TWI408851B - Connector - Google Patents

Connector Download PDF

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Publication number
TWI408851B
TWI408851B TW096122255A TW96122255A TWI408851B TW I408851 B TWI408851 B TW I408851B TW 096122255 A TW096122255 A TW 096122255A TW 96122255 A TW96122255 A TW 96122255A TW I408851 B TWI408851 B TW I408851B
Authority
TW
Taiwan
Prior art keywords
edge
pins
contact
contact portion
pin
Prior art date
Application number
TW096122255A
Other languages
English (en)
Chinese (zh)
Other versions
TW200849729A (en
Inventor
Kazunari Suga
Shinichi Kimura
Akifumi Sato
Shuji Uchiyama
Original Assignee
Japan Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Engineering Co Ltd filed Critical Japan Engineering Co Ltd
Publication of TW200849729A publication Critical patent/TW200849729A/zh
Application granted granted Critical
Publication of TWI408851B publication Critical patent/TWI408851B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW096122255A 2007-06-06 2007-06-21 Connector TWI408851B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007150188A JP4912961B2 (ja) 2007-06-06 2007-06-06 エッジコネクタ及びバーンインシステム

Publications (2)

Publication Number Publication Date
TW200849729A TW200849729A (en) 2008-12-16
TWI408851B true TWI408851B (zh) 2013-09-11

Family

ID=40180236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096122255A TWI408851B (zh) 2007-06-06 2007-06-21 Connector

Country Status (4)

Country Link
JP (1) JP4912961B2 (ko)
KR (1) KR101204781B1 (ko)
CN (1) CN101320075B (ko)
TW (1) TWI408851B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012117881A (ja) * 2010-11-30 2012-06-21 Nippon Eng Kk バーンインボード及びバーンインシステム
CN102185199B (zh) * 2011-02-28 2013-03-13 中航光电科技股份有限公司 具有功率接触件的矩形电连接器
CN102185200B (zh) * 2011-02-28 2013-06-19 中航光电科技股份有限公司 功率接触片及使用该接触片的矩形电连接器
CN102185198B (zh) * 2011-02-28 2013-03-13 中航光电科技股份有限公司 功率接触件及其接触片
CN102709723B (zh) * 2011-03-28 2015-05-13 泰科电子(上海)有限公司 Usb连接器
CN103107446A (zh) * 2011-11-15 2013-05-15 宏致电子股份有限公司 电源连接器
JP5454608B2 (ja) * 2012-04-19 2014-03-26 第一精工株式会社 コネクタ端子
US10151774B2 (en) * 2015-06-10 2018-12-11 Asm Technology Singapore Pte Ltd Electrical contact having electrical isolated members for contacting an electrical component
CN108288788A (zh) * 2017-12-29 2018-07-17 杭州华为数字技术有限公司 一种电源连接器和电源连接组件
JP6985454B2 (ja) * 2020-05-19 2021-12-22 Ｎｅｃプラットフォームズ株式会社 組合せ構造、選択方法及び選択プログラム
KR102548884B1 (ko) * 2022-10-25 2023-06-28 (주)디지털프론티어 반도체 제조 공정의 티디비아이 장치용 핀 연결 구조

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255179A (ja) * 1988-04-05 1989-10-12 Hitachi Ltd コネクタ
JP2001023711A (ja) * 1999-07-06 2001-01-26 Yamaichi Electronics Co Ltd 挟接形ソケット
JP2002237340A (ja) * 2001-02-09 2002-08-23 Yamaichi Electronics Co Ltd カードエッジコネクタ
US20040205402A1 (en) * 2002-03-29 2004-10-14 Kabushiki Kaisha Toshiba Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01177884U (ko) * 1988-06-06 1989-12-19
JPH0246391U (ko) * 1988-09-22 1990-03-29
JPH02131281U (ko) * 1989-04-06 1990-10-31
US5980267A (en) * 1996-06-28 1999-11-09 Intel Corporation Connector scheme for a power pod power delivery system
CN100533163C (zh) * 2005-02-08 2009-08-26 奇景光电股份有限公司 可实施老化与电性测试的晶圆及其实施方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255179A (ja) * 1988-04-05 1989-10-12 Hitachi Ltd コネクタ
JP2001023711A (ja) * 1999-07-06 2001-01-26 Yamaichi Electronics Co Ltd 挟接形ソケット
JP2002237340A (ja) * 2001-02-09 2002-08-23 Yamaichi Electronics Co Ltd カードエッジコネクタ
US20040205402A1 (en) * 2002-03-29 2004-10-14 Kabushiki Kaisha Toshiba Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereof

Also Published As

Publication number Publication date
JP2008305611A (ja) 2008-12-18
KR101204781B1 (ko) 2012-11-26
CN101320075A (zh) 2008-12-10
KR20080107232A (ko) 2008-12-10
CN101320075B (zh) 2011-11-23
TW200849729A (en) 2008-12-16
JP4912961B2 (ja) 2012-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees