TWI405608B - 表面處理方法以及被表面處理的物品 - Google Patents

表面處理方法以及被表面處理的物品 Download PDF

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Publication number
TWI405608B
TWI405608B TW095110248A TW95110248A TWI405608B TW I405608 B TWI405608 B TW I405608B TW 095110248 A TW095110248 A TW 095110248A TW 95110248 A TW95110248 A TW 95110248A TW I405608 B TWI405608 B TW I405608B
Authority
TW
Taiwan
Prior art keywords
water
plasma
article
contact
contact angle
Prior art date
Application number
TW095110248A
Other languages
English (en)
Chinese (zh)
Other versions
TW200637648A (en
Inventor
上西理玄
野村信福
豊田洋通
Original Assignee
三菱麗陽股份有限公司
國立大學法人愛媛大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱麗陽股份有限公司, 國立大學法人愛媛大學 filed Critical 三菱麗陽股份有限公司
Publication of TW200637648A publication Critical patent/TW200637648A/zh
Application granted granted Critical
Publication of TWI405608B publication Critical patent/TWI405608B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D65/00—Accessories or auxiliary operations, in general, for separation processes or apparatus using semi-permeable membranes
    • B01D65/02—Membrane cleaning or sterilisation ; Membrane regeneration
    • A—HUMAN NECESSITIES
    • A62—LIFE-SAVING; FIRE-FIGHTING
    • A62D—CHEMICAL MEANS FOR EXTINGUISHING FIRES OR FOR COMBATING OR PROTECTING AGAINST HARMFUL CHEMICAL AGENTS; CHEMICAL MATERIALS FOR USE IN BREATHING APPARATUS
    • A62D3/00—Processes for making harmful chemical substances harmless or less harmful, by effecting a chemical change in the substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
    • H10P14/6512—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour
    • H10P14/6514—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials by exposure to a gas or vapour by exposure to a plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/18—Cleaning before device manufacture, i.e. Begin-Of-Line process by combined dry cleaning and wet cleaning
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00—Disinfection or sterilisation of materials or objects, in general; Accessories therefor
    • A61L2/02—Disinfection or sterilisation of materials or objects, in general; Accessories therefor using physical processes
    • A61L2/14—Plasma, i.e. ionised gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2321/00—Details relating to membrane cleaning, regeneration, sterilization or to the prevention of fouling
    • B01D2321/20—By influencing the flow
    • B01D2321/2066—Pulsated flow
    • B01D2321/2075—Ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Emergency Management (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Fuel Cell (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW095110248A 2005-03-25 2006-03-24 表面處理方法以及被表面處理的物品 TWI405608B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005089631 2005-03-25

Publications (2)

Publication Number Publication Date
TW200637648A TW200637648A (en) 2006-11-01
TWI405608B true TWI405608B (zh) 2013-08-21

Family

ID=37053300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110248A TWI405608B (zh) 2005-03-25 2006-03-24 表面處理方法以及被表面處理的物品

Country Status (5)

Country Link
US (1) US20080210664A1 (enExample)
JP (2) JP5518281B2 (enExample)
KR (1) KR100938323B1 (enExample)
TW (1) TWI405608B (enExample)
WO (1) WO2006104043A1 (enExample)

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* Cited by examiner, † Cited by third party
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US9275934B2 (en) * 2010-03-03 2016-03-01 Georgia Tech Research Corporation Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same
US10369327B2 (en) * 2010-04-28 2019-08-06 Clph, Llc Catheters with lubricious linings and methods for making and using them
JP5696447B2 (ja) * 2010-11-25 2015-04-08 Ｊｆｅスチール株式会社 表面処理金属材料の製造方法
JP5645163B2 (ja) * 2011-01-26 2014-12-24 国立大学法人大阪大学 フッ素系樹脂材料の表面改質方法及びフッ素系樹脂材料と金属材料の積層体
KR101405721B1 (ko) * 2011-04-29 2014-06-13 한국과학기술연구원 소수성이 개선된 기공체 및 그 제조 방법
KR101349075B1 (ko) * 2011-10-10 2014-01-16 한국과학기술연구원 물질전달성이 향상된 연료전지 및 그 제조 방법
US20230285630A1 (en) * 2014-02-18 2023-09-14 University Of South Australia Plasma hydrogel therapy
US9809493B2 (en) 2015-04-27 2017-11-07 Ford Global Technologies, Llc Surface treatment of glass bubbles
JP2019029333A (ja) * 2017-07-26 2019-02-21 東芝メモリ株式会社 プラズマ処理装置および半導体装置の製造方法
KR102148831B1 (ko) 2018-10-02 2020-08-27 삼성전기주식회사 코일 부품
KR102619877B1 (ko) * 2019-09-11 2024-01-03 삼성전자주식회사 기판 처리 장치
JP7427475B2 (ja) * 2020-02-28 2024-02-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7399209B2 (ja) * 2022-04-05 2023-12-15 エルジー・ケム・リミテッド 処理装置、分解生成物の製造方法、及び処理方法
JP7787452B2 (ja) * 2023-09-29 2025-12-17 ダイキン工業株式会社 エアフィルタ濾材、エアフィルタ濾材の使用方法、および空気処理装置
CN118952032B (zh) * 2024-09-20 2025-05-30 彤程电子材料(常州)有限公司 一种复合抛光垫及其制备方法和应用

Citations (2)

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US6106653A (en) * 1998-03-31 2000-08-22 Exxon Research And Engineering Co. Water vapor plasma treatment of glass surfaces
US20010010228A1 (en) * 1998-03-16 2001-08-02 Vlsi Technology, Inc. Method of protecting quartz hardware from etching during plasma-enhanced cleaning of a semiconductor processing chamber

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US20010010228A1 (en) * 1998-03-16 2001-08-02 Vlsi Technology, Inc. Method of protecting quartz hardware from etching during plasma-enhanced cleaning of a semiconductor processing chamber
US6106653A (en) * 1998-03-31 2000-08-22 Exxon Research And Engineering Co. Water vapor plasma treatment of glass surfaces

Also Published As

Publication number Publication date
KR100938323B1 (ko) 2010-01-22
TW200637648A (en) 2006-11-01
KR20070113313A (ko) 2007-11-28
US20080210664A1 (en) 2008-09-04
JP5725304B2 (ja) 2015-05-27
WO2006104043A1 (ja) 2006-10-05
JP5518281B2 (ja) 2014-06-11
JPWO2006104043A1 (ja) 2008-09-04
JP2013031842A (ja) 2013-02-14

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