-04-17 Texas Instruments Incorporated Encapsulating package for an integrated circuit
EP2731130A1 (en) * 2012-11-12 2014-05-14 Nxp B.V. Cavity package for an integrated circuit
US9312231B2 (en) * 2013-10-31 2016-04-12 Freescale Semiconductor, Inc. Method and apparatus for high temperature semiconductor device packages and structures using a low temperature process
US9461005B2 (en) * 2015-02-12 2016-10-04 Ampleon Netherlands B.V. RF package with non-gaseous dielectric material
US10431526B2 (en) * 2017-10-09 2019-10-01 Cree, Inc. Rivetless lead fastening for a semiconductor package
US10897824B2 (en) * 2017-10-30 2021-01-19 Baker Hughes, A Ge Company, Llc Encapsulation of downhole microelectronics and method the same
US11410898B2 (en) * 2017-10-31 2022-08-09 Nagase Chemtex Corporation Manufacturing method of mounting structure, and sheet therefor
US10446414B2 (en) * 2017-12-22 2019-10-15 Texas Instruments Incorporated Semiconductor package with filler particles in a mold compound
US10672703B2 (en) 2018-09-26 2020-06-02 Nxp Usa, Inc. Transistor with shield structure, packaged device, and method of fabrication

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US6794481B2 (en) * 2001-06-28 2004-09-21 Mitsubishi Gas Chemical Company, Inc. Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof

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Patent Citations (3)

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US5785789A (en) * 1993-03-18 1998-07-28 Digital Equipment Corporation Low dielectric constant microsphere filled layers for multilayer electrical structures
US6455606B1 (en) * 1997-04-02 2002-09-24 Sanyo Chemical Industries, Ltd. Polyurethane foam, process for producing the same, and foam forming composition
US6794481B2 (en) * 2001-06-28 2004-09-21 Mitsubishi Gas Chemical Company, Inc. Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof

Also Published As

Publication number Publication date
US20070090542A1 (en) 2007-04-26
WO2007050420A3 (en) 2007-08-30
WO2007050420A2 (en) 2007-05-03
US7435625B2 (en) 2008-10-14
US20090001614A1 (en) 2009-01-01
KR20080065980A (ko) 2008-07-15
TW200729427A (en) 2007-08-01
US7701074B2 (en) 2010-04-20
JP2009513019A (ja) 2009-03-26
TWI414046B (zh) 2013-11-01

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